CN106469658A - 片材粘附装置及粘附方法 - Google Patents

片材粘附装置及粘附方法 Download PDF

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CN106469658A
CN106469658A CN201610545837.3A CN201610545837A CN106469658A CN 106469658 A CN106469658 A CN 106469658A CN 201610545837 A CN201610545837 A CN 201610545837A CN 106469658 A CN106469658 A CN 106469658A
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坂本和纪
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Lintec Corp
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Abstract

片材粘附装置(10)具有:保持被粘接体(WF)的第一保持单元(20)、使粘接片(AS)的一面(AS1)与被第一保持单元(20)保持的被粘接体(WF)相对而保持该粘接片(AS)的外缘部的第二保持单元(30)、供给流体的流体供给单元(40)、将由第二保持单元(30)保持的粘接片(AS)按压在由第一保持单元(20)保持的被粘接体(WF)上并粘附的按压单元(50),第二保持单元(30)可形成包含粘接片(AS)在内而将第一保持单元(20)包围的闭塞空间(SP),流体供给单元(40)向闭塞空间(SP)供给流体,使粘接片(AS)向离开被粘接体(WF)的方向变形,按压单元(50)将变形后的粘接片(AS)向被粘接体(WF)按压并粘附。

Description

片材粘附装置及粘附方法
技术领域
本发明涉及片材粘附装置及粘附方法。
背景技术
目前,已知有将与半导体晶片(以下简称为晶片)等被粘接体相对配置的粘接片粘附在该被粘接体上的片材粘附装置(例如,参照文献1:日本特开2014-27081号公报)。
专利文献1:日本特开2014-27081号公报
但是,文献1记载那样的现有的片材粘附装置将作为流体的气体在开放空间向粘接片吹附,将距离晶片保持一定距离的状态的该粘接片粘附在晶片上,故而直至粘附动作结束为止,必须持续供给流体,具有流体的消耗激增的问题。
另外,由于需要将粘接片与晶片的距离保持为一定,故而具有用于供给流体的控制复杂化的问题。
发明内容
本发明的目的在于提供一种能够抑制流体的消耗的片材粘附装置及粘附方法。
本发明的另一目的在于提供能够防止流体的供给控制复杂化的片材粘附装置及粘附方法。
本发明的片材粘附装置具有:第一保持单元,其对被粘接体进行保持;第二保持单元,其使粘接片的一面与被所述第一保持单元保持的被粘接体相对而保持该粘接片的外缘部;流体供给单元,其供给流体;按压单元,其将由所述第二保持单元保持的粘接片按压在由所述第一保持单元保持的被粘接体上并粘附,所述第二保持单元可形成包含所述粘接片在内而将所述第一保持单元包围的闭塞空间,所述流体供给单元向所述闭塞空间供给流体,使所述粘接片向离开所述被粘接体的方向变形,所述按压单元将所述变形后的粘接片按压在所述被粘接体上并粘附。
在本发明的片材粘附装置中,优选的是,所述第一保持单元具有调整所述被粘接体的被粘接面的位置的调整单元,所述调整单元以所述被粘接体的被粘接面比所述粘接片的外缘部的所述一面更靠所述按压单元侧的方式可调整所述被粘接体的被粘接面的位置而设置。
本发明的片材粘附方法,其具有如下的工序:由第一保持单元保持被粘接体;使粘接片的一面与被所述第一保持单元保持的被粘接体相对,由第二保持单元保持该粘接片的外缘部;形成包含所述粘接片在内而由所述第二保持单元包围所述第一保持单元的闭塞空间;向所述闭塞空间供给流体,使所述粘接片向离开所述被粘接体的方向变形;将由所述第二保持单元保持的粘接片按压在由所述第一保持单元保持的被粘接体上并粘附。
根据以上的本发明,由于向闭塞空间供给流体,故而仅通过供给一定量的流体就能够使粘接片向离开被粘接体的方向变形,能够抑制流体的消耗。
另外,由于只要供给一定量的流体即可,故而能够防止流体的供给控制的复杂化。
另外,若以被粘接体的被粘接面比粘接片的外缘部的一面更靠按压单元侧的方式可调整被粘接体的被粘接面的位置,则能够将粘接片可靠地按压在被粘接体上。
附图说明
图1是本发明一实施方式的片材粘附装置的侧面图;
图2是片材粘附装置的动作说明图。
具体实施方式
以下,基于附图对本发明的一实施方式进行说明。
另外,本实施方式中的X轴、Y轴、Z轴为分别正交的关系,Ⅹ轴及Y轴设为规定平面内的轴,Z轴设为与所述规定平面正交的轴。另外,在本实施方式中,在以从与Y轴平行的图1中跟前方向观测的情况为基准表示方向的情况下,“上”为Z轴的箭头标记方向,“下”为其反方向,“左”为Ⅹ轴的箭头标记方向,“右”为其反方向,“前”为与Y轴平行的图1中跟前方向,“后”为其反方向。
在图1中,片材粘附装置10具有:保持作为被粘接体的晶片WF的第一保持单元20、使粘接片AS的一面AS1与被第一保持单元20保持的晶片WF相对而保持该粘接片AS的外缘部的第二保持单元30、供给作为流体的气体的流体供给单元40、将由第二保持单元30保持的粘接片AS按压在由第一保持单元20保持的晶片WF上并粘附的按压单元50。另外,粘接片AS以将作为框架的环形框RF的开口部RFl闭塞的方式预先粘附在该环形框RF上。
第一保持单元20具有:具有通过减压泵或真空注射器等未图示的减压单元可吸附保持晶片WF的保持面21A的内侧台21;由输出轴22A支承内侧台21,并且调整晶片WF的被粘接面WFl的位置的调整单元、即作为驱动设备的直动电机22。
第二保持单元30具有:通过利用减压泵或真空注射器等未图示的减压单元吸附环形框RF而可保持粘接片AS的外缘部的保持面31;在保持面31上开设,由其底面部32A支承直动电动机22的凹部32。由此,第二保持单元30可形成包含粘接片AS在内(由粘接片AS和环形框RF)而包围第一保持单元20的闭塞空间SP。
流体供给单元40具有:经由配管41A与闭塞空间SP连接,向该闭塞空间SP供给气体的加压泵及涡轮等加压单元41;设置在配管41A上,调整闭塞空间SP内的压力的电磁阀或分隔阀等压力调节单元42。
按压单元50具有作为驱动设备的线性电动机51、被线性电动机51的滑块51A支承的作为驱动设备的直动电动机52、经由托架53支承在直动电动机52的输出轴52A上的作为按压部件的按压辊54。
在以上的片材粘附装置10中,对将粘接片AS粘附在晶片WF上的顺序进行说明。
首先,相对于将各部件配置在初始位置的图1中实线所示的状态的片材粘附装置10,操作者或多关节机械手等未图示的搬送单元将晶片WF载置在保持面21A上的规定位置。接着,第一保持单元20驱动未图示的减压单元,由保持面21A吸附保持晶片WF。而且,未图示的搬送单元以粘接片AS为上侧而将环形框RF载置在保持面31上的规定位置。接着,第一保持单元20驱动未图示的减压单元,由保持面31吸附保持环形框RF。
之后,流体供给单元40驱动加压单元41,向闭塞空间SP供给规定量的气体,如图1中双点划线所示,使粘接片AS的中央部向按压单元50侧突出,使该粘接片AS向离开晶片WF的方向变形。接着,第一保持单元20驱动直动电动机22,以晶片WF的被粘接面WFl比粘接片AS的外缘部的一面ASl稍靠按压单元50侧的方式,调整内侧台21的位置。而且,按压单元50驱动直动电动机52及线性电动机51,使按压辊54下降而按压粘接片AS之后,如图2所示地,使按压辊54向右方向移动。由此,按压辊54将变形后的粘接片AS按压在晶片WF上,挤出该粘接片AS与晶片WF之间的空气而将其粘附。此时,由于粘接片AS向离开晶片WF的方向弯曲,故而能够在按压辊54移动之前,防止粘接片AS的右侧粘附在晶片WF上。在此,通过将向上方弯曲的粘接片AS粘附到晶片WF上,闭塞空间SP的体积减少,闭塞空间SP内的压力上升的话,由压力开关或负载单元等未图示的压力检测单元检测该压力变化。而且,基于该未图示的压力检测单元的检测结果,流体供给单元40驱动压力调节单元42,使闭塞空间SP内的压力一定而进行控制。
之后,若按压辊54向图2中双点划线所示的位置移动,则按压单元50驱动线性电动机51及直动电动机52,使按压辊54回归到初始位置。接着,第一保持单元20及第二保持单元30停止未图示的减压单元的驱动。而且,操作者或未图示的搬送单元经由粘接片AS将晶片WF和环形框RF一体化的一体物向下一工序搬送后,第一保持单元20驱动直动电动机22,使内侧台21回归到初始位置,之后反复进行上述同样的动作。
根据以上那样的实施方式,由于向闭塞空间SP供给气体,故而仅通过供给一定量的气体即可使粘接片AS向离开晶片WF的方向变形,能够抑制气体的消耗。
另外,由于只要供给一定量的气体即可,故而能够防止气体的供给控制的复杂化。
以上,由上述记载公开了用于实施本发明的最佳的构成、方法等,但本发明不限于此。即,本发明主要对特定的实施方式进行了特别图示并进行了说明。但只要不脱离本发明的技术思想及目的范围,相对于上述的实施方式,本领域技术人员也能够对形状、材质、数量及其他详细的构成进行各种变形。另外,上述公开的限定了形状、材质等的记载是为了容易地理解本发明而示例地记载,并非限定本发明,故而除了这些形状、材质等的限定的一部分或全部的限定之外的部件的名称的记载也包含在本发明中。
例如,第一保持单元20也可以为利用机械夹具或夹具缸等夹具单元、库仑力、粘接剂、粘着剂、磁力、伯努利吸附等保持被粘接体的构成。
直动电动机22也可以以使晶片WF的被粘接面WFl与粘接片AS的外缘部的一面AS同高,或者使被粘接面WFl位于一面ASl的下方的方式调整内侧台21的高度。
第二保持单元30也可以为利用机械夹具或夹具缸等夹具单元、库仑力、粘接剂、粘着剂、磁力、伯努利吸附等保持被粘接体的构成。
流体供给单元40供给的流体可以为大气、单体气体以及混合气体等气体,只要能够确保粘接片AS相对于晶片WF的粘接力,则也可以为水、油等液体、胶状体等。
流体供给单元40也可以为侧面看使粘接片AS为M型或W型等波状变形的构成。
按压单元50能够采用圆棒、板材、橡胶、树脂、海绵等构成的按压部件,通过喷附气体而将粘接片AS按压在被粘接体上,也可以将粘接片AS从中央部向外缘部按压。
粘接片AS也可以不粘附在环形框RF上。该情况下,第二保持单元30由粘接片AS形成闭塞空间SP。
框架除了环形框RF以外,也可以为不为环状(外周不相连)的框架、圆形、椭圆形、三角形以上的多边形、其他形状。在不为环状的框架的情况下,只要在保持面31设置可形成闭塞空间SP的闭塞部件即可。
另外,本发明的粘接片AS及被粘接体的材质、种类、形状等不特别限定。例如,粘接片AS既可以为圆形、椭圆形、三角形及四边形等多边形、其他形状,也可以为压感粘接性、热感粘接性等粘接方式,在采用了热感粘接性的粘接片AS的情况下,只要利用设置将该粘接片加热的适当的线圈加热器及加热管等加热侧等的加热单元的适当方法即可。另外,粘接片AS例如既可以为仅粘接剂层的单层结构、在基材片与粘接剂层之间具有中间层的结构、在基材片的上面具有覆盖层等三层以上的构成、进而能够从粘接剂层将基材片剥离的所谓双面粘接片那样的构成,双面粘接片可以具有单层或多层的中间层、无中间层的单层或多层构成。另外,作为被粘接体,例如食品、树脂容器、硅半导体晶片及化合物半导体晶片等半导体晶片、电路基板、光盘等信息存储基板、玻璃板、钢板、陶器、木板或树脂板等任意形态的部件及物品等也能够作为对象。另外,能够将粘接片AS改变功能上的、用途上的读法,例如,信息存储用标签、装饰用标签、保护带、切割带、钻石触摸膜、接合带、记录层形成树脂片等任意形状的任意片材、薄膜、带等粘附在上述那样的任意的被粘接体上。
只要能够实现对这些方式及工序说明的动作、功能或工序,则本发明的方式及工序不作限定,而且,不完全限定为上述实施方式所示的简单的一实施方式的构成物及工序。例如,第一保持单元若能够保持被粘接体,则参照本申请当初的技术常识,若在其技术范围内,则不进行限定(省略对其他方式及工序的说明)。
另外,上述实施方式的驱动设备除了能够采用转动电动机、直动电动机、线性电动机、单轴机械手、多关节机械手等电动设备、气缸、油压缸、无杆缸及转子缸等促动器等之外,也能够采用将其直接或间接组合的构成(也与实施方式中示例的重复)。

Claims (3)

1.一种片材粘附装置,其具有:
第一保持单元,其对被粘接体进行保持;
第二保持单元,其使粘接片的一面与被所述第一保持单元保持的被粘接体相对而保持该粘接片的外缘部;
流体供给单元,其供给流体;
按压单元,其将由所述第二保持单元保持的粘接片按压在由所述第一保持单元保持的被粘接体上并粘附,
所述第二保持单元可形成包含所述粘接片在内而将所述第一保持单元包围的闭塞空间,
所述流体供给单元向所述闭塞空间供给流体,使所述粘接片向离开所述被粘接体的方向变形,
所述按压单元将所述变形后的粘接片按压在所述被粘接体上并粘附。
2.如权利要求1所述的片材粘附装置,其特征在于,
所述第一保持单元具有调整所述被粘接体的被粘接面的位置的调整单元,
所述调整单元以所述被粘接体的被粘接面比所述粘接片的外缘部的所述一面更靠所述按压单元侧的方式可调整所述被粘接体的被粘接面的位置而设置。
3.一种片材粘附方法,其具有如下的工序:
由第一保持单元保持被粘接体;
使粘接片的一面与被所述第一保持单元保持的被粘接体相对,由第二保持单元保持该粘接片的外缘部;
形成包含所述粘接片在内而由所述第二保持单元包围所述第一保持单元的闭塞空间;
向所述闭塞空间供给流体,使所述粘接片向离开所述被粘接体的方向变形;
将由所述第二保持单元保持的粘接片按压在由所述第一保持单元保持的被粘接体上并粘附。
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108695196A (zh) * 2017-04-11 2018-10-23 琳得科株式会社 分离装置及分离方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6925714B2 (ja) * 2017-05-11 2021-08-25 株式会社ディスコ ウェーハの加工方法
JP6837717B2 (ja) * 2017-05-11 2021-03-03 株式会社ディスコ ウェーハの加工方法
JP6914587B2 (ja) * 2017-05-25 2021-08-04 株式会社ディスコ ウェーハの加工方法
TWI775083B (zh) * 2020-05-26 2022-08-21 毅力科技有限公司 真空壓膜系統及真空壓膜方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11301613A (ja) * 1998-04-22 1999-11-02 Jorg Von Saegaan Maschinenbau Gmbh ガス充填密封包装方法及び装置
CN103081087A (zh) * 2010-08-26 2013-05-01 琳得科株式会社 片材粘附装置及粘附方法
JP2014027081A (ja) * 2012-07-26 2014-02-06 Nitto Denko Corp 半導体ウエハのマウント方法および半導体ウエハのマウント装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0356216A (ja) * 1989-07-14 1991-03-11 Toppan Printing Co Ltd ガス置換用ノズル及びガス置換方法
JP4141725B2 (ja) * 2002-04-09 2008-08-27 株式会社メカワールド フィルム貼付け方法
JP4723614B2 (ja) * 2008-06-06 2011-07-13 リンテック株式会社 シート貼付装置及び貼付方法
TWI460075B (zh) * 2010-11-11 2014-11-11 C Sun Mfg Ltd 壓合機

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11301613A (ja) * 1998-04-22 1999-11-02 Jorg Von Saegaan Maschinenbau Gmbh ガス充填密封包装方法及び装置
CN103081087A (zh) * 2010-08-26 2013-05-01 琳得科株式会社 片材粘附装置及粘附方法
JP2014027081A (ja) * 2012-07-26 2014-02-06 Nitto Denko Corp 半導体ウエハのマウント方法および半導体ウエハのマウント装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108695196A (zh) * 2017-04-11 2018-10-23 琳得科株式会社 分离装置及分离方法
CN108695196B (zh) * 2017-04-11 2023-03-24 琳得科株式会社 分离装置及分离方法

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