CN113043690A - 覆金属层叠板及电路基板 - Google Patents
覆金属层叠板及电路基板 Download PDFInfo
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- CN113043690A CN113043690A CN202011550852.XA CN202011550852A CN113043690A CN 113043690 A CN113043690 A CN 113043690A CN 202011550852 A CN202011550852 A CN 202011550852A CN 113043690 A CN113043690 A CN 113043690A
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- layer
- transmission loss
- polyimide
- diamine
- metal
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Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/732—Dimensional properties
- B32B2307/734—Dimensional stability
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2379/00—Other polymers having nitrogen, with or without oxygen or carbon only, in the main chain
- B32B2379/08—Polyimides
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2019238111A JP2021106248A (ja) | 2019-12-27 | 2019-12-27 | 金属張積層板及び回路基板 |
JP2019-238111 | 2019-12-27 |
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CN113043690A true CN113043690A (zh) | 2021-06-29 |
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CN202011550852.XA Pending CN113043690A (zh) | 2019-12-27 | 2020-12-24 | 覆金属层叠板及电路基板 |
Country Status (4)
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JP (1) | JP2021106248A (ko) |
KR (1) | KR20210084275A (ko) |
CN (1) | CN113043690A (ko) |
TW (1) | TW202126128A (ko) |
Cited By (1)
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TWI824642B (zh) * | 2022-07-27 | 2023-12-01 | 大陸商宏啟勝精密電子(秦皇島)有限公司 | 軟性電路板及其製造方法 |
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JPWO2023281776A1 (ko) * | 2021-07-09 | 2023-01-12 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103171190A (zh) * | 2011-12-21 | 2013-06-26 | 新日铁住金化学株式会社 | 两面覆金属层叠板及其制造方法 |
CN107009697A (zh) * | 2016-01-05 | 2017-08-04 | 荒川化学工业株式会社 | 覆铜箔层叠体和印刷布线板 |
JP2018140544A (ja) * | 2017-02-28 | 2018-09-13 | 新日鉄住金化学株式会社 | 金属張積層板、接着シート、接着性ポリイミド樹脂組成物及び回路基板 |
JP2018170417A (ja) * | 2017-03-30 | 2018-11-01 | 新日鉄住金化学株式会社 | 金属張積層板及び回路基板 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JP4029732B2 (ja) | 2003-01-17 | 2008-01-09 | 宇部興産株式会社 | 低誘電率ポリイミド基板の製造法 |
-
2019
- 2019-12-27 JP JP2019238111A patent/JP2021106248A/ja active Pending
-
2020
- 2020-12-22 KR KR1020200180438A patent/KR20210084275A/ko unknown
- 2020-12-24 CN CN202011550852.XA patent/CN113043690A/zh active Pending
- 2020-12-24 TW TW109146039A patent/TW202126128A/zh unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103171190A (zh) * | 2011-12-21 | 2013-06-26 | 新日铁住金化学株式会社 | 两面覆金属层叠板及其制造方法 |
CN107009697A (zh) * | 2016-01-05 | 2017-08-04 | 荒川化学工业株式会社 | 覆铜箔层叠体和印刷布线板 |
JP2018140544A (ja) * | 2017-02-28 | 2018-09-13 | 新日鉄住金化学株式会社 | 金属張積層板、接着シート、接着性ポリイミド樹脂組成物及び回路基板 |
JP2018170417A (ja) * | 2017-03-30 | 2018-11-01 | 新日鉄住金化学株式会社 | 金属張積層板及び回路基板 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI824642B (zh) * | 2022-07-27 | 2023-12-01 | 大陸商宏啟勝精密電子(秦皇島)有限公司 | 軟性電路板及其製造方法 |
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JP2021106248A (ja) | 2021-07-26 |
KR20210084275A (ko) | 2021-07-07 |
TW202126128A (zh) | 2021-07-01 |
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