CN105984081B - 树脂密封装置以及树脂密封方法 - Google Patents

树脂密封装置以及树脂密封方法 Download PDF

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Publication number
CN105984081B
CN105984081B CN201610165773.4A CN201610165773A CN105984081B CN 105984081 B CN105984081 B CN 105984081B CN 201610165773 A CN201610165773 A CN 201610165773A CN 105984081 B CN105984081 B CN 105984081B
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resin
sealing
members
floor members
die
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Chinese (zh)
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CN105984081A (zh
Inventor
大西洋平
高丈明
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Towa Corp
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Towa Corp
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/26Moulds
    • B29C45/2602Mould construction elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67126Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00Moulds or cores; Details thereof or accessories therefor
    • B29C33/42Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/021Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32Component parts, details or accessories; Auxiliary operations
    • B29C43/56Compression moulding under special conditions, e.g. vacuum
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565Moulds
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B29C2043/181Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B29C2043/181Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated
    • B29C2043/182Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated completely
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32Component parts, details or accessories; Auxiliary operations
    • B29C43/56Compression moulding under special conditions, e.g. vacuum
    • B29C2043/561Compression moulding under special conditions, e.g. vacuum under vacuum conditions
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32Component parts, details or accessories; Auxiliary operations
    • B29C43/56Compression moulding under special conditions, e.g. vacuum
    • B29C2043/565Compression moulding under special conditions, e.g. vacuum in a clean sterile environment, e.g. to avoid contamination
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00Moulds or cores; Details thereof or accessories therefor
    • B29C33/44Moulds or cores; Details thereof or accessories therefor with means for, or specially constructed to facilitate, the removal of articles, e.g. of undercut articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32Component parts, details or accessories; Auxiliary operations
    • B29C43/36Moulds for making articles of definite length, i.e. discrete articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32Component parts, details or accessories; Auxiliary operations
    • B29C43/36Moulds for making articles of definite length, i.e. discrete articles
    • B29C43/361Moulds for making articles of definite length, i.e. discrete articles with pressing members independently movable of the parts for opening or closing the mould, e.g. movable pistons
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32Component parts, details or accessories; Auxiliary operations
    • B29C43/50Removing moulded articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29LINDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00Other particular articles
    • B29L2031/34Electrical apparatus, e.g. sparking plugs or parts thereof
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29LINDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00Other particular articles
    • B29L2031/34Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3406Components, e.g. resistors
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29LINDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00Other particular articles
    • B29L2031/34Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3425Printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
CN201610165773.4A 2015-03-23 2016-03-22 树脂密封装置以及树脂密封方法 Active CN105984081B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015-059711 2015-03-23
JP2015059711A JP6491508B2 (ja) 2015-03-23 2015-03-23 樹脂封止装置及び樹脂成形品の製造方法

Publications (2)

Publication Number Publication Date
CN105984081A CN105984081A (zh) 2016-10-05
CN105984081B true CN105984081B (zh) 2018-10-09

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Country Status (6)

Country Link
US (1) US10170346B2 (fr)
EP (1) EP3072660B1 (fr)
JP (1) JP6491508B2 (fr)
KR (1) KR101832597B1 (fr)
CN (1) CN105984081B (fr)
TW (1) TWI645520B (fr)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6785690B2 (ja) * 2017-03-07 2020-11-18 Towa株式会社 樹脂封止装置、樹脂成形方法および樹脂成形品の製造方法
DE102017109676A1 (de) 2017-05-05 2018-11-08 Atm Gmbh Einbettpresse und Verschlusseinrichtung für eine Einbettpresse
CN107038965A (zh) * 2017-05-05 2017-08-11 深圳浩翔光电技术有限公司 Led显示装置、成型模组、及其生产工艺
DE102017109677A1 (de) * 2017-05-05 2018-11-08 Atm Gmbh Einbettpresse, Absaugeinrichtung für eine Einbettpresse und modulares Einbettpressensystem
JP6886341B2 (ja) * 2017-05-10 2021-06-16 Towa株式会社 樹脂成形用成形型、樹脂成形装置、樹脂成形用成形型調整方法、及び樹脂成形品製造方法
JP6482616B2 (ja) * 2017-08-21 2019-03-13 Towa株式会社 樹脂成形装置及び樹脂成形品製造方法
TWI787417B (zh) * 2018-02-09 2022-12-21 日商山田尖端科技股份有限公司 壓縮成形用模具及壓縮成形裝置
JP7060390B2 (ja) * 2018-02-09 2022-04-26 アピックヤマダ株式会社 圧縮成形用金型及び圧縮成形装置
KR102337659B1 (ko) * 2018-02-21 2021-12-09 삼성전자주식회사 금형 검사 장치 및 금형 검사 방법
CN108673798B (zh) * 2018-05-10 2023-06-23 长垣方元橡塑有限公司 一种自动滑板式防水栓脱模装置
TWI769288B (zh) * 2018-08-08 2022-07-01 揚明光學股份有限公司 射出成型模具及製造高分子材料元件的方法
JP6837530B1 (ja) * 2019-10-17 2021-03-03 Towa株式会社 樹脂成形方法及び樹脂成形装置
USD956833S1 (en) * 2019-10-31 2022-07-05 Towa Corporation Plunger unit
JP2021088086A (ja) * 2019-12-03 2021-06-10 Nissha株式会社 回路付き2色成形用金型装置および回路付き2色成形品
JP7360368B2 (ja) * 2020-08-18 2023-10-12 Towa株式会社 樹脂成形装置及び樹脂成形品の製造方法
JP7530769B2 (ja) * 2020-08-25 2024-08-08 Towa株式会社 樹脂成形装置及び樹脂成形品の製造方法
JP7444453B2 (ja) * 2020-11-25 2024-03-06 アピックヤマダ株式会社 樹脂封止装置及び樹脂封止方法
JP7360407B2 (ja) * 2021-02-10 2023-10-12 Towa株式会社 樹脂成形装置及び樹脂成形品の製造方法
JP7118204B1 (ja) * 2021-04-12 2022-08-15 三菱電機株式会社 半導体装置
CN114571664B (zh) * 2022-02-28 2024-01-16 广东风华芯电科技股份有限公司 一种用于半导体芯片封装的去溢料装置及其方法
JP2024013299A (ja) * 2022-07-20 2024-02-01 Towa株式会社 樹脂成形装置、及び樹脂成形品の製造方法
CN115064470B (zh) * 2022-07-28 2022-11-08 合肥富芯元半导体有限公司 一种半导体晶体管的封装结构及其封装方法
CN116978796B (zh) * 2023-09-25 2023-12-15 深圳德芯微电技术有限公司 一种半导体芯片的封装结构及其封装方法
CN117698024B (zh) * 2023-12-18 2024-06-25 青岛环球输送带有限公司 一种节能式橡胶硫化机

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4778641A (en) * 1986-08-11 1988-10-18 National Semiconductor Corporation Method of molding a pin grid array package
JPH085099B2 (ja) * 1992-05-19 1996-01-24 株式会社リコー 射出成形品
MY114536A (en) 1994-11-24 2002-11-30 Apic Yamada Corp A resin molding machine and a method of resin molding
JP3214789B2 (ja) 1994-11-24 2001-10-02 アピックヤマダ株式会社 樹脂モールド装置及び樹脂モールド方法
TW555636B (en) 2001-11-26 2003-10-01 Sumitomo Heavy Industries A molding method of a resin molded article by a mold apparatus, the mold apparatus, the resin molded article, and a molding machine having the mold apparatus
JP3677763B2 (ja) * 2001-12-04 2005-08-03 株式会社サイネックス 半導体装置製造用金型
JP4373237B2 (ja) * 2004-02-13 2009-11-25 Towa株式会社 半導体チップの樹脂封止成形方法および樹脂封止成形用金型
JP2007005675A (ja) * 2005-06-27 2007-01-11 Apic Yamada Corp 樹脂封止金型および半導体装置
TWI359069B (en) * 2004-11-02 2012-03-01 Apic Yamada Corp Resin molding equipment and resin molding method
JP4953619B2 (ja) * 2005-11-04 2012-06-13 Towa株式会社 電子部品の樹脂封止成形装置
JP4791851B2 (ja) * 2006-02-24 2011-10-12 Towa株式会社 電子部品の樹脂封止成形装置
JP2007251094A (ja) * 2006-03-20 2007-09-27 Towa Corp 半導体チップの樹脂封止成形装置
TW200901341A (en) * 2007-05-29 2009-01-01 Towa Corp Compression molding method and device for electronic component
JP5174874B2 (ja) * 2010-09-16 2013-04-03 Towa株式会社 圧縮成形型及び圧縮成形方法
JP5229292B2 (ja) * 2010-10-01 2013-07-03 第一精工株式会社 樹脂封止装置および樹脂封止方法
JP5663785B2 (ja) * 2010-12-17 2015-02-04 アピックヤマダ株式会社 樹脂モールド方法及び樹脂モールド装置
US20130069223A1 (en) * 2011-09-16 2013-03-21 Hui-Chang Chen Flash memory card without a substrate and its fabrication method
JP5627619B2 (ja) * 2012-02-28 2014-11-19 Towa株式会社 樹脂封止装置及び樹脂封止体の製造方法
JP2013184413A (ja) * 2012-03-08 2013-09-19 Sumitomo Heavy Ind Ltd 樹脂封止装置及び樹脂封止方法
JP5774545B2 (ja) * 2012-05-29 2015-09-09 Towa株式会社 樹脂封止成形装置
NL2010379C2 (nl) * 2013-03-01 2014-09-03 Besi Netherlands B V Mal, drager met te omhullen elektronische componenten, drager met omhulde elektronische componenten, gesepareerd omhulde elektronisch component en werkwijze voor het omhullen van elektronische componenten.
JP5934138B2 (ja) * 2013-04-12 2016-06-15 Towa株式会社 電子部品の圧縮樹脂封止方法及び圧縮樹脂封止装置

Also Published As

Publication number Publication date
JP6491508B2 (ja) 2019-03-27
TW201707162A (zh) 2017-02-16
EP3072660A1 (fr) 2016-09-28
JP2016181548A (ja) 2016-10-13
KR101832597B1 (ko) 2018-02-26
CN105984081A (zh) 2016-10-05
EP3072660B1 (fr) 2020-11-04
KR20160113973A (ko) 2016-10-04
US10170346B2 (en) 2019-01-01
TWI645520B (zh) 2018-12-21
US20160284576A1 (en) 2016-09-29

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