CN111867975A - 一种球形粉体填料的制备方法、由此得到的球形粉体填料及其应用 - Google Patents

一种球形粉体填料的制备方法、由此得到的球形粉体填料及其应用 Download PDF

Info

Publication number
CN111867975A
CN111867975A CN201880090638.5A CN201880090638A CN111867975A CN 111867975 A CN111867975 A CN 111867975A CN 201880090638 A CN201880090638 A CN 201880090638A CN 111867975 A CN111867975 A CN 111867975A
Authority
CN
China
Prior art keywords
spherical
spherical powder
powder filler
siloxane
filler
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201880090638.5A
Other languages
English (en)
Inventor
陈树真
李锐
成永红
孟国栋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhejiang Sanshi New Material Technology Co Ltd
Original Assignee
Zhejiang Sanshi New Material Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhejiang Sanshi New Material Technology Co Ltd filed Critical Zhejiang Sanshi New Material Technology Co Ltd
Publication of CN111867975A publication Critical patent/CN111867975A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/113—Silicon oxides; Hydrates thereof
    • C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/18—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/06—Preparatory processes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/544—Silicon-containing compounds containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K8/00—Compositions for drilling of boreholes or wells; Compositions for treating boreholes or wells, e.g. for completion or for remedial operations
    • C09K8/02—Well-drilling compositions
    • C09K8/04—Aqueous well-drilling compositions
    • C09K8/06—Clay-free compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Pigments, Carbon Blacks, Or Wood Stains (AREA)
  • Developing Agents For Electrophotography (AREA)
  • Silicon Polymers (AREA)

Abstract

一种球形粉体填料的制备方法，包括步骤：S1，提供组成为0‑10wt%的Q单位和90‑100wt%的T单位的球形硅氧烷；S2，对该球形硅氧烷进行热处理，以使得球形硅氧烷中的硅羟基发生缩合以得到缩合硅氧烷；以及S3，加入处理剂对缩合硅氧烷进行表面处理，以消除缩合硅氧烷中的硅羟基以得到球形粉体填料，该处理剂包括二硅氮烷或一卤硅烷，该处理剂的重量百分比添加量为0.5‑50wt%。该球形粉体填料应用于半导体封装材料、电路板及其中间半产品。该填料具有低诱电率、低诱电损失、无导电异物、无粗大颗粒和低放射性。

Description

PCT国内申请，说明书已公开。

Claims (9)

  1. PCT国内申请，权利要求书已公开。
CN201880090638.5A 2018-07-27 2018-08-09 一种球形粉体填料的制备方法、由此得到的球形粉体填料及其应用 Pending CN111867975A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
PCT/CN2018/097327 WO2020019277A1 (zh) 2018-07-27 2018-07-27 一种球形粉体填料的制备方法、由此得到的球形粉体填料及其应用
CNPCT/CN2018/097327 2018-07-27
PCT/CN2018/099603 WO2020019372A1 (zh) 2018-07-27 2018-08-09 一种球形粉体填料的制备方法、由此得到的球形粉体填料及其应用

Publications (1)

Publication Number Publication Date
CN111867975A true CN111867975A (zh) 2020-10-30

Family

ID=69180600

Family Applications (3)

Application Number Title Priority Date Filing Date
CN201880090639.XA Pending CN111868141A (zh) 2018-07-27 2018-07-27 一种球形粉体填料的制备方法、由此得到的球形粉体填料及其应用
CN201880090638.5A Pending CN111867975A (zh) 2018-07-27 2018-08-09 一种球形粉体填料的制备方法、由此得到的球形粉体填料及其应用
CN201980016671.8A Active CN111819266B (zh) 2018-07-27 2019-02-22 一种球形或角形粉体填料的制备方法、由此得到的球形或角形粉体填料及其应用

Family Applications Before (1)

Application Number Title Priority Date Filing Date
CN201880090639.XA Pending CN111868141A (zh) 2018-07-27 2018-07-27 一种球形粉体填料的制备方法、由此得到的球形粉体填料及其应用

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201980016671.8A Active CN111819266B (zh) 2018-07-27 2019-02-22 一种球形或角形粉体填料的制备方法、由此得到的球形或角形粉体填料及其应用

Country Status (5)

Country Link
US (1) US20210309832A1 (zh)
JP (1) JP7333099B2 (zh)
KR (1) KR102328377B1 (zh)
CN (3) CN111868141A (zh)
WO (3) WO2020019277A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220120644A (ko) * 2020-02-17 2022-08-30 제지앙 써드 에이지 매터리얼 테크놀로지 컴퍼니., 리미티드 구형 실리카 파우더 필러의 제조 방법, 이로부터 획득된 파우더 필러 및 그 응용
JP7401943B2 (ja) * 2020-02-17 2023-12-20 浙江三時紀新材科技有限公司 球状シリカ粉末充填剤の調製方法、これによって得られた粉末充填剤およびその使用
CN112679938B (zh) * 2020-12-25 2023-04-07 威海云山科技有限公司 匀质的a2级聚氨酯泡沫在保温材料中的应用及其制备工艺
JPWO2022176448A1 (zh) * 2021-02-18 2022-08-25

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1502122A (zh) * 2000-06-23 2004-06-02 ����Τ�����ʹ�˾ 恢复电介质膜及电介质材料中疏水性的方法
CN103083192A (zh) * 2013-02-06 2013-05-08 安泰科技股份有限公司 可固化弹性体印模材料
CN103254665A (zh) * 2013-05-14 2013-08-21 兴清永宝（北京）科技有限公司 硅烷偶联剂组合物及其制备方法和用途
CN107128935A (zh) * 2017-05-23 2017-09-05 苏州纳迪微电子有限公司 一种高纯度球形二氧化硅微粉的制备方法
WO2018065058A1 (de) * 2016-10-06 2018-04-12 Wacker Chemie Ag Verfahren zur herstellung sphärischer polysilsesquioxanpartikel

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61159450A (ja) * 1984-12-29 1986-07-19 Toshiba Silicone Co Ltd ポリオルガノシロキサン組成物
JPH0633337B2 (ja) * 1989-04-18 1994-05-02 信越化学工業株式会社 球状ポリオルガノシルセスキオキサン微粒子及びその製造方法
JPH0347848A (ja) * 1989-04-26 1991-02-28 Takeda Chem Ind Ltd プリプレグの製造法
JPH062820B2 (ja) * 1989-09-05 1994-01-12 信越化学工業株式会社 シリコーンエラストマー微粉末の製造方法
JPH0623254B2 (ja) * 1990-03-19 1994-03-30 信越化学工業株式会社 アクリロキシ基、メルカプト基含有シルセスキオキサン球状微粉末の製造方法
JPH0830150B2 (ja) * 1990-09-13 1996-03-27 信越化学工業株式会社 ポリオルガノシルセスキオキサン微粒子及びその製造法
JPH06179751A (ja) * 1992-12-14 1994-06-28 Tokuyama Soda Co Ltd ポリオルガノシルセスキオキサンの製法
JP2832143B2 (ja) * 1993-12-28 1998-12-02 信越化学工業株式会社 シリコーン微粒子およびその製造方法
JP3086629B2 (ja) * 1995-07-10 2000-09-11 信越化学工業株式会社 化粧料
JP2001152095A (ja) 1999-11-29 2001-06-05 Shin Etsu Chem Co Ltd 塗料組成物
JP2001192452A (ja) * 2000-01-13 2001-07-17 Ge Toshiba Silicones Co Ltd 球状シリコーン微粒子およびその製造方法
JP4372331B2 (ja) * 2000-11-07 2009-11-25 電気化学工業株式会社 シリカ微粉の表面改質法
US6509423B1 (en) * 2001-08-21 2003-01-21 Dow Corning Corporation Silicone composition and cured silicone product
DE102004010756A1 (de) * 2004-03-05 2005-09-22 Degussa Ag Silanisierte Kieselsäuren
JP5147095B2 (ja) 2005-09-20 2013-02-20 宇部日東化成株式会社 シリカ系フィラーおよびそれを含む透明樹脂組成物
JP2007146150A (ja) * 2005-11-02 2007-06-14 Hitachi Chem Co Ltd 封止用エポキシ樹脂組成物及びそれを用いた電子部品装置
CN100396714C (zh) * 2006-02-27 2008-06-25 中蓝晨光化工研究院 有机硅树脂的合成方法
WO2014124367A1 (en) * 2013-02-11 2014-08-14 Dow Corning Corporation Method for forming thermally conductive thermal radical cure silicone compositions
US9809682B2 (en) 2014-01-14 2017-11-07 Tokuyama Corporation Hydrophobized spherical polyalkylsilsesquioxane fine particle, external additive for toner, dry toner for electrophotography, and method of manufacturing hydrophobized spherical polyalkylsilsesquioxane fine particle
CN105080440B (zh) * 2015-07-10 2017-07-07 华烁科技股份有限公司 一种制备聚倍半硅氧烷微球的绿色环保方法
CN107177042B (zh) * 2017-07-24 2019-06-28 常熟市常吉化工有限公司 一种低挥发分球形硅树脂微粉的制备方法
CN107827117B (zh) * 2017-11-22 2020-12-22 江苏联瑞新材料股份有限公司 一种多峰形分布球形二氧化硅微粉的制备方法
CN108083286A (zh) * 2018-01-05 2018-05-29 江苏联瑞新材料股份有限公司 一种球形二氧化硅微粉及其制备方法和应用

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1502122A (zh) * 2000-06-23 2004-06-02 ����Τ�����ʹ�˾ 恢复电介质膜及电介质材料中疏水性的方法
CN103083192A (zh) * 2013-02-06 2013-05-08 安泰科技股份有限公司 可固化弹性体印模材料
CN103254665A (zh) * 2013-05-14 2013-08-21 兴清永宝（北京）科技有限公司 硅烷偶联剂组合物及其制备方法和用途
WO2018065058A1 (de) * 2016-10-06 2018-04-12 Wacker Chemie Ag Verfahren zur herstellung sphärischer polysilsesquioxanpartikel
CN107128935A (zh) * 2017-05-23 2017-09-05 苏州纳迪微电子有限公司 一种高纯度球形二氧化硅微粉的制备方法

Also Published As

Publication number Publication date
KR20210014196A (ko) 2021-02-08
CN111819266B (zh) 2021-06-18
CN111868141A (zh) 2020-10-30
JP7333099B2 (ja) 2023-08-24
WO2020019372A1 (zh) 2020-01-30
JP2021533219A (ja) 2021-12-02
US20210309832A1 (en) 2021-10-07
CN111819266A (zh) 2020-10-23
WO2020019277A1 (zh) 2020-01-30
KR102328377B1 (ko) 2021-11-18
WO2020019709A1 (zh) 2020-01-30

Similar Documents

Publication Publication Date Title
CN111801808B (zh) 一种球形或角形粉体填料的制备方法、由此得到的球形或角形粉体填料及其应用
CN111867975A (zh) 一种球形粉体填料的制备方法、由此得到的球形粉体填料及其应用
CN112236393B (zh) 一种球形二氧化硅粉体填料的制备方法、由此得到的粉体填料及其应用
JP2006526704A (ja) 光電子装置用封入剤およびその製造方法
CN113736142B (zh) 半导体封装材料或基板材料
JP7490255B2 (ja) 球状または角状の粉末フィラーの製造方法、これによって得られた球状または角状の粉末フィラーおよびその応用
CN111868918B (zh) 一种半导体封装材料的制备方法以及由此得到的半导体封装材料
WO2020168784A1 (zh) 一种球形或角形粉体填料的制备方法、由此得到的球形或角形粉体填料及其应用
CN113603103A (zh) 半导体封装材料，基板材料的制备方法，由此得到的半导体封装材料，基板材料及其应用
CN111936421B (zh) 一种球形二氧化硅粉体填料的制备方法和由此得到的球形二氧化硅粉体填料及其应用
CN113461022A (zh) 一种球形二氧化硅粉体填料的制备方法、由此得到的粉体填料及其应用
CN111065603A (zh) 一种半导体封装材料的制备方法以及由此得到的半导体封装材料
JPH04320417A (ja) 半導体封止用エポキシ樹脂組成物および半導体装置

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20201030

WD01 Invention patent application deemed withdrawn after publication