CN1063579C - 半导体装置 - Google Patents
半导体装置 Download PDFInfo
- Publication number
- CN1063579C CN1063579C CN95190765A CN95190765A CN1063579C CN 1063579 C CN1063579 C CN 1063579C CN 95190765 A CN95190765 A CN 95190765A CN 95190765 A CN95190765 A CN 95190765A CN 1063579 C CN1063579 C CN 1063579C
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- chip
- semiconductor device
- bonding
- tube core
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
Claims (9)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP191502/1994 | 1994-08-15 | ||
JP19150294 | 1994-08-15 | ||
JP191502/94 | 1994-08-15 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1132003A CN1132003A (zh) | 1996-09-25 |
CN1063579C true CN1063579C (zh) | 2001-03-21 |
Family
ID=16275723
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN95190765A Expired - Fee Related CN1063579C (zh) | 1994-08-15 | 1995-08-15 | 半导体装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US5739588A (zh) |
JP (1) | JP3578770B2 (zh) |
KR (1) | KR100201924B1 (zh) |
CN (1) | CN1063579C (zh) |
TW (1) | TW368745B (zh) |
WO (1) | WO1996005613A1 (zh) |
Families Citing this family (78)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6734545B1 (en) * | 1995-11-29 | 2004-05-11 | Hitachi, Ltd. | BGA type semiconductor device and electronic equipment using the same |
US6861290B1 (en) | 1995-12-19 | 2005-03-01 | Micron Technology, Inc. | Flip-chip adaptor package for bare die |
TW459323B (en) * | 1996-12-04 | 2001-10-11 | Seiko Epson Corp | Manufacturing method for semiconductor device |
TW480636B (en) * | 1996-12-04 | 2002-03-21 | Seiko Epson Corp | Electronic component and semiconductor device, method for manufacturing and mounting thereof, and circuit board and electronic equipment |
JP2975979B2 (ja) * | 1996-12-30 | 1999-11-10 | アナムインダストリアル株式会社 | ボールグリッドアレイ半導体パッケージ用可撓性回路基板 |
JPH10214917A (ja) * | 1997-01-30 | 1998-08-11 | Sony Corp | 半導体装置及び半導体装置の製造方法並びに配線基板 |
JP3959697B2 (ja) * | 1997-01-30 | 2007-08-15 | ソニー株式会社 | 半導体装置及び半導体装置の製造方法並びに配線基板 |
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1995
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- 1995-08-15 JP JP50719796A patent/JP3578770B2/ja not_active Expired - Fee Related
- 1995-08-15 KR KR1019960701568A patent/KR100201924B1/ko not_active IP Right Cessation
- 1995-08-15 WO PCT/JP1995/001622 patent/WO1996005613A1/ja active Application Filing
- 1995-08-15 US US08/624,496 patent/US5739588A/en not_active Expired - Lifetime
- 1995-08-15 CN CN95190765A patent/CN1063579C/zh not_active Expired - Fee Related
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JPS61218139A (ja) * | 1985-03-25 | 1986-09-27 | Hitachi Chiyou Lsi Eng Kk | 半導体装置 |
Also Published As
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KR100201924B1 (ko) | 1999-06-15 |
KR960705357A (ko) | 1996-10-09 |
US5739588A (en) | 1998-04-14 |
TW368745B (en) | 1999-09-01 |
WO1996005613A1 (en) | 1996-02-22 |
JP3578770B2 (ja) | 2004-10-20 |
CN1132003A (zh) | 1996-09-25 |
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