CN112309863B - 超低导通电阻ldmos及其制作方法 - Google Patents
超低导通电阻ldmos及其制作方法 Download PDFInfo
- Publication number
- CN112309863B CN112309863B CN201910701420.5A CN201910701420A CN112309863B CN 112309863 B CN112309863 B CN 112309863B CN 201910701420 A CN201910701420 A CN 201910701420A CN 112309863 B CN112309863 B CN 112309863B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 43
- 210000000746 body region Anatomy 0.000 claims abstract description 52
- 238000005530 etching Methods 0.000 claims abstract description 51
- 238000000034 method Methods 0.000 claims abstract description 15
- 239000000758 substrate Substances 0.000 claims description 23
- 229920002120 photoresistant polymer Polymers 0.000 claims description 22
- 238000005468 ion implantation Methods 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
- 150000002500 ions Chemical class 0.000 claims description 6
- 238000002955 isolation Methods 0.000 claims description 6
- 238000001259 photo etching Methods 0.000 claims description 6
- 230000008021 deposition Effects 0.000 claims description 5
- 238000005498 polishing Methods 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims description 5
- 238000002834 transmittance Methods 0.000 abstract description 7
- 238000010586 diagram Methods 0.000 description 14
- 238000001459 lithography Methods 0.000 description 3
- 101000658644 Homo sapiens Tetratricopeptide repeat protein 21A Proteins 0.000 description 2
- 102100034913 Tetratricopeptide repeat protein 21A Human genes 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66674—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/66681—Lateral DMOS transistors, i.e. LDMOS transistors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/80—Etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7816—Lateral DMOS transistors, i.e. LDMOS transistors
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
Abstract
Description
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910701420.5A CN112309863B (zh) | 2019-07-31 | 2019-07-31 | 超低导通电阻ldmos及其制作方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910701420.5A CN112309863B (zh) | 2019-07-31 | 2019-07-31 | 超低导通电阻ldmos及其制作方法 |
Publications (2)
Publication Number | Publication Date |
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CN112309863A CN112309863A (zh) | 2021-02-02 |
CN112309863B true CN112309863B (zh) | 2024-02-23 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201910701420.5A Active CN112309863B (zh) | 2019-07-31 | 2019-07-31 | 超低导通电阻ldmos及其制作方法 |
Country Status (1)
Country | Link |
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CN (1) | CN112309863B (zh) |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005037933A (ja) * | 2003-06-30 | 2005-02-10 | Hoya Corp | グレートーンマスクの製造方法及びグレートーンマスク |
JP2008198903A (ja) * | 2007-02-15 | 2008-08-28 | Fuji Electric Holdings Co Ltd | 半導体装置 |
CN101872737A (zh) * | 2010-01-28 | 2010-10-27 | 中国科学院上海微系统与信息技术研究所 | 一种抑制soi浮体效应的mos结构及其制作方法 |
CN104167360A (zh) * | 2013-05-16 | 2014-11-26 | 无锡华润上华半导体有限公司 | 横向扩散金属氧化物半导体器件及其制造方法 |
CN105374686A (zh) * | 2014-09-02 | 2016-03-02 | 无锡华润上华半导体有限公司 | 一种ldmos器件的制作方法 |
CN105990139A (zh) * | 2015-01-30 | 2016-10-05 | 无锡华润上华半导体有限公司 | 横向扩散金属氧化物半导体场效应管的制造方法 |
CN106847894A (zh) * | 2015-12-02 | 2017-06-13 | 德克萨斯仪器股份有限公司 | 具有与栅极自对准的体扩散的ldmos器件 |
EP3255654A1 (en) * | 2016-06-12 | 2017-12-13 | Semiconductor Manufacturing International Corporation (Shanghai) | Semiconductor device and fabrication method thereof |
CN107742645A (zh) * | 2016-09-28 | 2018-02-27 | 成都芯源系统有限公司 | 具有自对准体区的ldmos器件的制造方法 |
CN108693697A (zh) * | 2017-04-04 | 2018-10-23 | 株式会社Sk电子 | 光掩模和光掩模坯以及光掩模的制造方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080191276A1 (en) * | 2007-02-08 | 2008-08-14 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor devices and fabrication methods thereof |
CN104425247B (zh) * | 2013-08-27 | 2018-01-23 | 无锡华润上华科技有限公司 | 一种绝缘栅双极型晶体管的制备方法 |
US9997605B2 (en) * | 2014-01-21 | 2018-06-12 | Shanghai Huahong Grace Semiconductor Manufacturing Corporation | LDMOS device and its manufacturing method |
-
2019
- 2019-07-31 CN CN201910701420.5A patent/CN112309863B/zh active Active
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005037933A (ja) * | 2003-06-30 | 2005-02-10 | Hoya Corp | グレートーンマスクの製造方法及びグレートーンマスク |
JP2008198903A (ja) * | 2007-02-15 | 2008-08-28 | Fuji Electric Holdings Co Ltd | 半導体装置 |
CN101872737A (zh) * | 2010-01-28 | 2010-10-27 | 中国科学院上海微系统与信息技术研究所 | 一种抑制soi浮体效应的mos结构及其制作方法 |
CN104167360A (zh) * | 2013-05-16 | 2014-11-26 | 无锡华润上华半导体有限公司 | 横向扩散金属氧化物半导体器件及其制造方法 |
CN105374686A (zh) * | 2014-09-02 | 2016-03-02 | 无锡华润上华半导体有限公司 | 一种ldmos器件的制作方法 |
CN105990139A (zh) * | 2015-01-30 | 2016-10-05 | 无锡华润上华半导体有限公司 | 横向扩散金属氧化物半导体场效应管的制造方法 |
CN106847894A (zh) * | 2015-12-02 | 2017-06-13 | 德克萨斯仪器股份有限公司 | 具有与栅极自对准的体扩散的ldmos器件 |
EP3255654A1 (en) * | 2016-06-12 | 2017-12-13 | Semiconductor Manufacturing International Corporation (Shanghai) | Semiconductor device and fabrication method thereof |
CN107742645A (zh) * | 2016-09-28 | 2018-02-27 | 成都芯源系统有限公司 | 具有自对准体区的ldmos器件的制造方法 |
CN108693697A (zh) * | 2017-04-04 | 2018-10-23 | 株式会社Sk电子 | 光掩模和光掩模坯以及光掩模的制造方法 |
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Publication number | Publication date |
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CN112309863A (zh) | 2021-02-02 |
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Address after: No.385, Hongcao Road, Xuhui District, Shanghai 200233 Applicant after: SHANGHAI ADVANCED SEMICONDUCTO Address before: No.385, Hongcao Road, Xuhui District, Shanghai 200233 Applicant before: ADVANCED SEMICONDUCTOR MANUFACTURING Co.,Ltd. |
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Effective date of registration: 20211109 Address after: 201306 No. 600, Yunshui Road, Lingang xinpian District, pilot Free Trade Zone, Pudong New Area, Shanghai Applicant after: Shanghai Jita Semiconductor Co.,Ltd. Address before: No.385, Hongcao Road, Xuhui District, Shanghai 200233 Applicant before: SHANGHAI ADVANCED SEMICONDUCTO |
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