TW201807095A - 水溶性預焊劑、使用其之電子基板及表面處理方法 - Google Patents
水溶性預焊劑、使用其之電子基板及表面處理方法 Download PDFInfo
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- TW201807095A TW201807095A TW106115561A TW106115561A TW201807095A TW 201807095 A TW201807095 A TW 201807095A TW 106115561 A TW106115561 A TW 106115561A TW 106115561 A TW106115561 A TW 106115561A TW 201807095 A TW201807095 A TW 201807095A
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- water
- soluble preflux
- organic solvent
- mass
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims abstract description 23
- 238000000034 method Methods 0.000 title claims description 15
- 238000004381 surface treatment Methods 0.000 title claims description 9
- 239000003755 preservative agent Substances 0.000 title abstract 2
- 230000002335 preservative effect Effects 0.000 title abstract 2
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims abstract description 41
- 239000003960 organic solvent Substances 0.000 claims abstract description 28
- 238000009835 boiling Methods 0.000 claims abstract description 24
- -1 imidazole compound Chemical class 0.000 claims abstract description 17
- 150000007524 organic acids Chemical class 0.000 claims abstract description 10
- 230000001681 protective effect Effects 0.000 claims description 19
- 239000000758 substrate Substances 0.000 claims description 18
- 150000001875 compounds Chemical class 0.000 claims description 10
- ZUHZGEOKBKGPSW-UHFFFAOYSA-N tetraglyme Chemical compound COCCOCCOCCOCCOC ZUHZGEOKBKGPSW-UHFFFAOYSA-N 0.000 claims description 8
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 claims description 4
- COBPKKZHLDDMTB-UHFFFAOYSA-N 2-[2-(2-butoxyethoxy)ethoxy]ethanol Chemical compound CCCCOCCOCCOCCO COBPKKZHLDDMTB-UHFFFAOYSA-N 0.000 claims description 4
- WAEVWDZKMBQDEJ-UHFFFAOYSA-N 2-[2-(2-methoxypropoxy)propoxy]propan-1-ol Chemical compound COC(C)COC(C)COC(C)CO WAEVWDZKMBQDEJ-UHFFFAOYSA-N 0.000 claims description 4
- 125000005843 halogen group Chemical group 0.000 claims description 4
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 125000003545 alkoxy group Chemical group 0.000 claims description 3
- 125000004453 alkoxycarbonyl group Chemical group 0.000 claims description 3
- 125000003282 alkyl amino group Chemical group 0.000 claims description 3
- 125000000217 alkyl group Chemical group 0.000 claims description 3
- 150000001412 amines Chemical class 0.000 claims description 3
- 125000003277 amino group Chemical group 0.000 claims description 3
- PXXJHWLDUBFPOL-UHFFFAOYSA-N benzamidine Chemical group NC(=N)C1=CC=CC=C1 PXXJHWLDUBFPOL-UHFFFAOYSA-N 0.000 claims description 3
- CVXBEEMKQHEXEN-UHFFFAOYSA-N carbaryl Chemical compound C1=CC=C2C(OC(=O)NC)=CC=CC2=C1 CVXBEEMKQHEXEN-UHFFFAOYSA-N 0.000 claims description 3
- 229960005286 carbaryl Drugs 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 3
- 125000004093 cyano group Chemical group *C#N 0.000 claims description 3
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 3
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 claims description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims 3
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 claims 2
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 claims 1
- 238000000576 coating method Methods 0.000 abstract description 10
- 239000011248 coating agent Substances 0.000 abstract description 9
- 230000015572 biosynthetic process Effects 0.000 abstract description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 14
- 238000002156 mixing Methods 0.000 description 14
- NLKNQRATVPKPDG-UHFFFAOYSA-M potassium iodide Chemical compound [K+].[I-] NLKNQRATVPKPDG-UHFFFAOYSA-M 0.000 description 9
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 5
- 235000011054 acetic acid Nutrition 0.000 description 5
- 238000002425 crystallisation Methods 0.000 description 5
- 230000008025 crystallization Effects 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 150000002366 halogen compounds Chemical class 0.000 description 4
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 4
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 description 4
- ICZMYHOUGXQUMI-UHFFFAOYSA-N 4-chloro-2-(3-phenylpropyl)-1h-benzimidazole Chemical compound N=1C=2C(Cl)=CC=CC=2NC=1CCCC1=CC=CC=C1 ICZMYHOUGXQUMI-UHFFFAOYSA-N 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 3
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical group [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- ODWXUNBKCRECNW-UHFFFAOYSA-M bromocopper(1+) Chemical compound Br[Cu+] ODWXUNBKCRECNW-UHFFFAOYSA-M 0.000 description 3
- 229910052801 chlorine Inorganic materials 0.000 description 3
- 125000001309 chloro group Chemical group Cl* 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- BSYVTEYKTMYBMK-UHFFFAOYSA-N tetrahydrofurfuryl alcohol Chemical compound OCC1CCCO1 BSYVTEYKTMYBMK-UHFFFAOYSA-N 0.000 description 3
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 2
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 2
- 239000000872 buffer Substances 0.000 description 2
- 238000005238 degreasing Methods 0.000 description 2
- JXTHNDFMNIQAHM-UHFFFAOYSA-N dichloroacetic acid Chemical compound OC(=O)C(Cl)Cl JXTHNDFMNIQAHM-UHFFFAOYSA-N 0.000 description 2
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 235000019253 formic acid Nutrition 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- IOLCXVTUBQKXJR-UHFFFAOYSA-M potassium bromide Chemical compound [K+].[Br-] IOLCXVTUBQKXJR-UHFFFAOYSA-M 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 239000011975 tartaric acid Substances 0.000 description 2
- 235000002906 tartaric acid Nutrition 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- VNDYJBBGRKZCSX-UHFFFAOYSA-L zinc bromide Chemical compound Br[Zn]Br VNDYJBBGRKZCSX-UHFFFAOYSA-L 0.000 description 2
- 239000011592 zinc chloride Substances 0.000 description 2
- 235000005074 zinc chloride Nutrition 0.000 description 2
- UAYWVJHJZHQCIE-UHFFFAOYSA-L zinc iodide Chemical compound I[Zn]I UAYWVJHJZHQCIE-UHFFFAOYSA-L 0.000 description 2
- PWMWNFMRSKOCEY-UHFFFAOYSA-N 1-Phenyl-1,2-ethanediol Chemical compound OCC(O)C1=CC=CC=C1 PWMWNFMRSKOCEY-UHFFFAOYSA-N 0.000 description 1
- KYUPIHBUKDNZKE-UHFFFAOYSA-N 1-amino-3-methylbutan-2-ol Chemical compound CC(C)C(O)CN KYUPIHBUKDNZKE-UHFFFAOYSA-N 0.000 description 1
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical compound CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 description 1
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 1
- MONMFXREYOKQTI-UHFFFAOYSA-N 2-bromopropanoic acid Chemical compound CC(Br)C(O)=O MONMFXREYOKQTI-UHFFFAOYSA-N 0.000 description 1
- BFSVOASYOCHEOV-UHFFFAOYSA-N 2-diethylaminoethanol Chemical compound CCN(CC)CCO BFSVOASYOCHEOV-UHFFFAOYSA-N 0.000 description 1
- KZLYQYPURWXOEW-UHFFFAOYSA-N 2-iodopropanoic acid Chemical compound CC(I)C(O)=O KZLYQYPURWXOEW-UHFFFAOYSA-N 0.000 description 1
- NRZCZKLAOWPJKZ-UHFFFAOYSA-N 6-chloro-2-[2-(2-nitrophenyl)ethyl]-1h-benzimidazole Chemical compound [O-][N+](=O)C1=CC=CC=C1CCC1=NC2=CC=C(Cl)C=C2N1 NRZCZKLAOWPJKZ-UHFFFAOYSA-N 0.000 description 1
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical group [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- JJLJMEJHUUYSSY-UHFFFAOYSA-L Copper hydroxide Chemical compound [OH-].[OH-].[Cu+2] JJLJMEJHUUYSSY-UHFFFAOYSA-L 0.000 description 1
- 239000005750 Copper hydroxide Substances 0.000 description 1
- 229910021589 Copper(I) bromide Inorganic materials 0.000 description 1
- 229910021591 Copper(I) chloride Inorganic materials 0.000 description 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- 229910021380 Manganese Chloride Inorganic materials 0.000 description 1
- GLFNIEUTAYBVOC-UHFFFAOYSA-L Manganese chloride Chemical compound Cl[Mn]Cl GLFNIEUTAYBVOC-UHFFFAOYSA-L 0.000 description 1
- UEEJHVSXFDXPFK-UHFFFAOYSA-N N-dimethylaminoethanol Chemical compound CN(C)CCO UEEJHVSXFDXPFK-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- RAOSIAYCXKBGFE-UHFFFAOYSA-K [Cu+3].[O-]P([O-])([O-])=O Chemical compound [Cu+3].[O-]P([O-])([O-])=O RAOSIAYCXKBGFE-UHFFFAOYSA-K 0.000 description 1
- 238000002835 absorbance Methods 0.000 description 1
- MQRWBMAEBQOWAF-UHFFFAOYSA-N acetic acid;nickel Chemical compound [Ni].CC(O)=O.CC(O)=O MQRWBMAEBQOWAF-UHFFFAOYSA-N 0.000 description 1
- ZOIORXHNWRGPMV-UHFFFAOYSA-N acetic acid;zinc Chemical compound [Zn].CC(O)=O.CC(O)=O ZOIORXHNWRGPMV-UHFFFAOYSA-N 0.000 description 1
- 239000004480 active ingredient Substances 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- ITHZDDVSAWDQPZ-UHFFFAOYSA-L barium acetate Chemical compound [Ba+2].CC([O-])=O.CC([O-])=O ITHZDDVSAWDQPZ-UHFFFAOYSA-L 0.000 description 1
- 229940112016 barium acetate Drugs 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 239000007853 buffer solution Substances 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- FOCAUTSVDIKZOP-UHFFFAOYSA-N chloroacetic acid Chemical compound OC(=O)CCl FOCAUTSVDIKZOP-UHFFFAOYSA-N 0.000 description 1
- 229940106681 chloroacetic acid Drugs 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229940125904 compound 1 Drugs 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910001956 copper hydroxide Inorganic materials 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 description 1
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- NKNDPYCGAZPOFS-UHFFFAOYSA-M copper(i) bromide Chemical compound Br[Cu] NKNDPYCGAZPOFS-UHFFFAOYSA-M 0.000 description 1
- OPQARKPSCNTWTJ-UHFFFAOYSA-L copper(ii) acetate Chemical compound [Cu+2].CC([O-])=O.CC([O-])=O OPQARKPSCNTWTJ-UHFFFAOYSA-L 0.000 description 1
- HFDWIMBEIXDNQS-UHFFFAOYSA-L copper;diformate Chemical compound [Cu+2].[O-]C=O.[O-]C=O HFDWIMBEIXDNQS-UHFFFAOYSA-L 0.000 description 1
- GBRBMTNGQBKBQE-UHFFFAOYSA-L copper;diiodide Chemical compound I[Cu]I GBRBMTNGQBKBQE-UHFFFAOYSA-L 0.000 description 1
- QYCVHILLJSYYBD-UHFFFAOYSA-L copper;oxalate Chemical compound [Cu+2].[O-]C(=O)C([O-])=O QYCVHILLJSYYBD-UHFFFAOYSA-L 0.000 description 1
- 229940045803 cuprous chloride Drugs 0.000 description 1
- 229960002887 deanol Drugs 0.000 description 1
- 229960005215 dichloroacetic acid Drugs 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 description 1
- 239000012972 dimethylethanolamine Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- DGGBWMIHLYPLEU-UHFFFAOYSA-N ethyl 2-[(3-bromophenyl)methyl]-3h-benzimidazole-5-carboxylate Chemical compound N1C2=CC(C(=O)OCC)=CC=C2N=C1CC1=CC=CC(Br)=C1 DGGBWMIHLYPLEU-UHFFFAOYSA-N 0.000 description 1
- JBTWLSYIZRCDFO-UHFFFAOYSA-N ethyl methyl carbonate Chemical compound CCOC(=O)OC JBTWLSYIZRCDFO-UHFFFAOYSA-N 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 229960002089 ferrous chloride Drugs 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- NMCUIPGRVMDVDB-UHFFFAOYSA-L iron dichloride Chemical compound Cl[Fe]Cl NMCUIPGRVMDVDB-UHFFFAOYSA-L 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- 229940046892 lead acetate Drugs 0.000 description 1
- 239000011565 manganese chloride Substances 0.000 description 1
- 235000002867 manganese chloride Nutrition 0.000 description 1
- 229940099607 manganese chloride Drugs 0.000 description 1
- 229940099596 manganese sulfate Drugs 0.000 description 1
- 239000011702 manganese sulphate Substances 0.000 description 1
- 235000007079 manganese sulphate Nutrition 0.000 description 1
- BHVPEUGTPDJECS-UHFFFAOYSA-L manganese(2+);diformate Chemical compound [Mn+2].[O-]C=O.[O-]C=O BHVPEUGTPDJECS-UHFFFAOYSA-L 0.000 description 1
- RGVLTEMOWXGQOS-UHFFFAOYSA-L manganese(2+);oxalate Chemical compound [Mn+2].[O-]C(=O)C([O-])=O RGVLTEMOWXGQOS-UHFFFAOYSA-L 0.000 description 1
- SQQMAOCOWKFBNP-UHFFFAOYSA-L manganese(II) sulfate Chemical compound [Mn+2].[O-]S([O-])(=O)=O SQQMAOCOWKFBNP-UHFFFAOYSA-L 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- RMIODHQZRUFFFF-UHFFFAOYSA-N methoxyacetic acid Chemical compound COCC(O)=O RMIODHQZRUFFFF-UHFFFAOYSA-N 0.000 description 1
- 229940078494 nickel acetate Drugs 0.000 description 1
- 238000010979 pH adjustment Methods 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 230000003449 preventive effect Effects 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- YNJBWRMUSHSURL-UHFFFAOYSA-N trichloroacetic acid Chemical compound OC(=O)C(Cl)(Cl)Cl YNJBWRMUSHSURL-UHFFFAOYSA-N 0.000 description 1
- 239000004246 zinc acetate Substances 0.000 description 1
- 229960000314 zinc acetate Drugs 0.000 description 1
- 229940102001 zinc bromide Drugs 0.000 description 1
- ZULTYUIALNTCSA-UHFFFAOYSA-N zinc hydride Chemical compound [ZnH2] ZULTYUIALNTCSA-UHFFFAOYSA-N 0.000 description 1
- 229910000051 zinc hydride Inorganic materials 0.000 description 1
Classifications
-
- A—HUMAN NECESSITIES
- A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
- A01N—PRESERVATION OF BODIES OF HUMANS OR ANIMALS OR PLANTS OR PARTS THEREOF; BIOCIDES, e.g. AS DISINFECTANTS, AS PESTICIDES OR AS HERBICIDES; PEST REPELLANTS OR ATTRACTANTS; PLANT GROWTH REGULATORS
- A01N25/00—Biocides, pest repellants or attractants, or plant growth regulators, characterised by their forms, or by their non-active ingredients or by their methods of application, e.g. seed treatment or sequential application; Substances for reducing the noxious effect of the active ingredients to organisms other than pests
- A01N25/02—Biocides, pest repellants or attractants, or plant growth regulators, characterised by their forms, or by their non-active ingredients or by their methods of application, e.g. seed treatment or sequential application; Substances for reducing the noxious effect of the active ingredients to organisms other than pests containing liquids as carriers, diluents or solvents
- A01N25/04—Dispersions, emulsions, suspoemulsions, suspension concentrates or gels
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/08—Anti-corrosive paints
-
- A—HUMAN NECESSITIES
- A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
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Abstract
本發明之水溶性預焊劑之特徵在於:含有(A)咪唑系化合物、(B)有機酸、(C)錯合物覆膜形成助劑、(D)有機溶劑、及(E)水,上述(D)有機溶劑於溫度20℃下於水中之溶解度為10 g/100 g以上,並且沸點為100℃以上且300℃以下。
Description
本發明係關於一種水溶性預焊劑、使用其之電子基板及表面處理方法。
印刷配線基板多數情況下以形成有阻焊劑覆膜之狀態流通。於此種情形時,印刷配線基板之大部分被阻焊劑覆膜覆蓋,但於電極端子(焊墊)不存在阻焊劑覆膜以供搭載電子零件。因此,於印刷配線基板之流通或保管時,電極端子之表面容易被氧化。因此,對於印刷配線基板之電極端子,存在為了防止電極端子表面發生氧化而對電極端子之表面實施鍍金處理之情況。然而,鍍金處理存在因使用貴金屬而成本變高之問題。因此,對於印刷配線基板,採用藉由水溶性預焊劑於電極端子之表面形成保護覆膜之方法代替鍍金處理(例如文獻1:日本專利特開平6-322551號公報)。 如文獻1所記載之先前之水溶性預焊劑存在如下問題:於以低溫(例如5℃以下)保存之情形時,水溶性預焊劑中之咪唑系化合物出現結晶化。因此,要求水溶性預焊劑亦能夠於低溫環境下保管(低溫穩定性)。 水溶性預焊劑中之咪唑系化合物由於不溶或難溶於水,故而通常使用乙酸等有機酸而使之溶解於水。另外,儘管針對咪唑系化合物之種類或有機酸之種類,進行有包括低溫穩定性在內之諸多特性之研究,但尚未發現具有充分之低溫穩定性之組合。又,作為提高水溶性預焊劑之低溫穩定性之方法,亦存在使用可溶解咪唑系化合物之醇類等有機溶劑之方法。然而,嘗試使用醇類等有機溶劑以提高低溫穩定性,但又產生難以於電極端子之表面形成咪唑系化合物之保護覆膜之問題。如此,於維持保護覆膜之形成性之同時提高低溫穩定性非常難以實現。
因此,本發明之目的在於提供一種具有優異之低溫穩定性之水溶性預焊劑、以及使用其之電子基板及表面處理方法。 本發明者等人為了達成上述目的而努力反覆進行研究,結果發現如下見解。即,於對含有咪唑系化合物、有機酸及錯合物覆膜形成助劑之水溶性預焊劑添加有機溶劑之情形時,通常低溫穩定性會提高,但同時保護覆膜之形成性降低。然而,於使用滿足特定條件之有機溶劑之情形時,驚訝地發現可於維持保護覆膜之形成性之同時提高低溫穩定性,從而完成本發明。 本發明之水溶性預焊劑其特徵在於:含有(A)咪唑系化合物、(B)有機酸、(C)錯合物覆膜形成助劑、(D)有機溶劑、及(E)水,上述(D)有機溶劑於溫度20℃下於水中之溶解度為10 g/100 g以上,並且沸點為100℃以上且300℃以下。 於本發明之水溶性預焊劑中,較佳為上述(A)咪唑系化合物為下述通式(1)所表示之化合物。 (下述通式(1)中,X及Y分別可相同亦可不同,表示選自由碳數1~7之直鏈或支鏈烷基、鹵素原子、胺基、二低級烷基胺基、羥基、低級烷氧基、氰基、乙醯基、苯甲醯基、胺甲醯基、甲醯基、羧基、低級烷氧基羰基及硝基所組成之群中之至少一者,n表示0~4之整數,m表示0~10之整數,p表示0~4之整數)於本發明之水溶性預焊劑中,較佳為上述(D)有機溶劑為選自由三丙二醇單甲醚(methyl propylene triglycol)、三乙二醇單丁醚(butyl triglycol)、丙二醇單甲醚、四乙二醇二甲醚、四氫呋喃甲醇、及丙二醇單甲醚乙酸酯所組成之群中之至少1種。 本發明之電子基板其特徵在於:具備藉由上述水溶性預焊劑而形成之保護覆膜。 本發明之表面處理方法其特徵在於:具備使用上述水溶性預焊劑於電子基板之電極端子上形成保護覆膜之步驟。 根據本發明,可提供一種具有優異之低溫穩定性之水溶性預焊劑、以及使用其之電子基板及表面處理方法。
本發明之水溶性預焊劑含有以下將要說明之(A)咪唑系化合物、(B)有機酸、(C)錯合物覆膜形成助劑、(D)有機溶劑、及(E)水。 [(A)成分] 作為用於本發明之(A)咪唑系化合物,可使用公知之咪唑系化合物。就所形成之保護覆膜之性能之觀點而言,作為該(A)成分,較佳為下述通式(1)所表示之化合物。上述通式(1)中,X及Y分別可相同亦可不同,表示選自由碳數1~7之直鏈或支鏈烷基、鹵素原子、胺基、二低級烷基胺基、羥基、低級烷氧基、氰基、乙醯基、苯甲醯基、胺甲醯基、甲醯基、羧基、低級烷氧基羰基及硝基所組成之群中之至少一者,n表示0~4之整數,m表示0~10之整數,p表示0~4之整數。 作為鹵素原子,可列舉:氯原子、溴原子及碘原子。該等之中,就提高電極端子之焊料潤濕性之觀點而言,較佳為氯原子、溴原子,尤佳為氯原子。 作為上述通式(1)所表示之化合物,可列舉:2-(3-氯)苄基苯并咪唑、2-(3,4-二氯)苄基苯并咪唑、4-氯-2-(3-苯基丙基)苯并咪唑、6-氯-2-{(2-硝基苯基)乙基}苯并咪唑、及6-乙氧羰基-2-(3-溴苄基)苯并咪唑等。該等之中,就抑制電極端子之表面之氧化之觀點而言,更佳為2-(3-氯)苄基苯并咪唑、2-(3,4-二氯)苄基苯并咪唑、4-氯-2-(3-苯基丙基)苯并咪唑。又,該等可單獨使用1種,亦可混合使用2種以上。 作為上述(A)成分之調配量,相對於水溶性預焊劑100質量%,較佳為0.01質量%以上且10質量%以下,更佳為0.05質量%以上且5質量%以下。藉由將調配量設為上述下限以上,容易形成防銹膜等塗膜。又,若調配量超過上述上限,則存在不溶解成分容易變多之傾向,從而於經濟性方面欠佳。 [(B)成分] 作為用於本發明之(B)有機酸,可列舉:甲酸、乙酸、丙酸、丁酸、乙醇酸、酒石酸、乳酸、氯乙酸、二氯乙酸、三氯乙酸、溴乙酸、及甲氧基乙酸等。該等之中,較佳為甲酸、乙酸。又,該等可單獨使用1種,亦可混合使用2種以上。 作為上述(B)成分之調配量,相對於水溶性預焊劑100質量%,較佳為1質量%以上且40質量%以下,更佳為1質量%以上且20質量%以下,尤佳為1質量%以上且10質量%以下。若調配量未達上述下限,則存在難以使覆膜形成咪唑系化合物溶解之傾向,另一方面,若超過上述上限,則存在保護覆膜之形成性容易降低之傾向。 [(C)成分] 作為用於本發明之(C)錯合物覆膜形成助劑,可列舉:甲酸銅、氯化亞銅、氯化銅、草酸銅、乙酸銅、氫氧化銅、碳酸銅、磷酸銅、硫酸銅、甲酸錳、氯化錳、草酸錳、硫酸錳、乙酸鋅、乙酸鉛、乙酸鎳、乙酸鋇、氫化鋅、氯化亞鐵、氯化鐵、氧化亞鐵、氧化鐵、碘化銅、碘化鉀、碘化鋅、溴化亞銅、溴化銅、溴化鉀、及溴化鋅等金屬化合物。該等之中,就提高焊料潤濕性、或提高耐熱性之觀點而言,較佳為氯化鋅、溴化銅、碘化鉀。又,該等可單獨使用1種,亦可混合使用2種以上。 作為上述(C)成分之調配量,相對於水溶性預焊劑100質量%,較佳為0.01質量%以上且10質量%以下,更佳為0.05質量%以上且5質量%以下。若調配量未達上述下限,則存在提高保護覆膜之形成性之效果不足之傾向,另一方面,若超過上述上限,則存在保護覆膜之形成性變得過度或低溫下之液體穩定性降低之傾向。 [(D)成分] 用於本發明之(D)有機溶劑於溫度20℃下於水中之溶解度需為10 g/100 g以上,並且沸點需為100℃以上且300℃以下。藉由含有此種(D)成分,可提高水溶性預焊劑之低溫穩定性。 又,就水溶性預焊劑之低溫穩定性之觀點而言,(D)成分於溫度20℃下於水中之溶解度更佳為15 g/100 g以上,尤佳為50 g/100 g以上。再者,於可對水100 g混合任意量之有機溶劑之情形時,將該有機溶劑之溶解度表達為任意混合。 又,就水溶性預焊劑之低溫穩定性之觀點而言,(D)成分之沸點更佳為120℃以上且280℃以下,尤佳為180℃以上且260℃以下。再者,於本說明書中,所謂沸點係指1013 hPa下之沸點。 作為上述(D)成分,只要為滿足上述條件者,則可使用二醇醚系溶劑、二醇酯系溶劑及醇系溶劑等。該等之中,就低溫穩定性之觀點而言,較佳為二醇醚系溶劑。 作為上述(D)成分,可列舉:三丙二醇單甲醚(溶解度:任意混合;沸點:242℃)、三乙二醇單丁醚(溶解度:任意混合;沸點:271℃)、丙二醇單甲醚(溶解度:任意混合;沸點:121℃)、四乙二醇二甲醚(溶解度:任意混合;沸點:275℃)、四氫呋喃甲醇(溶解度:任意混合;沸點:178℃)、及丙二醇單甲醚乙酸酯(溶解度:18.5 g/100 g;沸點:146℃)。該等之中,就低溫穩定性與保護覆膜之形成性的均衡性之觀點而言,較佳為三丙二醇單甲醚。又,該等可單獨使用1種,亦可混合使用2種以上。再者,括號內所記載之溶解度係於溫度20℃下於水中之溶解度。 作為上述(D)成分之調配量,相對於水溶性預焊劑100質量%,較佳為0.2質量%以上且15質量%以下,更佳為0.5質量%以上且10質量%以下,尤佳為1質量%以上且5質量%以下。若調配量未達上述下限,則存在水溶性預焊劑之低溫穩定性變得不充分之傾向,另一方面,若超過上述上限,則存在保護覆膜之形成性降低之傾向。 [(E)成分及其他成分] 用於本發明之(E)水係水溶性預焊劑中除上述(A)成分、上述(B)成分、上述(C)成分、上述(D)成分、及以下將要說明之其他成分以外之剩餘部分。 作為可調配於本發明之水溶性預焊劑中之其他成分,可列舉:含有與自上述(C)成分分離之金屬離子對應之鹼的緩衝液、或鹵素化合物等。 作為上述緩衝液中之鹼,可列舉:氨、二乙胺、三乙胺、二乙醇胺、三乙醇胺、單乙醇胺、二甲基乙醇胺、二乙基乙醇胺、異丙基乙醇胺、氫氧化鈉、及氫氧化鉀等。 作為上述鹵素化合物,可列舉:溴丙酸及碘丙酸等。該等鹵素化合物可單獨使用1種,亦可混合使用2種以上。 於使用上述鹵素化合物之情形時,作為其調配量,相對於水溶性預焊劑100質量%,較佳為0.01質量%以上且10質量%以下,更佳為0.05質量%以上且5質量%以下。 [表面處理方法及電子基板] 其次,對本發明之表面處理方法及電子基板進行說明。 本發明之表面處理方法具備使用水溶性預焊劑於電子基板之電極端子上形成保護覆膜之步驟。 作為電子基板,可列舉:印刷配線基板及半導體用基板等。 作為保護覆膜之形成方法,例如可採用如下方法:對處理對象之印刷配線基板之電極端子之表面實施預處理步驟,即,進行脫脂、化學研磨(軟蝕刻)、酸洗、水洗後,於10~60℃、1秒~100分鐘(較佳為20~50℃、5秒~60分鐘,更佳為20~50℃、10秒~10分鐘)之條件下將印刷配線基板浸漬於上述水溶性預焊劑中。以此方式,上述通式(1)所表示之化合物附著於電極端子之表面,其附著量隨著處理溫度之提高、處理時間之延長而越來越多。此時,若利用超音波則更佳。再者,亦可藉由其他塗佈方法,例如噴霧法、刷塗、輥塗等形成保護覆膜。 以如上方式可製造本發明之電子基板。即,本發明之電子基板具備藉由上述水溶性預焊劑而形成之保護覆膜。 實施例 其次,藉由實施例及比較例而更具體地說明本發明,但本發明並不受該等示例之任何限定。再者,將實施例及比較例中使用之材料示於以下。 ((A)成分) 咪唑系化合物:4-氯-2-(3-苯基丙基)苯并咪唑 ((B)成分) 有機酸A:乙酸 有機酸B:酒石酸 ((C)成分) 錯合物覆膜形成助劑A:氯化鋅 錯合物覆膜形成助劑B:溴化銅 錯合物覆膜形成助劑C:碘化鉀 ((D)成分) 有機溶劑A:三丙二醇單甲醚(溶解度:任意混合;沸點:242℃) 有機溶劑B:三乙二醇單丁醚(溶解度:任意混合;沸點:271℃) 有機溶劑C:丙二醇單甲醚(溶解度:任意混合;沸點:121℃) 有機溶劑D:四乙二醇二甲醚(溶解度:任意混合;沸點:275℃) 有機溶劑E:四氫呋喃甲醇(溶解度:任意混合;沸點:178℃) 有機溶劑F:丙二醇單甲醚乙酸酯(溶解度:18.5 g/100 g;沸點:146℃) ((E)成分) 水:純水 (其他成分) 有機溶劑G:苯乙二醇(溶解度:2.7 g/100 g;沸點:245℃) 有機溶劑H:三丙二醇單丁醚(butyl propylene triglycol)(溶解度:0.4 g/100 g;沸點:274℃) 有機溶劑I:二乙二醇二丁醚(溶解度:0.3 g/100 g;沸點:256℃) 有機溶劑J:乙醇(溶解度:任意混合;沸點:78℃) 有機溶劑K:異丙醇(溶解度:任意混合;沸點:82℃) [實施例1] 使咪唑系化合物1質量%、有機酸A 2質量%、錯合物覆膜形成助劑A 0.5質量%及有機溶劑A溶解於水96質量%,而獲得水溶性預焊劑。又,所獲得之水溶性預焊劑藉由作為緩衝液之25質量%氨水進行pH調整,而製成能夠形成覆膜之水溶性預焊劑處理液。 [實施例2~15] 依據表1所示之組成而調配各材料,除此以外,以與實施例1同樣之方式獲得水溶性預焊劑及處理液。 [比較例1~7] 依據表2所示之組成而調配各材料,除此以外,以與實施例1同樣之方式獲得水溶性預焊劑及處理液。 <水溶性預焊劑之評價> 藉由如下方法,對水溶性預焊劑之性能(覆膜厚度、低溫保管穩定性、再溶解性)進行評價或測定。將所獲得之結果示於表1~表3。 (1)覆膜厚度 對雙面覆銅積層板(大小:25 mm×50 mm;厚度:1.6 mm;基材之種類:FR-4)進行脫脂、軟蝕刻及水洗而淨化表面後,於40℃下於水溶性預焊劑處理液中浸漬2分鐘而形成覆膜,並進行水洗、熱風乾燥,而獲得試驗基板。對該試驗基板,將表面積25 cm2
之試驗基板上之覆膜萃取至0.5%鹽酸50 mL,其後,測定因萃取液中之覆膜有效成分而產生之極大吸光度,並根據換算式算出覆膜厚度(單位:μm)。 (2)低溫保管穩定性 量取水溶性預焊劑100 mL置於可密閉之玻璃瓶(容積:120 mL~150 mL)內,並栓緊而獲得試樣。將該試樣靜置於設定為溫度5℃(誤差2℃以內)之冷藏保管庫中。其後,每隔24小時將試樣取出,藉由目視確認有無結晶。並依據下述基準,評價低溫保管穩定性。 A:經過240小時亦無結晶產生。 B:經過168小時亦無結晶產生,但於240小時以內產生結晶。 C:經過48小時亦無結晶產生,但於168小時以內產生結晶。 D:於48小時以內產生結晶。 (3)再溶解性 量取水溶性預焊劑100 mL置於可密閉之玻璃瓶(容積:120 mL~150 mL)內,並栓緊而獲得試樣。將該試樣靜置於設定為溫度-15℃(誤差2℃以內)之冷凍保管庫中。其後,於水溶性預焊劑完全凝固後將其取出(時間預計為24小時以上且48小時以下)。繼而,將該試樣於溫度40℃之恆溫水槽中靜置加溫1小時,其後,利用磁力攪拌器於室溫下攪拌1小時,藉由目視確認於試樣溫度恢復至室溫後有無結晶。並依據下述基準,評價再溶解性。 A:析出物完全溶解。 B:析出物殘留,不完全溶解。 [表1]
[表2]
根據表1及表2所示之結果,確認關於本發明之水溶性預焊劑(實施例1~15),覆膜厚度、低溫保管穩定性及再溶解性均良好。因此,確認根據本發明,可獲得具有優異之低溫穩定性之水溶性預焊劑。 另一方面,可知關於不含(D)成分之水溶性預焊劑(比較例1~7),再溶解性欠佳,又,覆膜厚度及低溫保管穩定性兩者未變得良好。
Claims (5)
- 一種水溶性預焊劑,其特徵在於:含有(A)咪唑系化合物、(B)有機酸、(C)錯合物覆膜形成助劑、(D)有機溶劑、及(E)水, 上述(D)有機溶劑於溫度20℃下於水中之溶解度為10 g/100 g以上,並且沸點為100℃以上且300℃以下。
- 如請求項1之水溶性預焊劑,其中上述(A)咪唑系化合物為下述通式(1)所表示之化合物,(通式(1)中,X及Y分別可相同亦可不同,表示選自由碳數1~7之直鏈或支鏈烷基、鹵素原子、胺基、二低級烷基胺基、羥基、低級烷氧基、氰基、乙醯基、苯甲醯基、胺甲醯基、甲醯基、羧基、低級烷氧基羰基及硝基所組成之群中之至少一者,n表示0~4之整數,m表示0~10之整數,p表示0~4之整數)。
- 如請求項1或2之水溶性預焊劑,其中上述(D)有機溶劑為選自由三丙二醇單甲醚、三乙二醇單丁醚、丙二醇單甲醚、四乙二醇二甲醚、四氫呋喃甲醇、及丙二醇單甲醚乙酸酯所組成之群中之至少1種。
- 一種電子基板,其特徵在於:具備藉由如請求項1或2之水溶性預焊劑而形成之保護覆膜。
- 一種表面處理方法,其特徵在於:具備使用如請求項1或2之水溶性預焊劑於電子基板之電極端子上形成保護覆膜之步驟。
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