TWI745603B - 銅蝕刻液 - Google Patents

銅蝕刻液 Download PDF

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Publication number
TWI745603B
TWI745603B TW107123822A TW107123822A TWI745603B TW I745603 B TWI745603 B TW I745603B TW 107123822 A TW107123822 A TW 107123822A TW 107123822 A TW107123822 A TW 107123822A TW I745603 B TWI745603 B TW I745603B
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TW
Taiwan
Prior art keywords
copper
ammonium
etching
etching solution
circuit
Prior art date
Application number
TW107123822A
Other languages
English (en)
Chinese (zh)
Other versions
TW201908525A (zh
Inventor
希代誠
渡口繁
熊谷博之
松原敏明
中村惟之
Original Assignee
日商梅爾帝克斯股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 日商梅爾帝克斯股份有限公司 filed Critical 日商梅爾帝克斯股份有限公司
Publication of TW201908525A publication Critical patent/TW201908525A/zh
Application granted granted Critical
Publication of TWI745603B publication Critical patent/TWI745603B/zh

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/32—Alkaline compositions
    • C23F1/34—Alkaline compositions for etching copper or alloys thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW107123822A 2017-07-14 2018-07-10 銅蝕刻液 TWI745603B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-137995 2017-07-14
JP2017137995 2017-07-14

Publications (2)

Publication Number Publication Date
TW201908525A TW201908525A (zh) 2019-03-01
TWI745603B true TWI745603B (zh) 2021-11-11

Family

ID=65001367

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107123822A TWI745603B (zh) 2017-07-14 2018-07-10 銅蝕刻液

Country Status (5)

Country Link
JP (1) JP6949306B2 (ja)
KR (1) KR102472714B1 (ja)
CN (1) CN110997981A (ja)
TW (1) TWI745603B (ja)
WO (1) WO2019013160A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021065601A1 (ja) * 2019-09-30 2021-04-08 京セラ株式会社 配線基板
CN111926331A (zh) * 2020-08-05 2020-11-13 上海毅蓝电子科技有限公司 碱性蚀刻液及其原位电解提铜再生利用装置和方法
CN112235951B (zh) * 2020-10-20 2021-09-21 盐城维信电子有限公司 一种不同铜厚的线路板制作方法
JP7274221B2 (ja) 2020-11-11 2023-05-16 メック株式会社 エッチング剤及び回路基板の製造方法
CN113652694A (zh) * 2021-06-24 2021-11-16 广东桐鸣环保科技有限公司 一种镀铜层剥离液以及剥离方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102230178A (zh) * 2011-04-29 2011-11-02 西安东旺精细化学有限公司 镍或镍/铜合金的蚀刻液组合物
TW201211312A (en) * 2010-06-18 2012-03-16 Mitsubishi Gas Chemical Co Etching solution for multilayer film structures containing copper and molybdenum layers
CN104975183A (zh) * 2015-07-17 2015-10-14 中南大学 一种从酸性CuCl2蚀刻液中分离回收铜的方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5010698B1 (ja) * 1970-12-26 1975-04-23
JPS51149139A (en) * 1975-06-18 1976-12-21 Yamatoya Shokai Etching liquid for copper
JPS5285935A (en) * 1976-01-12 1977-07-16 Mitsubishi Gas Chemical Co Peeling solution for copper plating
JP3962239B2 (ja) 2001-10-30 2007-08-22 株式会社Ａｄｅｋａ エッチング剤組成物及びパターン形成方法
JP4434632B2 (ja) 2003-06-10 2010-03-17 三菱瓦斯化学株式会社 プリント配線板の製造方法
JP4129218B2 (ja) * 2003-09-30 2008-08-06 メルテックス株式会社 ウエハ上の銅エッチング液
DE102004030924A1 (de) * 2004-06-25 2006-01-19 Elo-Chem-Csm Gmbh Elektrolytisch regenerierbare Ätzlösung
JP4430990B2 (ja) 2004-06-29 2010-03-10 株式会社荏原電産 セミアディティブ工法用回路形成エッチング液
JP2006111953A (ja) 2004-10-18 2006-04-27 Mec Kk 銅又は銅合金のエッチング剤、その製造法、補給液及び配線基板の製造法
JP5273710B2 (ja) 2007-11-27 2013-08-28 メック株式会社 エッチング剤
JP5715088B2 (ja) 2012-05-30 2015-05-07 四国化成工業株式会社 銅のエッチング方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201211312A (en) * 2010-06-18 2012-03-16 Mitsubishi Gas Chemical Co Etching solution for multilayer film structures containing copper and molybdenum layers
CN102230178A (zh) * 2011-04-29 2011-11-02 西安东旺精细化学有限公司 镍或镍/铜合金的蚀刻液组合物
CN104975183A (zh) * 2015-07-17 2015-10-14 中南大学 一种从酸性CuCl2蚀刻液中分离回收铜的方法

Also Published As

Publication number Publication date
WO2019013160A1 (ja) 2019-01-17
JP6949306B2 (ja) 2021-10-13
KR102472714B1 (ko) 2022-11-29
KR20200029398A (ko) 2020-03-18
TW201908525A (zh) 2019-03-01
JPWO2019013160A1 (ja) 2020-05-21
CN110997981A (zh) 2020-04-10

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