CN105984081B - 树脂密封装置以及树脂密封方法 - Google Patents
树脂密封装置以及树脂密封方法 Download PDFInfo
- Publication number
- CN105984081B CN105984081B CN201610165773.4A CN201610165773A CN105984081B CN 105984081 B CN105984081 B CN 105984081B CN 201610165773 A CN201610165773 A CN 201610165773A CN 105984081 B CN105984081 B CN 105984081B
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- resin
- sealing
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- floor members
- die
- Prior art date
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- 229920005989 resin Polymers 0.000 title claims abstract description 425
- 239000011347 resin Substances 0.000 title claims abstract description 425
- 238000007789 sealing Methods 0.000 title claims abstract description 316
- 238000000034 method Methods 0.000 title claims abstract description 115
- 239000000758 substrate Substances 0.000 claims abstract description 78
- 239000007788 liquid Substances 0.000 claims abstract description 63
- 230000007246 mechanism Effects 0.000 claims description 108
- 230000008569 process Effects 0.000 claims description 68
- 238000007493 shaping process Methods 0.000 claims description 41
- 238000000465 moulding Methods 0.000 claims description 38
- 230000002093 peripheral effect Effects 0.000 claims description 36
- 230000007423 decrease Effects 0.000 claims description 24
- 230000000630 rising effect Effects 0.000 claims description 8
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 description 46
- 239000013256 coordination polymer Substances 0.000 description 27
- 241000283216 Phocidae Species 0.000 description 15
- 150000002148 esters Chemical class 0.000 description 14
- 230000009471 action Effects 0.000 description 12
- 238000005520 cutting process Methods 0.000 description 9
- 239000004065 semiconductor Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 230000036544 posture Effects 0.000 description 3
- 238000013459 approach Methods 0.000 description 2
- 238000000748 compression moulding Methods 0.000 description 2
- 230000006837 decompression Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000008676 import Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 230000008450 motivation Effects 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/2602—Mould construction elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/56—Compression moulding under special conditions, e.g. vacuum
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
- B29C2043/181—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
- B29C2043/181—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated
- B29C2043/182—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated completely
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/56—Compression moulding under special conditions, e.g. vacuum
- B29C2043/561—Compression moulding under special conditions, e.g. vacuum under vacuum conditions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/56—Compression moulding under special conditions, e.g. vacuum
- B29C2043/565—Compression moulding under special conditions, e.g. vacuum in a clean sterile environment, e.g. to avoid contamination
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/44—Moulds or cores; Details thereof or accessories therefor with means for, or specially constructed to facilitate, the removal of articles, e.g. of undercut articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
- B29C43/361—Moulds for making articles of definite length, i.e. discrete articles with pressing members independently movable of the parts for opening or closing the mould, e.g. movable pistons
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/50—Removing moulded articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3406—Components, e.g. resistors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3425—Printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015-059711 | 2015-03-23 | ||
JP2015059711A JP6491508B2 (ja) | 2015-03-23 | 2015-03-23 | 樹脂封止装置及び樹脂成形品の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105984081A CN105984081A (zh) | 2016-10-05 |
CN105984081B true CN105984081B (zh) | 2018-10-09 |
Family
ID=55696934
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610165773.4A Active CN105984081B (zh) | 2015-03-23 | 2016-03-22 | 树脂密封装置以及树脂密封方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US10170346B2 (fr) |
EP (1) | EP3072660B1 (fr) |
JP (1) | JP6491508B2 (fr) |
KR (1) | KR101832597B1 (fr) |
CN (1) | CN105984081B (fr) |
TW (1) | TWI645520B (fr) |
Families Citing this family (24)
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JP6785690B2 (ja) * | 2017-03-07 | 2020-11-18 | Towa株式会社 | 樹脂封止装置、樹脂成形方法および樹脂成形品の製造方法 |
DE102017109676A1 (de) | 2017-05-05 | 2018-11-08 | Atm Gmbh | Einbettpresse und Verschlusseinrichtung für eine Einbettpresse |
CN107038965A (zh) * | 2017-05-05 | 2017-08-11 | 深圳浩翔光电技术有限公司 | Led显示装置、成型模组、及其生产工艺 |
DE102017109677A1 (de) * | 2017-05-05 | 2018-11-08 | Atm Gmbh | Einbettpresse, Absaugeinrichtung für eine Einbettpresse und modulares Einbettpressensystem |
JP6886341B2 (ja) * | 2017-05-10 | 2021-06-16 | Towa株式会社 | 樹脂成形用成形型、樹脂成形装置、樹脂成形用成形型調整方法、及び樹脂成形品製造方法 |
JP6482616B2 (ja) * | 2017-08-21 | 2019-03-13 | Towa株式会社 | 樹脂成形装置及び樹脂成形品製造方法 |
TWI787417B (zh) * | 2018-02-09 | 2022-12-21 | 日商山田尖端科技股份有限公司 | 壓縮成形用模具及壓縮成形裝置 |
JP7060390B2 (ja) * | 2018-02-09 | 2022-04-26 | アピックヤマダ株式会社 | 圧縮成形用金型及び圧縮成形装置 |
KR102337659B1 (ko) * | 2018-02-21 | 2021-12-09 | 삼성전자주식회사 | 금형 검사 장치 및 금형 검사 방법 |
CN108673798B (zh) * | 2018-05-10 | 2023-06-23 | 长垣方元橡塑有限公司 | 一种自动滑板式防水栓脱模装置 |
TWI769288B (zh) * | 2018-08-08 | 2022-07-01 | 揚明光學股份有限公司 | 射出成型模具及製造高分子材料元件的方法 |
JP6837530B1 (ja) * | 2019-10-17 | 2021-03-03 | Towa株式会社 | 樹脂成形方法及び樹脂成形装置 |
USD956833S1 (en) * | 2019-10-31 | 2022-07-05 | Towa Corporation | Plunger unit |
JP2021088086A (ja) * | 2019-12-03 | 2021-06-10 | Nissha株式会社 | 回路付き2色成形用金型装置および回路付き2色成形品 |
JP7360368B2 (ja) * | 2020-08-18 | 2023-10-12 | Towa株式会社 | 樹脂成形装置及び樹脂成形品の製造方法 |
JP7530769B2 (ja) * | 2020-08-25 | 2024-08-08 | Towa株式会社 | 樹脂成形装置及び樹脂成形品の製造方法 |
JP7444453B2 (ja) * | 2020-11-25 | 2024-03-06 | アピックヤマダ株式会社 | 樹脂封止装置及び樹脂封止方法 |
JP7360407B2 (ja) * | 2021-02-10 | 2023-10-12 | Towa株式会社 | 樹脂成形装置及び樹脂成形品の製造方法 |
JP7118204B1 (ja) * | 2021-04-12 | 2022-08-15 | 三菱電機株式会社 | 半導体装置 |
CN114571664B (zh) * | 2022-02-28 | 2024-01-16 | 广东风华芯电科技股份有限公司 | 一种用于半导体芯片封装的去溢料装置及其方法 |
JP2024013299A (ja) * | 2022-07-20 | 2024-02-01 | Towa株式会社 | 樹脂成形装置、及び樹脂成形品の製造方法 |
CN115064470B (zh) * | 2022-07-28 | 2022-11-08 | 合肥富芯元半导体有限公司 | 一种半导体晶体管的封装结构及其封装方法 |
CN116978796B (zh) * | 2023-09-25 | 2023-12-15 | 深圳德芯微电技术有限公司 | 一种半导体芯片的封装结构及其封装方法 |
CN117698024B (zh) * | 2023-12-18 | 2024-06-25 | 青岛环球输送带有限公司 | 一种节能式橡胶硫化机 |
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JPH085099B2 (ja) * | 1992-05-19 | 1996-01-24 | 株式会社リコー | 射出成形品 |
MY114536A (en) | 1994-11-24 | 2002-11-30 | Apic Yamada Corp | A resin molding machine and a method of resin molding |
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TW555636B (en) | 2001-11-26 | 2003-10-01 | Sumitomo Heavy Industries | A molding method of a resin molded article by a mold apparatus, the mold apparatus, the resin molded article, and a molding machine having the mold apparatus |
JP3677763B2 (ja) * | 2001-12-04 | 2005-08-03 | 株式会社サイネックス | 半導体装置製造用金型 |
JP4373237B2 (ja) * | 2004-02-13 | 2009-11-25 | Towa株式会社 | 半導体チップの樹脂封止成形方法および樹脂封止成形用金型 |
JP2007005675A (ja) * | 2005-06-27 | 2007-01-11 | Apic Yamada Corp | 樹脂封止金型および半導体装置 |
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US20130069223A1 (en) * | 2011-09-16 | 2013-03-21 | Hui-Chang Chen | Flash memory card without a substrate and its fabrication method |
JP5627619B2 (ja) * | 2012-02-28 | 2014-11-19 | Towa株式会社 | 樹脂封止装置及び樹脂封止体の製造方法 |
JP2013184413A (ja) * | 2012-03-08 | 2013-09-19 | Sumitomo Heavy Ind Ltd | 樹脂封止装置及び樹脂封止方法 |
JP5774545B2 (ja) * | 2012-05-29 | 2015-09-09 | Towa株式会社 | 樹脂封止成形装置 |
NL2010379C2 (nl) * | 2013-03-01 | 2014-09-03 | Besi Netherlands B V | Mal, drager met te omhullen elektronische componenten, drager met omhulde elektronische componenten, gesepareerd omhulde elektronisch component en werkwijze voor het omhullen van elektronische componenten. |
JP5934138B2 (ja) * | 2013-04-12 | 2016-06-15 | Towa株式会社 | 電子部品の圧縮樹脂封止方法及び圧縮樹脂封止装置 |
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JP6491508B2 (ja) | 2019-03-27 |
TW201707162A (zh) | 2017-02-16 |
EP3072660A1 (fr) | 2016-09-28 |
JP2016181548A (ja) | 2016-10-13 |
KR101832597B1 (ko) | 2018-02-26 |
CN105984081A (zh) | 2016-10-05 |
EP3072660B1 (fr) | 2020-11-04 |
KR20160113973A (ko) | 2016-10-04 |
US10170346B2 (en) | 2019-01-01 |
TWI645520B (zh) | 2018-12-21 |
US20160284576A1 (en) | 2016-09-29 |
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