CN110461768B - 二氧化硅粒子 - Google Patents

二氧化硅粒子 Download PDF

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CN110461768B
CN110461768B CN201880021559.9A CN201880021559A CN110461768B CN 110461768 B CN110461768 B CN 110461768B CN 201880021559 A CN201880021559 A CN 201880021559A CN 110461768 B CN110461768 B CN 110461768B
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silica particles
silica
mass
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CN110461768A (zh
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西村仁希
小野勇二
芝崎将一
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Nippon Shokubai Co Ltd
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    • C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
    • C09C1/28—Compounds of silicon
    • C09C1/30—Silicic acid
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    • C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/18—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof
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    • C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
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  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Silicon Compounds (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
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CN201880021559.9A 2017-04-06 2018-04-05 二氧化硅粒子 Active CN110461768B (zh)

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JP2017-076024 2017-04-06
JP2017076024 2017-04-06
JP2017-126981 2017-06-29
JP2017126981 2017-06-29
PCT/JP2018/014577 WO2018186468A1 (ja) 2017-04-06 2018-04-05 シリカ粒子

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CN110461768B true CN110461768B (zh) 2022-11-29

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EP (1) EP3608292B1 (enExample)
JP (2) JP6800316B2 (enExample)
KR (1) KR102450033B1 (enExample)
CN (1) CN110461768B (enExample)
WO (1) WO2018186468A1 (enExample)

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JP6564517B1 (ja) * 2018-12-17 2019-08-21 株式会社アドマテックス 電子材料用フィラー及びその製造方法、電子材料用樹脂組成物の製造方法、高周波用基板、並びに電子材料用スラリー
JP7509147B2 (ja) * 2019-07-26 2024-07-02 住友電気工業株式会社 光ファイバリボン及び光ファイバケーブル
JP7333225B2 (ja) * 2019-08-23 2023-08-24 株式会社日本触媒 （メタ）アクリル樹脂の製造方法及び（メタ）アクリル樹脂
JP7516763B2 (ja) * 2020-01-28 2024-07-17 三菱ケミカル株式会社 シリカ粒子の製造方法、シリカゾルの製造方法、中間生成物の除去方法及び研磨方法
CN115397775B (zh) * 2020-03-31 2024-08-06 日产化学株式会社 表面改性二氧化硅粒子的有机溶剂分散溶胶的制造方法
US12265270B2 (en) * 2021-03-08 2025-04-01 Corning Research & Development Corporation Flame retardant compositions for buffer tubes and method of making same
CN113698554B (zh) * 2021-09-16 2024-05-07 西安热工研究院有限公司 一种以纳米SiO2为内核的阴离子交换树脂及其制备方法
WO2023068152A1 (ja) * 2021-10-18 2023-04-27 三菱マテリアル電子化成株式会社 表面処理シリカ粒子分散ゾル及びその製造方法
CN113861812B (zh) * 2021-12-02 2022-03-29 富维薄膜（山东）有限公司 一种聚酯薄膜用涂布液及其应用
TWI815246B (zh) * 2021-12-16 2023-09-11 臺灣塑膠工業股份有限公司 矽基粉體及其製造方法
JP2023108405A (ja) * 2022-01-25 2023-08-04 日揮触媒化成株式会社 有機無機複合微粒子分散液およびその製造方法、並びに砥粒分散液
KR20250030503A (ko) * 2022-07-22 2025-03-05 가부시키가이샤 닛폰 쇼쿠바이 조성물
CN119968338A (zh) * 2022-09-30 2025-05-09 日产化学株式会社 含有胺的中空二氧化硅粒子的有机溶剂溶胶及其制造方法
TW202440460A (zh) * 2022-10-31 2024-10-16 日商日產化學股份有限公司 有機矽溶膠、及其製造方法

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EP3608292A4 (en) 2020-12-23
JP2021042122A (ja) 2021-03-18
JPWO2018186468A1 (ja) 2019-11-07
KR102450033B1 (ko) 2022-09-30
EP3608292B1 (en) 2024-11-27
US11214492B2 (en) 2022-01-04
JP6800316B2 (ja) 2020-12-16
EP3608292A1 (en) 2020-02-12
CN110461768A (zh) 2019-11-15
KR20190120827A (ko) 2019-10-24
JP7128250B2 (ja) 2022-08-30
US20200131044A1 (en) 2020-04-30

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