CN114900976B - 一种高密度线路板对位焊接结构及生产方法 - Google Patents
一种高密度线路板对位焊接结构及生产方法 Download PDFInfo
- Publication number
- CN114900976B CN114900976B CN202210385418.3A CN202210385418A CN114900976B CN 114900976 B CN114900976 B CN 114900976B CN 202210385418 A CN202210385418 A CN 202210385418A CN 114900976 B CN114900976 B CN 114900976B
- Authority
- CN
- China
- Prior art keywords
- welding
- circuit board
- outer layer
- film
- pins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000003466 welding Methods 0.000 title claims abstract description 58
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 37
- 229910000679 solder Inorganic materials 0.000 claims description 20
- 238000005553 drilling Methods 0.000 claims description 17
- 238000009713 electroplating Methods 0.000 claims description 16
- 230000008602 contraction Effects 0.000 claims description 10
- 238000003475 lamination Methods 0.000 claims description 10
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 9
- 238000005530 etching Methods 0.000 claims description 7
- 238000010019 resist printing Methods 0.000 claims description 7
- 238000006073 displacement reaction Methods 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 4
- 238000007747 plating Methods 0.000 claims description 3
- 238000005406 washing Methods 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 238000004381 surface treatment Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 25
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202210385418.3A CN114900976B (zh) | 2022-04-13 | 2022-04-13 | 一种高密度线路板对位焊接结构及生产方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202210385418.3A CN114900976B (zh) | 2022-04-13 | 2022-04-13 | 一种高密度线路板对位焊接结构及生产方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN114900976A CN114900976A (zh) | 2022-08-12 |
CN114900976B true CN114900976B (zh) | 2024-03-01 |
Family
ID=82716842
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202210385418.3A Active CN114900976B (zh) | 2022-04-13 | 2022-04-13 | 一种高密度线路板对位焊接结构及生产方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN114900976B (zh) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001196731A (ja) * | 2000-01-13 | 2001-07-19 | Sony Corp | バンプ形成方法および半導体チップの接合方法 |
CN103687466A (zh) * | 2012-08-30 | 2014-03-26 | 株式会社日立高新技术仪器 | 部件安装方法和部件安装装置 |
CN107567200A (zh) * | 2017-09-22 | 2018-01-09 | 广州兴森快捷电路科技有限公司 | 电路板焊盘修复方法 |
CN208338000U (zh) * | 2018-05-04 | 2019-01-04 | 东莞塘厦裕华电路板有限公司 | 印刷集成电路板备用管位结构 |
CN109511231A (zh) * | 2018-12-27 | 2019-03-22 | 深圳市确保电子有限公司 | 一种ic焊盘阻焊防短路设计 |
WO2020054620A1 (ja) * | 2018-09-10 | 2020-03-19 | 株式会社デンソー | スリーブはんだ付け装置 |
-
2022
- 2022-04-13 CN CN202210385418.3A patent/CN114900976B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001196731A (ja) * | 2000-01-13 | 2001-07-19 | Sony Corp | バンプ形成方法および半導体チップの接合方法 |
CN103687466A (zh) * | 2012-08-30 | 2014-03-26 | 株式会社日立高新技术仪器 | 部件安装方法和部件安装装置 |
CN107567200A (zh) * | 2017-09-22 | 2018-01-09 | 广州兴森快捷电路科技有限公司 | 电路板焊盘修复方法 |
CN208338000U (zh) * | 2018-05-04 | 2019-01-04 | 东莞塘厦裕华电路板有限公司 | 印刷集成电路板备用管位结构 |
WO2020054620A1 (ja) * | 2018-09-10 | 2020-03-19 | 株式会社デンソー | スリーブはんだ付け装置 |
CN109511231A (zh) * | 2018-12-27 | 2019-03-22 | 深圳市确保电子有限公司 | 一种ic焊盘阻焊防短路设计 |
Also Published As
Publication number | Publication date |
---|---|
CN114900976A (zh) | 2022-08-12 |
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TA01 | Transfer of patent application right |
Effective date of registration: 20240130 Address after: F2-601, Building F, Tianyou Maker Industrial Park, No. 2 Lixin Road, Qiaotou Community, Fuhai Street, Bao'an District, Shenzhen City, Guangdong Province, 518000 Applicant after: Shenzhen Yika Technology Co.,Ltd. Country or region after: China Address before: 518000, Building 12, Building 302, Xinyuan Industrial Zone, Tangwei Community, Fuhai Street, Bao'an District, Shenzhen, Guangdong Province. There are business premises located on the 1st and 2nd floors of Building 10, Xinyuan Industrial Zone, Tangwei Community, Fuhai Street, Bao'an District, Shenzhen, engaged in production and business activities at Foxconn Technology Applicant before: Shenzhen Ruibang Multilayer Circuit Board Technology Co.,Ltd. Country or region before: China |
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