CN107365521A - 水溶性预焊剂、使用其的电子基板及表面处理方法 - Google Patents
水溶性预焊剂、使用其的电子基板及表面处理方法 Download PDFInfo
- Publication number
- CN107365521A CN107365521A CN201710334152.9A CN201710334152A CN107365521A CN 107365521 A CN107365521 A CN 107365521A CN 201710334152 A CN201710334152 A CN 201710334152A CN 107365521 A CN107365521 A CN 107365521A
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- Prior art keywords
- water
- soluble preflux
- organic solvent
- envelope
- soluble
- Prior art date
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- Granted
Links
- 238000000034 method Methods 0.000 title claims description 25
- 239000000758 substrate Substances 0.000 title claims description 19
- 238000004381 surface treatment Methods 0.000 title claims description 10
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims abstract description 33
- 239000003960 organic solvent Substances 0.000 claims abstract description 28
- 238000009835 boiling Methods 0.000 claims abstract description 24
- -1 glyoxaline compound Chemical class 0.000 claims abstract description 21
- 150000001875 compounds Chemical class 0.000 claims abstract description 20
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 20
- 150000007524 organic acids Chemical class 0.000 claims abstract description 12
- ZUHZGEOKBKGPSW-UHFFFAOYSA-N tetraglyme Chemical compound COCCOCCOCCOCCOC ZUHZGEOKBKGPSW-UHFFFAOYSA-N 0.000 claims description 6
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 claims description 4
- COBPKKZHLDDMTB-UHFFFAOYSA-N 2-[2-(2-butoxyethoxy)ethoxy]ethanol Chemical compound CCCCOCCOCCOCCO COBPKKZHLDDMTB-UHFFFAOYSA-N 0.000 claims description 4
- 239000001089 [(2R)-oxolan-2-yl]methanol Substances 0.000 claims description 4
- 239000003795 chemical substances by application Substances 0.000 claims description 4
- 230000014509 gene expression Effects 0.000 claims description 4
- 125000005843 halogen group Chemical group 0.000 claims description 4
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims description 4
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 claims description 4
- BSYVTEYKTMYBMK-UHFFFAOYSA-N tetrahydrofurfuryl alcohol Chemical compound OCC1CCCO1 BSYVTEYKTMYBMK-UHFFFAOYSA-N 0.000 claims description 4
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical group CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 claims description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 125000002777 acetyl group Chemical group [H]C([H])([H])C(*)=O 0.000 claims description 3
- 125000003545 alkoxy group Chemical group 0.000 claims description 3
- 125000004453 alkoxycarbonyl group Chemical group 0.000 claims description 3
- 125000003236 benzoyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C(*)=O 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 3
- 125000004093 cyano group Chemical group *C#N 0.000 claims description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 3
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 claims description 3
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 claims 1
- 150000001335 aliphatic alkanes Chemical class 0.000 claims 1
- 125000003917 carbamoyl group Chemical group [H]N([H])C(*)=O 0.000 claims 1
- 239000012752 auxiliary agent Substances 0.000 abstract description 9
- 239000000203 mixture Substances 0.000 description 33
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 26
- 238000002156 mixing Methods 0.000 description 13
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 12
- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 description 7
- 238000002425 crystallisation Methods 0.000 description 6
- 230000008025 crystallization Effects 0.000 description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 5
- 210000004700 fetal blood Anatomy 0.000 description 5
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 4
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 4
- 235000011054 acetic acid Nutrition 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 239000012530 fluid Substances 0.000 description 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N isopropyl alcohol Natural products CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 description 4
- 125000006201 3-phenylpropyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 150000001298 alcohols Chemical class 0.000 description 3
- 239000002585 base Substances 0.000 description 3
- ODWXUNBKCRECNW-UHFFFAOYSA-M bromocopper(1+) Chemical compound Br[Cu+] ODWXUNBKCRECNW-UHFFFAOYSA-M 0.000 description 3
- 239000007853 buffer solution Substances 0.000 description 3
- 229910052801 chlorine Inorganic materials 0.000 description 3
- 125000001309 chloro group Chemical group Cl* 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 150000004820 halides Chemical class 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- WAEVWDZKMBQDEJ-UHFFFAOYSA-N 2-[2-(2-methoxypropoxy)propoxy]propan-1-ol Chemical compound COC(C)COC(C)COC(C)CO WAEVWDZKMBQDEJ-UHFFFAOYSA-N 0.000 description 2
- 125000003852 3-chlorobenzyl group Chemical group [H]C1=C([H])C(=C([H])C(Cl)=C1[H])C([H])([H])* 0.000 description 2
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 2
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 2
- 125000001246 bromo group Chemical group Br* 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000005238 degreasing Methods 0.000 description 2
- JXTHNDFMNIQAHM-UHFFFAOYSA-N dichloroacetic acid Chemical compound OC(=O)C(Cl)Cl JXTHNDFMNIQAHM-UHFFFAOYSA-N 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 235000019253 formic acid Nutrition 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 239000011975 tartaric acid Substances 0.000 description 2
- 235000002906 tartaric acid Nutrition 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- VNDYJBBGRKZCSX-UHFFFAOYSA-L zinc bromide Chemical compound Br[Zn]Br VNDYJBBGRKZCSX-UHFFFAOYSA-L 0.000 description 2
- 239000011592 zinc chloride Substances 0.000 description 2
- 235000005074 zinc chloride Nutrition 0.000 description 2
- UAYWVJHJZHQCIE-UHFFFAOYSA-L zinc iodide Chemical compound I[Zn]I UAYWVJHJZHQCIE-UHFFFAOYSA-L 0.000 description 2
- TXUICONDJPYNPY-UHFFFAOYSA-N (1,10,13-trimethyl-3-oxo-4,5,6,7,8,9,11,12,14,15,16,17-dodecahydrocyclopenta[a]phenanthren-17-yl) heptanoate Chemical compound C1CC2CC(=O)C=C(C)C2(C)C2C1C1CCC(OC(=O)CCCCCC)C1(C)CC2 TXUICONDJPYNPY-UHFFFAOYSA-N 0.000 description 1
- UJHSIDUUJPTLDY-UHFFFAOYSA-N (2-nitrophenyl)-phenylmethanone Chemical class [O-][N+](=O)C1=CC=CC=C1C(=O)C1=CC=CC=C1 UJHSIDUUJPTLDY-UHFFFAOYSA-N 0.000 description 1
- PWMWNFMRSKOCEY-UHFFFAOYSA-N 1-Phenyl-1,2-ethanediol Chemical compound OCC(O)C1=CC=CC=C1 PWMWNFMRSKOCEY-UHFFFAOYSA-N 0.000 description 1
- XPFCXIKQEQOMMW-UHFFFAOYSA-N 2-[(3,4-dichlorophenyl)methyl]-1h-benzimidazole Chemical compound C1=C(Cl)C(Cl)=CC=C1CC1=NC2=CC=CC=C2N1 XPFCXIKQEQOMMW-UHFFFAOYSA-N 0.000 description 1
- MONMFXREYOKQTI-UHFFFAOYSA-N 2-bromopropanoic acid Chemical compound CC(Br)C(O)=O MONMFXREYOKQTI-UHFFFAOYSA-N 0.000 description 1
- KZLYQYPURWXOEW-UHFFFAOYSA-N 2-iodopropanoic acid Chemical compound CC(I)C(O)=O KZLYQYPURWXOEW-UHFFFAOYSA-N 0.000 description 1
- QSSDFXGXUGCLSY-UHFFFAOYSA-N 3-[3-(3-butoxypropoxy)propoxy]propan-1-ol Chemical compound CCCCOCCCOCCCOCCCO QSSDFXGXUGCLSY-UHFFFAOYSA-N 0.000 description 1
- 125000006279 3-bromobenzyl group Chemical group [H]C1=C([H])C(=C([H])C(Br)=C1[H])C([H])([H])* 0.000 description 1
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical group [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910021589 Copper(I) bromide Inorganic materials 0.000 description 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 1
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 1
- 229910021380 Manganese Chloride Inorganic materials 0.000 description 1
- GLFNIEUTAYBVOC-UHFFFAOYSA-L Manganese chloride Chemical compound Cl[Mn]Cl GLFNIEUTAYBVOC-UHFFFAOYSA-L 0.000 description 1
- CJKRXEBLWJVYJD-UHFFFAOYSA-N N,N'-diethylethylenediamine Chemical compound CCNCCNCC CJKRXEBLWJVYJD-UHFFFAOYSA-N 0.000 description 1
- UEEJHVSXFDXPFK-UHFFFAOYSA-N N-dimethylaminoethanol Chemical compound CN(C)CCO UEEJHVSXFDXPFK-UHFFFAOYSA-N 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- 238000002835 absorbance Methods 0.000 description 1
- MQRWBMAEBQOWAF-UHFFFAOYSA-N acetic acid;nickel Chemical compound [Ni].CC(O)=O.CC(O)=O MQRWBMAEBQOWAF-UHFFFAOYSA-N 0.000 description 1
- 239000004480 active ingredient Substances 0.000 description 1
- 238000007605 air drying Methods 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- ITHZDDVSAWDQPZ-UHFFFAOYSA-L barium acetate Chemical compound [Ba+2].CC([O-])=O.CC([O-])=O ITHZDDVSAWDQPZ-UHFFFAOYSA-L 0.000 description 1
- 229940112016 barium acetate Drugs 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005660 chlorination reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 229940125904 compound 1 Drugs 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229940116318 copper carbonate Drugs 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- NKNDPYCGAZPOFS-UHFFFAOYSA-M copper(i) bromide Chemical compound Br[Cu] NKNDPYCGAZPOFS-UHFFFAOYSA-M 0.000 description 1
- OPQARKPSCNTWTJ-UHFFFAOYSA-L copper(ii) acetate Chemical compound [Cu+2].CC([O-])=O.CC([O-])=O OPQARKPSCNTWTJ-UHFFFAOYSA-L 0.000 description 1
- GQDHEYWVLBJKBA-UHFFFAOYSA-H copper(ii) phosphate Chemical compound [Cu+2].[Cu+2].[Cu+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O GQDHEYWVLBJKBA-UHFFFAOYSA-H 0.000 description 1
- GEZOTWYUIKXWOA-UHFFFAOYSA-L copper;carbonate Chemical compound [Cu+2].[O-]C([O-])=O GEZOTWYUIKXWOA-UHFFFAOYSA-L 0.000 description 1
- HFDWIMBEIXDNQS-UHFFFAOYSA-L copper;diformate Chemical compound [Cu+2].[O-]C=O.[O-]C=O HFDWIMBEIXDNQS-UHFFFAOYSA-L 0.000 description 1
- AEJIMXVJZFYIHN-UHFFFAOYSA-N copper;dihydrate Chemical compound O.O.[Cu] AEJIMXVJZFYIHN-UHFFFAOYSA-N 0.000 description 1
- GBRBMTNGQBKBQE-UHFFFAOYSA-L copper;diiodide Chemical compound I[Cu]I GBRBMTNGQBKBQE-UHFFFAOYSA-L 0.000 description 1
- QYCVHILLJSYYBD-UHFFFAOYSA-L copper;oxalate Chemical compound [Cu+2].[O-]C(=O)C([O-])=O QYCVHILLJSYYBD-UHFFFAOYSA-L 0.000 description 1
- 229960002887 deanol Drugs 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 229960005215 dichloroacetic acid Drugs 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- 229940043237 diethanolamine Drugs 0.000 description 1
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 description 1
- 239000012972 dimethylethanolamine Substances 0.000 description 1
- ZZVUWRFHKOJYTH-UHFFFAOYSA-N diphenhydramine Chemical compound C=1C=CC=CC=1C(OCCN(C)C)C1=CC=CC=C1 ZZVUWRFHKOJYTH-UHFFFAOYSA-N 0.000 description 1
- 239000002552 dosage form Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- WBJINCZRORDGAQ-UHFFFAOYSA-N ethyl formate Chemical compound CCOC=O WBJINCZRORDGAQ-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- HYFPVPNWNRFTMP-UHFFFAOYSA-N formic acid;manganese Chemical compound [Mn].OC=O HYFPVPNWNRFTMP-UHFFFAOYSA-N 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- ICIWUVCWSCSTAQ-UHFFFAOYSA-M iodate Chemical compound [O-]I(=O)=O ICIWUVCWSCSTAQ-UHFFFAOYSA-M 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- FBAFATDZDUQKNH-UHFFFAOYSA-M iron chloride Chemical compound [Cl-].[Fe] FBAFATDZDUQKNH-UHFFFAOYSA-M 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- 229940046892 lead acetate Drugs 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000003760 magnetic stirring Methods 0.000 description 1
- 239000011565 manganese chloride Substances 0.000 description 1
- 235000002867 manganese chloride Nutrition 0.000 description 1
- 229940099607 manganese chloride Drugs 0.000 description 1
- 229940099596 manganese sulfate Drugs 0.000 description 1
- 239000011702 manganese sulphate Substances 0.000 description 1
- 235000007079 manganese sulphate Nutrition 0.000 description 1
- RGVLTEMOWXGQOS-UHFFFAOYSA-L manganese(2+);oxalate Chemical compound [Mn+2].[O-]C(=O)C([O-])=O RGVLTEMOWXGQOS-UHFFFAOYSA-L 0.000 description 1
- SQQMAOCOWKFBNP-UHFFFAOYSA-L manganese(II) sulfate Chemical compound [Mn+2].[O-]S([O-])(=O)=O SQQMAOCOWKFBNP-UHFFFAOYSA-L 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 235000013372 meat Nutrition 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- RMIODHQZRUFFFF-UHFFFAOYSA-N methoxyacetic acid Chemical compound COCC(O)=O RMIODHQZRUFFFF-UHFFFAOYSA-N 0.000 description 1
- SYSQUGFVNFXIIT-UHFFFAOYSA-N n-[4-(1,3-benzoxazol-2-yl)phenyl]-4-nitrobenzenesulfonamide Chemical class C1=CC([N+](=O)[O-])=CC=C1S(=O)(=O)NC1=CC=C(C=2OC3=CC=CC=C3N=2)C=C1 SYSQUGFVNFXIIT-UHFFFAOYSA-N 0.000 description 1
- 229940078494 nickel acetate Drugs 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 238000010979 pH adjustment Methods 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- IOLCXVTUBQKXJR-UHFFFAOYSA-M potassium bromide Chemical compound [K+].[Br-] IOLCXVTUBQKXJR-UHFFFAOYSA-M 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- FDRCDNZGSXJAFP-UHFFFAOYSA-M sodium chloroacetate Chemical compound [Na+].[O-]C(=O)CCl FDRCDNZGSXJAFP-UHFFFAOYSA-M 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000001119 stannous chloride Substances 0.000 description 1
- 235000011150 stannous chloride Nutrition 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- YNJBWRMUSHSURL-UHFFFAOYSA-N trichloroacetic acid Chemical compound OC(=O)C(Cl)(Cl)Cl YNJBWRMUSHSURL-UHFFFAOYSA-N 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 229940102001 zinc bromide Drugs 0.000 description 1
- ZULTYUIALNTCSA-UHFFFAOYSA-N zinc hydride Chemical compound [ZnH2] ZULTYUIALNTCSA-UHFFFAOYSA-N 0.000 description 1
- 229910000051 zinc hydride Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/08—Anti-corrosive paints
-
- A—HUMAN NECESSITIES
- A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
- A01N—PRESERVATION OF BODIES OF HUMANS OR ANIMALS OR PLANTS OR PARTS THEREOF; BIOCIDES, e.g. AS DISINFECTANTS, AS PESTICIDES OR AS HERBICIDES; PEST REPELLANTS OR ATTRACTANTS; PLANT GROWTH REGULATORS
- A01N25/00—Biocides, pest repellants or attractants, or plant growth regulators, characterised by their forms, or by their non-active ingredients or by their methods of application, e.g. seed treatment or sequential application; Substances for reducing the noxious effect of the active ingredients to organisms other than pests
- A01N25/02—Biocides, pest repellants or attractants, or plant growth regulators, characterised by their forms, or by their non-active ingredients or by their methods of application, e.g. seed treatment or sequential application; Substances for reducing the noxious effect of the active ingredients to organisms other than pests containing liquids as carriers, diluents or solvents
- A01N25/04—Dispersions, emulsions, suspoemulsions, suspension concentrates or gels
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- A—HUMAN NECESSITIES
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Abstract
本发明提供一种水溶性预焊剂,其含有:(A)咪唑类化合物、(B)有机酸、(C)络合物被膜形成助剂、(D)有机溶剂、以及(E)水,所述(D)有机溶剂在温度20℃时于水中的溶解度为10g/100g以上,而且沸点为100℃以上且300℃以下。
Description
相关申请
本申请主张2016年5月12日提交的日本专利申请2016-096107的优先权,参照并引用其全部内容作为本申请的一部分。
技术领域
本发明涉及水溶性预焊剂、使用其的电子基板及表面处理方法。
背景技术
印刷布线基板大多以形成有阻焊被膜的状态流通。在这样的情况下,印刷布线基板的大部分被阻焊被膜所覆盖,但为了搭载电子部件,在电极端子(焊盘)不存在阻焊被膜。因此,在使印刷布线基板流通时、保存时,电极端子的表面容易被氧化。因此,对于印刷布线基板的电极端子而言,为了防止电极端子表面的氧化,有时对电极端子的表面实施镀金处理。但是,由于在镀金处理中使用贵金属,因此存在成本升高的问题。因此,在印刷布线基板中,采用了利用水溶性预焊剂在电极端子的表面形成保护被膜的方法来代替镀金处理(例如文献1:日本特开平6-322551号公报)。
文献1中记载的现有的水溶性预焊剂,在低温(例如5℃以下)下保存时,存在水溶性预焊剂中的咪唑类化合物发生结晶化的问题。因此,要求水溶性预焊剂在低温的环境下也能够保存(低温稳定性)。
水溶性预焊剂中的咪唑类化合物不溶或难溶于水,因此,通常使用乙酸等有机酸使其溶解于水。而且,对咪唑类化合物的种类、有机酸的种类进行了包括低温稳定性在内的各种特性的研究,但没有发现具有足够低温稳定性的组合。另外,作为使水溶性预焊剂的低温稳定性提高的方法,也有使用能够溶解咪唑类化合物的醇类等有机溶剂的方法。然而,即使使用醇类等有机溶剂来尝试提高低温稳定性,也存在难以在电极端子的表面形成咪唑类化合物的保护被膜的问题。这样,在保持保护被膜的形成性的同时使低温稳定性提高是非常困难的。
发明内容
因此,本发明的目的在于提供一种具有优异的低温稳定性的水溶性预焊剂、以及使用其的电子基板及表面处理方法。
本发明人等为了实现上述目的而反复进行了深入研究,结果发现以下见解。即,在对含有咪唑类化合物、有机酸及络合物被膜形成助剂的水溶性预焊剂添加有机溶剂时,通常低温稳定性提高,并且保护被膜的形成性降低。但是,在使用了满足特定条件的有机溶剂的情况下,令人惊讶地发现能够在保持保护被膜的形成性的同时提高低温稳定性,从而完成了本发明。
本发明的水溶性预焊剂含有:(A)咪唑类化合物、(B)有机酸、(C)络合物被膜形成助剂、(D)有机溶剂、以及(E)水,其中,所述(D)有机溶剂在温度20℃时于水中的溶解度为10g/100g以上,而且沸点为100℃以上且300℃以下。
在本发明的水溶性预焊剂中,所述(A)咪唑类化合物优选为下述通式(1)所示的化合物。
(在下述通式(1)中,X及Y分别可以相同或不同,表示选自碳原子数1~7的直链或支链的烷基、卤原子、氨基、二低级烷基氨基、羟基、低级烷氧基、氰基、乙酰基、苯甲酰基、氨基甲酰基、甲酰基、羧基、低级烷氧基羰基及硝基中的至少一个,n表示0~4的整数,m表示0~10的整数,p表示0~4的整数。)
在本发明的水溶性预焊剂中,所述(D)有机溶剂优选为选自三丙二醇单甲醚(methylpropylene triglycol)、三乙二醇单丁醚(buthyltriglycol)、丙二醇单甲醚、四乙二醇二甲醚、四氢糠醇及丙二醇单甲醚乙酸酯中的至少1种。
本发明的电子基板具备由所述水溶性预焊剂形成的保护被膜。
本发明的表面处理方法包括:使用所述水溶性预焊剂在电子基板的电极端子上形成保护被膜的工序。
根据本发明,可以提供一种具有优异的低温稳定性的水溶性预焊剂、以及使用其的电子基板及表面处理方法。
具体实施方式
本发明的水溶性预焊剂含有以下说明的(A)咪唑类化合物、(B)有机酸、(C)络合物被膜形成助剂、(D)有机溶剂、以及(E)水。
[(A)成分]
作为用于本发明的(A)咪唑类化合物,可以使用公知的咪唑类化合物。作为该(A)成分,从形成的保护被膜的性能的观点考虑,优选为下述通式(1)所示的化合物。
在所述通式(1)中,X及Y分别可以相同或不同,表示选自碳原子数1~7的直链或支链的烷基、卤原子、氨基、二低级烷基氨基、羟基、低级烷氧基、氰基、乙酰基、苯甲酰基、氨基甲酰基、甲酰基、羧基、低级烷氧基羰基及硝基中的至少一个,n表示0~4的整数,m表示0~10的整数,p表示0~4的整数。
作为卤原子,可以列举:氯原子、溴原子及碘原子。其中,从提高电极端子的焊料润湿性的观点考虑,优选为氯原子、溴原子,特别优选为氯原子。
作为所述通式(1)所示的化合物,可以列举:2-(3-氯苄基)苯并咪唑、2-(3,4-二氯苄基)苯并咪唑、4-氯-2-(3-苯基丙基)苯并咪唑、6-氯-2-{(2-硝基苯基)乙基}苯并咪唑、以及6-乙氧羰基-2-(3-溴苄基)苯并咪唑等。其中,从抑制电极端子表面的氧化的观点考虑,更优选为2-(3-氯苄基)苯并咪唑、2-(3,4-二氯苄基)苯并咪唑、4-氯-2-(3-苯基丙基)苯并咪唑。另外,这些化合物可以单独使用,也可以混合使用2种以上。
作为所述(A)成分的配合量,相对于水溶性预焊剂100质量%,优选为0.01质量%以上且10质量%以下,更优选为0.05质量%以上且5质量%以下。通过将配合量设为上述下限以上,易于形成防锈膜等涂膜。另外,在配合量超过上述上限时,存在不溶解成分容易增多的倾向,在经济上也不优选。
[(B)成分]
作为用于本发明的(B)有机酸,可以列举:甲酸、乙酸、丙酸、丁酸、乙醇酸、酒石酸、乳酸、氯乙酸、二氯乙酸、三氯乙酸、溴乙酸、以及甲氧基乙酸等。其中,优选为甲酸、乙酸。另外,这些有机酸可以单独使用,也可以混合使用2种以上。
作为所述(B)成分的配合量,相对于水溶性预焊剂100质量%,优选为1质量%以上且40质量%以下,更优选为1质量%以上且20质量%以下,特别优选为1质量%以上且10质量%以下。在配合量低于上述下限时,存在难以使形成被膜的咪唑类化合物溶解的倾向,另一方面,在超过上述上限时,存在保护被膜的形成性容易降低的倾向。
[(C)成分]
作为用于本发明的(C)络合物被膜形成助剂,可以列举:甲酸铜、氯化亚铜、氯化铜、草酸铜、乙酸铜、氢氧化铜、碳酸铜、磷酸铜、硫酸铜、甲酸锰、氯化锰、草酸锰、硫酸锰、乙酸锌、乙酸铅、乙酸镍、乙酸钡、氢化锌、氯化亚铁、氯化铁、氧化亚铁、氧化铁、碘化铜、碘化钾、碘化锌、溴化亚铜、溴化铜、溴化钾、以及溴化锌等金属化合物。其中,从提高焊料润湿性、提高耐热性的观点考虑,优选为氯化锌、溴化铜、碘化钾。另外,这些化合物可以单独使用,也可以混合使用2种以上。
作为上述(C)成分的配合量,相对于水溶性预焊剂100质量%,优选为0.01质量%以上且10质量%以下,更优选为0.05质量%以上且5质量%以下。在配合量低于上述下限时,存在使保护被膜的形成性提高的效果不足的倾向,另一方面,在超过上述上限时,存在保护被膜的形成性过高、低温下的液体稳定性降低的倾向。
[(D)成分]
对于本发明中使用的(D)有机溶剂而言,需要在温度20℃时于水中的溶解度为10g/100g以上,而且沸点为100℃以上且300℃以下。通过含有这样的(D)成分,可以提高水溶性预焊剂的低温稳定性。
另外,从水溶性预焊剂的低温稳定性的观点考虑,(D)成分在温度20℃时于水中的溶解度更优选为15g/100g以上,特别优选为50g/100g以上。需要说明的是,在相对于100g水可以混合任意量的有机溶剂的情况下,将该有机溶剂的溶解度表示为任意混合。
另外,从水溶性预焊剂的低温稳定性的观点考虑,(D)成分的沸点更优选为120℃以上且280℃以下,特别优选为180℃以上且260℃以下。需要说明的是,在本说明书中,沸点是指1013hPa下的沸点。
作为上述(D)成分,只要满足上述条件即可,可以使用二醇醚类溶剂、二醇酯类溶剂、以及醇类溶剂等。其中,从低温稳定性的观点考虑,优选为二醇醚类溶剂。
作为上述(D)成分,可以列举:三丙二醇单甲醚(溶解度:任意混合,沸点:242℃)、三乙二醇单丁醚(溶解度:任意混合,沸点:271℃)、丙二醇单甲醚(溶解度:任意混合,沸点:121℃)、四乙二醇二甲醚(溶解度:任意混合,沸点:275℃)、四氢糠醇(溶解度:任意混合,沸点:178℃)、以及丙二醇单甲醚乙酸酯(溶解度:18.5g/100g、沸点:146℃)等。其中,从低温稳定性及保护被膜的形成性的平衡的观点考虑,优选为三丙二醇单甲醚。另外,这些化合物可以单独使用,也可以混合使用2种以上。需要说明的是,括号内记载的溶解度是在温度20℃时于水中的溶解度。
相对于水溶性预焊剂100质量%,上述(D)成分的配合量优选为0.2质量%以上且15质量%以下,更优选为0.5质量%以上且10质量%以下,特别优选为1质量%以上且5质量%以下。在配合量低于上述下限时,存在水溶性预焊剂的低温稳定性不足的倾向,另一方面,在超过上述上限时,存在保护被膜的形成性降低的倾向。
[(E)成分及其它成分]
用于本发明的(E)水是水溶性预焊剂中的上述(A)成分、上述(B)成分、上述(C)成分、上述(D)成分、以及以下说明的其它成分以外的剩余部分。
作为可以配合在本发明的水溶性预焊剂中的其它成分,可以列举:含有相对于从上述(C)成分中分离的金属离子的碱的缓冲液、含卤化合物等。
作为上述缓冲液中的碱,可以列举:氨、二乙胺、三乙胺、二乙醇胺、三乙醇胺、单乙醇胺、二甲基乙醇胺、二乙基乙醇胺、异丙基乙醇胺、氢氧化钠、以及氢氧化钾等。
作为上述含卤化合物,可举出溴丙酸及碘丙酸等。这些含卤化合物可以单独使用1种,也可以混合使用2种以上。
在使用上述含卤化合物的情况下,相对于水溶性预焊剂100质量%,其配合量优选为0.01质量%以上且10质量%以下,更优选为0.05质量%以上且5质量%以下。
[表面处理方法及电子基板]
接下来,对本发明的表面处理方法及电子基板进行说明。
本发明的表面处理方法是具备使用水溶性预焊剂在电子基板的电极端子上形成保护被膜的工序的方法。
作为电子基板,可举出印刷布线基板及半导体用基板等。
作为保护被膜的形成方法,例如可以采用如下方法:实施对作为处理对象的印刷布线基板的电极端子的表面进行脱脂、化学抛光(软蚀刻(soft etching))、酸洗、水洗的前处理工序,然后,将印刷布线基板在上述水溶性预焊剂中于10~60℃下浸渍1秒钟~100分钟(优选在20~50℃下浸渍5秒钟~60分钟,更优选在20~50℃下浸渍10秒钟~10分钟)的方法。由此,上述通式(1)所示的化合物附着于电极端子的表面,处理温度越高,处理时间越长,其附着量越多。此时,更优选利用超声波。需要说明的是,也可以通过例如喷雾法、毛刷涂布、辊涂等其它涂布方法来形成保护被膜。
如上所述,可以制造本发明的电子基板。即,本发明的电子基板具备由上述水溶性预焊剂形成的保护被膜。
实施例
接下来,通过实施例及比较例进一步详细地对本发明进行说明,但本发明并不受这些例子任何限定。需要说明的是,将实施例及比较例中使用的材料示于以下。
((A)成分)
咪唑类化合物:4-氯-2-(3-苯基丙基)苯并咪唑
((B)成分)
有机酸A:乙酸
有机酸B:酒石酸
((C)成分)
络合物被膜形成助剂A:氯化锌
络合物被膜形成助剂B:溴化铜
络合物被膜形成助剂C:碘化钾
((D)成分)
有机溶剂A:三丙二醇单甲醚(溶解度:任意混合,沸点:242℃)
有机溶剂B:三乙二醇单丁醚(溶解度:任意混合,沸点:271℃)
有机溶剂C:丙二醇单甲醚(溶解度:任意混合,沸点:121℃)
有机溶剂D:四乙二醇二甲醚(溶解度:任意混合,沸点;275℃)
有机溶剂E:四氢糠醇(溶解度:任意混合,沸点:178℃)
有机溶剂F:丙二醇单甲醚乙酸酯(溶解度:18.5g/100g、沸点:146℃)
((E)成分)
水:纯水
(其它成分)
有机溶剂G:苯基乙二醇(溶解度:2.7g/100g、沸点:245℃)
有机溶剂H:三丙二醇单丁醚(溶解度:0.4g/100g、沸点:274℃)
有机溶剂I:二乙二醇二丁醚(溶解度:0.3g/100g、沸点:256℃)
有机溶剂J:乙醇(溶解度:任意混合,沸点:78℃)
有机溶剂K:异丙醇(溶解度:任意混合,沸点:82℃)
[实施例1]
使咪唑类化合物1质量%、有机酸A 2质量%、络合物被膜形成助剂A 0.5质量%及有机溶剂A溶解于水96质量%,得到了水溶性预焊剂。另外,用作为缓冲液的25质量%氨水对得到的水溶性预焊剂进行pH调整,制成了能够形成被膜的水溶性预焊剂处理液。
[实施例2~15]
除了按照表1所示的组成配合了各材料以外,与实施例1同样地得到了水溶性预焊剂及处理液。
[比较例1~7]
除了按照表2所示的组成配合了各材料以外,与实施例1同样地得到了水溶性预焊剂及处理液。
〈水溶性预焊剂的评价〉
通过以下的方法对水溶性预焊剂的性能(被膜厚度、低温保存稳定性、再溶解性)进行了评价或测定。将得到的结果示于表1~表3。
(1)被膜厚度
将双面覆铜叠层板(copper-clad laminate)(大小:25mm×50mm、厚度:1.6mm、基材的种类:FR-4)进行脱脂、软蚀刻及水洗,并清洗表面,然后在水溶性预焊剂处理液中于40℃下浸渍2分钟而形成被膜,进行水洗、热风干燥,得到了试验基板。对于该试验基板,将表面积25cm2的试验基板上的被膜提取于0.5%盐酸50mL中,然后,测定来自于提取液中的被膜有效成分的最大吸光度,由换算式计算出被膜厚度(单位:μm)。
(2)低温保存稳定性
将水溶性预焊剂100mL采集至能够密闭的玻璃瓶(容积:120mL~150mL)中,密闭盖严,得到了试样。将该试样静置于设定为温度5℃(误差2℃以内)的冷藏保存柜。然后,每隔24小时取出试样,通过肉眼观察确认有无结晶。然后,按照下述的基准对低温保存稳定性进行了评价。
A:即使经过240小时,也未产生结晶。
B:即使经过168小时,也未产生结晶,但在240小时以内产生结晶。
C:即使经过48小时,也未产生结晶,但在168小时以内产生结晶。
D:在48小时以内产生结晶。
(3)再溶解性
将水溶性预焊剂100mL采集至能够密闭的玻璃瓶(容积:120mL~150mL)中,密闭盖严,得到了试样。将该试样静置于设定为温度-15℃(误差2℃以内)的冷冻保存柜。然后,在水溶性预焊剂完全凝固后取出(参考时间为24小时以上且48小时以下)。接着,将该试样在温度40℃的恒温水槽中静置并加热1小时,然后用磁力搅拌器在室温下搅拌1小时,通过肉眼观察确认了试样的温度恢复至室温后有无结晶。然后,按照下述的基准对再溶解性进行了评价。
A:析出物完全溶解。
B:析出物残留,未完全溶解。
表2
由表1及表2所示的结果可知,对于本发明的水溶性预焊剂(实施例1~15)而言,可以确认到被膜厚度、低温保存稳定性及再溶解性均良好。因此,可以确认,根据本发明,能够得到具有优异的低温稳定性的水溶性预焊剂。
另一方面可知,对于不含有(D)成分的水溶性预焊剂(比较例1~7)而言,再溶解性不良,而且,被膜厚度及低温保存稳定性这两者也不好。
Claims (5)
1.一种水溶性预焊剂,其含有:(A)咪唑类化合物、(B)有机酸、(C)络合物被膜形成助剂、(D)有机溶剂、以及(E)水,其中,
所述(D)有机溶剂在温度20℃时于水中的溶解度为10g/100g以上,而且沸点为100℃以上且300℃以下。
2.根据权利要求1所述的水溶性预焊剂,其中,所述(A)咪唑类化合物为下述通式(1)所示的化合物,
在通式(1)中,X及Y分别可以相同或不同,表示选自碳原子数1~7的直链或支链的烷基、卤原子、氨基、二低级烷基氨基、羟基、低级烷氧基、氰基、乙酰基、苯甲酰基、氨基甲酰基、甲酰基、羧基、低级烷氧基羰基及硝基中的至少一个,n表示0~4的整数,m表示0~10的整数,p表示0~4的整数。
3.根据权利要求1或2所述的水溶性预焊剂,其中,所述(D)有机溶剂为选自三丙二醇单甲醚、三乙二醇单丁醚、丙二醇单甲醚、四乙二醇二甲醚、四氢糠醇及丙二醇单甲醚乙酸酯中的至少1种。
4.一种电子基板,其具备由权利要求1或2所述的水溶性预焊剂形成的保护被膜。
5.一种表面处理方法,该方法包括:使用权利要求1或2所述的水溶性预焊剂在电子基板的电极端子上形成保护被膜的工序。
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