JP6252412B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP6252412B2 JP6252412B2 JP2014184186A JP2014184186A JP6252412B2 JP 6252412 B2 JP6252412 B2 JP 6252412B2 JP 2014184186 A JP2014184186 A JP 2014184186A JP 2014184186 A JP2014184186 A JP 2014184186A JP 6252412 B2 JP6252412 B2 JP 6252412B2
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- 239000004065 semiconductor Substances 0.000 title claims description 47
- 229910052751 metal Inorganic materials 0.000 claims description 24
- 239000002184 metal Substances 0.000 claims description 24
- 239000003822 epoxy resin Substances 0.000 claims description 16
- 229920000647 polyepoxide Polymers 0.000 claims description 16
- 229920005989 resin Polymers 0.000 claims description 14
- 239000011347 resin Substances 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 9
- 238000007789 sealing Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 description 13
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000945 filler Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229910002601 GaN Inorganic materials 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
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Description
図1は本発明の実施の形態1に係る半導体装置を示す平面図である。図2は図1のI−IIに沿った断面図である。
図3は本発明の実施の形態2に係る半導体装置の主要部を拡大した平面図である。本実施の形態では、直線型のスリット8が実装部品5の4つの角部に設けられている。これにより、実装部品5の角部で発生する応力を抑制することができる。また、応力を十分に抑制するためには、実装部品5とスリット8の間隔Dが5mm以下であり、スリット8の幅Wが金属パターン3の厚み以上であることが好ましい。その他の構成及び効果は実施の形態1と同様である。
図4は本発明の実施の形態3に係る半導体装置の主要部を拡大した平面図である。本実施の形態では、L字型スリット8が実装部品5の4つの角部に沿って設けられている。これにより、実装部品5の角部で発生する応力を更に抑制することができる。また、実装部品5の実装時にL字型のスリット8が目印になるため、実装部品5の位置ズレを抑制することができる。その他の構成及び効果は実施の形態1と同様である。
図5は本発明の実施の形態4に係る半導体装置の主要部を拡大した平面図である。本実施の形態では、直線状スリット8が実装部品5の4つの辺に沿って設けられている。これにより、実装部品5の辺で発生する応力を抑制することができる。その他の構成及び効果は実施の形態1と同様である。
図6は本発明の実施の形態5に係る半導体装置の主要部を拡大した平面図である。本実施の形態では、L字型スリット8が実装部品5の4つの角部に沿って設けられ、かつ、直線状スリット8が実装部品5の4つの辺に沿って設けられている。これにより、実施の形態3,4の両方の効果を得ることができる。その他の構成及び効果は実施の形態1と同様である。
図7は本発明の実施の形態6に係る半導体装置の主要部を拡大した平面図である。本実施の形態ではスリット8が実装部品5の周りを囲んでいる。これにより、実装部品5の周り全体で発生する応力を抑制することができる。その他の構成及び効果は実施の形態1と同様である。
図8は本発明の実施の形態7に係る半導体装置の主要部を拡大した平面図である。本実施の形態ではスリットとして実装部品5の周りを囲む複数のディンプル9が設けられている。これにより、実装部品5の周りで発生する応力を均一に抑制することができる。また、実施の形態6に比べて放熱性が高い。その他の構成及び効果は実施の形態1と同様である。
図9は本発明の実施の形態8に係る半導体装置の主要部を拡大した平面図である。本実施の形態ではスリット8は互いに離間した2つの実装部品5の間の一部に設けられている。これにより、隣り合う2つの実装部品5間の導通を維持しつつ、両者の間で発生する応力を抑制することができる。その他の構成及び効果は実施の形態1と同様である。
図10は本発明の実施の形態9に係る半導体装置の主要部を拡大した平面図である。本実施の形態ではスリット8が楕円形である。これによりスリット8の開口面積を大きく確保できるため、応力の抑制効果が大きくなる。また、直線型スリット比べ放熱経路を大きく取れるため、放熱性も良い。その他の構成及び効果は実施の形態1と同様である。
Claims (5)
- 絶縁樹脂と、前記絶縁樹脂上に設けられた金属パターンとを有する基板と、
前記金属パターン上に実装された実装部品と、
前記金属パターン及び前記実装部品を封止するエポキシ樹脂とを備え、
前記実装部品の周辺において前記金属パターンにスリットが設けられ、
前記スリットにおいて前記金属パターンから露出した前記絶縁樹脂と前記エポキシ樹脂とが密着し、
前記スリットは、前記実装部品の角部に沿って設けられたL字型スリットを有することを特徴とする半導体装置。 - 前記スリットは、前記実装部品の辺に沿って設けられた直線状スリットを更に有することを特徴とする請求項1に記載の半導体装置。
- 前記実装部品と前記スリットの間隔は5mm以下であることを特徴とする請求項1又は2に記載の半導体装置。
- 前記スリットの幅は前記金属パターンの厚み以上であることを特徴とする請求項1〜3の何れか1項に記載の半導体装置。
- 前記実装部品はワイドバンドギャップ半導体によって形成されていることを特徴とする請求項1〜4の何れか1項に記載の半導体装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014184186A JP6252412B2 (ja) | 2014-09-10 | 2014-09-10 | 半導体装置 |
US14/728,167 US9355999B2 (en) | 2014-09-10 | 2015-06-02 | Semiconductor device |
DE102015215132.8A DE102015215132B4 (de) | 2014-09-10 | 2015-08-07 | Halbleitervorrichtung |
CN201510574471.8A CN105405814B (zh) | 2014-09-10 | 2015-09-10 | 半导体装置 |
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JP6727427B2 (ja) * | 2017-05-10 | 2020-07-22 | 三菱電機株式会社 | 半導体装置、及び、その製造方法、並びに、電力変換装置、及び、移動体 |
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TW368745B (en) * | 1994-08-15 | 1999-09-01 | Citizen Watch Co Ltd | Semiconductor device with IC chip highly secured |
JP2001189401A (ja) * | 1999-12-28 | 2001-07-10 | Hitachi Ltd | 配線基板及び半導体装置 |
US7034382B2 (en) | 2001-04-16 | 2006-04-25 | M/A-Com, Inc. | Leadframe-based chip scale package |
JP2005340647A (ja) * | 2004-05-28 | 2005-12-08 | Nec Compound Semiconductor Devices Ltd | インターポーザ基板、半導体パッケージ及び半導体装置並びにそれらの製造方法 |
JP4672290B2 (ja) * | 2004-06-16 | 2011-04-20 | 富士通株式会社 | 回路基板、パッケージ基板の製造方法及びパッケージ基板 |
JP4319591B2 (ja) | 2004-07-15 | 2009-08-26 | 株式会社日立製作所 | 半導体パワーモジュール |
KR101391924B1 (ko) | 2007-01-05 | 2014-05-07 | 페어차일드코리아반도체 주식회사 | 반도체 패키지 |
JP5071405B2 (ja) * | 2009-02-13 | 2012-11-14 | 三菱電機株式会社 | 電力用半導体装置 |
DE102011078582A1 (de) | 2011-07-04 | 2013-01-10 | Robert Bosch Gmbh | Verfahren zum Herstellen von strukturierten Sinterschichten und Halbleiterbauelement mit strukturierter Sinterschicht |
CN104170075B (zh) * | 2012-03-15 | 2018-06-26 | 富士电机株式会社 | 半导体装置 |
US8884443B2 (en) * | 2012-07-05 | 2014-11-11 | Advanced Semiconductor Engineering, Inc. | Substrate for semiconductor package and process for manufacturing |
JP5812146B2 (ja) | 2014-04-14 | 2015-11-11 | 株式会社三洋物産 | 遊技機 |
DE112015000210T5 (de) * | 2014-05-30 | 2016-08-25 | Fuji Electric Co., Ltd. | Halbleitervorrichtung |
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US20160071821A1 (en) | 2016-03-10 |
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DE102015215132A1 (de) | 2016-03-10 |
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