JP2021106248A - 金属張積層板及び回路基板 - Google Patents
金属張積層板及び回路基板 Download PDFInfo
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- JP2021106248A JP2021106248A JP2019238111A JP2019238111A JP2021106248A JP 2021106248 A JP2021106248 A JP 2021106248A JP 2019238111 A JP2019238111 A JP 2019238111A JP 2019238111 A JP2019238111 A JP 2019238111A JP 2021106248 A JP2021106248 A JP 2021106248A
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- layer
- transmission loss
- polyimide
- diamine
- resin
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- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
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- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
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- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
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- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
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- H—ELECTRICITY
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- H05K1/03—Use of materials for the substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
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Priority Applications (4)
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|---|---|---|---|
| JP2019238111A JP2021106248A (ja) | 2019-12-27 | 2019-12-27 | 金属張積層板及び回路基板 |
| KR1020200180438A KR20210084275A (ko) | 2019-12-27 | 2020-12-22 | 금속 피복 적층판 및 회로 기판 |
| CN202011550852.XA CN113043690A (zh) | 2019-12-27 | 2020-12-24 | 覆金属层叠板及电路基板 |
| TW109146039A TW202126128A (zh) | 2019-12-27 | 2020-12-24 | 覆金屬層疊板及電路基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019238111A JP2021106248A (ja) | 2019-12-27 | 2019-12-27 | 金属張積層板及び回路基板 |
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| JP2021106248A true JP2021106248A (ja) | 2021-07-26 |
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| JP2019238111A Pending JP2021106248A (ja) | 2019-12-27 | 2019-12-27 | 金属張積層板及び回路基板 |
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| JP (1) | JP2021106248A (ko) |
| KR (1) | KR20210084275A (ko) |
| CN (1) | CN113043690A (ko) |
| TW (1) | TW202126128A (ko) |
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| JPWO2023281776A1 (ko) * | 2021-07-09 | 2023-01-12 | ||
| CN117528897A (zh) * | 2022-07-27 | 2024-02-06 | 宏启胜精密电子(秦皇岛)有限公司 | 软性电路板及其制造方法 |
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| JP4029732B2 (ja) | 2003-01-17 | 2008-01-09 | 宇部興産株式会社 | 低誘電率ポリイミド基板の製造法 |
| JP5886027B2 (ja) * | 2011-12-21 | 2016-03-16 | 新日鉄住金化学株式会社 | 両面金属張積層板およびその製造方法 |
| JP6825368B2 (ja) * | 2016-01-05 | 2021-02-03 | 荒川化学工業株式会社 | 銅張積層体及びプリント配線板 |
| JP7479781B2 (ja) * | 2017-02-28 | 2024-05-09 | 日鉄ケミカル＆マテリアル株式会社 | 金属張積層板、接着シート、接着性ポリイミド樹脂組成物及び回路基板 |
| JP7301495B2 (ja) | 2017-03-30 | 2023-07-03 | 日鉄ケミカル＆マテリアル株式会社 | 金属張積層板及び回路基板 |
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2020
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- 2020-12-24 CN CN202011550852.XA patent/CN113043690A/zh active Pending
- 2020-12-24 TW TW109146039A patent/TW202126128A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| KR20210084275A (ko) | 2021-07-07 |
| TW202126128A (zh) | 2021-07-01 |
| CN113043690A (zh) | 2021-06-29 |
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