CN108074827A - 指纹识别模块及其制造方法 - Google Patents
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Abstract
本公开是提供一种指纹识别模块及其制造方法。该指纹识别模块包括一柔性电路板、一晶粒、一粘胶层以及一盖板。该制造方法包括下述步骤:(a)将该晶粒直接焊接于该柔性电路板上,且使该晶粒电性连接于该柔性电路板;(b)涂布该粘胶层于该晶粒的一上表面;(c)将一盖板迭覆于该粘胶层,使与该粘胶层粘合;以及(d)对界定于该盖板以及该柔性电路板之间的一封装空间实施一低压注塑封装,以于该封装空间形成一封装层并有防水的效果。
Description
技术领域
本公开涉及一种指纹识别模块及其制造方法,特别是一种晶粒直接设置于柔性电路板上的指纹识别模块及其制造方法。
背景技术
随着科技的快速发展,基本上已人人配备一支行动电子装置或笔记本电脑,为便于使用者在行动电子装置或笔记本电脑能安全地被识别身份,目前最普遍流行的生物识别类别的方式为指纹识别。
请参图1,图1为现有指纹识别模块的剖面示意图。现有指纹识别模块1包括一柔性电路板11、一锡膏12、一IC基板13以及一晶粒14。现有指纹识别模块1的制造方式为,先将从晶圆切割下来的一颗颗晶粒14通过点胶固定在IC基板13上,接者,进行焊线,使每一晶粒14上的多个接点电性连接于IC基板。完成焊线之后,接着执行封装制程,即封装位于IC基板13上的晶粒14以及焊线。其后,执行切割,将封装好的多个晶粒14以电脑数值控制工具机(Computerized Numerical Control;CNC)或激光方式连同IC基板13切割分离,而成为一颗颗的集成电路IC。为了能将集成电路IC应用于各式电子装置之中,集成电路IC需再经由表面固着技术固定在柔性电路板11上,比如通过锡膏12粘合在柔性电路板11上。最后再对柔性电路板11以及集成电路IC共同进行封胶,以达防水效果。
然而,上述现有的制程步骤复杂,且相关设备昂贵,因而导致封装制造的成本高居不下。有鉴于此,现有的指纹识别模块的制造方法仍亟待改进。
发明内容
本发明的主要目的在于提供一种指纹识别模块及其制造方法,通过将晶粒直接设置于柔性电路板上,且直接于柔性电路板上进行封装,以简化整个指纹识别模块的制程步骤,降低制造成本。
本公开的一优选实施概念,在于提供一种真空压合指纹识别模块的制造方法,包括下述步骤:
(a)将一晶粒直接连接固定于一柔性电路板上,且使该晶粒电性连接于该柔性电路板;
(b)涂布一粘胶层于该晶粒的一上表面;
(c)将一盖板迭覆于该粘胶层,以与该粘胶层粘合;以及
(d)对界定于该盖板以及该柔性电路板之间的一封装空间实施一低压注塑封装,以于该封装空间形成一封装层。
于一优选实施例中,于步骤(d)中,还包括下述步骤:
(d1)将该柔性电路板、该晶粒、该粘胶层以及该盖板一同放入一模具;
(d2)调整该模具处于1.5~40巴(bar)的压力;以及
(d3)注入一热融材料于该模具中,使该热融材料流入该封装空间,并于该封装空间固化形成该封装层,其中,该封装层密封该晶粒。
如于一优选实施例中,于步骤(d3)中,还包括下述步骤:
(d30)经由该模具的一入料口朝由该晶粒的一环侧边的该封装空间注塑该热融材料。
于一优选实施例中,于步骤(a)前,还包括下列步骤:
(a0)切割一晶圆成为多个晶粒。
于一优选实施例中,于步骤(d)后,还包括下列步骤:
(e)将已相互固接结合的该柔性电路板、该晶粒、该粘胶层、该盖板以及该封装层自该模具脱膜取出。
本公开的一优选实施概念,在于提供一种指纹识别模块,包括:
一柔性电路板;
一晶粒,设置于该柔性电路板上,且与该柔性电路板电性连接;
一粘胶层,涂布于该晶粒的一上表面;
一盖板,迭覆于该粘胶层;以及
一封装层,固化形成于该柔性电路板以及该盖板之间,并密封该晶粒。
于一优选实施例中,该封装层是选自一热融材料。
于一优选实施例中,该封装层的一上表面接抵于该盖板,该封装层的一下表面接抵于该柔性电路板,且该封装层环绕密封该晶粒。
于一优选实施例中,该粘胶层为一晶粒粘贴薄膜(Die Attach Film;DAF)或是一水胶。
于一优选实施例中,该指纹识别模块还包括一承载板,该承载板位于该柔性电路板的下方,以承载该柔性电路板。
附图说明
图1为现有指纹识别模块的一剖面示意图。
图2为本公开指纹识别模块的晶粒固定于柔性电路板的一剖面示意图。
图3为本公开指纹识别模块的粘胶层涂布于晶粒的上表面的一剖面示意图。
图4为本公开指纹识别模块的盖板迭覆于粘胶层的一剖面示意图。
图5为本公开指纹识别模块的盖板、粘胶层、晶粒、柔性电路板放置于低压注塑模具的一剖面示意图。
图6为本公开指纹识别模块完成低压注塑封装后的一剖面示意图。
图7为本公开指纹识别模块的制造方法的一流程图。
附图标记说明:
1 现有指纹识别模块 11 柔性电路板
12 锡膏 13 IC基板
14 晶粒 2 指纹识别模块
21 柔性电路板 22 晶粒
22a 金属接点 23 粘胶层
24 盖板 25 封装层
26 承载板 27 联接器
9 模具 90 封装空间
S0 步骤(a0) S1 步骤(a)
S2 步骤(b) S3 步骤(c)
S4 步骤(d) S41 步骤(d1)
S42 步骤(d2) S43 步骤(d3)
S430 步骤(d30) S5 步骤(e)
具体实施方式
请参阅图6,图6为本公开指纹识别模块完成低压注塑封装后的一剖面示意图,即本公开指纹识别模块的成品。。本公开指纹识别模块2包括一柔性电路板21、一晶粒22、一粘胶层23、一盖板24以及一封装层25。于此需先说明者为,柔性电路板(Flexible PrintCircuit;FPC)一般又简称软板,其经过蚀刻等加工等过程,最后会留下所需的多个线路(图未示),以作为电子信号传输媒介。其中,本公开的晶粒22为硅穿孔(Through-Silicon Via;TSV)的制程,晶粒22直接接触设置于柔性电路板的线路上,以达到晶粒22与柔性电路板21相互电性连接的目的。
再者,为了将盖板24设置于晶粒22的上方,晶粒22与盖板24之间设置有一粘胶层23,此即,晶粒22的一上表面涂布有粘胶层23,以供盖板24迭合且粘合于粘胶层23其上。于一优选实施方式中,粘胶层23为一晶粒粘贴薄膜(Die Attach Film;DAF)或是一水胶,但并不仅限于此。
本公开指纹识别模块的封装层25则是固化形成于柔性电路板21以及盖板24之间,并密封晶粒22。其中,封装层25的一上表面接抵于盖板24,封装层25的一下表面接抵于柔性电路板21,且封装层25环绕密封晶粒22。因此,晶粒22的周围被完全的密封,以防止外界的水气或灰尘侵蚀到晶粒22的金属接点,藉此以强固整体指纹识别模块2的结合性,且提高整体指纹识别模块2的信赖性。于一优选实施方式中,封装层25是选自一热融材料,该热融材料的本身特性是在室温之下为固体,但在加热到特定温度时熔融成为流体粘合剂。
本公开指纹识别模块2还包括一承载板26,承载板26位于柔性电路板21的下方,承载柔性电路板21,以提高整体指纹识别模块2的结构强度。于一优选实施方式中,承载板26为一结构补强钢板。此外,本公开指纹识别模块2还包括一联接器27,柔性电路板21可通过联接器27与外界进行数据传输以及获得电力。
请参照图7,图7为本公开指纹识别模块的制造方法的流程图。本公开电容式指纹识别模块2的制造方法,如图2所示,首先执行步骤S1将一晶粒22直接连接固定于一柔性电路板21上,且使晶粒22电性连接于该柔性电路板21,晶粒22具有多个金属接点22a,晶粒22通过多个金属接点22a电性连接于柔性电路板21,本公开是使用焊接的方式将晶粒22固定于一柔性电路板21上。优选地,柔性电路板21的下方设置有一承载板26,柔性电路板21被承载板26所承载,藉此以增加本公开指纹识别模块的整体结构强度。
步骤S1后,执行步骤S2。于步骤S2中,如图3所示,涂布一粘胶层23于晶粒22的一上表面。其后,接着执行步骤S3,如图4所示,将一盖板24迭覆于粘胶层23,以使盖板24与粘胶层23黏合。其中,通过上述步骤S2以及步骤S3,盖板24即可与晶粒22结合并位于晶粒22之上方。于一优选实施方式中,本公开所称之盖板24可以是使用陶瓷或玻璃材料所制成。
其后,执行步骤S4。于步骤S4中,如图5所示,对盖板24以及柔性电路板21之间的一封装空间90实施一低压注塑封装,以于封装空间90形成一封装层25。低压注塑封装的其中一个优势是,相较于传统的高压成型,使用低压注塑封装的平整度较高。于此须特别说明者为,封装空间90被界定于盖板24的一下表面以及柔性电路板21的一上表面之间。
详细而言,本公开所应用的低压注塑成型工艺是属一种开模式制程(Open-MoldProcess),且是种以低注塑压力以将热融材料注入模具9以快速固化成型的封装工艺,藉此以达到防水、防尘、抗冲击等技术效果。于步骤S4中,还包括下述步骤S41~S43。步骤S41:将柔性电路板21、晶粒22、粘胶层23以及盖板24一同放入一模具9,以准备于模具9内进行封装;步骤S42:调整模具9处于1.5~40巴(bar)的压力,此压力范围仅为本公开说明低压范围优选的一列举,但其可因应实际环境及需求而有所调整;以及步骤S43:注入一热融材料于模具9中,使该热融材料流入封装空间90,并于封装空间90固化形成封装层25,使封装层25密封晶粒22。其中,于步骤S43中,还包括步骤S430):经由模具9的一入料口91朝晶粒22的一环侧边的封装空间90注塑该热融材料。
于步骤(d)后,还包括步骤(e)。于步骤(e)中,如图6所示:将已相互固合的柔性电路板21、晶粒22、粘胶层23、盖板24以及封装层25自模具9脱膜取出,而成为完整的指纹识别模块2成品。
除此之外,于步骤(a)前,还包括步骤(a0):切割一晶圆成为多个晶粒22。本公开所称的晶粒22,为自TSV晶圆切割下来的成品。
综上所述,本公开的指纹识别模块将晶粒直接结合在柔性电路板后,即于柔性电路板之上对其进行封装,藉此以省略掉了传统需先将晶粒结合在IC载板的制造流程,同时得以降低封装制造的成本。除此之外,本公开的指纹识别模块是通过低压注塑封装,对于封装平整度的要求即可完全达到。
上述实施例仅为例示性说明本发明的原理及其技术效果,以及阐释本发明的技术特征,而非用于限制本发明的保护范围。任何熟悉本技术者的人士均可在不违背本发明的技术原理及构思的情况下,可轻易完成的改变或均等性的安排均属于本发明所主张的范围。因此,本发明的权利保护范围应如后述的权利要求所列。
Claims (10)
1.一种指纹识别模块的制造方法,包括下述步骤:
(a)将一晶粒直接连接固定于一柔性电路板上,且使该晶粒电性连接于该柔性电路板;
(b)涂布一粘胶层于该晶粒的一上表面;
(c)将一盖板迭覆于该粘胶层,以与该粘胶层粘合;以及
(d)对界定于该盖板以及该柔性电路板之间的一封装空间实施一低压注塑封装,以于该封装空间形成一封装层。
2.如权利要求1所述的指纹识别模块的制造方法,其中于步骤(d)中,还包括下述步骤:
(d1)将该柔性电路板、该晶粒、该粘胶层以及该盖板一同放入一模具;
(d2)调整该模具处于1.5~40巴的压力;以及
(d3)注入一热融材料于该模具中,使该热融材料流入该封装空间,并于该封装空间固化形成该封装层,其中,该封装层密封该晶粒。
3.如权利要求2所述的指纹识别模块的制造方法,其中于步骤(d3)中,还包括下述步骤:
(d30)经由该模具的一入料口朝由该晶粒的一环侧边的该封装空间注塑该热融材料。
4.如权利要求1所述的指纹识别模块的制造方法,其中于步骤(a)前,还包括下列步骤:
(a0)切割一晶圆成为多个晶粒。
5.如权利要求1所述的指纹识别模块的制造方法,其中于步骤(d)后,还包括下列步骤:
(e)将已相互固接结合的该柔性电路板、该晶粒、该粘胶层、该盖板以及该封装层自该模具脱膜取出。
6.一种指纹识别模块,包括:
一柔性电路板;
一晶粒,设置于该柔性电路板上,且与该柔性电路板电性连接;
一粘胶层,涂布于该晶粒的一上表面;
一盖板,迭覆于该粘胶层;以及
一封装层,固化形成于该柔性电路板以及该盖板之间,并密封该晶粒。
7.如权利要求6所述的指纹识别模块,其中该封装层是选自一热融材料。
8.如权利要求6所述的指纹识别模块,其中该封装层的一上表面接抵于该盖板,该封装层的一下表面接抵于该柔性电路板,且该封装层环绕密封该晶粒。
9.如权利要求6所述的指纹识别模块,其中该粘胶层为一晶粒粘贴薄膜或是一水胶。
10.如权利要求6所述的指纹识别模块,还包括一承载板,该承载板位于该柔性电路板的下方,以承载该柔性电路板。
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