JP2012172001A - 多分岐ポリイミド系ハイブリッド材料 - Google Patents
多分岐ポリイミド系ハイブリッド材料 Download PDFInfo
- Publication number
- JP2012172001A JP2012172001A JP2011033117A JP2011033117A JP2012172001A JP 2012172001 A JP2012172001 A JP 2012172001A JP 2011033117 A JP2011033117 A JP 2011033117A JP 2011033117 A JP2011033117 A JP 2011033117A JP 2012172001 A JP2012172001 A JP 2012172001A
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- JP
- Japan
- Prior art keywords
- hybrid material
- group
- polyimide
- multibranched
- polyimide hybrid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004642 Polyimide Substances 0.000 title claims abstract description 94
- 229920001721 polyimide Polymers 0.000 title claims abstract description 94
- 239000000463 material Substances 0.000 title claims abstract description 82
- 125000003118 aryl group Chemical group 0.000 claims abstract description 48
- 229920005575 poly(amic acid) Polymers 0.000 claims abstract description 46
- -1 alkoxy compound Chemical class 0.000 claims abstract description 29
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims abstract description 27
- 125000003277 amino group Chemical group 0.000 claims abstract description 26
- 238000006243 chemical reaction Methods 0.000 claims abstract description 26
- 125000006158 tetracarboxylic acid group Chemical group 0.000 claims abstract description 23
- 125000003545 alkoxy group Chemical group 0.000 claims abstract description 20
- 150000004703 alkoxides Chemical class 0.000 claims abstract description 19
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 18
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims abstract description 17
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 12
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 11
- 239000010703 silicon Substances 0.000 claims abstract description 11
- 230000018044 dehydration Effects 0.000 claims abstract description 8
- 238000006297 dehydration reaction Methods 0.000 claims abstract description 8
- 238000006798 ring closing metathesis reaction Methods 0.000 claims abstract description 6
- 239000007795 chemical reaction product Substances 0.000 claims abstract description 3
- 229910052809 inorganic oxide Inorganic materials 0.000 claims description 22
- 150000001875 compounds Chemical class 0.000 claims description 20
- 150000001412 amines Chemical class 0.000 claims description 13
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims description 11
- 239000012528 membrane Substances 0.000 claims description 11
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 10
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 10
- 150000001244 carboxylic acid anhydrides Chemical class 0.000 claims description 10
- 238000000926 separation method Methods 0.000 claims description 10
- 229910052719 titanium Inorganic materials 0.000 claims description 10
- 239000010936 titanium Substances 0.000 claims description 10
- 229910052726 zirconium Inorganic materials 0.000 claims description 10
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 9
- 229910052782 aluminium Inorganic materials 0.000 claims description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 9
- 229910052749 magnesium Inorganic materials 0.000 claims description 9
- 239000011777 magnesium Substances 0.000 claims description 9
- 239000010419 fine particle Substances 0.000 claims description 7
- 238000006068 polycondensation reaction Methods 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 229910052731 fluorine Inorganic materials 0.000 claims description 5
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 4
- 239000012776 electronic material Substances 0.000 claims description 4
- 239000011737 fluorine Substances 0.000 claims description 4
- 239000007784 solid electrolyte Substances 0.000 claims description 4
- 125000000542 sulfonic acid group Chemical group 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 12
- 230000035699 permeability Effects 0.000 abstract description 10
- 239000000126 substance Substances 0.000 abstract description 4
- 238000000465 moulding Methods 0.000 abstract description 3
- 230000008569 process Effects 0.000 abstract description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 24
- 239000007789 gas Substances 0.000 description 19
- 229920000592 inorganic polymer Polymers 0.000 description 16
- 238000005259 measurement Methods 0.000 description 15
- 239000000243 solution Substances 0.000 description 15
- 229920000642 polymer Polymers 0.000 description 14
- 239000000377 silicon dioxide Substances 0.000 description 14
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 9
- 125000004018 acid anhydride group Chemical group 0.000 description 8
- 239000002131 composite material Substances 0.000 description 7
- 239000010408 film Substances 0.000 description 7
- 239000002904 solvent Substances 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 6
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 6
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 5
- 150000004984 aromatic diamines Chemical class 0.000 description 5
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 5
- 239000012299 nitrogen atmosphere Substances 0.000 description 5
- 150000001491 aromatic compounds Chemical class 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 229920000620 organic polymer Polymers 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 230000000704 physical effect Effects 0.000 description 4
- 150000003457 sulfones Chemical class 0.000 description 4
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 3
- 238000001157 Fourier transform infrared spectrum Methods 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 230000009102 absorption Effects 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 229920006267 polyester film Polymers 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 235000012239 silicon dioxide Nutrition 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- MXPYJVUYLVNEBB-UHFFFAOYSA-N 2-[2-(2-carboxybenzoyl)oxycarbonylbenzoyl]oxycarbonylbenzoic acid Chemical compound OC(=O)C1=CC=CC=C1C(=O)OC(=O)C1=CC=CC=C1C(=O)OC(=O)C1=CC=CC=C1C(O)=O MXPYJVUYLVNEBB-UHFFFAOYSA-N 0.000 description 2
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 2
- CNODSORTHKVDEM-UHFFFAOYSA-N 4-trimethoxysilylaniline Chemical compound CO[Si](OC)(OC)C1=CC=C(N)C=C1 CNODSORTHKVDEM-UHFFFAOYSA-N 0.000 description 2
- ZHBXLZQQVCDGPA-UHFFFAOYSA-N 5-[(1,3-dioxo-2-benzofuran-5-yl)sulfonyl]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(S(=O)(=O)C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 ZHBXLZQQVCDGPA-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- 206010034972 Photosensitivity reaction Diseases 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 238000007385 chemical modification Methods 0.000 description 2
- 239000004927 clay Substances 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 150000004820 halides Chemical class 0.000 description 2
- 150000002484 inorganic compounds Chemical class 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000011259 mixed solution Substances 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 230000036211 photosensitivity Effects 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920006254 polymer film Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- KDYFGRWQOYBRFD-UHFFFAOYSA-N succinic acid Chemical compound OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- 238000002411 thermogravimetry Methods 0.000 description 2
- 230000000930 thermomechanical effect Effects 0.000 description 2
- FHBXQJDYHHJCIF-UHFFFAOYSA-N (2,3-diaminophenyl)-phenylmethanone Chemical compound NC1=CC=CC(C(=O)C=2C=CC=CC=2)=C1N FHBXQJDYHHJCIF-UHFFFAOYSA-N 0.000 description 1
- YLIKHLYLPLTUTL-UHFFFAOYSA-N (3-aminophenyl)-(2,4-diaminophenyl)methanone Chemical compound NC1=C(C(=O)C2=CC(=CC=C2)N)C=CC(=C1)N YLIKHLYLPLTUTL-UHFFFAOYSA-N 0.000 description 1
- IGUXFXNMXMXLCK-UHFFFAOYSA-N (3-aminophenyl)-(3,4-diaminophenyl)methanone Chemical compound NC1=CC=CC(C(=O)C=2C=C(N)C(N)=CC=2)=C1 IGUXFXNMXMXLCK-UHFFFAOYSA-N 0.000 description 1
- PGHVMIHPOANRPS-UHFFFAOYSA-N (3-aminophenyl)-(3,5-diaminophenyl)methanone Chemical compound NC1=CC=CC(C(=O)C=2C=C(N)C=C(N)C=2)=C1 PGHVMIHPOANRPS-UHFFFAOYSA-N 0.000 description 1
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- NPSMSOMZCHVSSW-UHFFFAOYSA-N (4-aminophenyl)-(2,4-diaminophenyl)methanone Chemical compound C1=CC(N)=CC=C1C(=O)C1=CC=C(N)C=C1N NPSMSOMZCHVSSW-UHFFFAOYSA-N 0.000 description 1
- JPMLZYOQEMXUTO-UHFFFAOYSA-N (ethoxy-methyl-pentan-2-yloxysilyl)formic acid Chemical compound C(CC)C(C)O[Si](OCC)(C(=O)O)C JPMLZYOQEMXUTO-UHFFFAOYSA-N 0.000 description 1
- GEYOCULIXLDCMW-UHFFFAOYSA-N 1,2-phenylenediamine Chemical compound NC1=CC=CC=C1N GEYOCULIXLDCMW-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- OYJGAVZGTMGAIX-UHFFFAOYSA-N 2-[(2-aminophenoxy)-dimethylsilyl]oxyaniline Chemical compound C=1C=CC=C(N)C=1O[Si](C)(C)OC1=CC=CC=C1N OYJGAVZGTMGAIX-UHFFFAOYSA-N 0.000 description 1
- QDMXRSFKPPVBDW-UHFFFAOYSA-N 2-[9-(2-aminophenyl)fluoren-9-yl]aniline Chemical compound NC1=CC=CC=C1C1(C=2C(=CC=CC=2)N)C2=CC=CC=C2C2=CC=CC=C21 QDMXRSFKPPVBDW-UHFFFAOYSA-N 0.000 description 1
- ISPYQTSUDJAMAB-UHFFFAOYSA-N 2-chlorophenol Chemical compound OC1=CC=CC=C1Cl ISPYQTSUDJAMAB-UHFFFAOYSA-N 0.000 description 1
- JQCLDNFNUWSZSH-UHFFFAOYSA-N 2-methoxysilyl-3,4-dimethylbenzoic acid Chemical compound CC1=C(C(=C(C(=O)O)C=C1)[SiH2]OC)C JQCLDNFNUWSZSH-UHFFFAOYSA-N 0.000 description 1
- YHMDIRXBIAWCFD-UHFFFAOYSA-N 3-(2-propylphenoxy)phthalic acid Chemical compound CCCC1=CC=CC=C1OC1=CC=CC(C(O)=O)=C1C(O)=O YHMDIRXBIAWCFD-UHFFFAOYSA-N 0.000 description 1
- HXLAEGYMDGUSBD-UHFFFAOYSA-N 3-[diethoxy(methyl)silyl]propan-1-amine Chemical compound CCO[Si](C)(OCC)CCCN HXLAEGYMDGUSBD-UHFFFAOYSA-N 0.000 description 1
- JLIMOJXOVUKDJX-UHFFFAOYSA-N 3-[methoxy(dimethyl)silyl]aniline Chemical compound CO[Si](C)(C)C1=CC=CC(N)=C1 JLIMOJXOVUKDJX-UHFFFAOYSA-N 0.000 description 1
- ZSEADYMLKBVVTB-UHFFFAOYSA-N 3-[methyl(trimethylsilyloxy)silyl]propan-1-amine Chemical compound C[SiH](CCCN)O[Si](C)(C)C ZSEADYMLKBVVTB-UHFFFAOYSA-N 0.000 description 1
- HORNXRXVQWOLPJ-UHFFFAOYSA-N 3-chlorophenol Chemical compound OC1=CC=CC(Cl)=C1 HORNXRXVQWOLPJ-UHFFFAOYSA-N 0.000 description 1
- XTEBLARUAVEBRF-UHFFFAOYSA-N 4-(1,1,1,3,3,3-hexafluoropropan-2-yl)aniline Chemical compound NC1=CC=C(C(C(F)(F)F)C(F)(F)F)C=C1 XTEBLARUAVEBRF-UHFFFAOYSA-N 0.000 description 1
- LFBALUPVVFCEPA-UHFFFAOYSA-N 4-(3,4-dicarboxyphenyl)phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)C(C(O)=O)=C1 LFBALUPVVFCEPA-UHFFFAOYSA-N 0.000 description 1
- HOSGAMZDLWSREP-UHFFFAOYSA-N 4-(3-aminophenyl)benzene-1,2-diamine Chemical group NC1=CC=CC(C=2C=C(N)C(N)=CC=2)=C1 HOSGAMZDLWSREP-UHFFFAOYSA-N 0.000 description 1
- KDSSYYNSKCBPGC-UHFFFAOYSA-N 4-(3-aminophenyl)benzene-1,3-diamine Chemical group NC1=CC(N)=CC=C1C1=CC=CC(N)=C1 KDSSYYNSKCBPGC-UHFFFAOYSA-N 0.000 description 1
- MPKIJEUTPZPJFP-UHFFFAOYSA-N 4-(4-aminophenoxy)benzene-1,2-diamine Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C(N)=C1 MPKIJEUTPZPJFP-UHFFFAOYSA-N 0.000 description 1
- RVYIVHUVZXDTGN-UHFFFAOYSA-N 4-(4-aminophenyl)benzene-1,2-diamine Chemical group C1=CC(N)=CC=C1C1=CC=C(N)C(N)=C1 RVYIVHUVZXDTGN-UHFFFAOYSA-N 0.000 description 1
- GMJHZZCVWDJKFB-UHFFFAOYSA-N 4-(4-aminophenyl)benzene-1,3-diamine Chemical group C1=CC(N)=CC=C1C1=CC=C(N)C=C1N GMJHZZCVWDJKFB-UHFFFAOYSA-N 0.000 description 1
- AUTXJLFNORABNE-UHFFFAOYSA-N 4-(4-aminophenyl)sulfanylbenzene-1,2-diamine Chemical compound C1=CC(N)=CC=C1SC1=CC=C(N)C(N)=C1 AUTXJLFNORABNE-UHFFFAOYSA-N 0.000 description 1
- LMCLQTHHLNHUPN-UHFFFAOYSA-N 4-(4-aminophenyl)sulfonylbenzene-1,2-diamine Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C(N)=C1 LMCLQTHHLNHUPN-UHFFFAOYSA-N 0.000 description 1
- RVIDWCHHVDGTMP-UHFFFAOYSA-N 4-[2-(3-aminophenyl)-1,1,1,3,3,3-hexafluoropropan-2-yl]benzene-1,2-diamine Chemical compound NC=1C=C(C=CC1N)C(C(F)(F)F)(C(F)(F)F)C1=CC(=CC=C1)N RVIDWCHHVDGTMP-UHFFFAOYSA-N 0.000 description 1
- LTNHKXMJAOIVIX-UHFFFAOYSA-N 4-[2-(3-aminophenyl)propan-2-yl]benzene-1,2-diamine Chemical compound NC=1C=C(C=CC1N)C(C)(C)C1=CC(=CC=C1)N LTNHKXMJAOIVIX-UHFFFAOYSA-N 0.000 description 1
- RYYUUQPLFHRZOY-UHFFFAOYSA-N 4-[2-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC=C1OC1=CC=C(N)C=C1 RYYUUQPLFHRZOY-UHFFFAOYSA-N 0.000 description 1
- GBOYBJSUOVZGSB-UHFFFAOYSA-N 4-[2-(4-aminophenyl)-1,1,1,3,3,3-hexafluoropropan-2-yl]benzene-1,2-diamine Chemical compound NC1=C(N)C=C(C(C(F)(F)F)(C2=CC=C(N)C=C2)C(F)(F)F)C=C1 GBOYBJSUOVZGSB-UHFFFAOYSA-N 0.000 description 1
- XGOVGCHNHXMWEH-UHFFFAOYSA-N 4-[2-(4-aminophenyl)-1,1,1,3,3,3-hexafluoropropan-2-yl]benzene-1,3-diamine Chemical compound NC1=CC(N)=C(C(C(F)(F)F)(C2=CC=C(N)C=C2)C(F)(F)F)C=C1 XGOVGCHNHXMWEH-UHFFFAOYSA-N 0.000 description 1
- LWKJREOYDSVPDF-UHFFFAOYSA-N 4-[2-(4-aminophenyl)propan-2-yl]benzene-1,2-diamine Chemical compound NC1=C(N)C=C(C(C)(C2=CC=C(N)C=C2)C)C=C1 LWKJREOYDSVPDF-UHFFFAOYSA-N 0.000 description 1
- BETSGYKQTIDAQB-UHFFFAOYSA-N 4-[2-(4-aminophenyl)propan-2-yl]benzene-1,3-diamine Chemical compound CC(C1=CC=C(N)C=C1N)(C)C1=CC=C(N)C=C1 BETSGYKQTIDAQB-UHFFFAOYSA-N 0.000 description 1
- YPGXCJNQPKHBLH-UHFFFAOYSA-N 4-[2-[2-[2-(4-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropan-2-yl]phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC=C1C(C(F)(F)F)(C(F)(F)F)C1=CC=CC=C1OC1=CC=C(N)C=C1 YPGXCJNQPKHBLH-UHFFFAOYSA-N 0.000 description 1
- AJYDKROUZBIMLE-UHFFFAOYSA-N 4-[2-[2-[2-(4-aminophenoxy)phenyl]propan-2-yl]phenoxy]aniline Chemical compound C=1C=CC=C(OC=2C=CC(N)=CC=2)C=1C(C)(C)C1=CC=CC=C1OC1=CC=C(N)C=C1 AJYDKROUZBIMLE-UHFFFAOYSA-N 0.000 description 1
- UTDAGHZGKXPRQI-UHFFFAOYSA-N 4-[4-[4-(4-aminophenoxy)phenyl]sulfonylphenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=C(S(=O)(=O)C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)C=C1 UTDAGHZGKXPRQI-UHFFFAOYSA-N 0.000 description 1
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 description 1
- FKEFNFCYNXARPG-UHFFFAOYSA-N 5-(3-aminophenyl)benzene-1,3-diamine Chemical group NC1=CC=CC(C=2C=C(N)C=C(N)C=2)=C1 FKEFNFCYNXARPG-UHFFFAOYSA-N 0.000 description 1
- ZVBBGWMHPIVCDQ-UHFFFAOYSA-N 5-(4-aminophenyl)benzene-1,3-diamine Chemical group C1=CC(N)=CC=C1C1=CC(N)=CC(N)=C1 ZVBBGWMHPIVCDQ-UHFFFAOYSA-N 0.000 description 1
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Abstract
【解決手段】芳香族テトラカルボン酸二無水物と、所定の非対称構造を有する芳香族トリアミンと、末端にアミノ基或いはカルボキシル基を有する、ケイ素等のアルコキシ化合物若しくはそれらの誘導体とを反応せしめて得られる、複数の末端のうちの少なくとも一部に水酸基又はアルコキシ基を有する多分岐ポリアミド酸と、所定のアルコキシドの少なくとも一種以上とを、水の存在下、ゾル−ゲル反応せしめ、得られた反応物を脱水閉環せしめることにより、目的とする多分岐ポリイミド系ハイブリッド材料を得た。
【選択図】図2
Description
ラン、3−アミノプロピルメチルジエトキシシラン、3−アミノフェニルジメチルメトキシシラン、アミノフェニルトリメトキシシラン、(アミノエチルアミノメチル)フェネチルトリメトキシシラン、プロピルトリメトキシシリルカルボン酸、プロピルメチルジエトキシシリルカルボン酸、ジメチルメトキシシリル安息香酸、テトラエトキシシリルプロピル琥珀酸等が挙げられる。チタンのアルコキシ化合物としては、特開2004−114360号公報中の段落[0085]において示されている如き構造(下記構造式)を呈するものが挙げられる。また、それらアルコキシ化合物の誘導体としては、例えば、各種ハロゲン化物等が挙げられる。
撹拌機、窒素導入管及び塩化カルシウム管を備えた100mLの三つ口フラスコに、4,4’−(ヘキサフルオロイソプロピリデン)ジフタル酸二無水物(6FDA)を1.33g仕込み、30mLのジメチルアセトアミド(DMAc)を加えて溶解した。この溶液を撹拌しながら、20mLのDMAcに溶解した2,4,4’−トリアミノジフェニルエーテル(TADE):0.34gを徐々に加えた後、25℃で3時間、撹拌し、多分岐ポリアミド酸を合成した。
下記表3に示す量のTMOS及びH2O を用いた以外は、実施例1と同様の条件に従って、2種類の重合体(試料2及び3)を得た。これらの試料についても、試料1と同様のFT−IRスペクトルが得られ、本発明に従う多分岐ポリイミド−シリカハイブリッドであることが確認された。試料2及び3における諸物性の測定結果を、下記表1及び表2に示す。
実施例1と同様の手法に従って得られた、シラン末端多分岐ポリアミド酸のDMAc溶液:6.0gに、メチルトリメトキシシラン(MTMS):0.062gと、水(H2O ):0.065gとを加え、室温にて24時間、撹拌した。その後、この混合溶液を、ポリエステルフィルム上にキャストし、85℃で2時間、乾燥し、更に、窒素雰囲気下にて、100℃で1時間、200℃で1時間、300℃で1時間、加熱処理を施し、重合体(試料4)を得た。得られた重合体(試料4)には、二酸化ケイ素換算で10重量%のシリカが含まれていた。試料4における諸物性の測定結果を下記表1及び表2に示す。
下記表3に示す量のMTMS及びH2O を用いた以外は、実施例4と同様の条件に従い、重合体(試料5〜7)を得た。これらの試料についても、試料1と同様のFT−IRスペクトルが得られ、本発明に従う多分岐ポリイミド系ハイブリッド材料(多分岐ポリイミド−シリカハイブリッド)であることが確認された。試料5〜7における諸物性の測定結果を、下記表1及び表2に示す。
実施例1と同様の手法に従って得られたシラン末端多分岐ポリアミド酸のDMAc溶液を、ポリエステルフィルム上にキャストし、85℃で2時間、乾燥し、更に、窒素雰囲気下にて100℃で1時間、200℃で1時間、300℃で1時間、加熱処理を施し、重合体(試料8)を得た。得られた重合体(試料8)には、二酸化ケイ素換算で1.7重量%のシリカが含まれていた。
Claims (11)
- 芳香族テトラカルボン酸二無水物と、下記一般式(I)で表される非対称構造を有する芳香族トリアミンと、末端にアミノ基或いはカルボキシル基を有する、ケイ素、マグネシウム、アルミニウム、ジルコニウム又はチタンのアルコキシ化合物若しくはそれらの誘導体とを反応せしめて得られる、複数の末端のうちの少なくとも一部に水酸基又はアルコキシ基を有する多分岐ポリアミド酸と、下記一般式(II)で表わされるアルコキシドの少なくとも一種以上とを、水の存在下、ゾル−ゲル反応せしめ、得られた反応物を脱水閉環せしめてなる多分岐ポリイミド系ハイブリッド材料。
- 芳香族テトラカルボン酸二無水物と、下記一般式(I)で表される非対称構造を有する芳香族トリアミンと、末端にアミノ基或いはカルボキシル基を有する、ケイ素、マグネシウム、アルミニウム、ジルコニウム又はチタンのアルコキシ化合物若しくはそれらの誘導体とを反応せしめて得られる、複数の末端のうちの少なくとも一部に水酸基又はアルコキシ基を有する多分岐ポリアミド酸を、脱水閉環せしめて多分岐ポリイミドとし、かかる多分岐ポリイミドと、下記一般式(II)で表わされるアルコキシドの少なくとも一種以上とを、水の存在下、ゾル−ゲル反応せしめて得られる多分岐ポリイミド系ハイブリッド材料。
- 芳香族テトラカルボン酸二無水物と、下記一般式(I)で表される非対称構造を有する芳香族トリアミンと、末端にアミノ基或いはカルボキシル基を有する、ケイ素、マグネシウム、アルミニウム、ジルコニウム又はチタンのアルコキシ化合物若しくはそれらの誘導体とを反応せしめて得られる、複数の末端のうちの少なくとも一部に水酸基又はアルコキシ基を有する多分岐ポリアミド酸を、重縮合及び脱水閉環せしめてなる多分岐ポリイミド系ハイブリッド材料。
- 表面がアミノ基又はカルボキシル基にて修飾された無機酸化物微粒子と、芳香族テトラカルボン酸二無水物と、下記一般式(I)で表される非対称構造を有する芳香族トリアミンとを反応せしめて得られる多分岐ポリイミド系ハイブリッド材料。
- 複数の末端に反応性残基を有し、そのうちの少なくとも一部が、アミン、カルボン酸、カルボン酸ハライド又はカルボン酸無水物との反応によって修飾されていることを特徴とする請求項1乃至請求項4の何れか1項に記載の多分岐ポリイミド系ハイブリッド材料。
- 複数の末端に反応性残基を有し、そのうちの少なくとも一部が、アミン、カルボン酸、カルボン酸ハライド又はカルボン酸無水物のフッ素含有化合物との反応によって修飾されていることを特徴とする請求項1乃至請求項4の何れか1項に記載の多分岐ポリイミド系ハイブリッド材料。
- 複数の末端に反応性残基を有し、そのうちの少なくとも一部が、アミン、カルボン酸、カルボン酸ハライド又はカルボン酸無水物のスルホン酸基含有化合物との反応によって修飾されていることを特徴とする請求項1乃至請求項4の何れか1項に記載の多分岐ポリイミド系ハイブリッド材料。
- 請求項1乃至請求項7の何れか1項に記載の多分岐ポリイミド系ハイブリッド材料からなる気体分離膜。
- 請求項1乃至請求項7の何れか1項に記載の多分岐ポリイミド系ハイブリッド材料からなる電子材料用絶縁膜。
- 請求項1乃至請求項7の何れか1項に記載の多分岐ポリイミド系ハイブリッド材料からなる耐熱性接着剤。
- 請求項1乃至請求項7の何れか1項に記載の多分岐ポリイミド系ハイブリッド材料からなる固体電解質膜。
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| JP2007246772A (ja) * | 2006-03-17 | 2007-09-27 | Nagoya Industrial Science Research Inst | 多分岐ポリイミド系ハイブリッド材料 |
| WO2008114798A1 (ja) * | 2007-03-19 | 2008-09-25 | Ibiden Co., Ltd. | 多孔性ポリイミド |
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| JPH08104749A (ja) * | 1994-09-14 | 1996-04-23 | Sunkyong Ind Ltd | ポリイミド/シリカ複合体及びそのフィルムの製造方法 |
| WO2006025327A1 (ja) * | 2004-08-30 | 2006-03-09 | National University Corporation Nagoya Institute Of Technology | 多分岐ポリイミド系ハイブリッド材料 |
| JP2007246772A (ja) * | 2006-03-17 | 2007-09-27 | Nagoya Industrial Science Research Inst | 多分岐ポリイミド系ハイブリッド材料 |
| WO2008114798A1 (ja) * | 2007-03-19 | 2008-09-25 | Ibiden Co., Ltd. | 多孔性ポリイミド |
| WO2011024908A1 (ja) * | 2009-08-26 | 2011-03-03 | イビデン株式会社 | 気体分離膜 |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103113578A (zh) * | 2013-01-31 | 2013-05-22 | 华南理工大学 | 改性的端羧基超支化聚酰胺树脂及其制备方法与应用 |
| EP2907840A1 (en) * | 2014-02-12 | 2015-08-19 | Essilor International (Compagnie Generale D'optique) | Optical article comprising a hard coat, and production method |
| WO2015121305A1 (en) * | 2014-02-12 | 2015-08-20 | Essilor International (Compagnie Generale D'optique) | Optical article comprising a hard coat, and production method |
| CN105980463A (zh) * | 2014-02-12 | 2016-09-28 | 埃西勒国际通用光学公司 | 包含硬质涂层的光学物品、以及生产方法 |
| CN105980463B (zh) * | 2014-02-12 | 2019-09-10 | 依视路国际公司 | 包含硬质涂层的光学物品、以及生产方法 |
| US10570310B2 (en) * | 2014-02-12 | 2020-02-25 | Essilor International | Optical article comprising a hard coat, and production method |
| CN118203959A (zh) * | 2024-05-13 | 2024-06-18 | 泰州南潇新材料科技有限公司 | 一种制备含超支化聚酰胺的聚酰胺复合膜的方法 |
| CN120224571A (zh) * | 2025-03-26 | 2025-06-27 | 嘉丰盛精密电子科技(孝感)有限公司 | 一种柔性线路板制备的方法及柔性线路板 |
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