CN106536783A - 反射片及其制造方法 - Google Patents

反射片及其制造方法 Download PDF

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Publication number
CN106536783A
CN106536783A CN201580039646.3A CN201580039646A CN106536783A CN 106536783 A CN106536783 A CN 106536783A CN 201580039646 A CN201580039646 A CN 201580039646A CN 106536783 A CN106536783 A CN 106536783A
Authority
CN
China
Prior art keywords
layer
reflector plate
reflective
silver
plate according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201580039646.3A
Other languages
English (en)
Chinese (zh)
Inventor
高剑侠
R·帕拉尼斯瓦米
M·塞巴斯蒂安
D·M·特拉瓦索
A·A·诺荣哈三世
安祐莹
M·M·戴维
N·P·克瑞尤特
成基勋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of CN106536783A publication Critical patent/CN106536783A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/021—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material including at least one metal alloy layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/021—Cleaning or etching treatments
    • C23C14/022—Cleaning or etching treatments by means of bombardment with energetic particles or radiation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/024—Deposition of sublayers, e.g. to promote adhesion of the coating
    • C23C14/025—Metallic sublayers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/20—Metallic material, boron or silicon on organic substrates
    • C23C14/205—Metallic material, boron or silicon on organic substrates by cathodic sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
    • C23C28/321—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer with at least one metal alloy layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Optical Elements Other Than Lenses (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
CN201580039646.3A 2014-08-07 2015-08-05 反射片及其制造方法 Pending CN106536783A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201462034382P 2014-08-07 2014-08-07
US62/034,382 2014-08-07
PCT/US2015/043715 WO2016022628A1 (en) 2014-08-07 2015-08-05 Reflection sheet and method of manufacturing the same

Publications (1)

Publication Number Publication Date
CN106536783A true CN106536783A (zh) 2017-03-22

Family

ID=54012263

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201580039646.3A Pending CN106536783A (zh) 2014-08-07 2015-08-05 反射片及其制造方法

Country Status (5)

Country Link
US (1) US10143082B2 (enExample)
JP (1) JP2017532586A (enExample)
KR (1) KR20170038894A (enExample)
CN (1) CN106536783A (enExample)
WO (1) WO2016022628A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108693578A (zh) * 2017-04-12 2018-10-23 扬明光学股份有限公司 反射元件及反射镜

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140122338A (ko) * 2013-04-09 2014-10-20 쓰리엠 이노베이티브 프로퍼티즈 캄파니 터치패널, 그 제조방법 및 터치패널용 Ag-Pd-Nd 합금
KR102639577B1 (ko) * 2016-11-21 2024-02-21 에스케이넥실리스 주식회사 금속 적층체 및 그 제조방법
GB2552248B (en) * 2017-05-19 2018-10-31 Cares Laboratory Ltd Heat reflective sheet for a tumble dryer
WO2021221669A1 (en) * 2020-04-30 2021-11-04 Hewlett-Packard Development Company, L.P. Digital pen sensor surface

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5620767A (en) * 1992-08-10 1997-04-15 Ricoh Company, Ltd. Light reflecting and heat dissipating material and optical information recording medium using the same
JPH09277422A (ja) * 1996-04-16 1997-10-28 Mitsui Toatsu Chem Inc 反射体及びそれを用いた反射部材
CN1361525A (zh) * 2000-12-26 2002-07-31 株式会社神户制钢所 光信息记录介质用反射层或半透明反射层、光信息记录介质和光信息记录介质用溅射靶
JP2006284880A (ja) * 2005-03-31 2006-10-19 Kobe Steel Ltd 光反射膜および光反射板
TW200637928A (en) * 2005-02-17 2006-11-01 Nikko Materials Co Ltd Barrier film for flexible copper substrate and sputtering target for barrier film formation
JP2008078276A (ja) * 2006-09-20 2008-04-03 Sumitomo Metal Mining Co Ltd 高耐熱密着力を有する銅被覆ポリイミド基板
US20090085052A1 (en) * 2007-09-27 2009-04-02 Samsung Electro-Mechanics Co., Ltd. Gan type light emitting diode device and method of manufacturing the same
CN102569618A (zh) * 2010-12-08 2012-07-11 日东电工株式会社 反射膜及其制造方法
CN105103098A (zh) * 2013-04-09 2015-11-25 3M创新有限公司 触控面板、其制备方法以及用于触控面板的银-钯-钕合金

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6125128A (ja) 1984-07-14 1986-02-04 Canon Inc カイラルスメクティック液晶素子
JP2002116313A (ja) * 2000-10-11 2002-04-19 Mitsui Chemicals Inc 反射シート及びそれを用いたリフレクター
JP2003185813A (ja) * 2001-12-21 2003-07-03 Mitsui Chemicals Inc 反射体およびその用途
JP2005029849A (ja) 2003-07-07 2005-02-03 Kobe Steel Ltd リフレクター用Ａｇ合金反射膜、及び、このＡｇ合金反射膜を用いたリフレクター、並びに、このＡｇ合金反射膜の形成用のＡｇ合金スパッタリングターゲット
US20060131700A1 (en) 2004-12-22 2006-06-22 David Moses M Flexible electronic circuit articles and methods of making thereof
WO2006132076A1 (ja) * 2005-06-07 2006-12-14 Matsushita Electric Industrial Co., Ltd. 情報記録媒体とその製造方法
KR20070103141A (ko) 2006-04-18 2007-10-23 삼성전자주식회사 반사판 일체형 회로 기판 및 이를 이용한 액정표시장치
JP2013177667A (ja) 2012-02-02 2013-09-09 Kobe Steel Ltd 反射膜および／または透過膜、もしくは電気配線および／または電極に用いられるＡｇ合金膜、並びにＡｇ合金スパッタリングターゲットおよびＡｇ合金フィラー

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5620767A (en) * 1992-08-10 1997-04-15 Ricoh Company, Ltd. Light reflecting and heat dissipating material and optical information recording medium using the same
JPH09277422A (ja) * 1996-04-16 1997-10-28 Mitsui Toatsu Chem Inc 反射体及びそれを用いた反射部材
CN1361525A (zh) * 2000-12-26 2002-07-31 株式会社神户制钢所 光信息记录介质用反射层或半透明反射层、光信息记录介质和光信息记录介质用溅射靶
TW200637928A (en) * 2005-02-17 2006-11-01 Nikko Materials Co Ltd Barrier film for flexible copper substrate and sputtering target for barrier film formation
JP2006284880A (ja) * 2005-03-31 2006-10-19 Kobe Steel Ltd 光反射膜および光反射板
JP2008078276A (ja) * 2006-09-20 2008-04-03 Sumitomo Metal Mining Co Ltd 高耐熱密着力を有する銅被覆ポリイミド基板
US20090085052A1 (en) * 2007-09-27 2009-04-02 Samsung Electro-Mechanics Co., Ltd. Gan type light emitting diode device and method of manufacturing the same
CN102569618A (zh) * 2010-12-08 2012-07-11 日东电工株式会社 反射膜及其制造方法
CN105103098A (zh) * 2013-04-09 2015-11-25 3M创新有限公司 触控面板、其制备方法以及用于触控面板的银-钯-钕合金

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108693578A (zh) * 2017-04-12 2018-10-23 扬明光学股份有限公司 反射元件及反射镜

Also Published As

Publication number Publication date
US20170164462A1 (en) 2017-06-08
US10143082B2 (en) 2018-11-27
KR20170038894A (ko) 2017-04-07
WO2016022628A1 (en) 2016-02-11
JP2017532586A (ja) 2017-11-02

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