CN110997981A - 铜蚀刻液 - Google Patents

铜蚀刻液 Download PDF

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Publication number
CN110997981A
CN110997981A CN201880045782.7A CN201880045782A CN110997981A CN 110997981 A CN110997981 A CN 110997981A CN 201880045782 A CN201880045782 A CN 201880045782A CN 110997981 A CN110997981 A CN 110997981A
Authority
CN
China
Prior art keywords
copper
ammonium
etching
etching solution
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201880045782.7A
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English (en)
Chinese (zh)
Inventor
希代诚
渡口繁
熊谷博之
松原敏明
中村惟之
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Meltex Inc
Original Assignee
Meltex Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Meltex Inc filed Critical Meltex Inc
Publication of CN110997981A publication Critical patent/CN110997981A/zh
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/32—Alkaline compositions
    • C23F1/34—Alkaline compositions for etching copper or alloys thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Wiring (AREA)
CN201880045782.7A 2017-07-14 2018-07-09 铜蚀刻液 Pending CN110997981A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017-137995 2017-07-14
JP2017137995 2017-07-14
PCT/JP2018/025863 WO2019013160A1 (ja) 2017-07-14 2018-07-09 銅エッチング液

Publications (1)

Publication Number Publication Date
CN110997981A true CN110997981A (zh) 2020-04-10

Family

ID=65001367

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201880045782.7A Pending CN110997981A (zh) 2017-07-14 2018-07-09 铜蚀刻液

Country Status (5)

Country Link
JP (1) JP6949306B2 (ja)
KR (1) KR102472714B1 (ja)
CN (1) CN110997981A (ja)
TW (1) TWI745603B (ja)
WO (1) WO2019013160A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111926331A (zh) * 2020-08-05 2020-11-13 上海毅蓝电子科技有限公司 碱性蚀刻液及其原位电解提铜再生利用装置和方法
CN112235951A (zh) * 2020-10-20 2021-01-15 盐城维信电子有限公司 一种不同铜厚的线路板制作方法
CN113652694A (zh) * 2021-06-24 2021-11-16 广东桐鸣环保科技有限公司 一种镀铜层剥离液以及剥离方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7330282B2 (ja) * 2019-09-30 2023-08-21 京セラ株式会社 配線基板
JP7274221B2 (ja) 2020-11-11 2023-05-16 メック株式会社 エッチング剤及び回路基板の製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51149139A (en) * 1975-06-18 1976-12-21 Yamatoya Shokai Etching liquid for copper
JPS5285935A (en) * 1976-01-12 1977-07-16 Mitsubishi Gas Chemical Co Peeling solution for copper plating
JP2005105333A (ja) * 2003-09-30 2005-04-21 Meltex Inc ウエハ上の銅エッチング液
CN102230178A (zh) * 2011-04-29 2011-11-02 西安东旺精细化学有限公司 镍或镍/铜合金的蚀刻液组合物
WO2011158634A1 (ja) * 2010-06-18 2011-12-22 三菱瓦斯化学株式会社 銅層及びモリブデン層を含む多層構造膜用エッチング液

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5010698B1 (ja) * 1970-12-26 1975-04-23
JP3962239B2 (ja) 2001-10-30 2007-08-22 株式会社Ａｄｅｋａ エッチング剤組成物及びパターン形成方法
JP4434632B2 (ja) 2003-06-10 2010-03-17 三菱瓦斯化学株式会社 プリント配線板の製造方法
DE102004030924A1 (de) * 2004-06-25 2006-01-19 Elo-Chem-Csm Gmbh Elektrolytisch regenerierbare Ätzlösung
JP4430990B2 (ja) 2004-06-29 2010-03-10 株式会社荏原電産 セミアディティブ工法用回路形成エッチング液
JP2006111953A (ja) 2004-10-18 2006-04-27 Mec Kk 銅又は銅合金のエッチング剤、その製造法、補給液及び配線基板の製造法
JP5273710B2 (ja) 2007-11-27 2013-08-28 メック株式会社 エッチング剤
JP5715088B2 (ja) 2012-05-30 2015-05-07 四国化成工業株式会社 銅のエッチング方法
CN104975183B (zh) * 2015-07-17 2017-07-14 中南大学 一种从酸性CuCl2蚀刻液中分离回收铜的方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51149139A (en) * 1975-06-18 1976-12-21 Yamatoya Shokai Etching liquid for copper
JPS5285935A (en) * 1976-01-12 1977-07-16 Mitsubishi Gas Chemical Co Peeling solution for copper plating
JP2005105333A (ja) * 2003-09-30 2005-04-21 Meltex Inc ウエハ上の銅エッチング液
WO2011158634A1 (ja) * 2010-06-18 2011-12-22 三菱瓦斯化学株式会社 銅層及びモリブデン層を含む多層構造膜用エッチング液
CN102230178A (zh) * 2011-04-29 2011-11-02 西安东旺精细化学有限公司 镍或镍/铜合金的蚀刻液组合物

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
刘德峥: "《精细化工生产工艺学》", 30 June 2000, 化学工业出版社 *
小克莱德•F•库姆斯: "《印制电路手册》", 31 January 1989, 国防工业出版社 *
谢平: "《PCB设计与加工》", 28 February 2017, 北京理工大学出版社 *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111926331A (zh) * 2020-08-05 2020-11-13 上海毅蓝电子科技有限公司 碱性蚀刻液及其原位电解提铜再生利用装置和方法
CN112235951A (zh) * 2020-10-20 2021-01-15 盐城维信电子有限公司 一种不同铜厚的线路板制作方法
CN113652694A (zh) * 2021-06-24 2021-11-16 广东桐鸣环保科技有限公司 一种镀铜层剥离液以及剥离方法

Also Published As

Publication number Publication date
JPWO2019013160A1 (ja) 2020-05-21
KR102472714B1 (ko) 2022-11-29
JP6949306B2 (ja) 2021-10-13
TWI745603B (zh) 2021-11-11
KR20200029398A (ko) 2020-03-18
WO2019013160A1 (ja) 2019-01-17
TW201908525A (zh) 2019-03-01

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