CN111725162A - 导热片、导热片的制造方法、放热部件和半导体装置 - Google Patents

导热片、导热片的制造方法、放热部件和半导体装置 Download PDF

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Publication number
CN111725162A
CN111725162A CN202010648108.7A CN202010648108A CN111725162A CN 111725162 A CN111725162 A CN 111725162A CN 202010648108 A CN202010648108 A CN 202010648108A CN 111725162 A CN111725162 A CN 111725162A
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CN
China
Prior art keywords
thermally conductive
sheet
main body
conductive sheet
carbon fibers
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010648108.7A
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English (en)
Chinese (zh)
Inventor
荒卷庆辅
金谷纮希
大门正英
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
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Dexerials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Publication of CN111725162A publication Critical patent/CN111725162A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
    • B81B3/0081—Thermal properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4068—Heatconductors between device and heatsink, e.g. compliant heat-spreaders, heat-conducting bands
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
CN202010648108.7A 2014-10-31 2015-10-27 导热片、导热片的制造方法、放热部件和半导体装置 Pending CN111725162A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2014222723 2014-10-31
JP2014-222723 2014-10-31
JP2015201410A JP6295238B2 (ja) 2014-10-31 2015-10-09 熱伝導シート、熱伝導シートの製造方法、放熱部材及び半導体装置
JP2015-201410 2015-10-09
CN201580055236.8A CN106796926B (zh) 2014-10-31 2015-10-27 导热片、导热片的制造方法、放热部件和半导体装置

Related Parent Applications (1)

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CN201580055236.8A Division CN106796926B (zh) 2014-10-31 2015-10-27 导热片、导热片的制造方法、放热部件和半导体装置

Publications (1)

Publication Number Publication Date
CN111725162A true CN111725162A (zh) 2020-09-29

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CN202010647909.1A Pending CN111739856A (zh) 2014-10-31 2015-10-27 导热片、导热片的制造方法、放热部件和半导体装置
CN202010648108.7A Pending CN111725162A (zh) 2014-10-31 2015-10-27 导热片、导热片的制造方法、放热部件和半导体装置
CN201580055236.8A Active CN106796926B (zh) 2014-10-31 2015-10-27 导热片、导热片的制造方法、放热部件和半导体装置

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CN202010647909.1A Pending CN111739856A (zh) 2014-10-31 2015-10-27 导热片、导热片的制造方法、放热部件和半导体装置

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Country Status (5)

Country Link
US (1) US9922901B2 (ja)
JP (2) JP6295238B2 (ja)
KR (1) KR102011652B1 (ja)
CN (3) CN111739856A (ja)
TW (1) TWI670464B (ja)

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KR102449343B1 (ko) * 2016-01-26 2022-10-04 데쿠세리아루즈 가부시키가이샤 열전도 시트, 열전도 시트의 제조 방법, 방열 부재 및 반도체 장치
KR102424424B1 (ko) * 2017-03-28 2022-07-22 삼성전자주식회사 전자 장치
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JP6817408B1 (ja) * 2019-12-27 2021-01-20 デクセリアルズ株式会社 熱伝導性シート及びその製造方法、熱伝導性シートの実装方法
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Also Published As

Publication number Publication date
CN106796926B (zh) 2020-07-28
US20170309542A1 (en) 2017-10-26
KR102011652B1 (ko) 2019-08-19
JP2016092407A (ja) 2016-05-23
US9922901B2 (en) 2018-03-20
TWI670464B (zh) 2019-09-01
CN111739856A (zh) 2020-10-02
TW201621256A (zh) 2016-06-16
KR20170044123A (ko) 2017-04-24
JP2017038086A (ja) 2017-02-16
CN106796926A (zh) 2017-05-31
JP6295238B2 (ja) 2018-03-14
JP6302034B2 (ja) 2018-03-28

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