CN107001589B - 包含酚醛乙烯基酯的厌氧可固化组合物 - Google Patents
包含酚醛乙烯基酯的厌氧可固化组合物 Download PDFInfo
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- CN107001589B CN107001589B CN201580063848.1A CN201580063848A CN107001589B CN 107001589 B CN107001589 B CN 107001589B CN 201580063848 A CN201580063848 A CN 201580063848A CN 107001589 B CN107001589 B CN 107001589B
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- Prior art keywords
- methyl
- acrylate
- composition
- epoxy resin
- novolac epoxy
- Prior art date
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- 239000000203 mixture Substances 0.000 title claims abstract description 97
- 229920001567 vinyl ester resin Polymers 0.000 title claims abstract description 17
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 claims description 43
- 125000000217 alkyl group Chemical group 0.000 claims description 28
- 239000004843 novolac epoxy resin Substances 0.000 claims description 26
- -1 sulphonic acid ester Chemical class 0.000 claims description 26
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 21
- 239000007795 chemical reaction product Substances 0.000 claims description 21
- 239000002253 acid Substances 0.000 claims description 17
- 125000004432 carbon atom Chemical group C* 0.000 claims description 17
- 239000000758 substrate Substances 0.000 claims description 17
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 15
- 229930185605 Bisphenol Natural products 0.000 claims description 15
- CERQOIWHTDAKMF-UHFFFAOYSA-N alpha-methacrylic acid Natural products CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 15
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 14
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 claims description 13
- 229910052799 carbon Inorganic materials 0.000 claims description 11
- 150000002148 esters Chemical class 0.000 claims description 10
- 229910052736 halogen Inorganic materials 0.000 claims description 9
- 150000002367 halogens Chemical class 0.000 claims description 9
- 125000003118 aryl group Chemical group 0.000 claims description 8
- 125000003342 alkenyl group Chemical group 0.000 claims description 7
- 229910052760 oxygen Inorganic materials 0.000 claims description 7
- CVHZOJJKTDOEJC-UHFFFAOYSA-N saccharin Chemical compound C1=CC=C2C(=O)NS(=O)(=O)C2=C1 CVHZOJJKTDOEJC-UHFFFAOYSA-N 0.000 claims description 7
- 229940081974 saccharin Drugs 0.000 claims description 7
- 235000019204 saccharin Nutrition 0.000 claims description 7
- 239000000901 saccharin and its Na,K and Ca salt Substances 0.000 claims description 7
- 229920003986 novolac Polymers 0.000 claims description 6
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 claims description 6
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims description 5
- IPZJQDSFZGZEOY-UHFFFAOYSA-N dimethylmethylene Chemical compound C[C]C IPZJQDSFZGZEOY-UHFFFAOYSA-N 0.000 claims description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 5
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 claims description 5
- 125000000325 methylidene group Chemical group [H]C([H])=* 0.000 claims description 5
- 229920001223 polyethylene glycol Polymers 0.000 claims description 5
- SVTBMSDMJJWYQN-UHFFFAOYSA-N 2-methylpentane-2,4-diol Chemical compound CC(O)CC(C)(C)O SVTBMSDMJJWYQN-UHFFFAOYSA-N 0.000 claims description 4
- 239000004593 Epoxy Substances 0.000 claims description 4
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 4
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 claims description 4
- 125000002877 alkyl aryl group Chemical group 0.000 claims description 4
- 125000000392 cycloalkenyl group Chemical group 0.000 claims description 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N formaldehyde Natural products O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims description 4
- 239000011976 maleic acid Substances 0.000 claims description 4
- KXDHJXZQYSOELW-UHFFFAOYSA-M Carbamate Chemical compound NC([O-])=O KXDHJXZQYSOELW-UHFFFAOYSA-M 0.000 claims description 3
- 150000001412 amines Chemical class 0.000 claims description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 3
- IAQRGUVFOMOMEM-UHFFFAOYSA-N but-2-ene Chemical group CC=CC IAQRGUVFOMOMEM-UHFFFAOYSA-N 0.000 claims description 3
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 claims description 3
- 229940118056 cresol / formaldehyde Drugs 0.000 claims description 3
- GPLRAVKSCUXZTP-UHFFFAOYSA-N diglycerol Chemical compound OCC(O)COCC(O)CO GPLRAVKSCUXZTP-UHFFFAOYSA-N 0.000 claims description 3
- 125000003700 epoxy group Chemical group 0.000 claims description 3
- 239000001301 oxygen Substances 0.000 claims description 3
- UWHCKJMYHZGTIT-UHFFFAOYSA-N tetraethylene glycol Chemical compound OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 claims description 3
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 claims description 2
- LCRCBXLHWTVPEQ-UHFFFAOYSA-N 2-phenylbenzaldehyde Chemical compound O=CC1=CC=CC=C1C1=CC=CC=C1 LCRCBXLHWTVPEQ-UHFFFAOYSA-N 0.000 claims description 2
- 239000002202 Polyethylene glycol Substances 0.000 claims description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 2
- 239000005864 Sulphur Substances 0.000 claims description 2
- 150000001408 amides Chemical class 0.000 claims description 2
- 239000004202 carbamide Substances 0.000 claims description 2
- 229940051250 hexylene glycol Drugs 0.000 claims description 2
- FNVQPLCHYJQMHP-UHFFFAOYSA-N methyl prop-2-enoate oxolane Chemical compound C(C=C)(=O)OC.O1CCCC1 FNVQPLCHYJQMHP-UHFFFAOYSA-N 0.000 claims description 2
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 claims description 2
- 229910000077 silane Inorganic materials 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 claims description 2
- 239000010703 silicon Substances 0.000 claims description 2
- 150000003457 sulfones Chemical class 0.000 claims description 2
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 claims description 2
- 150000004992 toluidines Chemical class 0.000 claims description 2
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 claims description 2
- 150000003673 urethanes Chemical class 0.000 claims description 2
- 230000017260 vegetative to reproductive phase transition of meristem Effects 0.000 claims 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 claims 1
- 239000007983 Tris buffer Substances 0.000 claims 1
- 150000001721 carbon Chemical group 0.000 claims 1
- 238000007046 ethoxylation reaction Methods 0.000 claims 1
- 238000006467 substitution reaction Methods 0.000 claims 1
- 239000013466 adhesive and sealant Substances 0.000 abstract description 2
- 239000000853 adhesive Substances 0.000 description 14
- 230000001070 adhesive effect Effects 0.000 description 14
- 239000001257 hydrogen Substances 0.000 description 10
- 229910052739 hydrogen Inorganic materials 0.000 description 10
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 10
- 239000000178 monomer Substances 0.000 description 8
- 230000032683 aging Effects 0.000 description 7
- 125000000962 organic group Chemical group 0.000 description 6
- 238000007711 solidification Methods 0.000 description 6
- 230000008023 solidification Effects 0.000 description 6
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 5
- 239000002738 chelating agent Substances 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 125000005843 halogen group Chemical group 0.000 description 4
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 4
- LBUJPTNKIBCYBY-UHFFFAOYSA-N 1,2,3,4-tetrahydroquinoline Chemical compound C1=CC=C2CCCNC2=C1 LBUJPTNKIBCYBY-UHFFFAOYSA-N 0.000 description 3
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 3
- 125000003358 C2-C20 alkenyl group Chemical group 0.000 description 3
- 102100026735 Coagulation factor VIII Human genes 0.000 description 3
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 3
- 101000911390 Homo sapiens Coagulation factor VIII Proteins 0.000 description 3
- 125000003545 alkoxy group Chemical group 0.000 description 3
- 125000001118 alkylidene group Chemical group 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
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- 150000001875 compounds Chemical class 0.000 description 3
- 238000007306 functionalization reaction Methods 0.000 description 3
- 125000005842 heteroatom Chemical group 0.000 description 3
- 125000002768 hydroxyalkyl group Chemical group 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 150000002978 peroxides Chemical class 0.000 description 3
- 239000004014 plasticizer Substances 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 3
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 3
- LRXTYHSAJDENHV-UHFFFAOYSA-H zinc phosphate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O LRXTYHSAJDENHV-UHFFFAOYSA-H 0.000 description 3
- 229910000165 zinc phosphate Inorganic materials 0.000 description 3
- 229920002818 (Hydroxyethyl)methacrylate Polymers 0.000 description 2
- BEWCNXNIQCLWHP-UHFFFAOYSA-N 2-(tert-butylamino)ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCNC(C)(C)C BEWCNXNIQCLWHP-UHFFFAOYSA-N 0.000 description 2
- YYPNJNDODFVZLE-UHFFFAOYSA-N 3-methylbut-2-enoic acid Chemical compound CC(C)=CC(O)=O YYPNJNDODFVZLE-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical class [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 150000001335 aliphatic alkanes Chemical class 0.000 description 2
- 125000004429 atom Chemical group 0.000 description 2
- 239000003085 diluting agent Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
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- 150000002118 epoxides Chemical class 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 125000000623 heterocyclic group Chemical group 0.000 description 2
- 125000005020 hydroxyalkenyl group Chemical group 0.000 description 2
- 230000001939 inductive effect Effects 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 125000001997 phenyl group Chemical class [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
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- 229910052717 sulfur Inorganic materials 0.000 description 2
- OWXJKYNZGFSVRC-NSCUHMNNSA-N (e)-1-chloroprop-1-ene Chemical compound C\C=C\Cl OWXJKYNZGFSVRC-NSCUHMNNSA-N 0.000 description 1
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 description 1
- KAJICSGLHKRDLN-UHFFFAOYSA-N 1,3-dicyclohexylthiourea Chemical compound C1CCCCC1NC(=S)NC1CCCCC1 KAJICSGLHKRDLN-UHFFFAOYSA-N 0.000 description 1
- IPJGAEWUPXWFPL-UHFFFAOYSA-N 1-[3-(2,5-dioxopyrrol-1-yl)phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC(N2C(C=CC2=O)=O)=C1 IPJGAEWUPXWFPL-UHFFFAOYSA-N 0.000 description 1
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- OIWOHHBRDFKZNC-UHFFFAOYSA-N cyclohexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CCCCC1 OIWOHHBRDFKZNC-UHFFFAOYSA-N 0.000 description 1
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Abstract
本发明涉及可用作用于厌氧可固化组合物的耐热性赋予组分的酚醛乙烯基酯,以及包含所述酚醛乙烯基酯的厌氧可固化组合物。该组合物特别可用作粘合剂和密封剂。
Description
技术领域
本发明涉及可用作用于厌氧可固化组合物的耐热性赋予组分的酚醛(novolac)乙烯基酯,以及包含所述酚醛乙烯基酯的厌氧可固化组合物。该组合物特别可用作粘合剂和密封剂。
背景技术
厌氧粘合剂组合物通常是公知的。参见例如R.D.Rich,“Anaerobic Adhesives”,Handbook of Adhesive Technology,29,467-79,A.Pizzi和K.L.Mittal编,MarcelDekker,Inc.,New York(1994)及其中引用的参考文献。其用途很多,并且新的应用正不断被开发。
常规的厌氧粘合剂组合物通常包含可自由基聚合的丙烯酸酯单体,以及过氧化物引发剂和抑制剂组分。常常,这种厌氧粘合剂组合物还含有促进剂组分,以提高所述组合物固化的速度。
常规厌氧粘合剂组合物然后也被赋予了改进的热特性。例如,美国专利3,988,299(Malofsky)涉及具有改进的热特性的可热固化组合物,其包含特定的丙烯酸酯单体和马来酰亚胺化合物。
L.J.Baccei和B.M.Malofsky,“Anaerobic Adhesives Containing MaleimidesHaving Improved Thermal Resistance”,Adhesive Chemicals,589-601,L-H Lee编,Plenum Publishing Corp.(1984)报道了使用马来酰亚胺——特别是N-苯基马来酰亚胺、间亚苯基二马来酰亚胺和亚甲基双苯胺与亚甲基二苯胺二马来酰亚胺的反应产物——以提高在至少150℃的温度下完全固化的厌氧粘合剂的耐热性。
美国专利6,043,327(Attarwala)提及能够在环境温度条件下固化的单组分厌氧粘合剂组合物,其反应产物在升高的温度(elevated temperature)下表现出耐热降解性。这些组合物包含(a)丙烯酸酯组分;(b)特定结构的共反应剂组分,其实例包括氰脲酸三烯丙酯、苯三甲酸三烯丙酯和异氰脲酸三烯丙酯;(c)马来酰亚胺组分;和(d)厌氧固化诱导组合物。
尽管现有技术如此,但是想要的是,对于在高温环境中使用的厌氧可固化组合物,向最终用户提供额外的选择。
发明内容
本文提供了一种这样的额外选择。
为此,提供了一种厌氧可固化组合物,其包含:
(a)(甲基)丙烯酸酯组分;
(b)厌氧固化体系;和
(c)酚醛环氧树脂与具有特定结构的酸的反应产物。
所述酸可以由以下结构表示:
其中R是H或CH3,X为H、C2H4COOH或其中Y是C2H4COOH或C2H2COOH。
酚醛环氧树脂可以是苯酚-或甲酚-甲醛酚醛环氧树脂。酚醛环氧树脂可以由以下结构表示:
其中R’为烷基,n为0.1~10,例如0.5~5。
在其它实例中,酚醛环氧树脂可以由下述结构表示:
其中R”是直接键、CH2、C(CH3)2、SO2、(CH3)2C-C6H4-C(CH3)2或O;R’”为烷基;n为2~10。
本文还提供了制备厌氧可固化组合物的方法。该方法包括混合甲基(丙烯酸酯)组分、厌氧固化体系和本文所述的酚醛乙烯基酯。
本文还提供了粘合两个以上基材的方法。该方法包括提供两个以上基材;将如此描述的厌氧可固化组合物分配到所述两个以上基材中的至少一个的表面上;使其上具有所述厌氧可固化组合物的两个以上基材的表面接触;和将所述厌氧可固化组合物暴露于厌氧固化条件下。
本文还提供了本发明的厌氧可固化组合物的反应产物。
附图说明
图1示例了当在M10经预加扭矩(5N·m)的磷酸锌螺母和螺栓上测量时,与LOCTITE620以及使用50%N,N'-1,3-亚苯基双马来酰亚胺作为代表性双马来酰亚胺树脂的厌氧可固化组合物相比,模型厌氧可固化组合物中三种酚醛乙烯基酯的热强度性能。在各种情况下,将厌氧可固化组合物在环境温度下固化1周。与两个对照物相比,含有酚醛乙烯基酯的厌氧可固化组合物在升高的温度(在此最高达300℃)下显示出优越的热强度性能。
图2示例了当在M10经预加扭矩的磷酸锌螺母和螺栓上测量时,含有酚醛乙烯基酯的厌氧可固化组合物(3号样品)的热老化性能。将厌氧可固化组合物在环境温度下固化1周,并且使在所示温度下随时间老化的经粘合的螺母和螺栓组件冷却至环境温度并测量断裂扭矩(break torque)。含有酚醛乙烯基酯的厌氧可固化组合物即使在180℃~300℃的升高温度下老化、甚至在该温度下老化至八周时也显示出优异的性能。
具体实施方式
如上所述,提供了一种厌氧可固化组合物,其包含:
(a)(甲基)丙烯酸酯组分;
(b)厌氧固化体系;和
(c)酚醛环氧树脂与具有特定结构的酸的反应产物。
所述酸可以由以下结构表示:
其中R是H或CH3,X为H、C2H4COOH或其中Y是C2H4COOH或C2H2COOH。
所述酸的具体实例包括:
酚醛环氧树脂可以是苯酚-或甲酚-甲醛酚醛环氧树脂。酚醛环氧树脂可以由以下结构表示:
其中R'为烷基,n为0.1~10,例如约0.5~5。
在一些实例中,酚醛环氧树脂可以是双酚-或联苯-甲醛酚醛环氧树脂,例如双酚A-、双酚F-、双酚S-、双酚M-或双酚E-甲醛酚醛环氧树脂。
在其它实例中,酚醛环氧树脂可以由下述结构表示:
其中R”是直接键、CH2、C(CH3)2、SO2、(CH3)2C-C6H4-C(CH3)2或O;R’”为烷基;n为2~10。
酚醛环氧树脂与酸的反应产物应以约10重量%~约60重量%、例如约25重量%~约50重量%的量存在于组合物中。
(甲基)丙烯酸酯组分可以由H2C=CGCO2R3表示,其中G选自H、卤素和具有1~约4个碳原子的烷基;R3选自烷基、环烷基、烯基、环烯基、烷芳基和具有6~约16个碳原子的芳基,所述基团经或未经硅烷、硅、氧、卤素、羰基、羟基、酯、羧酸、脲、氨基甲酸乙酯(urethane)、氨基甲酸酯(carbamate)、胺、酰胺、硫、磺酸酯(sulonate)和砜取代或间断。
(甲基)丙烯酸酯组分可以更特别地选自有机硅(甲基)丙烯酸酯、聚乙二醇二(甲基)丙烯酸酯、四氢呋喃(甲基)丙烯酸酯和四氢呋喃二(甲基)丙烯酸酯、(甲基)丙烯酸羟乙酯、(甲基)丙烯酸羟丙酯、(甲基)丙烯酸异冰片酯、己二醇二(甲基)丙烯酸酯、三羟甲基丙烷三(甲基)丙烯酸酯、二乙二醇二(甲基)丙烯酸酯、三乙二醇二(甲基)丙烯酸酯、四乙二醇二(甲基)丙烯酸酯、双甘油四(甲基)丙烯酸酯、二(甲基)丙烯酸四亚甲酯、二(甲基)丙烯酸亚乙酯、新戊二醇二(甲基)丙烯酸酯、双酚A-(甲基)丙烯酸酯、乙氧基化双酚A-(甲基)丙烯酸酯、双酚F-(甲基)丙烯酸酯、乙氧基化双酚F-(甲基)丙烯酸酯、双酚A-二(甲基)丙烯酸酯、乙氧基化双酚A-二(甲基)丙烯酸酯、双酚F-二(甲基)丙烯酸酯和乙氧基化双酚F-二(甲基)丙烯酸酯。
其它合适的(甲基)丙烯酸酯单体包括由下式表示的聚丙烯酸酯:
其中此处R4是选自氢、卤素和具有1~约4个碳原子的烷基中的基团;q是等于至少1、优选等于1~约4的整数;并且X是含有至少两个碳原子并且具有q+1的总键合能力(bonding capacity)的有机基团。关于X中碳原子数的上限,可行的(workable)单体以基本上任何值存在。然而,实际上,一般的上限为约50个碳原子,优选30个,最优选约20个。
例如,X可以是由下式表示的有机基团:
其中Y1和Y2各自是含有至少2个碳原子、优选2~约10个碳原子的有机基团,优选为烃基;Z是含有至少1个碳原子、优选2~约10个碳原子的有机基团,优选为烃基。
其它可用的(甲基)丙烯酸酯单体是二烷醇胺(dialkylolamine)或三烷醇胺(trialkylolamine)(例如乙醇胺或丙醇胺)与丙烯酸的反应产物,如法国专利1,581,361中所公开的那些。
可用的(甲基)丙烯酸酯低聚物的实例包括具有以下通式的那些:
其中此处R5表示的基团选自氢、卤素、具有1~约4个碳原子的低级烷基、具有1~约4个碳原子的羟烷基以及
其中此处R4选自氢、卤素和具有1~约4个碳原子的低级烷基;R6选自氢、羟基和
m是等于至少1、例如1~约15以上、优选1~约8的整数;n是等于至少1、例如1~约40以上、优选约2~约10的整数;且p为0或1。
所述(甲基)丙烯酸酯低聚物的实例包括二乙二醇二甲基丙烯酸酯、三乙二醇二甲基丙烯酸酯和四乙二醇二甲基丙烯酸酯;二(戊二醇)二甲基丙烯酸酯;四乙二醇二丙烯酸酯;四乙二醇二(氯丙烯酸酯);双甘油二丙烯酸酯;双甘油四甲基丙烯酸酯;丁二醇二甲基丙烯酸酯;新戊二醇二丙烯酸酯;和三羟甲基丙烷三丙烯酸酯。
也可以使用单官能(甲基)丙烯酸酯,例如具有极性基团的那些。在这种情况下的极性基团可以选自不稳定氢、杂环、羟基、氨基、氰基和含卤基团(halo group)。该类别中的化合物的实例是甲基丙烯酸环己酯、甲基丙烯酸四氢糠酯、丙烯酸羟乙酯、HEMA、甲基丙烯酸羟丙酯(“HPMA”)、甲基丙烯酸叔丁基氨基乙酯、丙烯酸氰乙酯、甲基丙烯酸氨基乙酯、甲基丙烯酸氨基丙酯、丙烯酸羟基己酯、甲基丙烯酸叔丁基氨基乙酯、甲基丙烯酸羟辛酯和甲基丙烯酸氯乙酯。
另一类可用的(甲基)丙烯酸酯单体通过在官能性取代基上含有活性氢原子的经单官能团取代的烷基或芳基(甲基)丙烯酸酯的反应来制备。该单官能的经(甲基)丙烯酸酯封端的材料与有机多异氰酸酯以适当的比例反应,以将所有的异氰酸酯基团转化成氨基甲酸乙酯或脲基。单官能烷基和芳基(甲基)丙烯酸酯优选为在其非丙烯酸酯部分上含有羟基或氨基官能团的丙烯酸酯和甲基丙烯酸酯。适合使用的(甲基)丙烯酸酯具有下式:
其中X选自-O-和
并且R9选自氢和具有1~7个碳原子的低级烷基;R7选自氢、卤素(如氯)以及甲基和乙基;并且R8是选自具有1~8个碳原子的低级亚烷基、亚苯基或亚萘基中的二价有机基团。这些基团与多异氰酸酯适当反应后,得到:
其中n为2~约6的整数;B是选自经取代的和未取代的烷基、烯基、环烷基、环烯基、芳基、芳烷基、烷芳基或杂环基团中的多价有机基团;并且R7、R8和X具有上述含义。
(甲基)丙烯酸酯组分应以约15%~约65%、例如约25%~约50%的量存在于组合物中。
厌氧固化体系包含糖精、甲苯胺(例如N,N-二乙基对甲苯胺(“DE-p-T”)和N,N-二甲基邻甲苯胺(“DM-o-T”))和乙酰基苯肼(“APH”)与马来酸中的一种或多种。参见例如美国专利3,218,305(Krieble)、4,180,640(Melody)、4,287,330(Rich)和4,321,349(Rich)。
用于厌氧可固化组合物的其它固化剂的实例包括硫代己内酰胺(例如美国专利5,411,988)和硫脲[例如美国专利3,970,505(Hauser)(四甲基硫脲)、德国专利文献DE1817989(烷基硫脲和N,N'-二环己基硫脲)和2806701(亚乙基硫脲)和日本专利文献JP07-308,757(酰基、烷基、次烷基、亚烷基和烷基硫脲)],其中后者中的某些已经被商业使用至直到大约二十年前。
美国专利6,897,277(Klemarczyk)提供了一种基于(甲基)丙烯酸酯组分的厌氧可固化组合物,其包含基本上不含糖精的厌氧固化诱导组合物和具有以下结构的厌氧固化促进剂化合物:
其中,R选自氢、卤素、烷基、烯基、羟基烷基、羟基烯基、羧基和磺酸基(sulfonato),并且R1选自氢、烷基、烯基、羟基烷基、羟基烯基和烷芳基,其实例是苯基甘氨酸和N-甲基苯基甘氨酸。
美国专利6,958,368(Messana)提供了一种厌氧可固化组合物。该组合物基于(甲基)丙烯酸酯组分,包含基本上不含糖精且具有以下结构的厌氧固化诱导组合物:
其中,Y是芳环,其任选地在至多五个位置上被C1-6烷基或烷氧基或者含卤基团取代;A为C=O、S=O或O=S=O;X是NH、O或S;Z是芳环,其任选地在至多5个位置上被C1-6烷基或烷氧基或者含卤基团取代,或者Y和Z一起可以连接到相同的芳环或芳环体系;前提条件是,当X是NH时,从该结构中排除邻磺酰苯甲酰亚胺。上述结构表示的厌氧固化促进剂化合物的实例包括2-磺基苯甲酸环状酸酐和3H-1,2-苯并二硫醇-3-酮-1,1-二氧化物。
厌氧可固化组合物中的另一可用的固化组分是四氢喹啉(“THQ”)。最近,汉高公司已经证实了新固化促进剂的效果。第一类具有以下结构:
其中,X是H、C1-20烷基、C2-20烯基或C7-20烷芳基,其中后三个基团中的任一个均可以被一个或多个杂(heteto)原子间断或者被选自-OH、-NH2或-SH中的一个或多个基团官能化,或X和Y一起形成具有5~7个环原子的碳环;Z是O、S或NX',其中X'是H、C1-20烷基、C2-20烯基或C7-20烷芳基,其中后三个基团中的任一个均可以被一个或多个杂原子间断或者被选自-OH、-NH2或-SH中的一个或多个基团官能化;R是任选存在的,但是当存在时其可以在芳环上出现至多3次,并且当存在时其为C1-20烷基、C2-20烯基或C7-20烷芳基,其中后三个基团中的任一个均可以被一个或多个杂原子间断或者被选自-OH、-NH2或-SH中的一个或多个基团官能化;并且n为0和1且z为1~3;前提条件是当X为H时,z不为2并且优选为1。更特别地,据此可以涵盖THQ类或二氢吲哚类加合物。(参见美国专利8,481,659。)
第二类具有以下结构:
其中,X是C1-20烷基、C2-20烯基或C7-20烷芳基,所述基团中的任何一个均可以被一个或多个杂原子间断,并且被选自-OH、-NH2或-SH中的至少一个、优选至少两个基团官能化,且z为1~3。(参见美国专利8,362,112。)
基于组合物的总重量,厌氧固化体系应以约1~10重量%的量存在。
例如,厌氧固化体系中可用组分的实例包括:
(i)下式的芳基胺:
其中,R1'是任选被取代的芳基,更特别是任选被烷基取代的苯基;R2'具有与R1'相同的含义或者是任选被取代的线性或支化烷基;且R3'是可以被取代的线性或支化烷基,但在氮的α位上含有至少一个氢原子;并且R1'~R3'中的任何两个可以一起形成单环或多环环结构,其可任选为稠环结构,并且其还可以是被取代的;
(ii)具有下式的化合物:
其中R4'是被C1-C4烷基取代的苯基,R5'选自氢、烷基、环烷基、烯基、环烯基、芳基、烷氧基、芳氧基、羰基、氨基和下列基团:
其中R7'选自含有1~约10个碳原子的烷基;
(iii)磺酰肼;或
(iv)氢化吡啶。
其它可用的促进剂包括:亚磺酰亚胺(sulfinimide)及其氧和硫衍生物,例如美国专利6,958,368(Klemarczyk)中所述的;苯基甘氨酸及其衍生物、1,4-氨基苯甲酰化合物和苯基吡唑啉酮,例如美国专利7,411,025(Messana)中所公开的;磺酰亚胺衍生物和磺酰胺衍生物,例如美国专利7,411,005(Messana)中所公开的;三噻二氮杂并环戊二烯,例如美国专利6,583,289(McArdle)中所述的;琥珀酸酐与苯肼(“SPH”)的反应产物,其可根据美国专利6,835,782(Morita)制备;和在同一分子上包含–C(=O)–NH–NH–键和有机酸官能团的化合物,例如美国专利6,835,762(Klemarczyk)中所公开的。
有时候,传统厌氧可固化组合物中包含另外的组分,以改变厌氧可固化组合物或其反应产物的物理性质。
例如,可包含在升高的温度条件下具有反应性的一种或多种稀释剂组分、单羟基烷烃或多羟基烷烃、聚合物增塑剂和螯合剂(参见美国专利6,391,993,在此将其公开内容通过援引加入的方式明确纳入本文),以改变配制物的物理性质和/或固化性能(profile)以及/或者经固化的粘合剂的强度或耐热性。
当使用时,基于厌氧可固化组合物的总重量,反应性稀释剂、增塑剂以及/或者单羟基烷烃或多羟基烷烃可以以约1重量%~约30重量%的量存在。
还可以使用稳定剂和抑制剂(例如酚类,包括氢醌和四氢化醌;和醌类,如萘醌和蒽醌)来控制和防止本发明组合物的过早过氧化物分解和聚合,而且还使用螯合剂(例如乙二胺四乙酸("EDTA")的四钠盐和β-酮酯)以从其中俘获痕量的金属污染物。当使用时,基于厌氧可固化组合物的总重量,螯合剂通常可以以约0.001重量%~约0.1重量%的量存在于组合物中。
金属催化剂溶液或其预混物的用量为约0.03重量%~约0.1重量%。在本领域技术人员认为需要时,可以在其中引入其它试剂,如增稠剂、非反应性增塑剂、填料、增韧组分(例如弹性体和橡胶)以及其它公知的添加剂。
本文还提供了制备厌氧可固化组合物的方法。该方法包括混合(甲基)丙烯酸酯组分、厌氧固化体系和本文所述的反应产物或加合物。
本文还提供了粘合两个以上基材的方法。该方法包括提供两个以上基材;将如此描述的厌氧可固化组合物分配到所述两个以上基材中的至少一个的表面上;使其上具有所述厌氧可固化组合物的两个以上基材的表面接触;并将所述厌氧可固化组合物暴露于厌氧固化条件下。
酚醛环氧树脂与酸的反应产物的更具体的代表包括酚醛乙烯基酯,其可以由以下两种结构表示:
其中,R’是烷基;n为0.5~10;X’为O、C2H4COO或其中Y’是C2H4COO或C2H2COO;和
其中,R”是直接键、CH2、C(CH3)2、SO2、(CH3)2C-C6H4-C(CH3)2或O;R’”为烷基;n为2~10;X’为O、C2H4COO或其中Y’是C2H4COO或C2H2COO。
在具有结构IIA的酚醛乙烯基酯的特别想要的代表中,R’”不存在;X’为O;R”为C(CH3)2;且n为6。
还提供了本发明的厌氧粘合剂组合物的反应产物。
本发明还提供了制备本发明的厌氧可固化组合物的方法和使用本发明的厌氧可固化组合物的方法。
可以使用本领域技术人员公知的常规方法来制备厌氧可固化组合物。例如,可以将本发明组合物的组分以符合组分待在组合物中发挥的作用和功能的任何方便的顺序混合在一起。
可以将厌氧可固化组合物施加到多种基材上以发挥本文所述的期望的益处和优点。例如,合适的基材可以由钢、黄铜、铜、铝、锌、玻璃以及其它金属和合金、陶瓷以及热固性材料构成。可以将适当的底漆施加到所选择的基材的表面以提高固化速率。参见例如美国专利5,811,473(Ramos)。本文公开的组合物的一个特别想要的用途是用作螺纹固定剂,即用以将螺母固定至螺栓。这可以通过将组合物施加到螺栓的螺纹上、将其与螺母配合并使其固化而实现。
根据具体的组合物、应用和施加几何形状以及是否施加升高的温度,固化可以在很宽的时间范围内进行。在环境温度的厌氧组合物下,固化速度可以从数分钟(非常快)变化至数天(非常慢)。
此外,本发明提供一种制备厌氧可固化组合物的方法,其步骤包括将(甲基)丙烯酸酯组分和上述的厌氧固化体系混合在一起。
本发明还提供了由本文所述的厌氧可固化组合物制备的制品。
本发明还提供了使用本发明的厌氧粘合剂组合物粘合两个以上基材的方法,其步骤包括将所述组合物施加至所需的基材表面以及将所述组合物在厌氧环境中暴露足以使所述组合物固化的时间。
实施例
酚醛乙烯基酯的制备
此处,反应产物由甲基丙烯酸、HEMA琥珀酸酯、HEMA马来酸酯或丙烯酸羧乙酯中的一种和酚醛环氧树脂使用合适的催化剂(如三苯基膦)以约1重量%的量制得。
更具体地,将官能度在2~8范围内的各种市售可得酚醛环氧化物(来自Momentive和Dow)与当量重量的甲基丙烯酸反应。反应(1)在无溶剂的情况下或(2)在作为反应性稀释剂的(甲基)丙烯酸酯单体中进行,所述(甲基)丙烯酸酯单体为三环癸烷二甲基丙烯酸酯(TCD DMA)、二羟甲基丙烷四丙烯酸酯(SR355)、乙氧基化双酚A二甲基丙烯酸酯(E2BADMA)。NVE1、NVE2和NVE3依次使用所列出的反应性稀释剂制备。当加热至约60~90℃的温度(通常约80℃)时,使用三苯基膦作为催化剂进行反应。
反应后进行FT-IR;一旦对应于环氧环的915cm-1处的峰消失,表明全部环氧基团被完全取代,则确认反应完全。
粘合剂配制物
用酚醛乙烯基酯、(甲基)丙烯酸酯组分以及包含糖精、乙酰基苯肼、马来酸、金属螯合剂和自由基引发剂(例如过氧化物、氢过氧化物或过酸酯)的厌氧固化体系制备厌氧可固化组合物。
表1示出了使用根据上述合成方法制备的酚醛乙烯基酯反应产物制备的厌氧可固化组合物。
表1
材料 | 重量% |
三环癸烷二甲基丙烯酸酯 | 25.00 |
甲基丙烯酸羟乙酯 | 12.00 |
EDTA二钠溶液 | 0.70 |
马来酸 | 0.65 |
糖精 | 0.95 |
乙酰基苯肼 | 0.55 |
丙氧基化双酚A富马酸酯 | 10.00 |
氢过氧化枯烯 | 1.00 |
NVE | 49.15 |
制备1号样品,其中NVE为NVE1。2号和3号样品依次含有相同量的NVE 2和NVE 3。
热性能
在已经被预加扭矩至5N·m的磷酸锌螺母和螺栓上对上述配制的厌氧可固化组合物进行评价。将所述组合物在最高达300℃的温度下加热和评价。含有酚醛乙烯基酯反应产物的样品提供了优异的性能。性能通过根据ISO 10123的断裂扭矩(breakaway torque)值测量,其中在升高的温度下进行测量(热强度),其数据记录在下表A中并示于图1中。
表A
另外,在升高的温度下老化后,使经3号样品粘合的螺母/螺栓组件冷却至环境温度,并在该温度下评价(热老化),其数据记录在表B中并示于图2中。
表B
热强度和热老化性能优于采用用于厌氧可固化组合物的传统高温添加剂(例如,在例如LOCTITE 620中使用的双马来酰亚胺化合物)所获得的。
Claims (18)
1.厌氧可固化组合物,其包含:
(a)(甲基)丙烯酸酯组分;
(b)厌氧固化体系;和
(c)酚醛环氧树脂与由以下结构所表示的酸的反应产物:
其中R是H或CH3;X为H、C2H4COOH或其中Y是C2H4COOH或C2H2COOH,
其中所述反应产物不包含衍生自酚醛环氧树脂的环氧基团。
2.如权利要求1所述的组合物,其中所述酚醛环氧树脂是苯酚-或甲酚-甲醛酚醛环氧树脂。
3.如权利要求1所述的组合物,其中所述酚醛环氧树脂由以下结构表示:
其中R’为烷基,n为0.5~10。
4.如权利要求3所述的组合物,其中R’为CH3。
5.如权利要求1所述的组合物,其中所述酚醛环氧树脂是双酚-或联苯-甲醛酚醛环氧树脂。
6.如权利要求1所述的组合物,其中所述酚醛环氧树脂是双酚A-、双酚F-、双酚S-、双酚M-或双酚E-甲醛酚醛环氧树脂。
7.如权利要求1所述的组合物,其中所述酚醛环氧树脂由以下结构表示:
其中R”是直接键、CH2、C(CH3)2、SO2、(CH3)2C-C6H4-C(CH3)2或O;R’”为烷基;n为2~10。
8.如权利要求7所述的组合物,其中R’”为CH3。
9.如权利要求1所述的组合物,其中所述(c)的反应产物是酚醛乙烯基酯。
10.如权利要求1所述的组合物,其中所述(甲基)丙烯酸酯组分由H2C=CGCO2R4表示,其中G选自H、卤素和具有1~4个碳原子的烷基;R4选自烷基、环烷基、烯基、环烯基、烷芳基和具有6~16个碳原子的芳基,所述基团经或未经选自硅烷、硅、氧、卤素、羰基、羟基、酯、羧酸、脲、氨基甲酸乙酯、氨基甲酸酯、胺、酰胺、硫、磺酸酯和砜的成员取代或间断。
11.如权利要求1所述的组合物,其中所述(甲基)丙烯酸酯组分选自有机硅(甲基)丙烯酸酯、聚乙二醇二(甲基)丙烯酸酯、四氢呋喃(甲基)丙烯酸酯和四氢呋喃二(甲基)丙烯酸酯、(甲基)丙烯酸羟乙酯、(甲基)丙烯酸羟丙酯、丙烯酸异冰片酯、己二醇二(甲基)丙烯酸酯、三羟甲基丙烷三(甲基)丙烯酸酯、二乙二醇二(甲基)丙烯酸酯、三乙二醇二(甲基)丙烯酸酯、四乙二醇二(甲基)丙烯酸酯、双甘油四(甲基)丙烯酸酯、二(甲基)丙烯酸四亚甲酯、二(甲基)丙烯酸亚乙酯、新戊二醇二(甲基)丙烯酸酯、双酚A-(甲基)丙烯酸酯、乙氧基化双酚A-(甲基)丙烯酸酯、双酚F-(甲基)丙烯酸酯、乙氧基化双酚F-(甲基)丙烯酸酯、双酚A-二(甲基)丙烯酸酯、乙氧基化双酚A-二(甲基)丙烯酸酯、双酚F-二(甲基)丙烯酸酯和乙氧基化双酚F-二(甲基)丙烯酸酯。
12.如权利要求1所述的组合物,其中,基于所述组合物的总重量,所述厌氧固化体系以1~10重量%的量存在。
13.如权利要求1所述的组合物,其中所述厌氧固化体系包含糖精、甲苯胺、乙酰基苯肼和马来酸中的一种或多种。
14.制备厌氧可固化组合物的方法,其包括混合甲基(丙烯酸酯)组分、厌氧固化体系和酚醛环氧树脂与由以下结构表示的酸的反应产物:
其中R是H或CH3;X为H、C2H4COOH或其中Y是C2H4COOH或C2H2COOH,
其中所述反应产物不包含衍生自酚醛环氧树脂的环氧基团。
15.粘合两个以上基材的方法,其包括:
(a)提供两个以上基材;
(b)将权利要求1所述的厌氧可固化组合物分配到所述两个以上基材中的至少一个的表面上;
(c)使其上具有所述厌氧可固化组合物的两个以上基材的表面接触;和
(d)将所述厌氧可固化组合物暴露于厌氧固化条件下。
16.权利要求1所述的组合物的反应产物。
17.如权利要求1所述的组合物,其中所述酚醛环氧树脂与酸的反应产物由以下结构表示:
其中R’是烷基;n为0.5~10;X’为O、C2H4COO或其中Y’是C2H4COO或C2H2COO。
18.如权利要求1所述的组合物,其中所述酚醛环氧树脂与酸的反应产物由以下结构表示:
其中R”是直接键、CH2、C(CH3)2、SO2、(CH3)2C-C6H4-C(CH3)2或O;R’”为烷基;n为2~10;X’为O、C2H4COO或其中Y’是C2H4COO或C2H2COO。
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