CN107533977B - 半导体存储装置及其制造方法 - Google Patents
半导体存储装置及其制造方法 Download PDFInfo
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- CN107533977B CN107533977B CN201580077335.6A CN201580077335A CN107533977B CN 107533977 B CN107533977 B CN 107533977B CN 201580077335 A CN201580077335 A CN 201580077335A CN 107533977 B CN107533977 B CN 107533977B
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- electrode
- memory device
- semiconductor memory
- insulating layer
- silicon
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 67
- 238000004519 manufacturing process Methods 0.000 title description 26
- 238000003860 storage Methods 0.000 claims description 25
- 239000010410 layer Substances 0.000 description 78
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 66
- 229910052710 silicon Inorganic materials 0.000 description 66
- 239000010703 silicon Substances 0.000 description 66
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 25
- 229910052814 silicon oxide Inorganic materials 0.000 description 25
- 229910000449 hafnium oxide Inorganic materials 0.000 description 24
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 description 24
- 230000004888 barrier function Effects 0.000 description 18
- 238000000034 method Methods 0.000 description 15
- 230000015654 memory Effects 0.000 description 10
- 238000005530 etching Methods 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 239000000758 substrate Substances 0.000 description 8
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 7
- 229910052721 tungsten Inorganic materials 0.000 description 7
- 239000010937 tungsten Substances 0.000 description 7
- 229910052581 Si3N4 Inorganic materials 0.000 description 6
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 6
- 239000011162 core material Substances 0.000 description 5
- 238000001020 plasma etching Methods 0.000 description 5
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000011229 interlayer Substances 0.000 description 4
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 4
- 229920005591 polysilicon Polymers 0.000 description 4
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 238000001039 wet etching Methods 0.000 description 3
- 241000293849 Cordylanthus Species 0.000 description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
- H10B41/30—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region
- H10B41/35—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region with a cell select transistor, e.g. NAND
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42324—Gate electrodes for transistors with a floating gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/401—Multistep manufacturing processes
- H01L29/4011—Multistep manufacturing processes for data storage electrodes
- H01L29/40114—Multistep manufacturing processes for data storage electrodes the electrodes comprising a conductor-insulator-conductor-insulator-semiconductor structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/788—Field effect transistors with field effect produced by an insulated gate with floating gate
- H01L29/7881—Programmable transistors with only two possible levels of programmation
- H01L29/7883—Programmable transistors with only two possible levels of programmation charging by tunnelling of carriers, e.g. Fowler-Nordheim tunnelling
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
- H10B41/20—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by three-dimensional arrangements, e.g. with cells on different height levels
- H10B41/23—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels
- H10B41/27—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Semiconductor Memories (AREA)
- Non-Volatile Memory (AREA)
Abstract
Description
Claims (10)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2015/056102 WO2016139727A1 (ja) | 2015-03-02 | 2015-03-02 | 半導体記憶装置及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN107533977A CN107533977A (zh) | 2018-01-02 |
CN107533977B true CN107533977B (zh) | 2021-01-08 |
Family
ID=56849285
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201580077335.6A Active CN107533977B (zh) | 2015-03-02 | 2015-03-02 | 半导体存储装置及其制造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US10686045B2 (zh) |
CN (1) | CN107533977B (zh) |
TW (1) | TWI596742B (zh) |
WO (1) | WO2016139727A1 (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113410242A (zh) | 2015-05-01 | 2021-09-17 | 东芝存储器株式会社 | 半导体存储装置 |
TWI620307B (zh) | 2015-05-13 | 2018-04-01 | 東芝記憶體股份有限公司 | 半導體記憶裝置及其製造方法 |
US9847342B2 (en) | 2016-03-14 | 2017-12-19 | Toshiba Memory Corporation | Semiconductor memory device and method for manufacturing same |
US9837434B2 (en) | 2016-03-14 | 2017-12-05 | Toshiba Memory Corporation | Semiconductor memory device and method for manufacturing same |
TWI622131B (zh) | 2016-03-18 | 2018-04-21 | Toshiba Memory Corp | Semiconductor memory device and method of manufacturing same |
JP7189814B2 (ja) * | 2019-03-18 | 2022-12-14 | キオクシア株式会社 | 半導体記憶装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102201416A (zh) * | 2010-03-26 | 2011-09-28 | 三星电子株式会社 | 三维半导体装置及其制造方法 |
CN103208419A (zh) * | 2012-01-16 | 2013-07-17 | 英飞凌科技奥地利有限公司 | 具有沟槽触点的半导体晶体管及其形成方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5016832B2 (ja) | 2006-03-27 | 2012-09-05 | 株式会社東芝 | 不揮発性半導体記憶装置及びその製造方法 |
KR101616089B1 (ko) * | 2009-06-22 | 2016-04-28 | 삼성전자주식회사 | 3차원 반도체 메모리 소자 |
JP5558090B2 (ja) * | 2009-12-16 | 2014-07-23 | 株式会社東芝 | 抵抗変化型メモリセルアレイ |
JP2011165815A (ja) * | 2010-02-08 | 2011-08-25 | Toshiba Corp | 不揮発性半導体記憶装置 |
US8198672B2 (en) * | 2010-06-30 | 2012-06-12 | SanDisk Technologies, Inc. | Ultrahigh density vertical NAND memory device |
JP2012069606A (ja) | 2010-09-21 | 2012-04-05 | Toshiba Corp | 不揮発性半導体記憶装置 |
JP2012094694A (ja) * | 2010-10-27 | 2012-05-17 | Toshiba Corp | 不揮発性半導体記憶装置 |
KR101206508B1 (ko) * | 2011-03-07 | 2012-11-29 | 에스케이하이닉스 주식회사 | 3차원 구조를 갖는 비휘발성 메모리 장치 제조방법 |
US9240416B2 (en) | 2014-06-12 | 2016-01-19 | Kabushiki Kaisha Toshiba | Semiconductor memory device |
CN107548520B (zh) | 2015-02-24 | 2021-05-25 | 东芝存储器株式会社 | 半导体存储装置及其制造方法 |
-
2015
- 2015-03-02 WO PCT/JP2015/056102 patent/WO2016139727A1/ja active Application Filing
- 2015-03-02 CN CN201580077335.6A patent/CN107533977B/zh active Active
- 2015-03-12 TW TW104107969A patent/TWI596742B/zh active
-
2017
- 2017-08-23 US US15/683,941 patent/US10686045B2/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102201416A (zh) * | 2010-03-26 | 2011-09-28 | 三星电子株式会社 | 三维半导体装置及其制造方法 |
CN103208419A (zh) * | 2012-01-16 | 2013-07-17 | 英飞凌科技奥地利有限公司 | 具有沟槽触点的半导体晶体管及其形成方法 |
Also Published As
Publication number | Publication date |
---|---|
TWI596742B (zh) | 2017-08-21 |
US10686045B2 (en) | 2020-06-16 |
WO2016139727A1 (ja) | 2016-09-09 |
CN107533977A (zh) | 2018-01-02 |
US20170352735A1 (en) | 2017-12-07 |
TW201633506A (zh) | 2016-09-16 |
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Address after: Tokyo Patentee after: TOSHIBA MEMORY Corp. Address before: Tokyo Patentee before: Pangea Co.,Ltd. Address after: Tokyo Patentee after: Kaixia Co.,Ltd. Address before: Tokyo Patentee before: TOSHIBA MEMORY Corp. |
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Effective date of registration: 20220130 Address after: Tokyo Patentee after: Pangea Co.,Ltd. Address before: Tokyo Patentee before: TOSHIBA MEMORY Corp. |
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