CN111063785A - 发光装置的制造方法 - Google Patents

发光装置的制造方法 Download PDF

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Publication number
CN111063785A
CN111063785A CN201911315174.6A CN201911315174A CN111063785A CN 111063785 A CN111063785 A CN 111063785A CN 201911315174 A CN201911315174 A CN 201911315174A CN 111063785 A CN111063785 A CN 111063785A
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CN
China
Prior art keywords
light
emitting elements
emitting
emitting device
emitting element
Prior art date
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Pending
Application number
CN201911315174.6A
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English (en)
Chinese (zh)
Inventor
三次智纪
小关健司
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Nichia Corp
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Nichia Corp
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Filing date
Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Publication of CN111063785A publication Critical patent/CN111063785A/zh
Pending legal-status Critical Current

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/68Details of reflectors forming part of the light source
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • H10H20/036Manufacture or treatment of packages
    • H10H20/0363Manufacture or treatment of packages of optical field-shaping means
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/852Encapsulations
    • H10H20/854Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/855Optical field-shaping means, e.g. lenses
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/855Optical field-shaping means, e.g. lenses
    • H10H20/856Reflecting means
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/072Connecting or disconnecting of bump connectors
    • H10W72/07251Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/20Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)
CN201911315174.6A 2013-06-05 2014-06-05 发光装置的制造方法 Pending CN111063785A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013118558A JP6186904B2 (ja) 2013-06-05 2013-06-05 発光装置
JP2013-118558 2013-06-05
CN201410247326.4A CN104241510A (zh) 2013-06-05 2014-06-05 发光装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201410247326.4A Division CN104241510A (zh) 2013-06-05 2014-06-05 发光装置

Publications (1)

Publication Number Publication Date
CN111063785A true CN111063785A (zh) 2020-04-24

Family

ID=50828810

Family Applications (3)

Application Number Title Priority Date Filing Date
CN201911315174.6A Pending CN111063785A (zh) 2013-06-05 2014-06-05 发光装置的制造方法
CN202110086719.1A Pending CN112838156A (zh) 2013-06-05 2014-06-05 发光装置
CN201410247326.4A Pending CN104241510A (zh) 2013-06-05 2014-06-05 发光装置

Family Applications After (2)

Application Number Title Priority Date Filing Date
CN202110086719.1A Pending CN112838156A (zh) 2013-06-05 2014-06-05 发光装置
CN201410247326.4A Pending CN104241510A (zh) 2013-06-05 2014-06-05 发光装置

Country Status (4)

Country Link
US (2) US20140362570A1 (enExample)
EP (1) EP2811517B1 (enExample)
JP (1) JP6186904B2 (enExample)
CN (3) CN111063785A (enExample)

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JP7190890B2 (ja) * 2018-12-07 2022-12-16 スタンレー電気株式会社 発光装置
JP7190889B2 (ja) * 2018-12-07 2022-12-16 スタンレー電気株式会社 発光装置及び発光装置モジュール
JP6947990B2 (ja) * 2019-04-22 2021-10-13 日亜化学工業株式会社 発光装置の製造方法及び発光装置
JP7307874B2 (ja) 2019-04-26 2023-07-13 日亜化学工業株式会社 発光装置及び発光モジュール
US12074250B2 (en) * 2020-01-23 2024-08-27 BOE MLED Technology Co., Ltd. Display substrate and method of manufacturing the same, and display device
CN119630152A (zh) * 2020-03-31 2025-03-14 光宝光电(常州)有限公司 封装结构
CN113851502A (zh) * 2020-06-10 2021-12-28 华为机器有限公司 显示面板、显示装置及显示面板的制备方法
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Also Published As

Publication number Publication date
EP2811517A1 (en) 2014-12-10
JP2014236175A (ja) 2014-12-15
CN112838156A (zh) 2021-05-25
US20180195675A1 (en) 2018-07-12
CN104241510A (zh) 2014-12-24
US20140362570A1 (en) 2014-12-11
US10429011B2 (en) 2019-10-01
EP2811517B1 (en) 2020-02-26
JP6186904B2 (ja) 2017-08-30

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