CN111819266A - 一种球形或角形粉体填料的制备方法、由此得到的球形或角形粉体填料及其应用 - Google Patents

一种球形或角形粉体填料的制备方法、由此得到的球形或角形粉体填料及其应用 Download PDF

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CN111819266A
CN111819266A CN201980016671.8A CN201980016671A CN111819266A CN 111819266 A CN111819266 A CN 111819266A CN 201980016671 A CN201980016671 A CN 201980016671A CN 111819266 A CN111819266 A CN 111819266A
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spherical
angular
powder filler
siloxane
filler
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CN111819266B (zh
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陈树真
李锐
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Zhejiang Sanshi New Material Technology Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/113—Silicon oxides; Hydrates thereof
    • C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/18—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/06—Preparatory processes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/544—Silicon-containing compounds containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
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    • C09K8/00—Compositions for drilling of boreholes or wells; Compositions for treating boreholes or wells, e.g. for completion or for remedial operations
    • C09K8/02—Well-drilling compositions
    • C09K8/04—Aqueous well-drilling compositions
    • C09K8/06—Clay-free compositions

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Pigments, Carbon Blacks, Or Wood Stains (AREA)
  • Silicon Polymers (AREA)
  • Developing Agents For Electrophotography (AREA)

Abstract

本发明涉及一种球形或角形粉体填料的制备方法，包括提供包括T单位的球形或角形硅氧烷，对该球形或角形硅氧烷进行热处理，热处理温度为250度以上至有机基氧化分解温度以下，以使得球形或角形硅氧烷中的硅羟基发生缩合以得到缩合硅氧烷；加入处理剂对缩合硅氧烷进行处理，以促进缩合硅氧烷中的硅羟基缩合以得到球形或角形粉体填料，该处理剂包括硅烷偶联剂和/或二硅氮烷，至少部分硅烷偶联剂和/或二硅氮烷的分子量除以25度时的比重小于或等于210。本发明还提供一种由此得到的球形或角形粉体填料。本发明又提供一种根据上述的球形或角形粉体填料的应用。本发明提供的填料具有低诱电率、低诱电损失、无导电异物、无粗大颗粒和低放射性。

Description

PCT国内申请，说明书已公开。

Claims (11)

  1. PCT国内申请，权利要求书已公开。
CN201980016671.8A 2018-07-27 2019-02-22 一种球形或角形粉体填料的制备方法、由此得到的球形或角形粉体填料及其应用 Active CN111819266B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
PCT/CN2018/097327 WO2020019277A1 (zh) 2018-07-27 2018-07-27 一种球形粉体填料的制备方法、由此得到的球形粉体填料及其应用
CNPCT/CN2018/097327 2018-07-27
PCT/CN2019/075832 WO2020019709A1 (zh) 2018-07-27 2019-02-22 一种球形或角形粉体填料的制备方法、由此得到的球形或角形粉体填料及其应用

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CN111819266B CN111819266B (zh) 2021-06-18

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CN201880090639.XA Pending CN111868141A (zh) 2018-07-27 2018-07-27 一种球形粉体填料的制备方法、由此得到的球形粉体填料及其应用
CN201880090638.5A Pending CN111867975A (zh) 2018-07-27 2018-08-09 一种球形粉体填料的制备方法、由此得到的球形粉体填料及其应用
CN201980016671.8A Active CN111819266B (zh) 2018-07-27 2019-02-22 一种球形或角形粉体填料的制备方法、由此得到的球形或角形粉体填料及其应用

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CN201880090638.5A Pending CN111867975A (zh) 2018-07-27 2018-08-09 一种球形粉体填料的制备方法、由此得到的球形粉体填料及其应用

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JP (1) JP7333099B2 (zh)
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CN (3) CN111868141A (zh)
WO (3) WO2020019277A1 (zh)

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CN112679938A (zh) * 2020-12-25 2021-04-20 威海云山科技有限公司 匀质的a2级聚氨酯泡沫在保温材料中的应用及其制备工艺

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JP7406854B2 (ja) * 2020-02-17 2023-12-28 浙江三時紀新材科技有限公司 球状シリカ粉末充填剤の調製方法、これによって得られた粉末充填剤およびその使用
JP7401943B2 (ja) * 2020-02-17 2023-12-20 浙江三時紀新材科技有限公司 球状シリカ粉末充填剤の調製方法、これによって得られた粉末充填剤およびその使用
WO2022176448A1 (ja) * 2021-02-18 2022-08-25 住友ベークライト株式会社 熱硬化性樹脂組成物、パワーモジュール用基板およびパワーモジュール

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US20210309832A1 (en) 2021-10-07
WO2020019372A1 (zh) 2020-01-30
CN111819266B (zh) 2021-06-18
WO2020019277A1 (zh) 2020-01-30
CN111867975A (zh) 2020-10-30
WO2020019709A1 (zh) 2020-01-30
JP7333099B2 (ja) 2023-08-24
KR102328377B1 (ko) 2021-11-18
JP2021533219A (ja) 2021-12-02
KR20210014196A (ko) 2021-02-08
CN111868141A (zh) 2020-10-30

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