CN106661273B - 表面改性复合二氧化硅粒子及包含该表面改性复合二氧化硅粒子的聚酰亚胺薄膜 - Google Patents
表面改性复合二氧化硅粒子及包含该表面改性复合二氧化硅粒子的聚酰亚胺薄膜 Download PDFInfo
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- CN106661273B CN106661273B CN201580035728.0A CN201580035728A CN106661273B CN 106661273 B CN106661273 B CN 106661273B CN 201580035728 A CN201580035728 A CN 201580035728A CN 106661273 B CN106661273 B CN 106661273B
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- modified composite
- polyimide film
- weight
- polysiloxane
- silica particles
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 132
- 239000002131 composite material Substances 0.000 title claims abstract description 53
- 229920001721 polyimide Polymers 0.000 title claims abstract description 49
- -1 polysiloxane Polymers 0.000 claims abstract description 42
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 40
- 229920000642 polymer Polymers 0.000 claims abstract description 23
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims abstract description 13
- 239000000377 silicon dioxide Substances 0.000 claims description 41
- 150000001875 compounds Chemical class 0.000 claims description 29
- 239000002245 particle Substances 0.000 claims description 27
- 239000000203 mixture Substances 0.000 claims description 21
- OLLFKUHHDPMQFR-UHFFFAOYSA-N dihydroxy(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](O)(O)C1=CC=CC=C1 OLLFKUHHDPMQFR-UHFFFAOYSA-N 0.000 claims description 8
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 claims description 8
- 239000009719 polyimide resin Substances 0.000 claims description 6
- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 claims description 6
- IEGCIDHTHXPHOI-UHFFFAOYSA-N dibutyl diphenyl silicate Chemical compound C=1C=CC=CC=1O[Si](OCCCC)(OCCCC)OC1=CC=CC=C1 IEGCIDHTHXPHOI-UHFFFAOYSA-N 0.000 claims description 5
- VWGYKEZAYCHFSA-UHFFFAOYSA-N diethyl diphenyl silicate Chemical compound C=1C=CC=CC=1O[Si](OCC)(OCC)OC1=CC=CC=C1 VWGYKEZAYCHFSA-UHFFFAOYSA-N 0.000 claims description 5
- 235000012239 silicon dioxide Nutrition 0.000 claims 2
- 239000000126 substance Substances 0.000 description 39
- 239000010408 film Substances 0.000 description 22
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 18
- 239000004642 Polyimide Substances 0.000 description 18
- 125000004432 carbon atom Chemical group C* 0.000 description 15
- 238000006243 chemical reaction Methods 0.000 description 15
- 230000000052 comparative effect Effects 0.000 description 12
- 238000000034 method Methods 0.000 description 12
- 238000002360 preparation method Methods 0.000 description 10
- 239000000243 solution Substances 0.000 description 10
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- 239000004962 Polyamide-imide Substances 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 125000003118 aryl group Chemical group 0.000 description 6
- 125000005843 halogen group Chemical group 0.000 description 6
- 229920002312 polyamide-imide Polymers 0.000 description 6
- 239000007787 solid Substances 0.000 description 6
- 239000000945 filler Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- 238000003756 stirring Methods 0.000 description 5
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 229920005575 poly(amic acid) Polymers 0.000 description 4
- WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical compound CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 125000004450 alkenylene group Chemical group 0.000 description 3
- 125000003545 alkoxy group Chemical group 0.000 description 3
- 125000002947 alkylene group Chemical group 0.000 description 3
- 125000004419 alkynylene group Chemical group 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 150000001721 carbon Chemical group 0.000 description 3
- 230000007062 hydrolysis Effects 0.000 description 3
- 238000006460 hydrolysis reaction Methods 0.000 description 3
- 238000012856 packing Methods 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 2
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 description 2
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 2
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 2
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 2
- 150000004984 aromatic diamines Chemical class 0.000 description 2
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000002338 electrophoretic light scattering Methods 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000003779 heat-resistant material Substances 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 229940018564 m-phenylenediamine Drugs 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000012046 mixed solvent Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000006068 polycondensation reaction Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- LXEJRKJRKIFVNY-UHFFFAOYSA-N terephthaloyl chloride Chemical compound ClC(=O)C1=CC=C(C(Cl)=O)C=C1 LXEJRKJRKIFVNY-UHFFFAOYSA-N 0.000 description 2
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- FLLRAXRMITXCAH-UHFFFAOYSA-N 2-[2-(2-aminophenyl)-1,1,1,3,3,3-hexafluoropropan-2-yl]aniline Chemical compound NC1=CC=CC=C1C(C(F)(F)F)(C(F)(F)F)C1=CC=CC=C1N FLLRAXRMITXCAH-UHFFFAOYSA-N 0.000 description 1
- NVKGJHAQGWCWDI-UHFFFAOYSA-N 4-[4-amino-2-(trifluoromethyl)phenyl]-3-(trifluoromethyl)aniline Chemical group FC(F)(F)C1=CC(N)=CC=C1C1=CC=C(N)C=C1C(F)(F)F NVKGJHAQGWCWDI-UHFFFAOYSA-N 0.000 description 1
- AXLYBMLJQCHBFV-UHFFFAOYSA-N 4-phenyl-5,5-bis(trifluoromethyl)cyclohex-3-ene-1,1-diamine Chemical compound FC(F)(F)C1(C(F)(F)F)CC(N)(N)CC=C1C1=CC=CC=C1 AXLYBMLJQCHBFV-UHFFFAOYSA-N 0.000 description 1
- YGYCECQIOXZODZ-UHFFFAOYSA-N 4415-87-6 Chemical compound O=C1OC(=O)C2C1C1C(=O)OC(=O)C12 YGYCECQIOXZODZ-UHFFFAOYSA-N 0.000 description 1
- WVOLTBSCXRRQFR-SJORKVTESA-N Cannabidiolic acid Natural products OC1=C(C(O)=O)C(CCCCC)=CC(O)=C1[C@@H]1[C@@H](C(C)=C)CCC(C)=C1 WVOLTBSCXRRQFR-SJORKVTESA-N 0.000 description 1
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- RQPZNWPYLFFXCP-UHFFFAOYSA-L barium dihydroxide Chemical compound [OH-].[OH-].[Ba+2] RQPZNWPYLFFXCP-UHFFFAOYSA-L 0.000 description 1
- 229910001863 barium hydroxide Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- WVOLTBSCXRRQFR-DLBZAZTESA-M cannabidiolate Chemical compound OC1=C(C([O-])=O)C(CCCCC)=CC(O)=C1[C@H]1[C@H](C(C)=C)CCC(C)=C1 WVOLTBSCXRRQFR-DLBZAZTESA-M 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000007810 chemical reaction solvent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 230000005520 electrodynamics Effects 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 230000016615 flocculation Effects 0.000 description 1
- 238000005189 flocculation Methods 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 125000005647 linker group Chemical group 0.000 description 1
- 238000004949 mass spectrometry Methods 0.000 description 1
- 238000000816 matrix-assisted laser desorption--ionisation Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000012643 polycondensation polymerization Methods 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000001308 synthesis method Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 238000004448 titration Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Manufacturing & Machinery (AREA)
- Engineering & Computer Science (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Materials Engineering (AREA)
- Pigments, Carbon Blacks, Or Wood Stains (AREA)
- Compounds Of Alkaline-Earth Elements, Aluminum Or Rare-Earth Metals (AREA)
- Silicon Compounds (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2014-0081404 | 2014-06-30 | ||
| KR20140081404 | 2014-06-30 | ||
| PCT/KR2015/006714 WO2016003166A1 (ko) | 2014-06-30 | 2015-06-30 | 표면 개질 복합 실리카 입자 및 이를 포함하는 폴리이미드 필름 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106661273A CN106661273A (zh) | 2017-05-10 |
| CN106661273B true CN106661273B (zh) | 2020-05-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201580035728.0A Active CN106661273B (zh) | 2014-06-30 | 2015-06-30 | 表面改性复合二氧化硅粒子及包含该表面改性复合二氧化硅粒子的聚酰亚胺薄膜 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6568121B2 (enExample) |
| KR (1) | KR102037699B1 (enExample) |
| CN (1) | CN106661273B (enExample) |
| TW (1) | TWI656097B (enExample) |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102452649B1 (ko) | 2016-10-21 | 2022-10-07 | 삼성전자주식회사 | 적층 투명 필름, 표시 장치용 윈도우 및 표시 장치 |
| CN107383658A (zh) * | 2017-08-03 | 2017-11-24 | 合肥泓定科技有限公司 | 聚苯乙烯阻燃保温材料及其制备方法 |
| KR102462940B1 (ko) | 2017-11-03 | 2022-11-04 | 삼성전자주식회사 | 폴리이미드, 폴리이미드 제조용 조성물, 폴리이미드를 포함하는 성형품 및 표시 장치 |
| JP6554599B1 (ja) * | 2017-11-09 | 2019-07-31 | 住友化学株式会社 | 光学フィルム |
| KR102701544B1 (ko) * | 2018-01-15 | 2024-09-04 | 닛산 가가쿠 가부시키가이샤 | 하이브리드 수지조성물 |
| CN112126090B (zh) * | 2019-06-25 | 2023-06-13 | 爱思开迈克沃有限公司 | 聚酰胺-酰亚胺膜及其制备方法 |
| KR102147278B1 (ko) * | 2019-07-05 | 2020-08-24 | 에스케이이노베이션 주식회사 | 폴리이미드계 필름, 커버윈도우용 필름 및 이를 포함하는 디스플레이 장치 |
| KR102317327B1 (ko) | 2019-08-29 | 2021-10-27 | 피아이첨단소재 주식회사 | 폴리이미드 필름 및 그 제조방법 |
| KR102147349B1 (ko) | 2019-09-30 | 2020-08-25 | 에스케이이노베이션 주식회사 | 윈도우 커버 필름 및 이를 이용한 플렉서블 디스플레이 패널 |
| KR102147299B1 (ko) | 2019-09-30 | 2020-08-24 | 에스케이이노베이션 주식회사 | 윈도우 커버 필름 및 이를 포함하는 플렉서블 디스플레이 패널 |
| KR102147288B1 (ko) * | 2019-09-30 | 2020-08-24 | 에스케이이노베이션 주식회사 | 폴리이미드계 필름 및 이를 포함하는 플렉서블 디스플레이 패널 |
| CN110696462A (zh) * | 2019-10-09 | 2020-01-17 | 安徽国风塑业股份有限公司 | 一种高强度双向拉伸聚乳酸薄膜及其制备方法 |
| KR102347589B1 (ko) | 2019-11-07 | 2022-01-10 | 피아이첨단소재 주식회사 | 저유전 폴리이미드 필름 및 그 제조방법 |
| KR102362385B1 (ko) | 2019-11-13 | 2022-02-15 | 피아이첨단소재 주식회사 | 고탄성 및 고내열 폴리이미드 필름 및 그 제조방법 |
| US20230257532A1 (en) * | 2020-07-10 | 2023-08-17 | Kolon Industries, Inc. | Polyimide-based film having excellent filler dispersibility and display device comprising same |
| WO2022010299A1 (ko) * | 2020-07-10 | 2022-01-13 | 코오롱인더스트리 주식회사 | 광투과성 필름 및 이를 포함하는 표시장치 |
| KR102617724B1 (ko) | 2020-11-04 | 2023-12-27 | 피아이첨단소재 주식회사 | 높은 치수 안정성을 가지는 폴리이미드 필름 및 그 제조방법 |
| KR102445910B1 (ko) | 2020-11-24 | 2022-09-22 | 피아이첨단소재 주식회사 | 높은 치수 안정성을 가지는 폴리이미드 필름 및 그 제조방법 |
| KR102584535B1 (ko) | 2021-05-27 | 2023-09-27 | 인하대학교 산학협력단 | 흄드 실리카 나노입자를 포함하는 투명 하이브리드 필름 및 그 제조방법 |
| KR102692756B1 (ko) * | 2021-10-26 | 2024-08-07 | 피아이첨단소재 주식회사 | 폴리아믹산 조성물 및 이의 제조방법 |
| KR102692760B1 (ko) * | 2021-10-26 | 2024-08-07 | 피아이첨단소재 주식회사 | 폴리아믹산 조성물 및 이의 제조방법 |
| CN114716825B (zh) * | 2022-01-05 | 2023-04-18 | 中国地质大学（北京） | 一种聚酰亚胺复合材料及其制备和应用 |
| KR20240053229A (ko) | 2022-10-17 | 2024-04-24 | 피아이첨단소재 주식회사 | 폴리이미드 필름 및 그 제조방법 |
| CN117229653A (zh) * | 2023-08-30 | 2023-12-15 | 深圳先进电子材料国际创新研究院 | 二氧化硅表面改性方法、改性二氧化硅及应用 |
| CN117229652A (zh) * | 2023-08-30 | 2023-12-15 | 深圳先进电子材料国际创新研究院 | 二氧化硅表面改性方法、改性二氧化硅及应用 |
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| JP2003171577A (ja) * | 2001-12-06 | 2003-06-20 | Toyo Ink Mfg Co Ltd | 高耐熱性、撥水性、親油性表面処理無機酸化物、その製造方法および樹脂組成物 |
| CN102086303A (zh) * | 2009-12-03 | 2011-06-08 | 财团法人工业技术研究院 | 聚酰胺酸树脂组合物、由其制备的聚酰亚胺薄膜及层压材料 |
| TW201400531A (zh) * | 2012-06-29 | 2014-01-01 | Kolon Inc | 聚醯亞胺及含有該聚醯亞胺的聚醯亞胺薄膜 |
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| Publication number | Publication date |
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| CN106661273A (zh) | 2017-05-10 |
| JP6568121B2 (ja) | 2019-08-28 |
| KR20160002402A (ko) | 2016-01-07 |
| JP2017520662A (ja) | 2017-07-27 |
| TWI656097B (zh) | 2019-04-11 |
| TW201600462A (zh) | 2016-01-01 |
| KR102037699B1 (ko) | 2019-10-29 |
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