CN109791887B - 第一保护膜形成用片 - Google Patents

第一保护膜形成用片 Download PDF

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Publication number
CN109791887B
CN109791887B CN201780061254.6A CN201780061254A CN109791887B CN 109791887 B CN109791887 B CN 109791887B CN 201780061254 A CN201780061254 A CN 201780061254A CN 109791887 B CN109791887 B CN 109791887B
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China
Prior art keywords
resin film
curable resin
buffer layer
meth
protective film
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CN201780061254.6A
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English (en)
Chinese (zh)
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CN109791887A (zh
Inventor
山岸正宪
安达一政
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Lintec Corp
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Lintec Corp
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Publication of CN109791887A publication Critical patent/CN109791887A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Dicing (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
CN201780061254.6A 2016-10-05 2017-09-08 第一保护膜形成用片 Active CN109791887B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016-197523 2016-10-05
JP2016197523 2016-10-05
PCT/JP2017/032468 WO2018066302A1 (ja) 2016-10-05 2017-09-08 第１保護膜形成用シート

Publications (2)

Publication Number Publication Date
CN109791887A CN109791887A (zh) 2019-05-21
CN109791887B true CN109791887B (zh) 2023-04-28

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ID=61830909

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201780061254.6A Active CN109791887B (zh) 2016-10-05 2017-09-08 第一保护膜形成用片

Country Status (7)

Country Link
JP (1) JP6344811B1 (ja)
KR (1) KR102412725B1 (ja)
CN (1) CN109791887B (ja)
PH (1) PH12019500713A1 (ja)
SG (1) SG11201902955QA (ja)
TW (1) TWI649195B (ja)
WO (1) WO2018066302A1 (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108821231B (zh) * 2018-06-26 2019-08-09 清华大学 一种基于力学原理的表面具有微结构的高弹性基体及方法
JP2020063362A (ja) * 2018-10-17 2020-04-23 住友ベークライト株式会社 湿式摩擦材用接着剤組成物
JP6859376B2 (ja) * 2019-01-22 2021-04-14 グンゼ株式会社 カバーフィルム
JP6697603B1 (ja) * 2019-03-27 2020-05-20 グンゼ株式会社 カバーフィルム
JPWO2021171898A1 (ja) * 2020-02-27 2021-09-02
JP7323734B1 (ja) * 2022-01-12 2023-08-08 リンテック株式会社 第１保護膜形成用シート、半導体装置の製造方法、及びシートの使用

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012169484A (ja) * 2011-02-15 2012-09-06 Nitto Denko Corp 半導体装置の製造方法
JP2013004872A (ja) * 2011-06-20 2013-01-07 Hitachi Chem Co Ltd 半導体装置の製造方法、フィルム状接着剤及び接着剤シート
JP2013123003A (ja) * 2011-12-12 2013-06-20 Nitto Denko Corp 積層シート、及び、積層シートを用いた半導体装置の製造方法
KR20140044758A (ko) * 2012-10-05 2014-04-15 린텍 가부시키가이샤 표면 보호 시트
KR20140069508A (ko) * 2012-11-29 2014-06-10 제일모직주식회사 반도체 웨이퍼 표면 보호용 점착 필름
JP2015005598A (ja) * 2013-06-20 2015-01-08 古河電気工業株式会社 半導体ウエハ表面保護用粘着テープ
JP2015084352A (ja) * 2013-10-25 2015-04-30 東レ株式会社 回路部材接着用積層シートおよび半導体装置の製造方法
CN104797423A (zh) * 2012-11-30 2015-07-22 琳得科株式会社 带固化性树脂膜形成层的片材以及使用了该片材的半导体装置的制造方法
JP2015183008A (ja) * 2014-03-20 2015-10-22 リンテック株式会社 粘着シート
CN105452408A (zh) * 2013-09-30 2016-03-30 琳得科株式会社 树脂膜形成用复合片
CN105765699A (zh) * 2013-11-22 2016-07-13 琳得科株式会社 切割片用基材膜及基材膜的制造方法
KR20160111385A (ko) * 2014-01-21 2016-09-26 린텍 가부시키가이샤 웨이퍼 보호용 점착 시트

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5666335B2 (ja) 2011-02-15 2015-02-12 日東電工株式会社 保護層形成用フィルム
JP6347657B2 (ja) * 2014-04-22 2018-06-27 デクセリアルズ株式会社 保護テープ、及びこれを用いた半導体装置の製造方法

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012169484A (ja) * 2011-02-15 2012-09-06 Nitto Denko Corp 半導体装置の製造方法
JP2013004872A (ja) * 2011-06-20 2013-01-07 Hitachi Chem Co Ltd 半導体装置の製造方法、フィルム状接着剤及び接着剤シート
JP2013123003A (ja) * 2011-12-12 2013-06-20 Nitto Denko Corp 積層シート、及び、積層シートを用いた半導体装置の製造方法
KR20140044758A (ko) * 2012-10-05 2014-04-15 린텍 가부시키가이샤 표면 보호 시트
KR20140069508A (ko) * 2012-11-29 2014-06-10 제일모직주식회사 반도체 웨이퍼 표면 보호용 점착 필름
CN104797423A (zh) * 2012-11-30 2015-07-22 琳得科株式会社 带固化性树脂膜形成层的片材以及使用了该片材的半导体装置的制造方法
JP2015005598A (ja) * 2013-06-20 2015-01-08 古河電気工業株式会社 半導体ウエハ表面保護用粘着テープ
CN105452408A (zh) * 2013-09-30 2016-03-30 琳得科株式会社 树脂膜形成用复合片
JP2015084352A (ja) * 2013-10-25 2015-04-30 東レ株式会社 回路部材接着用積層シートおよび半導体装置の製造方法
CN105765699A (zh) * 2013-11-22 2016-07-13 琳得科株式会社 切割片用基材膜及基材膜的制造方法
KR20160111385A (ko) * 2014-01-21 2016-09-26 린텍 가부시키가이샤 웨이퍼 보호용 점착 시트
JP2015183008A (ja) * 2014-03-20 2015-10-22 リンテック株式会社 粘着シート

Also Published As

Publication number Publication date
TWI649195B (zh) 2019-02-01
JPWO2018066302A1 (ja) 2018-10-04
CN109791887A (zh) 2019-05-21
KR20190056385A (ko) 2019-05-24
JP6344811B1 (ja) 2018-06-20
KR102412725B1 (ko) 2022-06-23
WO2018066302A1 (ja) 2018-04-12
PH12019500713A1 (en) 2019-11-11
SG11201902955QA (en) 2019-05-30
TW201821270A (zh) 2018-06-16

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