CN107103273A - 指纹辨识模块及其制造方法 - Google Patents

指纹辨识模块及其制造方法 Download PDF

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CN107103273A
CN107103273A CN201611146972.7A CN201611146972A CN107103273A CN 107103273 A CN107103273 A CN 107103273A CN 201611146972 A CN201611146972 A CN 201611146972A CN 107103273 A CN107103273 A CN 107103273A
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fingerprint
sensing chip
identification
cover plate
fingerprint sensing
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张清晖
吴东颖
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Primax Electronics Ltd
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Abstract

本发明提供一种指纹辨识模块，包括：一基板；一指纹感测芯片，贴附于该电路板上，用以感测一指纹影像；一盖板胶层，形成于该指纹感测芯片的一上表面；一盖板，贴附于该盖板胶层；以及一模封层，形成于该基板上。该模封层将该电路板上的该指纹感测芯片，该胶层及该盖板封装一起并显露出该盖板。本发明指纹辨识模块具有超薄化及提升感测正确性的技术效果。

Description

指纹辨识模块及其制造方法
技术领域
本发明涉及一种生物辨识元件，尤其涉及指纹辨识模块。
背景技术
一般应用于电子产品的指纹辨识装置主要用以读取指纹影像，并于确认所读取的指纹影像与预存的指纹相符时对电子产品进行解锁操作。早期的指纹辨识装置多用于门禁系统。近年来，随着智能手机技术的发展，在手机设置指纹辨识装置的趋势已经形成。相较于应于门禁系统的指纹辨识装置，设置于手机的指纹辨识装置必须因应手机的超薄化而降低指纹辨识装置的厚度。此外，如何提升指纹辨识装置感测指纹影像的正确性也是本技术领域人士所努力的项目。
请参照图1所示的现有指纹辨识模块的示意图。图1的指纹辨识模块10包括一指纹感测芯片11，一硬式电路板12，一柔性电路板13，一模封层(mold compound)14，一盖板16以及增加柔性电路板的平整度的一加强板17。指纹感测芯片11通过胶层12A贴附于硬式电路板12上，并使用导线W连接芯片11与硬式电路板12。硬式电路板12与软式电路板13由焊锡层13A贴合在一起。软式电路板13与加强板17则由胶层17A黏合在一起。盖板16则通过胶层15粘贴于模封层14上。
当一手指放置于盖板16时，指纹感测芯片11，例如电容式指纹感测芯片，感测手指的指纹影像，并将指纹影像通过硬式电路板12以及软式电路板13传输至电子装置进行辨识。对本技术领域的人士而言，图1的指纹辨识模块10仍具有需改善的项目。首先，在使用感测芯片感测指纹的情况中，例如电容式指纹感测晶片，指纹感测芯片11的感测表面与手指之间的距离越短，对于感测的正确性就越高。然而，于图1的指纹辨识模块10中，手指与芯片11表面之间的距离包括了芯片11上表面的模封层的厚度D2与胶层15及盖板16的厚度总合D1。这是因为在现有指纹辨识模块10的制程中，需要先对芯片11及导线W进行模封制程以形成模封层14，接着再于模封层14上表面涂布贴合盖板16用的胶层15。在形成模封层14时，不可避免地在芯片11上表面存在有一定厚度的模封层的厚度D2。此厚度则增加了芯片11感测指纹的距离。
图1指纹辨识模块1的另一需要改善的项目在于模封层14厚度不均匀的问题。在形成模封层14的过程中，时常无法精确地控制封装结构的应力，造成模封层14厚度不均匀，而于模封层14的表面14S形成翘折(warpage)，导致形成于模封层14的表面的胶层15的厚度也不均匀，呈现两边厚中间薄的或两边薄中间厚的状态。此厚度不均匀的情况将使得芯片11感测电容值的基准不一致而导致误判的结果。
发明内容
本发明的目的在于提供一种具有较小厚度及提升感测正确性的指纹辨识模块及其制造方法。
于一较佳实施例中，本发明提供一种指纹辨识模块，包括：一基板，具有多个电性接点；一指纹感测芯片，贴附于该电路板上，用以感测一指纹影像，其中该感测芯片与该基板上的该多个电性接点经由多根导线连接一起而使该指纹感测芯片与该基板形成电性接触；一盖板胶层，形成于该指纹感测芯片的一上表面；一盖板，贴附于该盖板胶层；以及一模封层，形成于该基板上，其中该模封层将该电路板上的该指纹感测芯片，该胶层及该盖板封装一起并显露出该盖板。于又一较佳实施例中，本发明提供一种指纹辨识模块的制造方法，包括以下步骤：(a)将多个指纹感测芯片粘着于一基板上，其中，该基板上于每一该指纹感测芯片的周围具有多个导电接点；(b)对该多个指纹感测芯片与该基板进行打线连接，而使每一该指纹感测芯片与该基板形成电性连接；(c)形成一胶层于该多个指纹感测芯片的上表面；(d)放置一盖板于该胶层上；(e)对该多个指纹感测芯片进行封塑处理而使每一该指纹感测芯片及该胶层被一模封层包覆；以及，(f)执行一切割步骤而形成多个别的指纹感测芯片单元；(g)将该多个别的指纹感测芯片单元附着于一柔性电路板上；以及(h)切割该柔性电路板而形成多个别的指纹辨识模块。
附图说明
图1是现有指纹辨识模块的结构示意图。
图2是本发明指纹辨识模块的第一较佳实施例结构示意图。
图3是本发明指纹辨识模块的第二较佳实施例结构示意图。
图4A-E是本发明制造指纹辨识模块的制造方法的一较佳实施例示意图。
图5A-C是本发明制造指纹辨识模块的制造方法的另一较佳实施例示意图。
附图标记说明：
10、20、30、40指纹辨识模块 12A、13A、17A、22A、27A
11、21、31、41指纹感测芯片 32A、36A胶层
12、22、42基板 26A导电层
13、32、46柔性电路板 21S、31S、41S感测区
14、24、34、45模封层 40A指纹感测芯片单元
15、23、33、43盖板胶层 W导线
16、25、35、44盖板 P电性接点
17、27、36金属板
具体实施方式
以下参照附图说明本发明指纹辨识模块的结构及其制造方法的相关实施例。请参照图2，其为本发明指纹辨识模块的第一较佳实施例示意图。如图2所示，本发明指纹辨识模块20包括一指纹感测芯片(die)21，一基板22，盖板胶层23，模封层(molding compound)24，一盖板25，一柔性电路板26。此外，图2实施例还包括一金属片27。指纹感测芯片21通过粘胶层22A贴附于基板22。盖板25通过盖板胶层23而贴附于模封层24。基板22通过导电层26A贴附于柔性电路板26。例如，使用表面粘着技术(Surface-mount technology，SMT)，通过焊锡使基板22与柔性电路板26贴附一起并形成电性连接，金属片27则通过粘胶层27A贴附于柔性电路板26。于本实施例中，基板22是硬式电路板。于基板22上指纹感测芯片21的周围具有多个电性接点P。通过导线W连接指纹感测芯片21与电性接点P而形成纹辨识芯片20与基板22之间的电性连接。此外，指纹感测芯片21具有一感测区21S。盖板胶层23形成于指纹感测芯片21的感测区21S上且不与导线W接触。
于图1实施例中，指纹感测芯片21可为，例如，电容式指纹感测器，但本发明并不以此为限。基板22及柔性电路板26则用以将指纹感测芯片21感测到的指纹影像的像素传导至指纹辨识模块外部。模封层24将指纹感测芯片21，导线W，多个电性接点P以及盖板胶层23密封一起，以隔绝模块外的尘埃。盖板25提供手指与辨识模块的接触界面并保护辨识模块的表面不致因为手指的多次接触而被损坏。通过将手指放置于盖板25，指纹感测芯片20可感测手指的指纹影像。盖板25可以是，例如玻璃盖板或陶瓷盖板。贴附于柔性电路板26的金属片27是用以加强柔性电路板10的平整度，以避免导线W及多个电性接点P之间产生空焊的情况。当然，于某些情况中也可选择不使用金属片27。
依据图2显示的本发明指纹辨识模块20的结构，本发明指纹辨识模块20的盖板胶层23与指纹感测芯片21被模封层24封装在一起。此结构可免除图1所示的芯片11上表面的模封层的厚度D2，因此指纹感测芯片21的表面至盖板25的厚度L比厚度(D1+D2)小。亦即，指纹感测芯片21的表面至盖板25的距离比图1指纹辨识模块10的距离小，而有助于提升指纹感测芯片21的感测灵敏度。同时，指纹辨识模块20的整体厚度被降低亦有助于指纹辨识模块20的超薄化。
请参照图3，其为本发明指纹辨识模块的第二实施例示意图。图3的指纹辨识模块30包括一指纹感测芯片31，一柔性电路板32，盖板胶层33，模封层34，一盖板35，以及一金属片36。于柔性电路板32上指纹感测芯片30的周围具有多个电性接点P。图3亦显示出连接指纹感测芯片31与电性接点P的导线W。此外，指纹感测芯片31具有一感测区31S。指纹感测芯片31通过胶层32A而贴附于柔性电路板32。金属片36则通过胶层36A而贴附于柔性电路板32底部。图3实施例于图2实施例的差异在于，图3实施例中的电性接点P直接形成于柔性电路板31上，故图3实施例不需硬式电路板。此结构可进一步降低指纹辨识模块的厚度。
以下参照图4A-4B说明本发明指纹辨识模块的制造方法。为简要说明之故，图4A-4B仅显示盖板胶层43，而未显示出其它胶层及导电层。如图4A所示，多个指纹感测芯片41(于本例中显示2个)被贴附于同一基板42上。于本例中，基板42为硬式电路板。接着对每一指纹感测芯片41进行打线连接步骤，使指纹感测芯片41通过导线W与基板42的电性接点P形成电性连接。在打线步骤后，分别于每一指纹感测芯片41表面的感测区41S形成盖板胶层43。之后贴附一盖板44于盖板胶层43。贴附盖板44之后将进行一封塑(molding)步骤，使用模塑料将指纹感测芯片41、盖板胶层43及盖板44被模封层45封装在一起，并显露出盖板44的上表面，如图4B所示。之后进行一切割步骤，将同一基板上的多个指纹感测芯片41分离而形成个别的指纹感测芯片单元40A，如图4C所示。接着，使用，例如，表面粘着技术的制程将多个指纹感测芯片单元40A贴附于同一柔性电路板46上。以及，对柔性电路板46进行切割，而形成多个指纹辨识模块40，如图4E所示。
于本发明另一实施例中，亦可使用柔性电路板46做为基板，而省略硬式电路板42的使用。如图5A所示，多个指纹感测芯片41(于本例中显示2个)被贴附于同一柔性电路板46上。接着对每一指纹感测芯片41进行打线连接步骤，使指纹感测芯片41通过导线W与柔性电路板46的电性接点P形成电性连接。在打线步骤后，分别于每一指纹感测芯片41表面的感测区41S形成盖板胶层43并贴附盖板44。之后进行图5B的步骤。由于图5B步骤与图4B相同，故不再重复描述。接着进行一切割步骤，将同一柔性电路板46上的多个指纹感测芯片41分离而形成个别的指纹感测模块50，如图5C所示。
于本发明的制造方法中，盖板胶层43及盖板44于同一步骤中被封塑一起。于此制程中，当模封层45产生翘折现象时，盖板44会产生相同的翘折形变，使得指纹感测芯片41的感测区表面至盖板44的距离保持一致，避免了因翘折形变所导致的误判。
以上所述仅为本发明的较佳实施例，并非用以限定本发明的权利要求，因此凡其它未脱离本发明所公开的精神下所完成的等效改变或修饰，均应包含于本发明的权利要求内。

Claims (10)

1.一种指纹辨识模块，包括：
一基板，具有多个电性接点；
一指纹感测芯片，贴附于该电路板上，用以感测一指纹影像，其中该感测芯片与该基板上的该多个电性接点经由多根导线连接一起而使该指纹感测芯片与该基板形成电性接触；
一盖板胶层，形成于该指纹感测芯片的一上表面；
一盖板，贴附于该盖板胶层；以及
一模封层，形成于该基板上，其中该模封层将该电路板上的该指纹感测芯片，该胶层及该盖板封装一起并显露出该盖板。
2.如权利要求1的指纹辨识模块，其中该指纹感测芯片的该上表面具有一感测区，其中该盖板胶层是形成于该感测区且不与该导线接触。
3.如权利要求1的指纹辨识模块，其中该基板是一柔性电路板。
4.如权利要求1的指纹辨识模块，其中该基板是一硬式电路板，且该指纹辨识模块还包括一柔性电路板贴附于该基板。
5.如权利要求1的指纹辨识模块，其中该盖板是一陶瓷盖板或一玻璃盖板。
6.一种指纹辨识模块的制造方法，包括以下步骤：
(a)将多个指纹感测芯片粘着于一基板上，其中，该基板上于每一该指纹感测芯片的周围具有多个导电接点；
(b)对该多个指纹感测芯片与该基板进行打线连接，而使每一该指纹感测芯片与该基板形成电性连接；
(c)形成一胶层于该多个指纹感测芯片的上表面；
(d)放置一盖板于该胶层上；
(e)对该多个指纹感测芯片进行封塑处理而使每一该指纹感测芯片及该胶层被一模封层包覆；以及，
(f)执行一切割步骤而形成多个别的指纹感测芯片单元；
(g)将该多个别的指纹感测芯片单元附着于一柔性电路板上；以及
(h)切割该柔性电路板而形成多个别的指纹辨识模块。
7.如权利要求6的指纹辨识模块的制造方法，其中每一该指纹感测芯片的该上表面具有一感测区，其中该盖板胶层是分别形成于该感测区且不与该导线接触。
8.如权利要求6的指纹辨识模块的制造方法，其中该基板是一硬式电路板。
9.一种指纹辨识模块的制造方法，包括以下步骤：
(a)将多个指纹感测芯片粘着于一柔性电路板上，其中，该柔性电路板上于每一该指纹感测芯片的周围具有多个导电接点；
(b)对该多个指纹感测芯片与该柔性电路板进行打线连接，而使每一该指纹感测芯片与该基板形成电性连接；
(c)形成一胶层于该多个指纹感测芯片的上表面；
(d)放置一盖板于该胶层上；
(e)对该多个指纹感测芯片进行封塑处理而使每一该指纹感测芯片及该胶层被一模封层包覆；以及，
(f)执行一切割步骤而形成多个别的指纹辨识模块。
10.如权利要求9的指纹辨识模块的制造方法，其中每一该指纹感测芯片的该上表面具有一感测区，其中该盖板胶层是分别形成于该感测区且不与该导线接触。
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