CN109511231B - 一种ic焊盘阻焊防短路设计 - Google Patents
一种ic焊盘阻焊防短路设计 Download PDFInfo
- Publication number
- CN109511231B CN109511231B CN201811607115.1A CN201811607115A CN109511231B CN 109511231 B CN109511231 B CN 109511231B CN 201811607115 A CN201811607115 A CN 201811607115A CN 109511231 B CN109511231 B CN 109511231B
- Authority
- CN
- China
- Prior art keywords
- solder mask
- printing
- solder
- bridge
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/163—Monitoring a manufacturing process
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
Description
Claims (7)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811607115.1A CN109511231B (zh) | 2018-12-27 | 2018-12-27 | 一种ic焊盘阻焊防短路设计 |
CN201911056149.0A CN110719704A (zh) | 2018-12-27 | 2018-12-27 | 一种ic焊盘 |
CN201911063279.7A CN110809363B (zh) | 2018-12-27 | 2018-12-27 | 一种ic焊盘 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811607115.1A CN109511231B (zh) | 2018-12-27 | 2018-12-27 | 一种ic焊盘阻焊防短路设计 |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201911056149.0A Division CN110719704A (zh) | 2018-12-27 | 2018-12-27 | 一种ic焊盘 |
CN201911063279.7A Division CN110809363B (zh) | 2018-12-27 | 2018-12-27 | 一种ic焊盘 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN109511231A CN109511231A (zh) | 2019-03-22 |
CN109511231B true CN109511231B (zh) | 2019-12-27 |
Family
ID=65755328
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201811607115.1A Active CN109511231B (zh) | 2018-12-27 | 2018-12-27 | 一种ic焊盘阻焊防短路设计 |
CN201911063279.7A Active CN110809363B (zh) | 2018-12-27 | 2018-12-27 | 一种ic焊盘 |
CN201911056149.0A Withdrawn CN110719704A (zh) | 2018-12-27 | 2018-12-27 | 一种ic焊盘 |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201911063279.7A Active CN110809363B (zh) | 2018-12-27 | 2018-12-27 | 一种ic焊盘 |
CN201911056149.0A Withdrawn CN110719704A (zh) | 2018-12-27 | 2018-12-27 | 一种ic焊盘 |
Country Status (1)
Country | Link |
---|---|
CN (3) | CN109511231B (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110913601B (zh) * | 2019-11-18 | 2021-08-24 | 大连崇达电路有限公司 | 一种阻焊平移菲林的制作方法 |
CN111642079B (zh) * | 2020-06-03 | 2021-12-21 | 瑞声精密制造科技(常州)有限公司 | 柔性电路板的丝网印刷方法、制备方法及柔性电路板 |
CN114900976B (zh) * | 2022-04-13 | 2024-03-01 | 深圳壹卡科技有限公司 | 一种高密度线路板对位焊接结构及生产方法 |
CN114900987B (zh) * | 2022-04-13 | 2024-02-02 | 峻凌电子(合肥)有限公司 | 一种高密度线路板对位焊接结构及生产方法 |
CN114786364B (zh) * | 2022-06-22 | 2022-08-23 | 广东科翔电子科技股份有限公司 | 一种Mini-LED PCB微小焊盘阻焊偏位控制方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014030867A1 (ko) * | 2012-08-23 | 2014-02-27 | Cho Hyoyoung | 인쇄회로기판의 솔더 레지스트 형성 방법 및 그 방법으로 제조된 인쇄회로기판 |
CN103200777A (zh) * | 2013-04-22 | 2013-07-10 | 景旺电子(深圳)有限公司 | 一种厚铜板精细阻焊桥的制作方法 |
CN105592629B (zh) * | 2014-10-24 | 2018-09-04 | 深圳崇达多层线路板有限公司 | 一种阻焊检查焊盘的设计方法 |
CN105208788B (zh) * | 2015-08-11 | 2018-04-03 | 深圳崇达多层线路板有限公司 | 一种提高阻焊层与阻焊层对位精度的方法 |
CN107708322B (zh) * | 2017-10-30 | 2021-06-15 | 大连崇达电路有限公司 | 一种阻焊桥脱落的返工修复方法 |
-
2018
- 2018-12-27 CN CN201811607115.1A patent/CN109511231B/zh active Active
- 2018-12-27 CN CN201911063279.7A patent/CN110809363B/zh active Active
- 2018-12-27 CN CN201911056149.0A patent/CN110719704A/zh not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
CN110809363A (zh) | 2020-02-18 |
CN110719704A (zh) | 2020-01-21 |
CN109511231A (zh) | 2019-03-22 |
CN110809363B (zh) | 2022-12-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN109511231B (zh) | 一种ic焊盘阻焊防短路设计 | |
CN106231802B (zh) | 一种金属化半槽的制作方法 | |
CN106973514A (zh) | 一种pcb中pad的制作方法 | |
CN104812178B (zh) | 具有分段式金手指的电路板的制作方法 | |
CN103179796A (zh) | 线路板制造方法及使用该方法制造的线路板 | |
CN107027245A (zh) | 一种阻焊桥的制作方法 | |
CN104883827A (zh) | 一种线路板导电孔进行树脂塞孔的制造工艺 | |
CN110798983B (zh) | 一种应用于pcb半塞孔溢油上焊盘的改善方法 | |
CN108124384A (zh) | 无内定位的小尺寸线路板成型加工方法 | |
CN107172833A (zh) | 一种高落差阶梯电路板的制作方法 | |
CN111479400A (zh) | 一种线路板的化学沉金板漏镀处理方法 | |
CN110944454A (zh) | 电路板生产工艺 | |
CN114615830B (zh) | 一种改善埋铜块电路板压合溢胶的方法 | |
CN113473711A (zh) | 一种去除pcb板l型槽孔孔内铜丝的方法 | |
CN107484357A (zh) | 一种非对称式多板材嵌套拼贴式混压板的制作方法 | |
JP3420147B2 (ja) | プリント配線母板の加工方法及びプリント配線母板 | |
KR20210086934A (ko) | 연성 회로 기판의 보강구조 | |
CN110856358A (zh) | 一种用于cof线路成形的方法 | |
CN220528292U (zh) | 一种柔性线路板涨缩控制的面板 | |
CN211702554U (zh) | 一种带有保护围墙的基板 | |
CN106358363A (zh) | 一种印刷电路板设计方法、印刷电路板及终端设备 | |
JPS6167936A (ja) | 半導体装置の製造方法 | |
CN107750095B (zh) | 一种多孔薄板的贴膜制作方法 | |
CN212979530U (zh) | 用于金手指阻焊油墨印刷的菲林挡油网板 | |
CN107592746A (zh) | 一种fpc阻焊曝光对位方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB03 | Change of inventor or designer information | ||
CB03 | Change of inventor or designer information |
Inventor after: Feng Pinbing Inventor after: Yang Xiaohong Inventor after: Huang Qiuling Inventor before: Yang Xiaohong Inventor before: Huang Qiuling |
|
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20191202 Address after: 518000 zone B, floor 12, Tangwei Xinyuan Industrial Zone, Fuyong street, Bao'an District, Shenzhen City, Guangdong Province Applicant after: Shenzhen Ruibang Multilayer Circuit Board Technology Co., Ltd. Address before: 518000 2nd Floor, Songyuan Wai, Egongling Community, Pinghu Street, Longgang District, Shenzhen City, Guangdong Province Applicant before: Shenzhen Guarantee Electronics Co., Ltd. |
|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20210628 Address after: 518000 402, No. 35, Sanhe Village, Tongsheng community, Dalang street, Longhua District, Shenzhen City, Guangdong Province Patentee after: Shenzhen gaochuangde Technology Co.,Ltd. Address before: 518000 area B, 2nd floor, building 12, Tangwei Xinyuan Industrial Zone, Fuyong street, Bao'an District, Shenzhen City, Guangdong Province Patentee before: Shenzhen Ruibang Multilayer Circuit Board Technology Co.,Ltd. |