CN107571444A - 压缩成形装置的树脂材料供给方法及供给机构、以及压缩成形方法及压缩成形装置 - Google Patents
压缩成形装置的树脂材料供给方法及供给机构、以及压缩成形方法及压缩成形装置 Download PDFInfo
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- CN107571444A CN107571444A CN201710650258.XA CN201710650258A CN107571444A CN 107571444 A CN107571444 A CN 107571444A CN 201710650258 A CN201710650258 A CN 201710650258A CN 107571444 A CN107571444 A CN 107571444A
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Landscapes
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013-246068 | 2013-11-28 | ||
| JP2013246068A JP6049597B2 (ja) | 2013-11-28 | 2013-11-28 | 圧縮成形装置の樹脂材料供給方法及び供給機構、並びに圧縮成形方法及び圧縮成形装置 |
| CN201410670897.9A CN104708734B (zh) | 2013-11-28 | 2014-11-20 | 压缩成形装置的树脂材料供给方法及供给机构、以及压缩成形方法及压缩成形装置 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410670897.9A Division CN104708734B (zh) | 2013-11-28 | 2014-11-20 | 压缩成形装置的树脂材料供给方法及供给机构、以及压缩成形方法及压缩成形装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107571444A true CN107571444A (zh) | 2018-01-12 |
Family
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Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410670897.9A Active CN104708734B (zh) | 2013-11-28 | 2014-11-20 | 压缩成形装置的树脂材料供给方法及供给机构、以及压缩成形方法及压缩成形装置 |
| CN201710650258.XA Withdrawn CN107571444A (zh) | 2013-11-28 | 2014-11-20 | 压缩成形装置的树脂材料供给方法及供给机构、以及压缩成形方法及压缩成形装置 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410670897.9A Active CN104708734B (zh) | 2013-11-28 | 2014-11-20 | 压缩成形装置的树脂材料供给方法及供给机构、以及压缩成形方法及压缩成形装置 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6049597B2 (enExample) |
| KR (2) | KR101706525B1 (enExample) |
| CN (2) | CN104708734B (enExample) |
| TW (2) | TWI608551B (enExample) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6057880B2 (ja) * | 2013-11-28 | 2017-01-11 | Towa株式会社 | 圧縮成形装置の樹脂材料供給方法及び供給装置 |
| JP6017634B1 (ja) * | 2015-06-10 | 2016-11-02 | Towa株式会社 | 圧縮成形装置の樹脂材料供給装置及び方法、圧縮成形装置、並びに樹脂成形品製造方法 |
| JP6612172B2 (ja) * | 2016-04-25 | 2019-11-27 | Towa株式会社 | 樹脂成形装置、樹脂成形方法、樹脂成形品の製造方法及び製品の製造方法 |
| JP6744780B2 (ja) * | 2016-08-09 | 2020-08-19 | アピックヤマダ株式会社 | 樹脂モールド装置 |
| JP6279047B1 (ja) * | 2016-10-11 | 2018-02-14 | Towa株式会社 | 樹脂材料供給装置、樹脂材料供給方法、樹脂成形装置、及び樹脂成形品製造方法 |
| JP6298871B1 (ja) * | 2016-10-21 | 2018-03-20 | Towa株式会社 | 樹脂材料供給装置、樹脂材料供給方法、樹脂成形装置、及び樹脂成形品製造方法 |
| JP6270969B2 (ja) * | 2016-11-22 | 2018-01-31 | Towa株式会社 | 圧縮成形装置の樹脂材料供給方法及び供給機構、並びに圧縮成形方法及び圧縮成形装置 |
| JP7088687B2 (ja) * | 2018-02-16 | 2022-06-21 | アピックヤマダ株式会社 | 樹脂モールド装置及び樹脂モールド方法 |
| TWI787411B (zh) * | 2018-02-16 | 2022-12-21 | 日商山田尖端科技股份有限公司 | 樹脂模製裝置 |
| JP6923503B2 (ja) * | 2018-11-27 | 2021-08-18 | Towa株式会社 | 樹脂成形装置、及び樹脂成形品の製造方法 |
| JP6721738B2 (ja) * | 2019-02-14 | 2020-07-15 | アピックヤマダ株式会社 | 樹脂モールド装置 |
| JP6861776B1 (ja) * | 2019-10-24 | 2021-04-21 | Towa株式会社 | 樹脂供給機構、樹脂成形装置及び樹脂成形品の製造方法 |
| JP7291660B2 (ja) * | 2020-04-17 | 2023-06-15 | Towa株式会社 | 樹脂成形品の製造方法、樹脂成形装置 |
| JP7360364B2 (ja) * | 2020-07-03 | 2023-10-12 | Towa株式会社 | 樹脂成形装置及び樹脂成形品の製造方法 |
| JP7360365B2 (ja) * | 2020-07-14 | 2023-10-12 | Towa株式会社 | 樹脂材料供給装置、樹脂成形装置及び樹脂成形品の製造方法 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1167081A (ja) * | 1997-08-15 | 1999-03-09 | Canon Inc | 平板型画像形成装置の製造方法、および平板型画像形成装置 |
| US6383948B1 (en) * | 1999-12-20 | 2002-05-07 | Tokyo Electron Limited | Coating film forming apparatus and coating film forming method |
| JP3922588B2 (ja) * | 2005-05-27 | 2007-05-30 | 内外化成株式会社 | 合成樹脂成形品の成形方法 |
| JP4588645B2 (ja) * | 2006-02-07 | 2010-12-01 | オリジン電気株式会社 | 樹脂膜形成装置、方法およびプログラム |
| JP4858966B2 (ja) * | 2006-11-02 | 2012-01-18 | Towa株式会社 | 電子部品の圧縮成形方法及び成形装置 |
| JP4855307B2 (ja) * | 2007-03-13 | 2012-01-18 | Towa株式会社 | 電子部品の圧縮成形方法 |
| JP5153509B2 (ja) * | 2008-08-08 | 2013-02-27 | Towa株式会社 | 電子部品の圧縮成形方法及び金型装置 |
| JP5133855B2 (ja) * | 2008-11-25 | 2013-01-30 | 株式会社ディスコ | 保護膜の被覆方法 |
| JP2010207723A (ja) * | 2009-03-10 | 2010-09-24 | Disco Abrasive Syst Ltd | 樹脂膜形成装置 |
| JP5248453B2 (ja) * | 2009-09-18 | 2013-07-31 | 住友重機械工業株式会社 | 樹脂封止装置及び樹脂封止方法 |
| JP5576197B2 (ja) * | 2010-07-08 | 2014-08-20 | Towa株式会社 | 電子部品の圧縮成形方法及び成形装置 |
| JP5468574B2 (ja) * | 2011-06-29 | 2014-04-09 | Towa株式会社 | 電子部品の樹脂封止成形方法及び装置 |
| KR101950894B1 (ko) * | 2011-11-08 | 2019-04-22 | 아피쿠 야마다 가부시키가이샤 | 수지 밀봉 장치 |
| JP6039198B2 (ja) * | 2012-03-07 | 2016-12-07 | Towa株式会社 | 樹脂封止電子部品の製造方法及び樹脂封止電子部品の製造装置 |
| JP5774538B2 (ja) * | 2012-04-11 | 2015-09-09 | Towa株式会社 | 樹脂封止装置及び樹脂封止方法 |
| JP5792681B2 (ja) * | 2012-06-20 | 2015-10-14 | Towa株式会社 | 樹脂供給方法、樹脂供給装置及び圧縮成形装置 |
| JP6057880B2 (ja) * | 2013-11-28 | 2017-01-11 | Towa株式会社 | 圧縮成形装置の樹脂材料供給方法及び供給装置 |
-
2013
- 2013-11-28 JP JP2013246068A patent/JP6049597B2/ja active Active
-
2014
- 2014-10-06 TW TW105117025A patent/TWI608551B/zh active
- 2014-10-06 TW TW103134723A patent/TWI543278B/zh active
- 2014-11-19 KR KR1020140161812A patent/KR101706525B1/ko active Active
- 2014-11-20 CN CN201410670897.9A patent/CN104708734B/zh active Active
- 2014-11-20 CN CN201710650258.XA patent/CN107571444A/zh not_active Withdrawn
-
2017
- 2017-02-07 KR KR1020170017021A patent/KR101741390B1/ko active Active
Also Published As
| Publication number | Publication date |
|---|---|
| KR20170017985A (ko) | 2017-02-15 |
| KR20150062124A (ko) | 2015-06-05 |
| CN104708734B (zh) | 2017-08-29 |
| CN104708734A (zh) | 2015-06-17 |
| JP6049597B2 (ja) | 2016-12-21 |
| TWI608551B (zh) | 2017-12-11 |
| TWI543278B (zh) | 2016-07-21 |
| KR101706525B1 (ko) | 2017-02-14 |
| TW201633413A (zh) | 2016-09-16 |
| JP2015101082A (ja) | 2015-06-04 |
| KR101741390B1 (ko) | 2017-05-29 |
| TW201521126A (zh) | 2015-06-01 |
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Application publication date: 20180112 |