CN107148665B - 基板清洗装置及基板清洗方法 - Google Patents
基板清洗装置及基板清洗方法 Download PDFInfo
- Publication number
- CN107148665B CN107148665B CN201580059263.2A CN201580059263A CN107148665B CN 107148665 B CN107148665 B CN 107148665B CN 201580059263 A CN201580059263 A CN 201580059263A CN 107148665 B CN107148665 B CN 107148665B
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- Prior art keywords
- substrate
- cleaning
- component
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- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004140 cleaning Methods 0.000 title claims abstract description 425
- 238000000034 method Methods 0.000 title claims description 25
- 239000000758 substrate Substances 0.000 claims abstract description 370
- 238000009991 scouring Methods 0.000 claims description 28
- 230000007246 mechanism Effects 0.000 claims description 20
- 230000033001 locomotion Effects 0.000 claims description 19
- 239000012530 fluid Substances 0.000 description 18
- 238000000227 grinding Methods 0.000 description 13
- 239000007788 liquid Substances 0.000 description 12
- 239000007921 spray Substances 0.000 description 11
- 239000000203 mixture Substances 0.000 description 9
- 238000009472 formulation Methods 0.000 description 8
- 238000001035 drying Methods 0.000 description 7
- 238000005406 washing Methods 0.000 description 7
- 238000002347 injection Methods 0.000 description 6
- 239000007924 injection Substances 0.000 description 6
- 230000009467 reduction Effects 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 238000003860 storage Methods 0.000 description 5
- 230000009471 action Effects 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000010355 oscillation Effects 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- 101000873785 Homo sapiens mRNA-decapping enzyme 1A Proteins 0.000 description 2
- 230000037396 body weight Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000011068 loading method Methods 0.000 description 2
- 102100035856 mRNA-decapping enzyme 1A Human genes 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000008450 motivation Effects 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 241000050051 Chelone glabra Species 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000011086 high cleaning Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- SYHGEUNFJIGTRX-UHFFFAOYSA-N methylenedioxypyrovalerone Chemical compound C=1C=C2OCOC2=CC=1C(=O)C(CCC)N1CCCC1 SYHGEUNFJIGTRX-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
-
- A—HUMAN NECESSITIES
- A46—BRUSHWARE
- A46B—BRUSHES
- A46B13/00—Brushes with driven brush bodies or carriers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
- B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/022—Cleaning travelling work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02096—Cleaning only mechanical cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014223715 | 2014-10-31 | ||
| JP2014-223715 | 2014-10-31 | ||
| PCT/JP2015/005279 WO2016067562A1 (ja) | 2014-10-31 | 2015-10-20 | 基板洗浄装置及び基板洗浄方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107148665A CN107148665A (zh) | 2017-09-08 |
| CN107148665B true CN107148665B (zh) | 2018-04-20 |
Family
ID=55856929
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201580059263.2A Active CN107148665B (zh) | 2014-10-31 | 2015-10-20 | 基板清洗装置及基板清洗方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US10163664B2 (ja) |
| JP (1) | JP6178019B2 (ja) |
| KR (2) | KR20170043664A (ja) |
| CN (1) | CN107148665B (ja) |
| TW (1) | TWI607502B (ja) |
| WO (1) | WO2016067562A1 (ja) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6901277B2 (ja) * | 2017-02-20 | 2021-07-14 | グローバルウェーハズ・ジャパン株式会社 | スクラブ洗浄方法およびスクラブ洗浄装置 |
| JP6792512B2 (ja) * | 2017-05-16 | 2020-11-25 | 株式会社荏原製作所 | 基板洗浄装置および基板処理装置 |
| JP7009128B2 (ja) * | 2017-09-20 | 2022-01-25 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法及び記憶媒体 |
| KR102279523B1 (ko) * | 2018-01-30 | 2021-07-20 | 주식회사 케이씨텍 | 브러쉬 세정 장치 |
| JP7137941B2 (ja) * | 2018-03-15 | 2022-09-15 | 株式会社荏原製作所 | 基板洗浄装置、及び基板洗浄方法 |
| JP6979935B2 (ja) * | 2018-10-24 | 2021-12-15 | 三菱電機株式会社 | 半導体製造装置および半導体製造方法 |
| JP7149869B2 (ja) * | 2019-02-07 | 2022-10-07 | 株式会社荏原製作所 | 基板洗浄方法および基板洗浄装置 |
| CN114649245B (zh) * | 2022-05-19 | 2022-09-09 | 西安奕斯伟材料科技有限公司 | 一种用于承载和清洁硅片的装置 |
| JP2024064210A (ja) * | 2022-10-27 | 2024-05-14 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理方法及び基板処理装置 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101045230A (zh) * | 2006-03-30 | 2007-10-03 | 大日本网目版制造株式会社 | 基板处理装置以及基板处理方法 |
| CN101075553A (zh) * | 2006-05-17 | 2007-11-21 | 大日本网目版制造株式会社 | 基板处理方法以及基板处理装置 |
| CN103786091A (zh) * | 2012-10-26 | 2014-05-14 | 株式会社荏原制作所 | 研磨装置及研磨方法 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR0171491B1 (ko) * | 1994-09-20 | 1999-03-30 | 이시다 아키라 | 회전식 기판세정장치 |
| JP3539834B2 (ja) * | 1997-02-10 | 2004-07-07 | 大日本スクリーン製造株式会社 | 基板洗浄方法および基板洗浄装置 |
| JP3320640B2 (ja) | 1997-07-23 | 2002-09-03 | 東京エレクトロン株式会社 | 洗浄装置 |
| JP3701188B2 (ja) * | 2000-10-04 | 2005-09-28 | 大日本スクリーン製造株式会社 | 基板洗浄方法およびその装置 |
| JP2003068695A (ja) * | 2001-08-29 | 2003-03-07 | Hitachi Ltd | 半導体集積回路装置の製造方法 |
| JP4261931B2 (ja) | 2002-07-05 | 2009-05-13 | 株式会社荏原製作所 | 無電解めっき装置および無電解めっき後の洗浄方法 |
| KR101190169B1 (ko) | 2005-02-07 | 2012-10-12 | 가부시키가이샤 에바라 세이사꾸쇼 | 기판처리장치, 연마장치, 무전해 도금장치 및 제어프로그램 |
| KR100892809B1 (ko) * | 2006-03-30 | 2009-04-10 | 다이닛뽕스크린 세이조오 가부시키가이샤 | 기판처리장치 및 기판처리방법 |
| US8578953B2 (en) | 2006-12-20 | 2013-11-12 | Tokyo Electron Limited | Substrate cleaning apparatus, substrate cleaning method, and computer-readable storage medium |
| JP5192206B2 (ja) * | 2007-09-13 | 2013-05-08 | 株式会社Ｓｏｋｕｄｏ | 基板処理装置および基板処理方法 |
| JP5767898B2 (ja) | 2011-08-12 | 2015-08-26 | 株式会社東芝 | 半導体装置の製造方法 |
| JP6113960B2 (ja) | 2012-02-21 | 2017-04-12 | 株式会社荏原製作所 | 基板処理装置および基板処理方法 |
| JP6297308B2 (ja) * | 2012-12-06 | 2018-03-20 | 株式会社荏原製作所 | 基板洗浄装置及び基板洗浄方法 |
-
2015
- 2015-10-20 US US15/523,078 patent/US10163664B2/en active Active
- 2015-10-20 WO PCT/JP2015/005279 patent/WO2016067562A1/ja active Application Filing
- 2015-10-20 JP JP2016556206A patent/JP6178019B2/ja active Active
- 2015-10-20 KR KR1020177009473A patent/KR20170043664A/ko active Search and Examination
- 2015-10-20 KR KR1020187021758A patent/KR102004109B1/ko active IP Right Grant
- 2015-10-20 CN CN201580059263.2A patent/CN107148665B/zh active Active
- 2015-10-27 TW TW104135205A patent/TWI607502B/zh active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101045230A (zh) * | 2006-03-30 | 2007-10-03 | 大日本网目版制造株式会社 | 基板处理装置以及基板处理方法 |
| CN101075553A (zh) * | 2006-05-17 | 2007-11-21 | 大日本网目版制造株式会社 | 基板处理方法以及基板处理装置 |
| CN103786091A (zh) * | 2012-10-26 | 2014-05-14 | 株式会社荏原制作所 | 研磨装置及研磨方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR102004109B1 (ko) | 2019-07-25 |
| KR20180088749A (ko) | 2018-08-06 |
| CN107148665A (zh) | 2017-09-08 |
| KR20170043664A (ko) | 2017-04-21 |
| JP6178019B2 (ja) | 2017-08-09 |
| WO2016067562A1 (ja) | 2016-05-06 |
| TW201628078A (zh) | 2016-08-01 |
| US20170316960A1 (en) | 2017-11-02 |
| JPWO2016067562A1 (ja) | 2017-05-25 |
| US10163664B2 (en) | 2018-12-25 |
| TWI607502B (zh) | 2017-12-01 |
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