TW200901341A - Compression molding method and device for electronic component - Google Patents

Compression molding method and device for electronic component Download PDF

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Publication number
TW200901341A
TW200901341A TW097116617A TW97116617A TW200901341A TW 200901341 A TW200901341 A TW 200901341A TW 097116617 A TW097116617 A TW 097116617A TW 97116617 A TW97116617 A TW 97116617A TW 200901341 A TW200901341 A TW 200901341A
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TW
Taiwan
Prior art keywords
hole
mold
resin
electronic component
compression molding
Prior art date
Application number
TW097116617A
Other languages
Chinese (zh)
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TWI376753B (en
Inventor
Shinji Takase
Takashi Tamura
Takeaki Taka
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Towa Corp
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Priority claimed from JP2007141640A external-priority patent/JP2008296382A/en
Priority claimed from JP2008038892A external-priority patent/JP5128309B2/en
Application filed by Towa Corp filed Critical Towa Corp
Publication of TW200901341A publication Critical patent/TW200901341A/en
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Publication of TWI376753B publication Critical patent/TWI376753B/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B29C2043/181—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

The present invention provides a compression molding method and a compression molding device for an electronic component. The method comprises the steps of closing molds firstly and soaking the electronic component in the resin material inside a downside mold cavity; then using a first inner pressing mechanism set inside a partitioned cavity side face component to press the cavity side face component by necessary pressing force toward an cavity bottom face component; and under the above condition, encapsulation forming the electronic component within the formed resin body. Through the above method, the generation of foreign bodies at the gap between the cavity bottom face component and the cavity side face component or a rugged slide of the cavity bottom face component is avoided.

Description

200901341 九、發明說明： 【明屬^】 發明領域 本發明係有關於一種電子零件之壓縮成形方法及該方 5 法所用之壓縮成形裝置，其係在壓縮成形用之孔内對已安 裝於基板之IC (Integrated Circuit:積體電路）進行壓縮成 形者。 I：先前技術】 發明背景 以往是利用脫模膜之電子零件之壓縮成形裝置（例如 包含具上下兩模具之模具的裝置）而藉壓縮鑄模法，將已 女裝於基板之電子零件在壓縮成形用孔内加以壓縮成形來 進行樹脂填封。該方法係如下進行。 15 20 首先，於上下兩模具間架設脫模膜，並使下模具面及 上模具孔的内面吸著覆蓋脫模膜。接著，對覆蓋了脫模膜 之下板具孔内供給樹脂材料，同_上模具之基板設置部 供給設置已安裝電子零件之基板。 寺覆凰了脫杈膜之下模具孔内的樹脂材料會被加 熱並融化。㈣，將上下兩模具合模來將電子零件浸潰於 下模具孔内已融化之樹脂材射，同時將已加熱融化之下 模具孔内的樹脂材料朝孔底面構件加壓，藉此對下模具孔 内之樹脂施加必要樹脂壓。 ^過硬化必要之預定時間後，將上下兩模具開模，藉 此可在下模具孔内’於其形狀已壓縮成形為與下模具孔之 5 200901341 形狀對應的樹脂成形體内，對已安裝於基板之電子零件進 行樹脂填封。由於該方法所用之模具是在僅設於下模具之 孔内壓縮成形，因此稱為「使用脫模模之單面鑄模」。記裁 前述習知使用脫模膜之單面鑄模的先前文獻有例如特開 5 2002 —43345 號公報。 惟’使用前述脫模膜來麼縮成形時，使用完的脫模膜 會成為產業廢棄物而產生龐大的處理費用，因此產品原價 會提高。又，為了對模具供給脫模膜，需要模處理器或模 按壓用之中間板等。故，模具之販賣價格會提高，最後以 10該模具生產之產品價格也會提高。為了控制前述產品之原 價提高，乃檢討不使用脫模膜之壓縮成形（請參考例如特 開2003 — 127162號公報）。 以第10A圖說明前述不使用脫模膜之壓縮成形方法如 下。模具在合模時，首先，於設於未覆蓋脫模膜之下模具 15 ι〇1的壓縮成形用孔102内，將電子零件浸潰於已加熱融化 之樹脂材料中。在該狀態下，以孔底面構件103加壓孔102 内之樹脂，藉此將已安裝於基板之電子零件樹脂填封於經 壓縮成形之樹脂成形體内。 在前述不使用脫模膜之壓縮成形時，設於下模具ι〇ι 20之孔（凹部）1〇1是由樹脂按壓用之孔底面構件103、與以 包圍孔底面構件103周圍之狀態設置之孔周圍構件（前壓 塊）104構成。重複前述模具之壓縮成形後，通常，會因孔 底面構件10 3之滑動面或孔側面構件丨〇 4之滑動面的磨損 等，使孔底面構件103與孔側面構件1〇4兩者間（滑動部） 200901341 容易產生間隙105。 故’如第10B圖所示，當下模具孔1〇2内沒有覆蓋脫模 膜時’孔底面構件103與孔周圍構件1〇4之間（滑動部）容 易產生間隙105。因此，經加熱融化之樹脂材料會滲入該間 5隙105並硬化，而使該間隙（滑動部）容易形成樹脂渣等異 物 106 〇 即’形成於該間隙105 (滑動部）之異物1〇6會使孔底 面構件103產生滑動不良，因此無法以孔底面構件1〇3有效 地加壓下模具孔102内之樹脂。 10 換έ之，習知所檢討之不使用脫模膜之壓縮成形方法 中，很難防止孔底面構件1〇3與孔周圍構件1〇4間所形成之 間隙105形成異物，而有無法有效地以孔底面構件⑽加壓 孔102内之樹脂的弊處。 又，如上所述，為除去形成於孔底面構件103與孔周圍 15構件104之間隙105的異物1〇6,必須定期分解模具1〇1來進 行清潔。故，有生產產品之時間損失大而造成成品率降低 之問題。 _ 【發明内容瀰 發明概要 20 祕決上述習知之問題點，本發明之目的在於，抑制 孔底面構件與孔周圍構件之間隙内產生異物，藉此防止孔 底面構件之滑動不良’而以孔底面構件有效地加壓孔 樹脂。 又，本發明之目的在於，藉不使用脫模膜之構成、或 7 200901341 藉以孔底面構件有效地加壓孔⑽狀構成來提高產品之 成品率。 5 10 15 為達成上述目的，本發明之電子零件之壓縮成形方法 包3有.ax置步驟，係將已安裝電子零件之基板供給設 置於C縮成开)用模具之基板設置部；供給步驟，係將樹脂 材料供給至模具之模具孔内；融化步驟，係將已供給至模 具孔内之树脂材料加熱並使其融化；浸潰步驟，係將模具 ，抵’藉此將電子零件浸潰於模具孔内已融化之樹脂；及， 壓縮成形步驟’係在已將電子料浸潰於已融化之樹脂的 〜、下利用t成模具孔之底面的孔底面構件來加壓模具 孔内之樹脂，而對模具孔内之樹脂施加必要樹脂壓，藉此 在扠具孔内將電子零件封裝於與模具孔之形狀對應的樹脂 成形體内，構成模具孔之側面的構件係使用與孔底面構件 之各邊對應地分割之孔側面構件；壓縮成形步驟中，利用 孔底面構件對模具孔内之樹脂施加必要樹脂壓時，係將經 分割之孔侧面構件分別按壓至孔底面構件。本發明之特徵 在於’構成模具孔側面之構件係使用對應孔底面構件之各 邊而分割之孔側面構件’於壓縮成形步驟中，以孔底面構 件對模具孔内之樹脂施加必要樹脂壓時，將經分割之孔側 面構件分別按壓至孔底面構件。 本發明其中一形態，係利用設於經分割之孔側面構件 的各内部或外部之按壓裝置，將孔側面構件按壓至前述孔 底面構件。 又，本發明之較佳實施形態中，經分割之孔側面構件 20 200901341 分別具有設置成可拆裝之小片構件，且該小片構件至少包 3與孔底面構件間之滑動面，又，湘孔底面構件對模具 孔内之树月曰施加必要樹脂壓時，係將小片構件之滑動面按 壓至孔底面構件。 5 纟發明巾’於利祕絲構件對模具孔内之樹脂施加 ' ’必要㈣日壓％ ’可對小片構件壓送壓縮空氣，藉此將小片 構件按壓至前述孔底面構件。 本發明之電子零件之壓縮成形裝置包含有：上模具； 下模具，係與上模具相對向地配置；基板設置部，係設於 1〇上模具，並供給已安裝電子零件之基板者；模具孔，係設 於下模具’而作為壓縮成形用者；孔底面構件，係形成模 具孔之底面者；孔側面構件，係形成模具孔之側面，旅分 別與孔底面構件之各邊對應地分割而設置者；及，按壓裝 置’係將經分割之孔側面構件分別按壓至孔底面構件者。 15 本發明其中一實施形態中，按壓裝置由設於經分割之 孔側面構件的内部或外部之按壓機構所構成。 又’本發明中，可於經分割之孔侧面構件分別以讦拆 裝之方式設置至少包含與孔底面構件間之滑動面的小片構 件’且按壓裝置包含一將小片構件按壓至孔底面構件之裝 • 20 置。 本發明之較佳實施形態中，經分割之孔側面構件分別 具有：孔側面構件本體，係使小片構件滑動者；壓送路樣’ 係設於孔側面構件本體，並具有用以對孔側面構件本體與 小片構件間形成之間隙壓送壓縮空氣的開口部；及，密対 9 200901341 構件，係包圍開口部且使間隙呈外氣阻隔狀態者；又，按 壓裝置包含空氣壓送機構，該空氣壓送機構係透過壓送路 &對間隙内之密封構件所包圍之空間部壓送空氣者。 藉具有上述步驟或構成之本發明，可防止因孔底面構 5件與經分割之孔側面構件間之間隙所產生之異物而造成孔 底面構件之滑動不良，藉此有效地以孔底面構件加壓孔内 之樹脂。 又，藉本發明，可在不使用脫模膜之情形下，有效地 以孔底面構件加壓孔内之樹脂，而可提高產品之成品率。 本毛明之上述及其它目的、特徵、局面與優點應可由 附加圖式及與本發明相關之町細說明可清楚理解。 圖式簡單說明 15 20 “第1A圖及第1]6圖係概略顯示本發明第一實施形態之 =零件之_成形用模具（電子零件之樹脂填封成形用 電子的概略縱剖面圖，第1A®係本發明第-實施形態之 二零件之壓縮成形用模具的開模狀態之概略縱剖面圖， 略顯之合模狀態的概略縱剖面圖，第1C圖係概 卜 A圖所示之下模具模面的概略平面圖。 第2A圖係擴大地概略顯示 擴大概略剖面s s _所不之杈具要部的 狀態，第、員不以孔底面構件加壓孔内之樹脂前的 _、擴大地概略顯示第 擴大概略剖面圖3 心扠具要部的 ㈣。 Q’顯示以孔底面構件域了孔内之樹脂的 第 3A®[ 第3B圖係擴大地概略顯示本發明第—實施开^ 200901341 悲其中一變形例之電子零件之壓縮成形用模具要部的擴大 概略剖面圖，第3A圖顯示以孔底面構件加壓孔内之樹脂前 的狀態，而第3B圖則顯不以孔底面構件加壓了孔内之樹脂 的狀態。 第4A圖、第4B圖係擴大地概略顯示本發明第一實施形 態另一變形例之電子零件之壓縮成形用模具要部的擴大概 略剖面圖’第4A圖顯示以孔底面構件加壓孔内之樹脂前的 狀態，而第4B圖則顯示以孔底面構件加壓了孔内之樹脂的 狀態。 10 第5A圖係概略顯示本發明第二實施形態之電子零件之 壓縮成形用模具的開模狀態之概略縱剖面圖，第5B圖係概 略顯示第5A®所示之下模具模面的概略平面圖，而第測 則係擴大地概略顯tf第5 A圖所示之模具要部的擴大概略縱 杳|J面圖。 15 第6A圖係概略顯示本發明第三實施形態之電子零件之 歷縮成开> 用模具的開模狀態之概略縱剖面圖，第圖及第 6C圖係擴大地概略顯示第6A圖所示之模具要部的擴大概 略縱剖面圖，第6B圖顯示以孔底面構件加屢孔内之樹脂前 的狀態，而第6C圖則顯示以孔底面構件加壓了孔内之樹脂 2〇的狀態。 第7 A圖係擴大地概略顯示本發明第四實施形態之電子 零件之壓縮成形用模具要部的擴大概略縱剖面圖，第7B· 係擴大地概略顯示第7A圖所示之模具要部的擴大概略圖 面圖，而第7C圖則係擴大地概略顯示本發 縱剖 月弟四實施形態 11 200901341 其中一變形例的電子零件之壓 略縱剖面圖。 縮成形用模具要部的擴大概 第8A圖係概略顯示本發明第五實施形態之電子零件之 壓縮成I用模具（電子零件之樹脂填封成形用模具）的開 5模狀態之概略縱剖面圖，第8B係概略顯示第8A圖所示之下 模具模面的概略平面圖。 第9A圖係擴大地概略顯示第认圖所示之模具要部的 擴大概略縱剖面圖，顯示孔底面構件之位置，第9β圖係擴 大地概略顯示與第9A_示之模具對應之模具要部的擴大 H)概略縱剖面圖，顯示以孔底面構件對孔内之樹脂加壓之狀 態。 第10A圖係概略顯示習知電子零件之壓縮成形用模具 (上下兩模具）中，包含下模具孔之下模具面的概略平面 圖，第10B圖係擴大地概略顯示第丨〇A圖所示之下模具要部 15的擴大概略縱剖面圖，顯示下模具孔内之孔底面構件的滑 動不良狀態。 I：實施方式】 較佳實施形態之說明 本發明實施形態之電子零件之壓縮成形用模具設有固 20 定之上模具、可動之下模具、設於上模具之電子零件並供 給已安裝電子零件之基板的基板設置部、設於下模具而具 有矩形孔開口部的壓縮成形用之孔、構成該孔側面之孔周 圍構件及形成孔底面之孔底面構件。 又，孔周圍構件由分別與孔開口部（或孔底面）之各 12 200901341 广、‘。也刀Dj之孔側面構件構成。而，以孔周圍構件與孔 =構件形成孔部，並構造成孔底面構件可於設於孔周圍 口:之。滑動孔滑動。經分割之孔側面構件的數量是由孔開 (或孔底面）在俯視時之形狀來決^,當孔開口部（或 孔底面）在俯視時為矩形時，便對應該矩形之四邊，將孔 周圍構件分割為四個孔側面構件。 a又’為有效地防止孔側面構件與孔底面構件間之滑動 P產生間隙，以必要按壓力將孔侧面構件之滑動部按壓至 =底面構件之滑動部的按壓機構，係設於孔側面構件之内 或外(明參考第-實施形態所示之内部按壓機構，第 -、三實施形態所示之外部按壓機構及第五實施形態之空 氣壓送機構）。 使用上述構成之電子零件之壓縮成形用模具時，首 先，將已安裝電子零件之基板供給設置於上模具之基板設 15置部。在該狀態下，對下模具之孔内供給樹脂材料，並將 上下兩模具合模，藉此可將電子零件浸潰於下模具孔内已 加熱融化之樹脂中。 接著，使孔底面構件朝上方移動必要之移動距離，藉 此可對下模具孔内之樹脂施加必要樹脂壓。此時，使用上 20述按壓機構，在以必要按壓力將經分割之孔側面構件的滑 動面按壓至孔底面構件之滑動面的狀態下，可使孔底面構 件朝上方移動。而’孔底面構件之移動方向與按壓機構之 按壓方向係例如互相垂直。 經過硬化必要之時間後，將上下兩模具開模，藉此可 13 200901341 在下模具孔内將電子零件壓縮成形（樹脂填封成形）於與 孔形狀對應之樹脂成形體（產品）内。 如上所述，藉本發明，由於可使用上述按壓機構，在 以必要按壓力將經分割之孔側面構件的滑動面按壓至孔底 5面構件之滑動面的狀態下，使孔底面構件朝上方移動，因 此可有效地防止孔底面構件與孔側面構件間產生間隙。 故，可防止孔底面構件與設孔側面構件間之間隙產生 異物’因此可防止孔底面構件之滑動不良，有效地以孔底 面構件加壓孔内之樹脂。 10 再者，藉本發明，可利用不使用脫模膜之構成、或以 孔底面構件有效地加壓孔内樹脂之構成來有效地提高產品 之生產性。 而，經分割之各孔側面構件可採用設置小片構件之構 成’該小片構件至少包含與孔底面構件之滑動面^此時， 15藉設於各孔侧面構件之按壓機構，可以必要按壓力來將小 片構件按壓至孔底面構件。 以下，根據圖式說明本發明之具體實施形態。 〔第—實施形態〕 首先，詳細說明本發明之第一實施形態。第1A圖、第 20 1B圖及第冗圖顯示第一實施形態之電子零件之壓縮成形 用模具（電子零件之樹脂填封成形用模具），第2A圖及第2B 圖顯示該模具要部之第一内部按壓機構。又，第3A圖、第 3B圖顯示第二内部按壓機構，第4A圖、第4B圖顯示第三内 部按壓機構。 14 200901341 (關於第一實施形態之電子零件之壓縮成形用模具的 構成） 如第1A圖、第1B圖及第ic圖所示，電子零件之壓縮成 形用模具設有固定之上模具1與與該上模具1相對向配置之 5可動下模具2。上模具！之模面設有基板設置部5 ,基板設置 - 卩5係在使電子养件3朝下之狀態下，供給設置已安裝電子 零件3之基板者。 又，下模具2設有壓縮成形用之孔6，並設有對該孔6 内供給樹脂材料7 (例如顆粒狀樹脂材料）之樹脂材料供給 1〇機構8。該供給機構8構造成可由朝孔6上方開口之孔開口部 9對孔6内供給樹脂材料。在本實施形態中，如第⑴圖所示， 孔6在平錢視下為具有4個紅㈣，可為矩形以 外之形狀。 又，雖未圖示，模具（上下模具）i、2設有將模具i、 15 2加熱至必要模具溫度的加熱機構，以及將模具丨、2以必要 合模壓力合模之合模機構。x，下模具2之孔6設有夠成該 孔6之底面的孔底面構件1〇，以及構成該孔6之成為底面外 周圍之側面的孔周圍構件（前壓塊）。 再者，如第1C圖所示，孔周圍構件在平面觀視下，舉 -20例言之’在分別對應孔底面構件10之矩形底面的四個邊（或 矩形之孔開口部9的四個邊）的情形下，分割為4個孔側面 構件η。又’孔底面構件_設有基台12，分割為4個之孔 側面構件11與基台12間，分麟有壓縮彈簧等彈性構件13。 而，經分割之孔側面構件丨丨的滑動面與孔底面構件1〇 15 200901341 1〇的滑動面間會形成滑動部14。 本實施形態中，如第1A圖、第1B圖所示，首先，將已 安筆雷 一 $ 、電子零件3之基板4供給設置於上模具〗之基板設置部 5 在°亥狀態下，將樹脂材料7供給至下模具孔6内，並加熱 、融化。接著，將模具1、2合模，藉此使經分割之孔側 立構件（W壓塊）U之各前端面分別與上模具丨之基板設置 所设置之基板4表面抵接。在該狀態下，使孔底面構件 10朝上方移動，藉此可對在下模具孔6内加熱融化之樹脂材 料施加必要樹脂壓。 10 M , !過樹脂材料硬化必要之時間後，將模具丨、2開模， 藉此可形成填封於與下模具孔6形狀對應之樹脂成形體15 内的電子零件3。 (關於設置在分割孔側面構件内部之内部按壓機構）BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a compression molding method for an electronic component and a compression molding apparatus used in the method of the same, which is mounted on a substrate in a hole for compression molding. The IC (Integrated Circuit) performs compression molding. I: Prior Art Background of the Invention In the past, a compression molding apparatus for an electronic component of a release film (for example, a device including a mold having two upper and lower molds) was used to compress and mold an electronic component which has been worn on a substrate by a compression molding method. The resin is filled by compression molding in a hole. This method is carried out as follows. 15 20 First, a release film is placed between the upper and lower molds, and the lower surface of the lower mold surface and the upper mold hole are covered with a release film. Next, a substrate on which the resin material is supplied in the hole of the plate under the release film is supplied, and the substrate on which the electronic component is mounted is supplied to the substrate installation portion of the upper mold. The resin material in the mold hole under the detachment film is heated and melted. (4) clamping the upper and lower molds to impregnate the electronic component into the melted resin material in the lower mold hole, and pressurizing the resin material in the mold hole under the heated melting to the bottom surface member, thereby The resin in the die hole is subjected to the necessary resin pressure. ^ After the predetermined time required for hardening, the upper and lower molds are opened, whereby the resin molded body corresponding to the shape of the lower mold hole 5 in the shape of the lower mold hole can be formed in the lower mold hole. The electronic parts of the substrate are resin-sealed. Since the mold used in this method is compression-molded in a hole provided only in the lower mold, it is called "one-side mold using a mold release mold". The prior art, which is a conventional one-sided mold using a release film, is disclosed in, for example, JP-A-2005-43345. However, when the above-mentioned release film is used for shrink molding, the used release film becomes industrial waste and generates a large processing cost, so the original price of the product is increased. Further, in order to supply the release film to the mold, a mold processor or an intermediate plate for press pressing is required. Therefore, the selling price of the mold will increase, and finally the price of the product produced by the mold will increase. In order to control the increase in the original price of the above-mentioned products, compression molding without using a release film is reviewed (refer to Japanese Laid-Open Patent Publication No. 2003-127162, for example). The above-described compression molding method which does not use a release film will be described in Fig. 10A. When the mold is closed, first, the electronic component is immersed in the heat-melted resin material in the compression molding hole 102 provided in the mold 15 〇1 which is not covered with the release film. In this state, the resin in the hole 102 is pressed by the hole bottom member 103, whereby the electronic component resin mounted on the substrate is filled in the compression molded resin molded body. In the above-described compression molding in which the release film is not used, the hole (concave portion) 1〇1 provided in the lower mold ι 20 is formed by the hole bottom surface member 103 for resin pressing and the state around the bottom surface member 103 surrounding the hole. A hole surrounding member (front block) 104 is formed. After the compression molding of the mold is repeated, the hole bottom surface member 103 and the hole side member 1〇4 are usually caused by the sliding surface of the hole bottom surface member 103 or the sliding surface of the hole side member 丨〇4. Sliding portion) 200901341 A gap 105 is easily generated. Therefore, as shown in Fig. 10B, when the release film is not covered in the lower die hole 1〇2, a gap 105 is easily formed between the hole bottom member 103 and the hole surrounding member 1〇4 (sliding portion). Therefore, the resin material which has been heated and melted penetrates into the gap 5 and hardens, and the gap (sliding portion) is likely to form foreign matter 106 such as resin slag, that is, the foreign matter formed in the gap 105 (sliding portion) 1〇6 Since the hole bottom member 103 is prevented from slipping, the resin in the lower die hole 102 cannot be effectively pressurized by the hole bottom member 1〇3. In the compression molding method which is not known to use a release film, it is difficult to prevent foreign matter from being formed in the gap 105 formed between the hole bottom member 1〇3 and the member around the hole 1〇4, and it is not effective. The hole bottom member (10) presses the resin in the hole 102 to the disadvantages. Further, as described above, in order to remove the foreign matter 1〇6 formed in the gap 105 between the hole bottom surface member 103 and the hole surrounding member 15, the mold 1〇1 must be periodically disassembled for cleaning. Therefore, there is a problem that the time lost in production of the product is large and the yield is lowered. SUMMARY OF THE INVENTION In order to solve the above problems, it is an object of the present invention to prevent foreign matter from occurring in the gap between the bottom member of the hole and the member around the hole, thereby preventing the sliding of the bottom member of the hole. The member effectively pressurizes the pore resin. Further, an object of the present invention is to improve the yield of a product by using a structure in which a release film is not used, or a structure in which the hole bottom member is effectively pressurized with a hole (10). 5 10 15 In order to achieve the above object, the electronic component compression molding method package 3 of the present invention has an .ax setting step of supplying a substrate on which an electronic component is mounted to a substrate setting portion of a C-shrinking mold; The resin material is supplied into the mold hole of the mold; the melting step heats and melts the resin material that has been supplied into the hole of the mold; the dipping step is performed by dipping the mold to the electronic part a resin that has been melted in the die hole; and, the compression molding step is performed by dipping the electronic material into the melted resin, and using the bottom surface member of the bottom surface of the die hole to press the die hole. Resin, and applying a necessary resin pressure to the resin in the die hole, thereby enclosing the electronic component in the resin molded body corresponding to the shape of the die hole in the fork hole, and the component forming the side of the die hole is used and the bottom surface of the hole a hole side member correspondingly divided by each side of the member; in the compression forming step, when the necessary resin pressure is applied to the resin in the die hole by the hole bottom member, the divided side member is divided Press the hole bottom member separately. The present invention is characterized in that the member constituting the side surface of the die hole is formed by using the hole side surface member which is divided by the respective sides of the hole bottom member, and in the compression molding step, when the hole bottom member applies a necessary resin pressure to the resin in the die hole, The divided hole side members are respectively pressed to the hole bottom member. In one aspect of the present invention, the hole side member is pressed to the hole bottom member by a pressing means provided inside or outside the divided side member. Moreover, in a preferred embodiment of the present invention, the divided hole side members 20 200901341 respectively have a small piece member that is detachably mounted, and the small piece member has at least a sliding surface between the hole 3 and the bottom surface member, and When the bottom member applies a necessary resin pressure to the tree in the mold hole, the sliding surface of the small member is pressed to the bottom surface member. 5 纟 Invention towel ‘After applying the resin to the resin in the hole of the mold, it is necessary to (4) the daily pressure %' to pressurize the compressed air to the small piece member, thereby pressing the small piece member to the above-mentioned hole bottom member. The compression molding apparatus for an electronic component of the present invention comprises: an upper mold; a lower mold disposed opposite to the upper mold; and a substrate installation portion provided on the upper mold and supplied to the substrate on which the electronic component is mounted; The hole is provided in the lower mold 'as a compression molding; the bottom surface member is formed on the bottom surface of the mold hole; the side surface member is formed on the side surface of the mold hole, and the brigade is divided correspondingly to each side of the bottom surface member And the installer; and the pressing device' is to press the divided hole side members to the hole bottom member respectively. In one embodiment of the present invention, the pressing means is constituted by a pressing mechanism provided inside or outside the divided side member. Further, in the present invention, the divided side member may be provided with a small piece member including at least a sliding surface with the bottom surface member, and the pressing means includes a pressing member for pressing the small piece member to the bottom surface member. Packing • 20 settings. In a preferred embodiment of the present invention, the divided side members have a hole side member body for sliding the small member; the pressure feed pattern is disposed on the hole side member body and has a side surface for the hole An opening portion for compressing compressed air is formed in a gap formed between the member body and the small member; and, the member 9 is surrounded by the opening portion and the gap is in an external air blocking state; and the pressing device includes an air pressure feeding mechanism, The air pressure feed mechanism transmits air to the space portion surrounded by the sealing member in the gap through the pressure feed path & According to the present invention having the above steps or configurations, it is possible to prevent the sliding of the hole bottom member due to the foreign matter generated by the gap between the bottom surface of the hole member and the divided side member, thereby effectively adding the hole bottom member The resin in the pressure hole. Further, according to the present invention, the resin in the hole can be effectively pressed by the hole bottom member without using the release film, and the yield of the product can be improved. The above and other objects, features, aspects and advantages of the present invention should be clearly understood from the accompanying drawings and the detailed description of the. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic longitudinal cross-sectional view showing an electron for resin encapsulation molding of an electronic component according to a first embodiment of the present invention. 1A® is a schematic longitudinal cross-sectional view showing a mold-opening state of a mold for compression molding of a second embodiment of the present invention, and a schematic longitudinal cross-sectional view of a mold clamping state, which is schematically shown in FIG. A schematic plan view of the lower mold surface. Fig. 2A is an enlarged view showing the enlarged outline ss _ the state of the main part of the cookware, and the first member does not press the resin in the hole in the hole bottom member. (4) showing the enlarged outline of the enlarged cross-sectional view of the center of the main part of the heart. The QA shows the 3A® of the resin in the hole with the hole bottom member. [Fig. 3B is an enlarged view of the present invention. ^ 200901341 An enlarged schematic cross-sectional view of a main part of a die for compression molding of an electronic component according to a modification, and FIG. 3A shows a state before the resin in the hole is pressed by the bottom member of the hole, and FIG. 3B shows a hole. The bottom member pressurizes the resin in the hole 4A and 4B are enlarged schematic cross-sectional views showing the main part of the mold for compression molding of the electronic component according to another modification of the first embodiment of the present invention. FIG. 4A shows the pressing of the bottom surface member. The state before the resin in the hole, and the state of the fourth embodiment shows the state in which the resin in the hole is pressed by the hole bottom member. Fig. 5A is a schematic view showing the mold for compression molding of the electronic component according to the second embodiment of the present invention. A schematic longitudinal cross-sectional view of the mold opening state, and a schematic plan view of the mold surface shown in FIG. 5A is schematically shown in FIG. 5B, and the first measurement is an enlarged outline of the main part of the mold shown in FIG. 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 An enlarged schematic longitudinal cross-sectional view of the main part of the mold shown in Fig. 6A is shown in an enlarged manner, and Fig. 6B shows a state before the resin in the hole bottom member is added to the hole, and a sixth bottom view shows the bottom member of the hole. Pressed the resin in the hole 2〇 7A is an enlarged schematic longitudinal cross-sectional view of the main part of the mold for compression molding of the electronic component according to the fourth embodiment of the present invention, and the seventh embodiment shows an enlarged schematic view of the mold shown in Fig. 7A. The enlarged schematic drawing of the part, and the 7Cth drawing is an enlarged view of the longitudinal section of the electronic component of the modification of the first embodiment of the present invention. FIG. 8A is a schematic longitudinal cross-sectional view showing a state in which a mold for compression of an electronic component according to a fifth embodiment of the present invention (a mold for resin encapsulation molding of an electronic component) is opened, and FIG. 8B is a schematic view. A schematic plan view of the die face shown in Fig. 8A. Fig. 9A is an enlarged schematic longitudinal sectional view showing the main part of the mold shown in the first drawing, showing the position of the bottom surface member of the hole, and the ninth figure shows an enlarged outline of the mold corresponding to the mold shown in Fig. 9A. Expansion of Part H) A schematic longitudinal cross-sectional view showing a state in which the resin in the hole is pressurized by the hole bottom member. Fig. 10A is a schematic plan view showing a mold surface for compression molding of a conventional electronic component (upper and lower molds), including a mold surface below the lower die hole, and Fig. 10B is an enlarged schematic view showing a second embodiment. An enlarged schematic longitudinal cross-sectional view of the lower mold main portion 15 shows a sliding failure state of the hole bottom member in the lower mold hole. I. EMBODIMENT OF THE PREFERRED EMBODIMENTS The mold for compression molding of an electronic component according to an embodiment of the present invention is provided with a mold for fixing a fixed mold, a movable lower mold, and an electronic component provided in the upper mold, and supplying the mounted electronic parts. A substrate mounting portion of the substrate, a hole for compression molding having a rectangular hole opening portion provided in the lower mold, a hole surrounding member constituting the side surface of the hole, and a hole bottom surface member forming the bottom surface of the hole. Further, the members around the hole are respectively widened from the hole opening portion (or the bottom surface of the hole) 12 200901341. It is also composed of a hole side member of the knife Dj. However, the hole surrounding member and the hole = member are formed into a hole portion, and the hole bottom member can be formed around the hole. The sliding hole slides. The number of split side members is determined by the shape of the hole opening (or the bottom surface of the hole) in a plan view. When the opening of the hole (or the bottom surface of the hole) is rectangular in plan view, the four sides of the rectangle will be The member around the hole is divided into four hole side members. a' is a pressing mechanism for effectively preventing the sliding P between the hole side member and the hole bottom member from being pressed, and pressing the sliding portion of the hole side member to the sliding portion of the bottom member to press the side member The inside and outside (refer to the internal pressing mechanism shown in the first embodiment, the external pressing mechanism shown in the first and third embodiments, and the air pressure feeding mechanism according to the fifth embodiment). When the mold for compression molding of the electronic component configured as described above is used, first, the substrate on which the electronic component is mounted is supplied to the substrate set portion of the upper mold. In this state, a resin material is supplied into the hole of the lower mold, and the upper and lower molds are clamped, whereby the electronic component can be immersed in the resin which has been heated and melted in the lower die hole. Next, the hole bottom member is moved upward by a necessary moving distance, whereby the necessary resin pressure can be applied to the resin in the lower die hole. At this time, in the state in which the sliding surface of the divided hole side member is pressed to the sliding surface of the hole bottom member by the required pressing force, the hole bottom member can be moved upward by the pressing mechanism described above. Further, the moving direction of the hole bottom member and the pressing direction of the pressing mechanism are, for example, perpendicular to each other. After the necessary time for hardening, the upper and lower molds are opened, whereby the electronic parts can be compression-molded (resin-sealed) in the lower mold hole in the resin molded body (product) corresponding to the hole shape. As described above, according to the present invention, since the sliding mechanism of the divided hole side member is pressed to the sliding surface of the hole bottom member by the necessary pressing force, the hole bottom member is faced upward. The movement is therefore effective to prevent a gap between the hole bottom member and the hole side member. Therefore, it is possible to prevent foreign matter from occurring in the gap between the hole bottom member and the side member of the hole. Therefore, it is possible to prevent the sliding of the hole bottom member and to effectively press the resin in the hole with the hole bottom member. Further, according to the present invention, the productivity of the product can be effectively improved by using a configuration in which the release film is not used or a structure in which the resin in the hole is effectively pressurized by the hole bottom member. However, the divided side members of the holes may be configured by providing a small piece member. The small piece member includes at least a sliding surface with the bottom surface member. At this time, 15 the pressing mechanism of the side member of each hole may be pressed by pressure. Press the small piece member to the hole bottom member. Hereinafter, specific embodiments of the present invention will be described based on the drawings. [First Embodiment] First, a first embodiment of the present invention will be described in detail. FIG. 1A, FIG. 20B and the redundant diagram show a mold for compression molding of an electronic component according to the first embodiment (a mold for resin encapsulation molding of an electronic component), and FIGS. 2A and 2B show the main part of the mold. The first internal pressing mechanism. Further, Figs. 3A and 3B show a second internal pressing mechanism, and Figs. 4A and 4B show a third internal pressing mechanism. 14 200901341 (Configuration of a mold for compression molding of an electronic component according to the first embodiment) As shown in FIG. 1A, FIG. 1B and FIG. 1C, a mold for compression molding of an electronic component is provided with a mold 1 and a fixed mold. The upper mold 1 is disposed opposite to the movable portion 2 to move the lower mold 2. On the mold! The substrate surface is provided with a substrate mounting portion 5, and the substrate is placed on the substrate in which the electronic component 3 is mounted with the electronic component 3 facing downward. Further, the lower mold 2 is provided with a hole 6 for compression molding, and a resin material supply mechanism 1 for supplying a resin material 7 (for example, a granular resin material) into the hole 6 is provided. The supply mechanism 8 is configured to supply a resin material into the hole 6 by a hole opening portion 9 that opens toward the upper side of the hole 6. In the present embodiment, as shown in the first (1), the hole 6 has four red (four) in the view of the flat money, and may have a shape other than a rectangle. Further, although not shown, the molds (upper and lower molds) i and 2 are provided with a heating mechanism for heating the molds i and 15 2 to a necessary mold temperature, and a mold clamping mechanism for clamping the molds 2 and 2 at a necessary mold clamping pressure. x, the hole 6 of the lower mold 2 is provided with a hole bottom member 1A which is the bottom surface of the hole 6, and a hole surrounding member (front block) which constitutes the side of the hole 6 which becomes the outer periphery of the bottom surface. Furthermore, as shown in FIG. 1C, the members around the hole are viewed in a plan view, and the four sides of the rectangular bottom surface corresponding to the hole bottom member 10 (or the rectangular opening portion 9 of the rectangular hole portion) are respectively exemplified. In the case of one side, it is divided into four hole side members η. Further, the hole bottom member _ is provided with a base 12, and is divided into four holes. The side member 11 and the base 12 are separated by an elastic member 13 such as a compression spring. On the other hand, the sliding portion 14 is formed between the sliding surface of the divided hole side member 与 and the sliding surface of the hole bottom member 1〇 15 200901341 1〇. In the present embodiment, as shown in FIG. 1A and FIG. 1B, first, the substrate 4 having the electronic device 3 and the substrate 4 of the electronic component 3 are supplied to the substrate mounting portion 5 provided in the upper mold. The resin material 7 is supplied into the lower mold hole 6 and heated and melted. Next, the molds 1 and 2 are clamped, whereby the front end faces of the divided hole side members (W press blocks) U are brought into contact with the surfaces of the substrates 4 provided on the substrate of the upper mold. In this state, the hole bottom member 10 is moved upward, whereby the necessary resin pressure can be applied to the resin material which is heated and melted in the lower die hole 6. 10 M , After the resin material is hardened for a period of time, the molds 丨 and 2 are opened, whereby the electronic component 3 filled in the resin molded body 15 corresponding to the shape of the lower mold hole 6 can be formed. (About the internal pressing mechanism provided inside the side member of the split hole)

又’本實施形態之壓縮成形模具中，如第2A圖、第2B 圖所示’第一内部按壓機構21設於經分割之各孔侧面構件 11。藉該第一内部按壓機構21，可針對孔底面構件1〇，由 内部以必要按壓力按壓經分割之孔側面構件11。該第一内 4知壓機構21設於經分割之孔側面構件11的各内部之必要 處所形成之收容空間22内。 20 „ 具體而言，第一内部按壓機構21係構成如下。設有位 於收容空間22之孔底面構件10側的壁面且上下方向較長的 長孔，該長孔23插通有前端側固設於孔底面構件1〇之棒 材24。插通該棒材24而設有彈性按壓用之壓縮彈簧（彈性 構件）25，棒材24之底端側固設有一固設且可卡止壓縮彈 16 200901341 簧2 4之一端侧的棒材卡止部2 6 (例如平板狀）。收容空間2 2 之孔底面構件10側的長孔23周圍設有卡止壓縮彈簧24之另 一端側的收容空間卡止部（壁面）27。 如此，設於收容空間22内之壓縮彈簧25是在卡止於棒 5材卡止部26與收容空間卡止部27間之狀態下設置，該壓縮 彈425可彈性按壓棒材卡止部26與收容空間卡止部π，藉 此相對孔底面構件10之滑動面來彈性按壓經分割之孔側面 構件11的滑動面。 故，沿孔側面構件11使孔底面構件1〇移動來加壓孔6内 1〇之樹脂時，可以必要按壓力來將經分割之孔側面構件11的 滑動面按壓至孔底面構件1〇之滑動面，因此可有效地防止 孔側面構件11之滑動面與孔底面構件丨〇之滑動面間（滑動 部14)產生間隙。 而，孔底面構件10、棒材24及棒材卡止部26係相對孔 15側面構件！】只朝上方移動必要距離。孔底面構件之移動 方向與孔側面構件11之按壓方向係例如相互垂直。 (電子零件之壓縮成形方法） 首先，如第1圖所示，將已安裝電子零件3之基板4供給 。又置於上模具丨之基板設置部5，並以樹脂材料之供給機構$ 2〇將樹月旨材料7 (例如顆粒狀樹脂㈣）供給至下模具孔6内， 再加熱使其融化。 接著，將上下兩模具卜2合模，藉此將分割孔側面構 件U之前端面與供給設置於上模則之基板4表面接合，並 將已安裝於基板4之電子零件3浸潰於已在下模具孔6内加 17 200901341 熱融化之樹脂。 接著，將孔底面構件10朝上方移動，藉此加壓孔6内之 樹脂。該孔底面構件1〇之加壓步驟中，以第一内部按壓機 構將經分割之孔側面構_分別按壓至孔底面構㈣。 5藉此’可有效防止孔侧面構件„之滑動面與相對向之孔底 面構件ίο之滑動面間形成之滑動部14產生間隙。 故，以孔底面構件ίο加壓時，在以第一内部按壓機構 21用必要&壓利將經分割之孔側面構件丨丨分別按壓至孔底 面構件10的狀態下，使孔底面構件1〇朝上方僅移動必要之 移動距離A ’藉此可對下模孔6内之樹脂施加必要樹脂壓。 經過硬化所需之必要時間後，將上下兩模具卜2開模， 藉此可形成填封於與下模具孔6形狀對應之樹脂成形體15 内的電子零件3。 如上所述，藉本貫施形態，可在以第一内部按壓機構 15 21用必要按壓利將經分割之孔側面構件11分別按壓至孔底 面構件10的狀態下，以孔底面構件10對孔6内之樹脂施加必 要樹脂壓。 故，根據第一實施形態，由於可防止孔底面構件10與 分割孔側面構件11間所形成之間隙（滑動部丨4)產生異物， 2〇結果，可防止該間隙（滑動部14)形成異物，因此可有效 地以孔底面構件1〇加壓孔6内之樹脂。 又，第一實施形態中，如上所述，由於可防止孔底面 構件10與分割孔側面構件U間之間隙（滑動部14)形成異 物’因此可減少定期分解並清洗模具之情事，並可使產品 18 200901341 (樹脂成形體15)之成品率提南，同時降低生產產。曰夺 時間損失。 故’根據第一實施形態，可防止孔底面構件與八判 孔侧面構件11之間隙（滑動部14)形成異物，因此可ϋ 5 品（樹脂成形體15)之成品率提高，且，由於可降低生產 產品時之時間損失，因此可使產品之生產性提高。 又，第一實施形態中，可防止孔底面構件1〇與分^孔 側面構件11之間隙（滑動部14)產生異物，藉此防止孔底 面構件10之滑動不良，因此可有效地以孔底面構件1〇加壓 10 孔内6之樹脂。 故，藉第一實施形態，在不使用脫模膜之構成中，可 防止孔底面構件10之滑動不良，並以孔底面構件1〇有效地 加壓孔内6之樹脂，因此可使產品之生產性提高。 (使用第二内部按壓機構之變形例） 15 接著’以第3Α圖及第3Β圖說明以第二内部按壓機構28 來代替第一實施形態之第一内部按壓機構21之變形例。 而’由於設有第3Α圖及第3Β圖所示之第二内部按壓機構28 的電子零件之壓縮成形用模具的構成構件與第丨八圖、第1Β 圖、第1C圖、第2Α圖及第2Β圖所示之模具構成構件相同， 20 因此賦予相同標號。 又，第二内部按壓機構28採用作為彈性構件之圓形彈 簧29來代替第一内部按壓機構21之壓縮彈簧25。 第二内部按壓機構28也與第一内部按壓機構21相同， 設於經分割之孔側面構件丨丨之必要處，將孔底面構件1〇按 19 200901341 壓至孔底面構件10。該第二内部按壓機構28設於孔側面構 件11内部之必要處所形成的收容空間22内。 具體而言，第二内部按壓機構28構成如下。設有位於 收容空間22之孔底面構件1〇側的壁面而上下方向較長之長 5孔23。該長孔23插通有前端側固設於孔底面構件10之棒材 24。插通該棒材24而設有彈性按壓用之圓形彈簧29，棒材 24之底端側固設有一固設且可卡止圓形彈簧29之一端側的 棒材卡止部26 (例如平板狀）。收容空間22之孔底面構件1〇 側的長孔23周圍設有卡止壓縮彈簧24之另一端側的收容空 10間卡止部（壁面）27。 如此，設於收容空間22内之圓形彈簧29是在卡止於棒 材T止部26與收容空間卡止部27間之狀態下設置。又，藉 °亥圓形彈簧29，可按壓棒材卡止部26與收容空間卡止部27 來以必要按壓力將經分割之孔側面構件u的滑動面按壓至 15孔底面構件10之滑動面。 故，相對孔侧面構件U使孔底面構件1〇朝上方移動來 加壓孔6内之樹脂時’可將經分割之孔侧面構件η的滑動 面知壓至孔底面構件1〇之滑動面。結果，可有效地防止孔 1面構件11之滑動面與孔底面構件丨G之滑動 20隙。 注土间 θ又’使用第二内部按壓機構28之構成與制第一内部 按壓機構21之構成相同地，可防止孔底面構件1〇與孔側面 構件11之間隙產生異物，藉此可防止孔底面構件⑺之滑動 良、、。果，可利用孔底面構件10有效地加壓孔6内之樹 20 200901341 脂。 又’採用不使用脫模模之模具時，或是利用孔底面構 件10有效地加壓孔6内之樹脂的構成中，可有效地使產品 (樹脂成形體15)之生產性提高。 5 而，孔底面構件10、棒材24、棒材卡止部26可相對經 分吾彳之孔側面構件丨丨朝上方只移動必要之移動距離B。 (使用第三内部按壓機構之變形例） 接著’以第4A圖及第4B圖說明以第三内部按壓機構31 來代替第一實施形態之第一内部按壓機構21、或第二内部 10按壓機構28之變形例。而，由於設有第4A圖及第4B圖所示 之第二内部按壓機構31的電子零件之壓縮成形用模具的構 成構件與第1A圖、第1B圖、第1(：圖、第2A圖及第2B圖所 示之模具構成構件相同，因此賦予相同標號。 第二内部按壓機構31使用圓形彈簣29作為彈性構件， 15這點與第二内部按壓機構28相同。第三内部按壓機構31 中，一個孔底面構件10係藉二個孔側面構件^由兩側包 夾。具體而言，第三内部按壓機構31是將一對孔側面構件 11相對向地配置，並將與第二内部按壓機構28之棒材24對 應的棒材33插通於孔底面構件1〇所設之貫通孔32，將相對 20向之一對第三内部按壓機構31結合而成。 接著，以由一個孔底面構件1〇、以及設於其周圍之四 個孔侧面構件11構成的下模具2為例，說明第三内部按壓機 構31 ’孔底面構件10係形成平面形狀具有四邊之矩形的下 模具孔6。 21 200901341 .門邵按壓機構31 5 10 15 20 ..... 潤札低由構件10設有頁通 杜1 〇勺且心通孔3 2之兩端的開口位置與將—個孔底面構 L夾於其間相對向配置之孔側面構件Η的收容空間Μ 之開口位置（長孔23) —致。 =騎加活嵌㈣插人㈣㈣，該棒卵之兩 =棒材卡止部26，該棒材卡止筒收容空間卡止部 配置有作為彈性構件之圓形彈簣29。換言之，可藉第 私壓機構3卜利用—對相對向之孔側面構件”將一 ?底面構件1(3由其兩側用必要按動加以按邀。 故’由於可防止孔底面構件1〇之滑動面與孔侧面構件 之滑動面間（滑動部14)產生間隙，因此可獲得與第一 ^按顯構21或第二内部賊機構帅狀作用效果， 卩利用第三内部按壓機構3 i來防止孔底面構件1〇之滑動 不良而提高生產性。 〔第二實施形態〕 、接著，詳細說明第二實施形態^第认圖及第5b圖顯示 第-實施形態之電子零件之壓縮成形用模具，第5C圖顯示 作為模具要部之第-外部按壓機構。而，第二實施形態所 不之模具的基本構成與第一實施形態所示之模具的基本構 成相同，因此省略其說明。 (關於第二實施形態之電子零件之壓縮成形用模具的 構成） 第5A圖及第5B圖所示之第二實施形態之模具中，設有 固又之上模具1、可動之下模具2、用以供給已安裝電子零 22 200901341 件3之基板4的上模具丄之基板設置部5、言免於下模具2之壓縮 成形用孔6與其孔開口部9。下模具2設有構成孔^孔底面 構件10及孔周圍構件（前壓塊）。 又’如第5B®所示，孔㈣構件設有孔側面構件u， «亥孔側面構件11由平面觀之，係對應例如矩形之孔6的底面 (或矩形之孔開口部9)之四邊分割為四個。 又，孔底面構件1〇固設於基台12，經分割之孔側面構 件11設置成可透過壓縮彈簧（彈性構件）13而相對基台12 彈f生上下動。經分割之各孔侧面構件U固接有設成可相對 1〇基台12滑動之導引棒38，且該導引棒38插通有彈性構件13。 藉具有上述構造之第二實施形態，將上下兩模具1、2 合模，藉此，首先使經分割之孔側面構件丨丨的各前端面與 供給設置於上模具1之基板4的表面接觸。之後，將已安裝 於基板4之電子零件3浸潰於已加熱融化之孔6的樹脂材料 15 (?) ’接著，使孔底面構件1〇向上動，藉此可對孔6内之樹 脂施加必要樹脂壓。 (關於第一外部按壓機構） 又，如圖所示，第二實施形態之模具2分別於各孔 側面構件11設有第一外部按壓機構36，第一外部按壓機構 20 36可相對孔底面構件10以必要按壓力將孔側面構件u由其 兩側加以按壓。 又，第一按壓機構36於經分割之孔側面構件丨丨外部側 的必要部位，設有外部加壓構件37及球狀柱塞4〇，外部加 壓構件37係以直立設置之狀態形成於基台12，球狀柱塞 23 200901341 係設於外部加壓構件3 7之必要部位而以必要按壓力按壓各 孔側面構件11。 s亥球狀柱塞40設有按壓用球構件（例如硬球）、作為按 壓球構件41之彈性構件的壓縮彈簧42、收容球構件41與彈 5簧42之收容空間们、以及具有收容空間43之球狀柱塞本體 44。又，球狀柱塞本體44藉設於其外周圍之螺絲部46，可 相對外部加壓構件37螺設成可自由拆裝，並可調整其螺設 位置。 又，球狀柱塞本體44之收容空間43的按壓前端側形成 10有卡止球構件41之罩斜面部45。球構件41通常（例如螺設 於外部加壓構件37前）是以設於球狀柱塞本體44前端側之 開口部47突出些許之狀態來設置。 藉上述構成，可利用螺設於外部加壓構件37之球狀柱 塞40將分割孔側面構件11對孔底面構件10進行按壓。故， 15藉第二實施形態之第一外部按壓機構36，可有效地防止分 割孔側面構件Π之滑動面與孔底面構件1 〇之滑動面間（滑 動部14)產生間隙。 而，第5C圖所示構成之例中，球構件41係存在於收容 空間43，呈透過球構件41以彈簧42按壓孔侧面構件u之狀 20 態。 (關於第二實施形態的電子零件之壓縮成形方法及其 作用效果） 第二實施形態中，與第—實施形態相同地，將上下兩 模具1、2合模來以孔底面構件1〇對孔6内之樹脂施加必要樹 24 200901341 脂壓，藉此將已安裝於基板4之電子零件3壓縮成形於樹脂 成形體15内。 故’第二實施形態中’藉包含球形柱塞等的第一外部 知:壓機構’對孔底面構件1 〇以必要按壓力按壓各經分割之 5孔側面構件11，藉此有效地防止孔側面構件11與孔底面構 件10間（滑動面14 )產生間隙。 換言之，藉第二實施形態’由於可防止孔底面構件10 與分割孔侧面構件11間形成之滑動部14產生間隙或異物， 因此可藉孔底面構件10有效地加壓孔6内之樹脂。 〇 又，藉第二實施形態，在不使用脫模膜之情形下，亦 可防止孔底面構件10之滑動不良，有效地提高產品之生產 性0 接著，詳細說明本發明之第三實施形態。第6A圖顯示 第三實施形態的電子零件之壓縮成形用模具，第6B圖及第 15 6C圖擴大顯示該模具要部之第二外部按壓機構。而，第三 實施形態所示之模具的基本構成與第一及第二實施形態所 示之模具的基本構成相同，因此省略說明。 (關於第三實施形態的電子零件之壓縮成形用模具構 成） 20 第6A圖所示之第三實施形態的模具3,與第一實施形態 相同地，設有固定之上模具1、可動之下模具2、用以供給 已安裝電子零件3之基板4的上模具1之基板設置部$、設於 下模具2之壓縮成形用孔6與孔開口部9。下模具2設有構成 孔6之孔底面構件10及孔側面構件11。 25 200901341 又’第三實施形態中，雖未圖示’但與第二實施形態 (參考第测）相同地，由平峨之，孔構件設有孔 側面構件u，該孔側面構件u係對應例如矩形孔6之底面 (或矩形孔開口部）之四邊而分割。 5 減有上述構成之第三實施形態，與第-、第二實施 形態相同地，將上下兩模具卜2合模’藉此，首先使各孔 側面構件11的各前端面與供給設置於上模具！之基板4的表 面接觸’並將已安裝於基板4之電子零件3浸潰於已加熱融 化之孔6的樹脂材料⑺，接著，使孔底面構件_上動， 10藉此可對孔6内之樹脂施加必要樹脂壓。 (關於第二外部按壓機構） 又，如圖式之構造例，第三實施形態之模具設有第二 外部按壓機構50，帛二外部按壓機構5〇可對孔底面構件1〇 將 >’、里刀割之各孔側面構件1丨由其外部加以按壓。第二外部 5彳女壓機構50分別設有立設於基台12之外部按壓構件51、以 及將外部按壓構件51卡止於基台12之卡止插銷52。 再者’第三實施形態之模具設有嵌合用凸部53及溝部 (凹部）54，嵌合用凸部53設於外部按壓構件51之前端側 的孔側面構件Π側，溝部54設於孔側面構件11而呈可對應 20凸部53嵌合滑動之狀態。 藉該構成，可藉外部按壓構件51之凸部53按壓孔側面 構件11之溝部54而滑動。故，藉以凸部53按壓溝部54，可 用必要按壓力對孔底面構件1〇按壓孔側面構件U。 而’孔側面構件11之前端面接觸設置於上模具丨之基板 26 200901341 4表面後，接著將孔底面構件10朝上方移動，藉此，以卡止 插銷52固設之外部按壓機構50的凸部53會按壓孔側面構件 11之溝部54而滑動。 (關於第三實施形態的電子零件之壓縮成形方法與作 5 用效果） 第三實施形態中，與第一、第二實施形態相同地，將 上下兩模具1、2合模來以孔底面構件10對孔6内之樹脂施加 必要樹脂壓，藉此可將已安裝於基板4之電子零件3壓縮成 形於樹脂成形體15内。 10 故，第三實施形態中，藉第二外部按壓機構50 (凸部） 對孔底面構件10按壓孔側面構件11，藉此可有效地防止孔 側面構件11與孔底面構件10間形成之滑動部14產生間隙或 形成異物，因此可利用孔底面構件10有效地加壓孔6内之樹 脂。又，藉第三實施形態，在不使用脫模膜之情形下，亦 15 可防止孔底面構件10之滑動不良，有效地提高產品之生產 性。 〔第四實施形態〕 接著，詳細說明本發明第四實施形態。第7A圖顯示第 四實施形態的電子零件之壓縮成形用模具，第7B圖顯示該 20 模具要部之片按壓機構。而，第四實施形態所示之模具的 基本構成與第--三實施形態所示之模具的基本構成相 同，因此省略說明。 (關於第四實施形態的電子零件之壓縮成形用模具構 成） 27 200901341 第7A圖所示之第四實施形態的模具，與第一〜三實施 形態相同地，設有固定之上模具1、可動之下模具2、用以 供給已安裝電子零件3之基板4的上模具丨之基板設置部5、 設於下模具2之壓縮成形用孔6與其孔開口部9。下模具2設 5 有構成孔6之孔底面構件10及孔周圍構件11。 又’第四實施形態中’雖未圖示，但與第二實施形態 (參考第5B圖）相同地，由平面觀之，孔周圍構件設有孔 側面構件11，該孔側面構件11係對應例如矩形孔6之底面 (或矩形孔開口部）之四邊而分割。孔側面構件11分別設 10 有可相對孔側面構件11自由拆裝之分割型小片構件61，該 分割型小片構件61係對應孔6之側面與孔侧面構件11的滑 動面。又，經分割之孔側面構件11分別設有將小片構件61 朝孔方向按壓之片按壓機構62。 藉具有上述構成之第四實施形態，首先，將上下兩模 15 具1、2合模，藉此使孔側面構件11之各小片構件61的各前 端面與供給設置於上模具之基板的表面接觸。在此狀態 下，將已安裝於基板之電子零件浸潰於已加熱融化之孔6的 樹脂材料7，接著，使孔底面構件10向上動，藉此可對孔6 内之樹脂施加必要樹脂壓。而，小片構件61只要是至少包 20 含孔側面構件11之滑動面的構成即可。 (關於片按壓機構） 第四實施形態中，如第7B圖所示，以必要按壓力將小 片構件61朝孔底面構件1〇按壓之片按壓機構62，係配置於 分割孔側面構件11之必要處所形成的收容空間63。又，片 28 200901341 按壓機構62設有片按壓構件64、彈性構件65及卡止彈性構 件65之卡止部66，片按壓構件64透過設於收容空間63之前 端側的開口部69來按壓小片構件61，而彈性構件65則是按 壓按壓構件64之壓縮彈簧等。故，藉片按壓構件64 (彈性 5構件65 )，可透過小片構件61來按壓孔底面構件1〇〇 (關於第四實施形態的電子零件之壓縮成形方法與作 用效果） 使用第四實施形態之模具，藉片按壓機構62，可對孔 底面構件10以必要按壓力來按壓構成各經分割之孔側面構 10件11的小片構件61，藉此有效地防止小片構件61與孔底面 構件10間（滑動部14)產生間隙或形成異物，因此可利用 孔底面構件10有效地加壓下模具孔6内之樹脂。又，藉第四 實施形態，在不使用脫模膜之情形下，亦可防止孔底面構 件10之滑動不良，有效地提高產品之生產性。 15 x ’如$7A®所示’小片構件61之滑動面構造成由孔 側面構件11之滑動面只突出距離c。再者，小片構件61之滑 動面設有可提高脫模性之脫模處理層67、或可提高滑動性 之滑動處理層67。此時，脫模處理層67或滑動處理層67可 形成例如鐵氟龍（登錄商標）等氟系表面處理劑。藉設置 20該脫模處理層67或滑動處理層67，可有效地防止小片構件 61與孔底面構件關形成之_ (滑動部14)形成異物。 又，如第7C圖所示，可於孔底面構件1〇之滑動面的必 要處、又置例如使用鐵敦龍（登錄商標）等氣系密封劑等 之密封構件68。藉設置上述密封構件68，可有效地防止小 29 200901341 片構件61與孔底面構件10間產生間隙。 而，脫模處理層67 (或滑動處理層67)亦可併用密封 構件68。 〔第五實施形態〕Further, in the compression molding die of the present embodiment, as shown in Figs. 2A and 2B, the first internal pressing mechanism 21 is provided in each of the divided side surface members 11. By the first inner pressing mechanism 21, the divided hole side member 11 can be pressed by the inside with the necessary pressing force for the hole bottom surface member 1?. The first inner pressure guiding mechanism 21 is provided in the accommodating space 22 formed at the necessary position inside each of the divided hole side members 11. Specifically, the first internal pressing mechanism 21 is configured as follows: a long hole that is long in the vertical direction is provided on a wall surface on the side of the hole bottom surface member 10 of the accommodating space 22, and the long hole 23 is inserted through the front end side. The bar 24 of the hole bottom member 1 is inserted into the bar 24 and is provided with a compression spring (elastic member) 25 for elastic pressing, and the bottom end side of the bar 24 is fixedly fixed and the compression bomb can be locked. 16 200901341 The bar locking portion 2 6 on one end side of the spring 2 4 (for example, a flat plate shape). The other end side of the locking compression spring 24 is provided around the long hole 23 on the hole bottom surface member 10 side of the accommodating space 2 2 . The space locking portion (wall surface) 27. The compression spring 25 provided in the accommodating space 22 is provided in a state of being locked between the rod 5 locking portion 26 and the accommodating space locking portion 27, and the compression bomb 425 is provided. The bar locking portion 26 and the accommodating space locking portion π are elastically pressed, whereby the sliding surface of the divided hole side member 11 is elastically pressed against the sliding surface of the hole bottom member 10. Therefore, the hole is formed along the hole side member 11. When the bottom member 1 is moved to pressurize the resin in the hole 6, it may be necessary The sliding surface of the divided hole side member 11 is pressed against the sliding surface of the hole bottom surface member 1 by pressing force, so that the sliding surface of the hole side member 11 and the sliding surface of the hole bottom member 丨〇 can be effectively prevented (sliding portion) 14) A gap is created. The hole bottom member 10, the bar member 24, and the bar locking portion 26 are opposite to the hole 15 side member!] only move upward by a necessary distance. The moving direction of the hole bottom member and the pressing of the hole side member 11 The direction is, for example, perpendicular to each other. (Compression molding method of electronic component) First, as shown in Fig. 1, the substrate 4 on which the electronic component 3 is mounted is supplied, and placed in the substrate mounting portion 5 of the upper mold, and is made of a resin material. The supply mechanism $2〇 supplies the tree material 7 (for example, the granular resin (4)) to the lower mold hole 6, and then heats it to melt. Next, the upper and lower molds 2 are closed, thereby dividing the side of the split hole The front end surface of the member U is joined to the surface of the substrate 4 which is supplied to the upper mold, and the electronic component 3 mounted on the substrate 4 is immersed in the resin which has been thermally melted in the lower mold hole 6 by 17 200901341. Next, the bottom of the hole The member 10 is moved upward, thereby pressurizing the resin in the hole 6. In the pressing step of the hole bottom member 1〇, the divided inner side surface structure is pressed to the bottom surface structure (4) by the first internal pressing mechanism. 5 thereby creating a gap between the sliding surface formed between the sliding surface of the hole side member and the sliding surface of the hole bottom member ί. Therefore, when the hole bottom member ί is pressed, the first bottom pressing member 21 presses the divided hole side member 丨丨 to the hole bottom member 10 by the necessary & The 〇 is moved upward only by the necessary moving distance A', whereby the necessary resin pressure can be applied to the resin in the lower die hole 6. After the necessary time required for the hardening, the upper and lower molds 2 are opened, whereby the electronic component 3 sealed in the resin molded body 15 corresponding to the shape of the lower mold hole 6 can be formed. As described above, in the state in which the first inner pressing mechanism 15 21 presses the divided hole side member 11 to the hole bottom member 10 with the necessary pressing force, the hole bottom member 10 is opposed to the hole. The resin in 6 is applied with the necessary resin pressure. Therefore, according to the first embodiment, it is possible to prevent foreign matter from being generated in the gap (sliding portion 丨4) formed between the hole bottom surface member 10 and the split hole side surface member 11. As a result, it is possible to prevent the gap (sliding portion 14) from forming foreign matter. Therefore, the resin in the hole 6 can be effectively pressed by the hole bottom member 1〇. Further, in the first embodiment, as described above, it is possible to prevent the gap between the hole bottom surface member 10 and the split hole side surface member U (the sliding portion 14) from forming foreign matter, so that it is possible to reduce the periodic decomposition and cleaning of the mold, and it is possible to The yield of the product 18 200901341 (resin molded body 15) is increased, and the production is reduced. Capture the loss of time. Therefore, according to the first embodiment, it is possible to prevent foreign matter from being formed in the gap (sliding portion 14) between the hole bottom member and the octagonal side member 11, so that the yield of the product (resin molded body 15) can be improved, and Reduce the time lost in the production of the product, thus improving the productivity of the product. Further, in the first embodiment, it is possible to prevent foreign matter from being generated in the gap (sliding portion 14) between the hole bottom surface member 1A and the branch hole side member 11, thereby preventing the sliding of the hole bottom member 10, thereby effectively forming the bottom surface of the hole. The member 1 is pressurized with resin in 10 holes. Therefore, according to the first embodiment, in the configuration in which the release film is not used, the sliding failure of the hole bottom member 10 can be prevented, and the resin in the hole 6 can be effectively pressurized by the hole bottom member 1 Productive improvement. (Modification of the second internal pressing mechanism is used.) Next, a modification of the first internal pressing mechanism 21 of the first embodiment in place of the second internal pressing mechanism 28 will be described with reference to the third and third drawings. And the constituent members of the mold for compression molding of the electronic component of the second internal pressing mechanism 28 shown in the third and third drawings are the eighth and third figures, the first figure, the first figure, and the second figure. The mold constituent members shown in Fig. 2 are the same, and 20 are given the same reference numerals. Further, the second inner pressing mechanism 28 uses a circular spring 29 as an elastic member instead of the compression spring 25 of the first inner pressing mechanism 21. Similarly to the first inner pressing mechanism 21, the second inner pressing mechanism 28 is provided at a position necessary for the divided side surface member ,, and the hole bottom surface member 1 is pressed to the hole bottom member 10 at 19 200901341. The second inner pressing mechanism 28 is provided in the accommodating space 22 formed at a necessary position inside the hole side member 11. Specifically, the second internal pressing mechanism 28 is configured as follows. A wall 5 having a wall surface on the side of the hole bottom member 1 of the accommodating space 22 is provided, and a long hole 5 is formed in the vertical direction. The long hole 23 is inserted into the bar 24 which is fixed to the hole bottom member 10 at the front end side. The rod 24 is inserted and provided with a circular spring 29 for elastic pressing, and the bottom end side of the rod 24 is fixed with a bar locking portion 26 which is fixed and can lock one end side of the circular spring 29 (for example Flat)). Around the long hole 23 on the side of the hole bottom surface member 1 of the accommodating space 22, there are provided ten locking portions (wall faces) 27 for accommodating the other end side of the locking compression spring 24. In this way, the circular spring 29 provided in the accommodating space 22 is provided in a state of being locked between the rod T stopper portion 26 and the accommodating space locking portion 27. Further, by the round spring 29, the bar locking portion 26 and the accommodating space locking portion 27 can be pressed to press the sliding surface of the divided hole side member u to the sliding of the 15-hole bottom member 10 with the necessary pressing force. surface. Therefore, when the hole bottom surface member U moves the hole bottom surface member 1 〇 upward to press the resin in the hole 6, the sliding surface of the divided hole side surface member η can be pressed to the sliding surface of the hole bottom surface member 1〇. As a result, it is possible to effectively prevent the sliding surface of the hole face member 11 from sliding with the hole bottom face member 丨G. The configuration of the second internal pressing mechanism 28 is the same as the configuration of the first internal pressing mechanism 21, and the foreign matter between the hole bottom surface member 1〇 and the hole side surface member 11 can be prevented from occurring, thereby preventing the hole from being formed. The bottom member (7) slides well. As a result, the hole bottom member 10 can be used to effectively pressurize the tree in the hole 6 20 200901341. Further, in the case where the mold which does not use the mold release mold is used, or the resin in the hole 6 is effectively pressed by the hole bottom member 10, the productivity of the product (resin molded body 15) can be effectively improved. 5, the hole bottom member 10, the bar member 24, and the bar locking portion 26 can be moved only upward by the necessary moving distance B with respect to the hole side member of the hole. (Modification Example Using Third Internal Pressing Mechanism) Next, the third internal pressing mechanism 31 may be used instead of the first internal pressing mechanism 21 of the first embodiment or the second internal 10 pressing mechanism in FIGS. 4A and 4B. A modification of 28. The constituent members of the compression molding die for the electronic component of the second internal pressing mechanism 31 shown in FIGS. 4A and 4B are the first FIG. 1A, FIG. 1B, and the first (Fig. 2A). The second internal pressing mechanism 31 uses the circular magazine 29 as the elastic member, and the second internal pressing mechanism is the same as the second internal pressing mechanism 28. The third internal pressing mechanism is the same as the second internal pressing mechanism 28. In the 31, one hole bottom member 10 is sandwiched by two side side members. Specifically, the third inner pressing mechanism 31 is configured to face the pair of hole side members 11 oppositely, and will be second. The bar 33 corresponding to the bar 24 of the inner pressing mechanism 28 is inserted into the through hole 32 provided in the hole bottom member 1A, and is formed by combining one pair of the third inner pressing mechanism 31 with respect to the 20 directions. The lower bottom mold 2 composed of the hole bottom member 1 and the four hole side members 11 provided around the hole is used as an example, and the third inner pressing mechanism 31 'the bottom surface member 10 is formed into a lower mold hole having a rectangular shape in a plan view. 6. 21 200901341 . Pressing mechanism 31 5 10 15 20 ..... The running low is provided by the member 10 with a page through the 1 scoop and the opening position of the two ends of the through hole 3 2 is opposite to the bottom surface of the hole The position of the opening of the accommodating space of the hole side member Μ (long hole 23) is the same as that of the opening hole (four) (four) (four), the two of the stick eggs = the bar locking portion 26, the bar locking cylinder The receiving space locking portion is provided with a circular magazine 29 as an elastic member. In other words, the bottom member 1 can be used by the first private pressing mechanism 3 It is necessary to press the invitation. Therefore, since it is possible to prevent a gap between the sliding surface of the hole bottom member 1〇 and the sliding surface of the hole side member (sliding portion 14), it is possible to obtain the first or second display 21 or the second The effect of the internal thief mechanism is squeaky, and the third internal pressing mechanism 3 i prevents the sliding failure of the hole bottom member 1 而 to improve productivity. [Second embodiment] Next, the second embodiment will be described in detail. Fig. 5 and Fig. 5b show the mold for compression molding of the electronic component of the first embodiment, the fifth The figure C shows the first-outer pressing mechanism as the main part of the mold. The basic configuration of the mold which is not in the second embodiment is the same as the basic configuration of the mold shown in the first embodiment, and therefore the description thereof will be omitted. In the mold of the second embodiment shown in FIGS. 5A and 5B, the upper mold 1 and the movable mold 2 are provided for supplying the mold. The substrate mounting portion 5 of the upper mold 基板 of the substrate 4 of the electronic device is mounted on the electronic die 22 200901341, and the hole forming portion 6 of the lower mold 2 is sealed from the hole opening portion 9. The lower mold 2 is provided with a hole bottom member 10 And the surrounding components (front clamp). Further, as shown in FIG. 5B®, the hole (four) member is provided with the hole side member u, and the "Hyper hole side member 11 is viewed from the plane, and corresponds to the four sides of the bottom surface of the rectangular hole 6 (or the rectangular hole opening portion 9). Split into four. Further, the hole bottom member 1 is fixed to the base 12, and the divided hole side member 11 is provided to be permeable to the base 12 by the compression spring (elastic member) 13. The divided side member U of the hole is fixedly connected with a guide bar 38 which is slidable relative to the base 12, and the guide bar 38 is inserted with the elastic member 13. According to the second embodiment having the above configuration, the upper and lower dies 1 and 2 are clamped, whereby the front end faces of the divided hole side members 首先 are first brought into contact with the surface of the substrate 4 provided on the upper mold 1 . Thereafter, the electronic component 3 mounted on the substrate 4 is immersed in the resin material 15 (?)' of the heated melted hole 6. Then, the hole bottom member 1〇 is moved upward, whereby the resin in the hole 6 can be applied. Requires resin pressure. (First external pressing mechanism) Further, as shown in the drawing, the mold 2 of the second embodiment is provided with a first external pressing mechanism 36 on each of the hole side members 11, and the first external pressing mechanism 20 36 is opposite to the bottom surface member. 10 Press the hole side member u from both sides with the necessary pressing force. Further, the first pressing mechanism 36 is provided with an external pressing member 37 and a spherical plunger 4〇 at a necessary portion on the outer side of the divided hole side member, and the external pressing member 37 is formed in an upright state. The base 12 and the spherical plunger 23 200901341 are attached to the necessary portions of the external pressing member 37, and the respective side surface members 11 are pressed by the necessary pressing force. The s-shaped ball plunger 40 is provided with a pressing ball member (for example, a hard ball), a compression spring 42 as an elastic member for pressing the ball member 41, a housing space for housing the ball member 41 and the spring 5 spring 42, and a housing space 43. The ball plunger body 44. Further, the ball plunger body 44 is screwed to the outer peripheral portion of the screw portion 46 so as to be detachable from the outer pressing member 37, and the screwing position thereof can be adjusted. Further, the pressing front end side of the accommodating space 43 of the spherical plunger main body 44 is formed with a cover inclined surface portion 45 having a locking ball member 41. The ball member 41 is normally provided (for example, before the external pressing member 37 is screwed) in a state in which the opening 47 provided on the front end side of the spherical plunger main body 44 is slightly protruded. According to the above configuration, the split hole side surface member 11 can be pressed against the hole bottom surface member 10 by the spherical plug 40 provided on the external pressing member 37. Therefore, by the first external pressing mechanism 36 of the second embodiment, it is possible to effectively prevent a gap between the sliding surface of the dividing hole side member 与 and the sliding surface of the hole bottom member 1 (sliding portion 14). In the example shown in Fig. 5C, the ball member 41 is present in the accommodating space 43, and the ball member 41 is pressed by the spring member 42 to press the hole side member u. (Compression molding method of electronic component according to the second embodiment and its operation and effect) In the second embodiment, as in the first embodiment, the upper and lower molds 1 and 2 are clamped to form a hole with the hole bottom member 1 The resin in the 6 is applied with the necessary resin 24 200901341, whereby the electronic component 3 mounted on the substrate 4 is compression molded into the resin molded body 15. Therefore, in the second embodiment, the first outer surface known by the spherical plunger or the like: the pressing mechanism presses the divided five-hole side members 11 with the necessary pressing force on the hole bottom surface member 1 , thereby effectively preventing the holes A gap is formed between the side member 11 and the hole bottom member 10 (sliding surface 14). In other words, according to the second embodiment, since the gap or foreign matter can be prevented from occurring in the sliding portion 14 formed between the hole bottom member 10 and the split hole side member 11, the resin in the hole 6 can be effectively pressed by the hole bottom member 10. Further, according to the second embodiment, in the case where the release film is not used, the sliding failure of the hole bottom member 10 can be prevented, and the productivity of the product can be effectively improved. Next, the third embodiment of the present invention will be described in detail. Fig. 6A is a view showing a mold for compression molding of an electronic component according to a third embodiment, and Fig. 6B and Fig. 6C show an enlarged second external pressing mechanism of the main part of the mold. The basic configuration of the mold shown in the third embodiment is the same as the basic configuration of the mold shown in the first and second embodiments, and thus the description thereof is omitted. (Mold of compression molding die for electronic component according to the third embodiment) 20 The mold 3 of the third embodiment shown in Fig. 6A is provided with the upper mold 1 and the movable mold as in the first embodiment. The mold 2 is provided with a substrate mounting portion $ for supplying the upper mold 1 of the substrate 4 on which the electronic component 3 is mounted, and a compression molding hole 6 and a hole opening portion 9 provided in the lower mold 2. The lower mold 2 is provided with a hole bottom member 10 and a hole side member 11 which constitute the hole 6. 25 200901341 In the third embodiment, although not shown in the drawings, the hole member is provided with a hole side member u, and the hole side member u corresponds to the second embodiment (refer to the first measurement). For example, the bottom surface of the rectangular hole 6 (or the rectangular hole opening portion) is divided into four sides. In the third embodiment in which the above-described configuration is reduced, the upper and lower molds 2 are clamped in the same manner as in the first and second embodiments. First, the front end faces of the respective hole side members 11 are supplied to the upper end. Mold! The surface of the substrate 4 is in contact with the resin material (7) which has been immersed in the molten metal hole 6 by the electronic component 3 mounted on the substrate 4, and then the hole bottom member _ is moved upward, whereby the hole 6 can be The resin is applied with the necessary resin pressure. (Second External Pressing Mechanism) Further, in the structural example of the drawings, the mold of the third embodiment is provided with the second external pressing mechanism 50, and the second external pressing mechanism 5〇 can be used for the hole bottom member 1 The side member 1 of each hole in which the knife is cut is pressed by the outside. The second outer female pressing mechanism 50 is provided with an outer pressing member 51 that is erected on the base 12, and a locking pin 52 that locks the outer pressing member 51 to the base 12. In the mold of the third embodiment, the fitting convex portion 53 and the groove portion (concave portion) 54 are provided, and the fitting convex portion 53 is provided on the side surface of the hole side member on the front end side of the outer pressing member 51, and the groove portion 54 is provided on the side of the hole. The member 11 is in a state in which the 20 convex portions 53 can be fitted and slid. With this configuration, the convex portion 53 of the outer pressing member 51 can be pressed to press the groove portion 54 of the hole side member 11. Therefore, by pressing the groove portion 54 by the convex portion 53, the hole side surface member 1 can be pressed against the hole bottom surface member 1 by the necessary pressing force. On the other hand, after the front end surface of the hole side member 11 is in contact with the surface of the substrate 26 200901341 4 provided on the upper mold ,, the hole bottom surface member 10 is moved upward, whereby the convex portion of the external pressing mechanism 50 fixed by the locking pin 52 is fixed. 53 will press the groove portion 54 of the hole side member 11 to slide. (Effects of the compression molding method for the electronic component of the third embodiment and the effect of the fifth embodiment) In the third embodiment, the upper and lower molds 1 and 2 are clamped together with the hole bottom member in the same manner as in the first and second embodiments. The necessary resin pressure is applied to the resin in the pair of holes 6 to compress and mold the electronic component 3 mounted on the substrate 4 into the resin molded body 15. Therefore, in the third embodiment, the hole side surface member 11 is pressed against the hole bottom member 10 by the second outer pressing mechanism 50 (protrusion), whereby the sliding between the hole side member 11 and the hole bottom member 10 can be effectively prevented. The portion 14 generates a gap or forms a foreign matter, so that the hole bottom member 10 can be used to effectively press the resin in the hole 6. Further, according to the third embodiment, in the case where the release film is not used, the sliding failure of the hole bottom member 10 can be prevented, and the productivity of the product can be effectively improved. [Fourth embodiment] Next, a fourth embodiment of the present invention will be described in detail. Fig. 7A is a view showing a mold for compression molding of an electronic component according to a fourth embodiment, and Fig. 7B is a view showing a sheet pressing mechanism for the main part of the mold. The basic configuration of the mold shown in the fourth embodiment is the same as the basic configuration of the mold shown in the third embodiment, and thus the description thereof is omitted. (Mold of compression molding for electronic components according to the fourth embodiment) 27 200901341 The mold of the fourth embodiment shown in Fig. 7A is provided with a fixed upper mold 1 and movable as in the first to third embodiments. The lower mold 2, the substrate mounting portion 5 for supplying the upper mold 已 of the substrate 4 on which the electronic component 3 is mounted, and the compression molding hole 6 provided in the lower mold 2 and the hole opening portion 9. The lower mold 2 is provided with a hole bottom member 10 and a hole surrounding member 11 which constitute the hole 6. Further, in the fourth embodiment, although not shown, similarly to the second embodiment (refer to FIG. 5B), the hole surrounding member is provided with a hole side member 11 in plan view, and the hole side member 11 corresponds to For example, the bottom surface of the rectangular hole 6 (or the rectangular hole opening portion) is divided into four sides. Each of the hole side members 11 is provided with a split type small piece member 61 which is detachably attachable to the hole side surface member 11, and the divided type small piece member 61 corresponds to the side surface of the hole 6 and the sliding surface of the hole side member 11. Further, each of the divided hole side members 11 is provided with a sheet pressing mechanism 62 that presses the small piece member 61 in the hole direction. According to the fourth embodiment having the above configuration, first, the upper and lower molds 15 and 1 are clamped, whereby the front end faces of the small pieces 61 of the hole side member 11 and the surface of the substrate provided on the upper mold are supplied. contact. In this state, the electronic component mounted on the substrate is immersed in the resin material 7 of the heated melted hole 6, and then the hole bottom member 10 is moved upward, whereby the necessary resin pressure can be applied to the resin in the hole 6. . Further, the small-piece member 61 may have a configuration in which at least the sliding surface of the hole-containing side member 11 is included. (Regarding the sheet pressing mechanism) In the fourth embodiment, as shown in Fig. 7B, the sheet pressing mechanism 62 that presses the small-piece member 61 against the hole bottom surface member 1 is required to be disposed on the split-hole side member 11 The accommodating space 63 formed by the space. Further, the sheet 28 200901341 is provided with the sheet pressing member 64, the elastic member 65, and the locking portion 66 of the locking elastic member 65. The sheet pressing member 64 transmits the small piece through the opening portion 69 provided on the front end side of the accommodating space 63. The member 61 is a compression spring or the like that presses the pressing member 64. Therefore, the hole pressing member 64 (elastic 5 member 65) can be used to press the hole bottom member 1 through the small piece member 61 (the compression molding method and the effect of the electronic component according to the fourth embodiment). The die, the die pressing mechanism 62, can press the small-diameter member 61 constituting each of the divided hole side members 10 with the necessary pressing force on the hole bottom member 10, thereby effectively preventing the gap between the small-piece member 61 and the hole bottom member 10. (The sliding portion 14) generates a gap or forms a foreign matter, so that the hole bottom member 10 can be used to effectively pressurize the resin in the lower mold hole 6. Further, according to the fourth embodiment, in the case where the release film is not used, the sliding failure of the hole bottom member 10 can be prevented, and the productivity of the product can be effectively improved. The sliding surface of the small piece member 61, as shown by $7A®, is constructed such that the sliding surface of the hole side member 11 protrudes only by the distance c. Further, the sliding surface of the small piece member 61 is provided with a release treatment layer 67 which can improve mold release property or a slide treatment layer 67 which can improve slidability. At this time, the release treatment layer 67 or the sliding treatment layer 67 can form a fluorine-based surface treatment agent such as Teflon (registered trademark). By the provision of the release treatment layer 67 or the sliding treatment layer 67, it is possible to effectively prevent the sheet member 61 from forming a foreign matter with the aperture bottom member (the sliding portion 14). Further, as shown in Fig. 7C, a sealing member 68 such as a gas sealant such as Tie Dunlong (registered trademark) can be used as necessary for the sliding surface of the hole bottom member 1A. By providing the above-described sealing member 68, it is possible to effectively prevent a gap from being formed between the sheet member 61 and the hole bottom member 10. Further, the release treatment layer 67 (or the sliding treatment layer 67) may be used in combination with the sealing member 68. [Fifth Embodiment]

5 接著，詳細說明本發明第五實施形態。第8A圖及第8B 圖顯示第五實施形態的電子零件之壓縮成形用模具，第9A 圖及第9B圖顯示該模具要部之小片構件按壓機構。 (關於第五實施形態的電子零件之壓縮成形用模具構 成） 10 如第8A圖及第8B圖所示，第五實施形態的電子零件之 壓縮成形用模具設有固定之上模具卜以及與該上模具相對 向配置之可動下模具2。上模具1之模面設有基板設置部5， 基板設置部5係用以在使電子零件3朝下方之狀態下，供給 設置已安裝電子零件3之基板4者。 15 又，下模具2設有壓縮成形用孔6，並設有對該孔6内供 給樹脂材料（7 )(例如顆粒狀樹脂材料）之樹脂材料供給 機構8，而可由朝孔6上方開口之孔開口部9 (圖式之實施形 態中，為平面具有4邊之矩形）對孔6内供給樹脂材料（7)。 又，雖未圖示，模具（上下兩模具）1、2設有可將模 20 具1、2加熱至必要模具溫度的加熱機構、以及以必要合模 壓力將模具1、2合模之合模機構。 又，下模具孔6設有構成該孔6之底面的孔底面構件 10、以及構成該孔6之底面外周圍的側面的孔側面構件（前 壓塊）。 30 200901341 再者，本實施形態中，如第8B圖所示，由平面觀之， 孔周圍構件係對應例如孔底面構件10之矩形孔6的底面（或 矩开》孔開口部9的4個邊）之四邊而分割，藉此形成4個分割 之孔側面構件11 (外周箝位器）。 5 又’孔底面構件10構造成固設於基台12，並於4個分割 孔側面構件11與基台12間分別設置壓縮彈簧等彈性構件 13 °而’分割孔側面構件11之滑動面與孔底面構件1〇之滑 動面間會形成滑動部14。 本實施形態中，藉具有上述構成，首先，如第8A圖所 10 一 不，於上模具1之基板設置部5供給設置已安裝電子零件3之 基板4，並於該狀態下，對下模具孔6内供給樹脂材料7並將 以加熱融化。接著，將模具丨、2合模，藉此使孔側面構件 (前壓塊）11之各前端面與供給設置於上模具丨之基板設置 部5的基板4表面接觸。在該狀態下，使孔底面構件1〇向上 方移動，藉此可對在下模具孔6内已加熱融化之樹脂施加必 要樹脂壓。故，在經過硬化所需之必要時間後，可將已安 農於基板4之電子零件3填封成形於與下模具孔6之形狀對 應的樹脂成形體15内。 (關於孔側面構件） 20 又，經分割之孔側面構件11設有可以必要按壓力將孔 側面構件11朝孔底面構件丨0按壓之按壓機構（後述之空氣 壓送機構）。 具體而s，如第9A圖及第9B圖所示，經分割之孔側面 構件11 (本體lla)設有按壓孔底面構件1〇小片構件71，而 31 200901341 該小片構件71係相對孔側面構件本體iia呈可自由拆裝。 且，設有可將該小片構件71朝孔6側之方向按壓的小片構件 按壓機構（後述之空氣壓送機構72)。 又，小片構件71設有將小片構件71朝按壓方向（孔6 5侧之方向）引導的引導部71a ’且可相對分割孔側面構件之 本體11a以引導部71a將小片構件71朝按壓方向按壓而僅滑 動些許。藉該構成’可利用小片構件按壓機構72以必要按 壓力將分割孔側面構件11之滑動面（具有引導部71a之小片 構件71的滑動面）朝孔底面構件1〇之滑動面按壓。 10 故，相對經分割之孔側面構件11使孔底面構件1〇朝上 方移動來加壓孔6内之樹脂時，可用必要按壓力將分割孔側 面構件11之小片構件71的滑動面朝孔底面構件1〇之滑動面 按壓。結果，可防止孔側面構件U (小片構件71)之滑動 面與孔底面構件10之滑動面間（滑動部14)產生間隙。 15 而，孔底面構件10之移動方向與分割孔側面構件11之 按壓方向係例如互相垂直。 (關於小片構件按壓機構） 又，如第9A圖及第9B圖所示，孔側面構件η之本體lla 與小片構件71間以必要之間隔形成微小之間隙73。又，該 20間隙73，係在經常與孔側面構件11之本體11a與小片構件71 接觸的狀態下，或在經常被夾持的狀態下，配設有〇環等阻 隔外氣用之密封構件74。藉該構造，間隙73可藉密封構件 74在將間隙73之内部以密封構件74包圍之狀態下，形成外 氣阻隔用空間部（空氣按壓用空間部75 )。 32 200901341 …又’分割孔側面構_之本體Ua於複數處設有壓縮空 氣等流體的壓縮流體之壓送路徑％。該屋适路以'' 側連継於設在密封構綱形成之外氣 側之壓縮^壓送用的開口部，同時另1側連通連接於 利用m越之壓力的空氣泵等流體壓％ ，且談 流體壓送機構72係成為小片構件按壓機構。 以 10 15 20 件之舉例言之，於間隙〜孔側面構 件之本體Ha與小片構件71經常夹持環狀軸構件Μ，形成 外乱阻隔空間部75。環狀密封構件74係以包 壓送路徑76的開^之狀態《。制構造，以氣壓送 =72透過壓送物6來細 75屢送，藉此可產“衫壓力，城奶壓力產生之必 P壓力，將小片構件71以必要按壓力朝孔6側之方向對孔 底面構件10按壓。 、、=藉_態’可以必要按壓力將小片_之 :=孔底面構件10之滑動面按壓，而可有效地防止經 二=構件U(小片構件71)與孔底面 動部丨4)形成間隙。 (關於將樹脂成形體脫模後移動孔底面構件） :實施形態中’進―步將已安裝於基板4之電子零件3 門；:成形於樹脂成形體15内，將模具（上下兩模具卜2) 件Γ〇朝並由下财孔6將細成形體15脫模後，使孔底面構 朝下方移動來回到原先之位置。 舉例言之，朝孔底面構件1〇之上下方向移動時，一般 33 200901341 在採用按壓孔底面構件10之按壓機構的情形下，由於是在 以分割孔側面構件u (小片構件71)來按壓孔底面構件1〇 的狀態下使孔底面構件10朝下方移動，因此孔底面構件1〇 有時會產生滑動不良。又，此時，無法有效地防止孔底面 5構件1〇與孔側面構件11 (小片構件7!)之滑動面！4所產生 的磨耗。 I·隹’本實施形通中’可解除因空氣麗送機構72所產生 的對小片構件71 (經分割之孔側面構件u)之按塵。故， 可解除因空氣壓送機構72所產生的小片構件71 (孔側面構 10件對孔底面構件10之按壓，並在不觀孔底面構件1〇 之狀態下，使孔底面構件10朝下方移動，因此可有效地防 止孔底面構件10產生的滑動不良。 又’使孔底面構件10朝上方移動時’以分割孔側面構 _(小片構件7〇按壓孔底面構件1〇，並使孔底面構件 朝下方移動時，由於可剌料分側面構件U按壓 孔底面構件Η)之構成，因此可有效地防止孔底面構件職 生的磨耗。 故’本實施形態中，加壓下模具孔6内之樹脂時，可壓 运空氣來按壓小片構件71 (經分割之孔側面構件⑴，藉此 2〇在以必要按壓力利用小片構件按壓孔底面構件10之^離 I ’使孔底面構⑽朝上方㈣，且，在由下模具偏内將 樹脂成形體脫模後，解除堡縮空氣之壓送，而在不以小片 構件71 (經分割之孔側面構件u)按壓孔底面構件之狀 態下，使孔底面構件10朝下方移動。 34 200901341 (電子零件之壓縮成形方法） 本實施形態的電子零件之壓縮成形方法中，首先，如 第8A圖所示，將已安裝電子零件3之基板4供給設置於上模 具1之基板設置部5，並以樹脂材料之供給機構8將樹脂材料 5 7 (例如顆粒狀樹脂材料）供給至下模具孔6内，再加熱使 其融化。接著，將上下兩模具j2合模，藉此將經分割之 孔側面構件11之前端面與供給設置於上模具丨之基板4表面 接合。在該狀態下，將已安裝於基板4之電子零件3浸潰於 已在下模具孔6内加熱融化之樹脂。 1〇 接著，將孔底面構件10朝上方移動，藉此將模具孔6 内之樹脂加壓。該利用孔底面構件1〇進行之樹脂加壓步驟 中，係藉空氣壓送機構72將空氣透過壓送路徑76壓送至間 隙乃所形成之空間部75。藉此，可用必要空氣壓力產生的 必要按壓力而利用經分割之孔側面構件u (小片構件71) 15 來按壓孔底面構件10。 、如此-來，藉第五實施形態之按壓機構，可在用必要 按壓力而利用經分割之孔底面構件1〇 (小片構件71)之滑 動面來按壓孔底面構件10之滑動面的狀態下，使孔底面構 件1〇朝上方移動，對下模具孔6内之樹脂施加必要樹脂壓。 20故，可有效地防止經分割之孔側面構件_滑動面與孔底 面構件10之滑動面間形成的滑動部14產生間隙。 經過樹脂材料硬化必要之時間後，將模具工、2開模， 2此可形成填封於與下模具孔6形狀對應之樹脂成形體15 内的電子零件3。 35 200901341 如前所述，本實施形態中，以孔底面構件10加壓時， 在用空氣壓送機構72將經分割之孔側面構件丨丨分別以必要 按壓力按壓孔底面構件1〇時’可藉孔底面構件1〇對孔6内之 樹脂施加必要樹脂壓。故，藉本實施形態，矸有效地防止 5孔底面構件10與孔側面構件11間所形成之滑動部14產生間 隙。 故，可有效地防止該間隙（滑動部14)形成異物，因 此可有效地用孔底面構件1 〇加麼孔6内之樹脂。 又，本實施形態中，如前所述，由於玎有效地防止孔 10 底面構件10與分割孔側面構件11之間隙（滑動部14)形成 異物，因此可減少定期分解清掃模具之情事。故，可有效 地提高產品（樹脂成形體15)之成品率，且可降低產品生 產之時間損失，因此可有效地提高產品之生產性。 又，本實施形態中，可藉防止孔底面構件10與分割孔 15 侧面構件11之間隙（滑動部14)產生異物來防止孔底面構 件10之滑動不良，結果，可有效地用孔底面構件1〇加壓孔6 内之樹脂。 又，藉第五實施形態，由於是不使用脫模膜，且可有 效地防止孔底面構件10之滑動不良的構成’因此可用孔底 20面構件10有效地加壓孔6内之樹脂’因此可有效地使產品之 生產性提高。 而，小片構件71之滑動面設有可提高脫模性之脫模處 理層或可提高滑動性之滑動處理層。此時’脫模處理層或 滑動處理層可形成例如鐵氟龍（登錄商標）荨氟糸表面處 36 200901341 理劑。藉該構造，可有效地防μ 1ΛΒΘ 文地防止小片構件71與孔底面構件 關形成之間隙（滑動部14)形成異物。 彳於孔底面構件1G之滑動面的必要處設置密封構 例如鐵氟龍（登錄商標）等氟系密封劑。藉設置上 ^封劑可有^地防止小片構件71與孔底面構件關產 隙巾，脫處理層（或滑動處理層）亦可併用密封 樽仵。 至此已詳細制切明，㈣絲例說明，並未構成 限疋，相信應可清楚理解發明 Λ — 毛月之祀圍應由申請專利範圍限 10 又0 【圏式簡單説明】 第1Α圖及第1Β圖係概 知本發料—實施形態之 书子零件之壓縮成形用模且 ΜΜ.Λ ΛΛ4Β. 、、电子令件之樹脂填封成形用 模具）的概略縱剖面圖，第 15 ^ 弟1Α圖係本發明第一實施形能之 = 牛之壓縮成形用模具的開模狀態之概略縱剖面二 略料第ΓαΓ之合模狀態的概略縱剖面圖，第1C圖係概 第1Α圖所示之下模具模面的概略平面圖。 第2Α圖係擴大地概略顯示第1Α圖所示之模具要部的 20 擴錢略剖面圖，顯示以孔底面構件加壓孔内之樹脂前的 狀悲，第2β圖係擴大地概略顯示第⑴圖所示之模具要部的 擴大概略剖面圖，顯示以孔底面構件加壓了孔内之樹脂的 狀態。 第3八圖、第3Β圖係擴大地概略顯示本發明第一實施形 態其中~變形例之電子零件之壓縮成形用模具要部的擴大 37 200901341 概略剖面圖，第3 A圖顯示以孔底面構件加壓孔内之樹脂前 的狀態’而第3B圖則顯示以孔底面構件加壓了孔内之樹脂 的狀態。 第4A圖、第4B圖係擴大地概略顯示本發明第一實施形 5態另一變形例之電子零件之壓縮成形用模具要部的擴大概 略剖面圖，第4A圖顯示以孔底面構件加壓孔内之樹脂前的 狀態’而第4B圖則顯示以孔底面構件加麼了孔内之樹脂的 狀態。 第5 A圖係概略顯示本發明第二實施形態之電子零件之 10 壓縮成形用模具的開模狀態之概略縱剖面圖，第5B圖係概 略顯示第5A圖所示之下模具模面的概略平面圖，而第5C圖 則係擴大地概略顯示第5A圖所示之模具要部的擴大概略縱 剖面圖。 第6A圖係概略顯示本發明第三實施形態之電子零件之 15壓縮成形用模具的開模狀態之概略縱剖面圖，第6B圖及第 6C圖係擴大地概略顯示第6A圖所示之模具要部的擴大概 略縱剖面圖，第6B圖顯示以孔底面構件加壓孔内之樹脂前 的狀態，而第6C圖則顯示以孔底面構件加壓了孔内之樹脂 的狀態。 20 第7A圖係擴大地概略顯示本發明第四實施形態之電子 零件之壓縮成形用模具要部的擴大概略縱剖面圖，第78圖 係擴大地概略顯示第7 A圖所示之模具要部的擴大概略縱剖 面圖，而第7C圖則係擴大地概略顯示本發明第四實施形態 其中一變形例的電子零件之壓縮成形用模具要部的擴大概 38 200901341 略縱剖面圖。 第8 A圖係概略顯示本發明第五實施形態之電子零件之 麗縮成形用;替a γ ^ ^辑具（電子零件之樹脂填封成形用模具）的開 模狀L之概略縱剖面圖’第8Β係概略顯示第8Α圖所示之下 5模具模面的概略平面圖。 第9Α圖係擴大地概略顯示第8Α圖所示之模具要部的 擴大概略縱剖面圖，顯示孔底面構件之位置，第9Β圖係擴 大地概略顯示與第9Α圖所示之模具對應之模具要部的擴大 概略縱剖面圖，顯示以孔底面構件對孔内之樹脂加壓之狀 10 態。 第10Α圖係概略顯示習知電子零件之壓縮成形用模具 (上下兩模具）中，包含下模具孔之下模具面的概略平面 圖’第10Β圖係擴大地概略顯示第10Α圖所示之下模具要部 的擴大概略縱剖面圖，顯示下模具孔内之孔底面構件的、、两 15 動不良狀態。 【主要元件符號說明】 1".上模具 2…下模具 3.. .電子零件 4…反 5.. .基板設置部 6·.·孔 7·.·樹脂材料 8…樹脂材料之供給機構 9···孔開口部 ίο...孔底面構件 11. · ·孔側面構件 12··.基台 13.· •彈性構件 14··_滑動部 39 200901341 15.. .樹脂成形體 21…第一按壓機構 22.. .收容空間 23…長孔 24…棒材 25.. ·壓縮彈簣 26.. .棒材卡止部 27.. .收容空間卡止部 28…第二内部按壓機構 29…圓形彈簧（彈性構件) 31…第三内部按壓機構 32.. .貫通孔 33…棒材 36.. .第一外部按壓機構 37…加壓構件 38.. .導引棒 40…球狀柱塞 41…球構件 42.. .壓縮彈簧 43.. .收容空間 44…球狀柱塞本體 45.. .箱體斜面部 46.. .螺絲部 47.. .開口部 50.. .第二外部按壓機構 51…外部按壓構件 52" ·卡止插銷 53.. .凸部 54".溝部 61…小片構件 62…片按壓機構 63.. .收容空間 64.. .片按壓機構 65…壓缩彈簧 66.. .卡止部 67···脫模處理層 68…密封構件 69.. .開口部 405 Next, a fifth embodiment of the present invention will be described in detail. Figs. 8A and 8B are views showing a mold for compression molding of an electronic component according to a fifth embodiment, and Figs. 9A and 9B are views showing a small-piece member pressing mechanism of the main part of the mold. (Molding of a mold for compression molding of an electronic component according to the fifth embodiment) 10 As shown in Figs. 8A and 8B, the mold for compression molding of the electronic component according to the fifth embodiment is provided with a fixing die and the same The upper mold 2 is disposed opposite to the movable mold 2. The substrate surface of the upper mold 1 is provided with a substrate mounting portion 5 for supplying the substrate 4 on which the electronic component 3 is mounted with the electronic component 3 facing downward. Further, the lower mold 2 is provided with a compression molding hole 6 and is provided with a resin material supply mechanism 8 for supplying a resin material (7) (for example, a granular resin material) into the hole 6, and is openable above the hole 6. The hole opening portion 9 (in the embodiment of the drawing, a rectangle having four sides in a plane) is supplied with a resin material (7) into the hole 6. Further, although not shown, the mold (upper and lower molds) 1 and 2 are provided with a heating mechanism capable of heating the molds 20 and 2 to the necessary mold temperature, and clamping the molds 1 and 2 at the necessary mold clamping pressure. Modular mechanism. Further, the lower die hole 6 is provided with a hole bottom surface member 10 constituting the bottom surface of the hole 6, and a hole side surface member (front pressing block) constituting a side surface of the outer periphery of the bottom surface of the hole 6. 30 200901341 In the present embodiment, as shown in Fig. 8B, the surrounding members of the hole correspond to, for example, four of the bottom surfaces (or the moment opening) of the rectangular holes 6 of the hole bottom member 10. The four sides are divided into four sides, thereby forming four divided hole side members 11 (outer circumference clamps). 5, the 'hole bottom member 10 is configured to be fixed to the base 12, and an elastic member 13 such as a compression spring is disposed between the four divided hole side members 11 and the base 12, and the sliding surface of the divided hole side member 11 is A sliding portion 14 is formed between the sliding surfaces of the hole bottom member 1A. In the present embodiment, by the above configuration, first, as shown in FIG. 8A, the substrate 4 on which the electronic component 3 is mounted is supplied to the substrate mounting portion 5 of the upper mold 1, and in this state, the lower mold is placed. The resin material 7 is supplied into the hole 6 and will be melted by heating. Next, the molds 丨 and 2 are closed, whereby the front end faces of the hole side members (front press blocks) 11 are brought into contact with the surface of the substrate 4 supplied to the substrate installation portion 5 of the upper mold 。. In this state, the hole bottom member 1〇 is moved upward, whereby a necessary resin pressure can be applied to the resin which has been heated and melted in the lower die hole 6. Therefore, after the necessary time required for the hardening, the electronic component 3 that has been implanted on the substrate 4 can be filled and formed in the resin molded body 15 corresponding to the shape of the lower die hole 6. Further, the divided side surface member 11 is provided with a pressing mechanism (an air pressure feeding mechanism to be described later) that can press the hole side surface member 11 toward the hole bottom surface member 丨0 by a pressure. Specifically, as shown in FIGS. 9A and 9B, the divided hole side member 11 (body 11a) is provided with a pressing hole bottom member 1〇 small piece member 71, and 31 200901341 the small piece member 71 is a relative hole side member The body iia is freely disassemblable. Further, a small piece member pressing mechanism (air pressure feeding mechanism 72 to be described later) capable of pressing the small piece member 71 in the direction of the hole 6 side is provided. Further, the small piece member 71 is provided with a guide portion 71a' that guides the small piece member 71 in the pressing direction (the direction of the hole 65 side) and can press the small piece member 71 toward the pressing direction with the guide portion 71a with respect to the body 11a of the divided hole side member. Just slide a little. According to this configuration, the small-piece member pressing mechanism 72 can press the sliding surface of the split-hole side member 11 (the sliding surface of the small-piece member 71 having the guide portion 71a) toward the sliding surface of the hole bottom member 1A by the pressure. Therefore, when the hole bottom surface member 11 is moved upward to press the resin in the hole 6 with respect to the divided hole side member 11, the sliding surface of the small piece member 71 of the divided hole side member 11 can be pressed toward the bottom surface of the hole by the necessary pressing force. The sliding surface of the member 1 is pressed. As a result, it is possible to prevent a gap between the sliding surface of the hole side member U (small piece member 71) and the sliding surface of the hole bottom member 10 (sliding portion 14). Further, the moving direction of the hole bottom member 10 and the pressing direction of the split hole side member 11 are, for example, perpendicular to each other. (Thin member pressing mechanism) Further, as shown in Figs. 9A and 9B, a minute gap 73 is formed between the main body 11a of the hole side member η and the small piece member 71 at necessary intervals. Further, the 20-gap 73 is provided in a state in which the main body 11a of the hole side member 11 is in contact with the small-piece member 71, or in a state in which it is often clamped, and a sealing member for blocking the outside air such as an ankle ring is disposed. 74. With this configuration, the gap 73 can be formed by the sealing member 74 in a state where the inside of the gap 73 is surrounded by the sealing member 74, and the outer air blocking space portion (the air pressing space portion 75) can be formed. 32 200901341 ... The body Ua of the 'divided hole side structure_ is provided with a pressure feed path % of a compressed fluid that compresses a fluid such as air at a plurality of points. The house is connected to the opening for compression and pressure feeding on the gas side outside the seal formation, and the other side is connected to the fluid pressure such as an air pump using the pressure of m. Further, the fluid pressure feed mechanism 72 is referred to as a small piece member pressing mechanism. In the example of 10 15 20 pieces, the body Ha and the small piece member 71 of the gap-to-hole side member often sandwich the annular shaft member Μ to form the outer disorder space portion 75. The annular seal member 74 is in a state in which the pressure feed path 76 is opened. The structure is sent by air pressure = 72 through the pressure feed 6 to send 75 times, thereby producing "shirt pressure, the pressure of the P generated by the pressure of the city milk, and the small piece member 71 is directed to the side of the hole 6 with the necessary pressing force. Pressing the hole bottom member 10. The pressing state of the hole bottom member 10 can be pressed by the pressing force of the hole bottom member 10, and the second member U (small member 71) and the hole can be effectively prevented. The bottom surface moving portion 丨 4) forms a gap. (Removing the hole bottom member after demolding the resin molded body): In the embodiment, the electronic component 3 that has been mounted on the substrate 4 is advanced; the resin molded body 15 is molded. Inside, the mold (upper and lower molds 2) are smashed and the fine molded body 15 is demolded by the lower hole 6, and the bottom surface of the hole is moved downward to return to the original position. For example, the bottom surface of the hole When the member 1 is moved up and down, generally 33 200901341 in the case where the pressing mechanism of the pressing hole bottom member 10 is employed, since the hole bottom member 1 is pressed by the split hole side member u (the small piece member 71) The bottom surface member 10 is moved downward, so the bottom of the hole In the case of the member 1〇, sliding failure may occur. Further, at this time, the wear of the sliding surface of the hole bottom surface member 5 and the hole side surface member 11 (small piece member 7!) cannot be effectively prevented. In the present embodiment, the dust of the small piece member 71 (the divided hole side member u) generated by the air delivery mechanism 72 can be released. Therefore, the small piece member 71 generated by the air pressure feeding mechanism 72 can be released. (The hole side surface 10 is pressed against the hole bottom surface member 10, and the hole bottom surface member 10 is moved downward without observing the hole bottom surface member 1b, so that the sliding failure of the hole bottom surface member 10 can be effectively prevented. Further, 'when the hole bottom member 10 is moved upwards', the side surface of the split hole is configured to be _ (the small piece member 7 〇 presses the hole bottom surface member 1 〇, and when the hole bottom surface member moves downward, the side member U presses the hole Since the bottom member Η) is configured, the wear of the hole bottom member can be effectively prevented. Therefore, in the present embodiment, when the resin in the lower mold hole 6 is pressurized, the air can be pressed to press the small member 71 (divided) Hole side member (1) By using the small member to press the hole bottom surface member 10 at the required pressing force, the hole bottom surface structure (10) is directed upward (four), and after the resin molded body is demolded from the lower mold side, the relief is released. In the state where the hole bottom member is pressed by the small piece member 71 (the divided hole side member u), the hole bottom surface member 10 is moved downward. 34 200901341 (Compression molding method for electronic parts) This embodiment In the compression molding method of the electronic component of the form, first, as shown in FIG. 8A, the substrate 4 on which the electronic component 3 is mounted is supplied to the substrate installation portion 5 provided in the upper mold 1, and the resin is supplied by the resin supply mechanism 8. Material 5 7 (for example, a particulate resin material) is supplied into the lower mold hole 6 and heated to be melted. Next, the upper and lower dies j2 are clamped, whereby the front end surface of the divided hole side member 11 is joined to the surface of the substrate 4 supplied to the upper mold 。. In this state, the electronic component 3 already mounted on the substrate 4 is immersed in the resin which has been heated and melted in the lower die hole 6. 1〇 Next, the hole bottom member 10 is moved upward, thereby pressurizing the resin in the die hole 6. In the resin pressurizing step by the hole bottom surface member 1A, the air pressure feed mechanism 72 presses the air through the pressure feed path 76 to the space portion 75 formed by the gap. Thereby, the hole bottom member 10 can be pressed by the divided hole side member u (small piece member 71) 15 by the necessary pressing force generated by the necessary air pressure. According to the pressing mechanism of the fifth embodiment, the sliding surface of the hole bottom surface member 10 can be pressed by the sliding surface of the divided hole bottom surface member 1 (the small piece member 71) with the necessary pressing force. The hole bottom member 1〇 is moved upward, and a necessary resin pressure is applied to the resin in the lower die hole 6. Therefore, it is possible to effectively prevent the gap between the divided side member _ sliding surface and the sliding portion formed between the sliding surfaces of the hole bottom member 10 from being generated. After the resin material has been hardened for a period of time, the molder and the mold are opened, and the electronic component 3 filled in the resin molded body 15 corresponding to the shape of the lower mold hole 6 can be formed. 35 200901341 As described above, in the present embodiment, when the hole bottom surface member 10 is pressurized, when the divided hole side member 丨丨 is pressed by the air pressure feeding mechanism 72 with the required pressing force, respectively, ' The necessary resin pressure can be applied to the resin in the hole 6 by the hole bottom member 1〇. Therefore, according to the present embodiment, the gap is effectively prevented from occurring in the sliding portion 14 formed between the 5-hole bottom member 10 and the hole side member 11. Therefore, it is possible to effectively prevent the gap (sliding portion 14) from forming foreign matter, so that the resin in the hole 6 can be efficiently applied by the hole bottom member 1. Further, in the present embodiment, as described above, since the foreign matter is effectively prevented from forming a foreign matter in the gap (sliding portion 14) between the bottom surface member 10 of the hole 10 and the side surface member 11 of the split hole, it is possible to reduce the situation in which the cleaning mold is periodically decomposed. Therefore, the yield of the product (resin molded body 15) can be effectively improved, and the time loss of product production can be reduced, so that the productivity of the product can be effectively improved. Further, in the present embodiment, it is possible to prevent the sliding of the hole bottom surface member 10 by preventing foreign matter from occurring in the gap (sliding portion 14) between the hole bottom surface member 10 and the side surface member 11 of the dividing hole 15 and, as a result, the hole bottom member 1 can be effectively used.树脂 Resin in the pressure hole 6. Further, according to the fifth embodiment, since the release film is not used and the sliding failure of the hole bottom member 10 can be effectively prevented, the hole bottom surface member 10 can effectively press the resin in the hole 6. It can effectively improve the productivity of the product. On the other hand, the sliding surface of the small piece member 71 is provided with a release treatment layer which can improve mold release property or a slide treatment layer which can improve slidability. At this time, the release-treatment layer or the sliding treatment layer can form, for example, a Teflon (registered trademark) fluorene-fluorene surface. With this configuration, it is possible to effectively prevent the gap between the small-piece member 71 and the hole bottom member from being formed (sliding portion 14) from forming foreign matter. A sealing structure such as a fluorine-based sealant such as Teflon (registered trademark) is provided in a place where the sliding surface of the hole bottom member 1G is required. The sealing agent can be used to prevent the small piece member 71 and the bottom surface member from closing the gap, and the release layer (or the sliding treatment layer) can also be used in combination with the sealing layer. So far, the detailed system has been clearly cut out. (4) The silk case description does not constitute a limit. It is believed that the invention should be clearly understood. The scope of the application should be limited to 10 and 0. [Simplified explanation] 1 Β 系 概 概 概 概 概 概 概 概 概 概 概 概 概 概 概 概 概 概 概 概 概 概 概 概 概 概 概 概 概 概 概 概 概 概 概 概 概 概 概 概 概 概 概 概 概 概 概 概 概 概 概 第 第 第Fig. 1 is a schematic longitudinal cross-sectional view showing a mold clamping state of a mold for compression molding of a cow, and a schematic longitudinal section of a mold clamping state of the mold opening mold, and Fig. 1C is a schematic view of the first embodiment A schematic plan view of the mold face below. In the second diagram, the outline of the 20-throw expansion of the main part of the mold shown in the first drawing is shown in an enlarged manner, and the second step of the second bottom view is shown in the enlarged view of the resin in the hole. (1) An enlarged schematic cross-sectional view of the main part of the mold shown in the figure, showing a state in which the resin in the hole is pressed by the bottom member of the hole. In the first embodiment of the present invention, the expansion of the main part for the compression molding of the electronic component according to the first modification of the present invention is shown in FIG. 3, which is a schematic cross-sectional view of the main part, and the third embodiment shows the bottom surface member. The state before the resin in the pressure hole is '', and the 3B figure shows the state in which the resin in the hole is pressurized by the hole bottom member. 4A and 4B are enlarged schematic cross-sectional views showing the main part of the mold for compression molding of the electronic component according to another modification of the fifth embodiment of the present invention, and FIG. 4A shows the pressing of the bottom member of the hole. The state before the resin in the hole' and the Fig. 4B show the state in which the resin in the hole is added by the bottom member of the hole. Fig. 5A is a schematic longitudinal cross-sectional view showing a mold opening state of a 10 compression molding die for an electronic component according to a second embodiment of the present invention, and Fig. 5B is a schematic view showing a schematic view of a lower mold surface shown in Fig. 5A. In the plan view, the 5C plan is an enlarged schematic longitudinal sectional view showing the main part of the mold shown in Fig. 5A in an enlarged manner. 6A is a schematic longitudinal cross-sectional view showing a mold opening state of a 15 compression molding die for an electronic component according to a third embodiment of the present invention, and FIGS. 6B and 6C are enlarged views schematically showing a mold shown in FIG. 6A. In the enlarged longitudinal cross-sectional view of the main portion, FIG. 6B shows a state before the resin in the hole is pressed by the hole bottom member, and FIG. 6C shows a state in which the resin in the hole is pressed by the hole bottom member. 20A is an enlarged schematic longitudinal cross-sectional view showing a main part of a mold for compression molding of an electronic component according to a fourth embodiment of the present invention, and an enlarged view of the main part of the mold shown in Fig. 7A. FIG. 7C is an enlarged longitudinal sectional view showing an enlarged portion of a main part for compression molding of an electronic component according to a modification of the fourth embodiment of the present invention. Fig. 8A is a schematic longitudinal cross-sectional view showing the mold opening L of the electronic component according to the fifth embodiment of the present invention, and the mold opening L of the γ ^ ^ tool (the mold for resin encapsulation molding of the electronic component). The '8th 概略 series outlines a schematic plan view of the 5 mold faces below the 8th drawing. The ninth drawing is an enlarged schematic longitudinal sectional view showing the main part of the mold shown in Fig. 8 and showing the position of the bottom surface member. The ninth drawing is an enlarged view showing the mold corresponding to the mold shown in Fig. 9 . An enlarged schematic longitudinal cross-sectional view of the main portion shows a state in which the resin in the hole is pressurized by the bottom member of the hole. Fig. 10 is a schematic plan view showing a mold for compression molding of a conventional electronic component (upper and lower molds), including a mold surface below the lower die hole. Fig. 10 is an enlarged schematic view showing the mold shown in Fig. 10 The enlarged longitudinal section of the main part shows the state of the bottom surface of the hole in the lower die hole. [Description of main component symbols] 1". Upper mold 2... Lower mold 3.. Electronic parts 4...Reverse 5.. Substrate setting part 6.·. Hole 7·.·Resin material 8...Resist material supply mechanism 9 ··· hole opening part ίο... hole bottom surface member 11. · hole side member 12··. base 13··•elastic member 14··_sliding portion 39 200901341 15.. resin molded body 21... A pressing mechanism 22: a receiving space 23... a long hole 24... a bar 25: a compression cartridge 26: a bar locking portion 27: a receiving space locking portion 28... a second inner pressing mechanism 29 ...round spring (elastic member) 31...third inner pressing mechanism 32.. through hole 33...bar material 36.. first outer pressing mechanism 37...pressing member 38.. guiding rod 40...spherical Plunger 41...ball member 42.. compression spring 43.. accommodating space 44...ball plunger body 45.. box slope portion 46.. screw portion 47.. opening portion 50.. 2 external pressing mechanism 51... external pressing member 52" locking latch 53.. convex portion 54" groove portion 61... small piece member 62... sheet pressing mechanism 63.. housing space 64.. sheet pressing mechanism 65... compression Spring 66 .. The locking portion 67 ????? releasably treated layer 69 .. 68 ... seal member opening part 40

Claims (1)

200901341 十、申請專利範圍： 1·一種電子零件之壓縮成形方法，包含有： 設置步驟，係將已安裝電子零件之基板，供給設置於 壓縮成形用模具之基板設置部； 供給步驟，係將樹脂材料供給至前述模具之模且孔内. 2步驟，係將已供給至前述模具孔内之樹脂材料加 熱亚使其融化； 10 15 20 浸潰步驟，係將前述模具合模，藉此將前述電子 浸潰於W述模具孔内已融化之樹脂；及 壓縮細彡㈣’係在已將前述電子料料 之樹脂的狀態下’利用形成前述模具孔之底㈣孔底面構 件來縛前述模具孔内之樹脂，而對前述模 _ 施加必要樹難，藉此在前频具孔㈣前述電4= 裂於與前述模具孔之形狀對應的樹脂成形體内； 構成前述模具孔之側面的構件係使用與孔 各邊對應地分割之孔側面構件； - :親缩成形步驟中，利用前述孔底面構件對前述模 、孔内之Μ脂施加必要樹脂壓時，係將 面構件分別按壓至前述孔底面構件。° =申請專利範圍第丨項之電子零件之壓縮成形方法 ^用設於經分割之前述孔側面構件的各内部或㈣之^ 機構，將前述孔側面構件按壓至前述孔底面構件 ^申請專職圍第1狀電子料之_成㈣法，盆中 、；刀創之前述孔側面構件分別具有設置成可拆裝之小片、構 200901341 件，且前述小片構件至少包含與前述孔底面構件間之滑動 面； 利用前述孔底面構件對前述模具孔内之樹脂施加必要 樹脂壓時，係將前述小片構件之前述滑動面按壓至前述孔 5 底面構件。 4.如申請專利範圍第3項之電子零件之壓縮成形方法，其係 於利用前述孔底面構件對前述模具孔内之樹脂施加必要樹 脂壓時，對前述小片構件壓送壓縮空氣，藉此將前述小片 構件按壓至前述孔底面構件。 10 5. —種電子零件之壓縮成形裝置，包含有： 上模具； 下模具，係與前述上模具相對向地配置者； 基板設置部，係設於前述上模具，並供給已安裝電子 零件之基板者； 15 模具孔，係設於前述下模具，而作為壓縮成形用者； 孔底面構件，係形成前述模具孔之底面者； 孔側面構件，係形成前述模具孔之侧面，並分別與前 述孔底面構件之各邊對應地分割而設置者；及 按壓裝置，係將經分割之前述孔側面構件分別按壓至 20 前述孔底面構件者。 6. 如申請專利範圍第5項之電子零件之壓縮成形裝置，其中 前述按壓裝置由設於經分割之前述孔側面構件的内部或外 部之按壓機構所構成。 7. 如申請專利範圍第5項之電子零件之壓縮成形裝置，其係 42 200901341 於經分割之前述孔側面構件分別以可拆裝之方式設有至少 包含與前述孔底面構件間之滑動面的小片構件； 前述按壓裝置包含一將前述小片構件按壓至前述孔底 面構件之裝置。 5 8.如申請專利範圍第7項之電子零件之壓縮成形裝置，其中 經分割之前述孔側面構件分別具有： 孔侧面構件本體，係使前述小片構件滑動者； 壓送路徑，係設於前述孔側面構件本體，並具有用以 對前述孔側面構件本體與前述小片構件間形成之間隙壓送 10 壓縮空氣的開口部；及 密封構件，係包圍前述開口部且使前述間隙呈外氣阻 隔狀態者； 又，前述按壓裝置包含空氣壓送機構，該空氣壓送機 構係透過前述壓送路徑對前述間隙内之前述密封構件所包 15 圍之空間部壓送空氣者。 43200901341 X. Patent application scope: 1. A compression molding method for an electronic component, comprising: a setting step of supplying a substrate on which an electronic component has been mounted to a substrate installation portion provided in a mold for compression molding; and a supply step of resin The material is supplied to the mold of the mold and in the hole. In the second step, the resin material supplied into the hole of the mold is heated and melted; 10 15 20 the step of dipping, the mold is clamped, thereby The electron is immersed in the melted resin in the hole of the mold; and the compressed fine 彡 (4) is attached to the bottom hole member of the bottom (4) hole forming the mold hole by the resin of the electronic material. In the resin, it is difficult to apply the necessary mold to the mold, whereby the front frequency hole (4) is electrically deformed into a resin molded body corresponding to the shape of the mold hole; and the member constituting the side surface of the mold hole a hole side member that is divided corresponding to each side of the hole is used; - : in the pro-forming step, a necessary tree is applied to the mold and the resin in the hole by the hole bottom member In the case of the grease pressure, the surface members are respectively pressed to the hole bottom member. ° = compression molding method for electronic parts according to the scope of the patent application of the present invention, by applying the inner side of the divided side member of the hole or the mechanism of (4), pressing the side member of the hole to the bottom surface member of the hole to apply for a full-time The first type of electronic material is formed by the method of "fourth", and the hole side member of the knife has a small piece and a structure of 200901341 which are arranged to be detachable, and the small piece member includes at least a sliding portion with the bottom surface member of the hole. When the required resin pressure is applied to the resin in the die hole by the hole bottom member, the sliding surface of the die member is pressed against the bottom member of the hole 5. 4. The compression molding method for an electronic component according to claim 3, wherein when a required resin pressure is applied to the resin in the die hole by the hole bottom member, compressed air is pressure-fed to the die member, thereby The aforementioned small piece member is pressed to the aforementioned hole bottom member. 10 — A compression molding apparatus for an electronic component, comprising: an upper mold; a lower mold disposed to face the upper mold; and a substrate installation portion provided to the upper mold and supplied to the mounted electronic component a substrate hole; 15 a mold hole is provided in the lower mold as a compression molding; a bottom surface member is formed on a bottom surface of the mold hole; and a hole side member is formed on a side surface of the mold hole, and respectively Each of the sides of the hole bottom member is correspondingly divided and provided; and the pressing means presses the divided hole side members to the hole bottom member. 6. The compression molding apparatus for an electronic component according to claim 5, wherein the pressing means is constituted by a pressing mechanism provided inside or outside the divided side member of the hole. 7. The compression molding apparatus for an electronic component according to claim 5, wherein the split hole side member is detachably provided with a sliding surface at least including the bottom surface member. The pressing member includes a means for pressing the small piece member to the bottom surface member. 5. The compression molding apparatus for an electronic component according to claim 7, wherein the divided side surface members respectively have: a hole side member body for sliding the small piece member; and a pressure feeding path is provided in the foregoing a hole side member body having an opening for pumping 10 compressed air to a gap formed between the hole side member body and the small piece member; and a sealing member surrounding the opening portion and causing the gap to be in an external air barrier state Further, the pressing device includes an air pressure feeding mechanism that transmits air to the space portion surrounded by the sealing member 15 in the gap through the pressure feeding path. 43
TW097116617A 2007-05-29 2008-05-06 Compression molding method and device for electronic component TW200901341A (en)

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JP2007141640A JP2008296382A (en) 2007-05-29 2007-05-29 Compression-molding method for electronic component and metal mold
JP2008038892A JP5128309B2 (en) 2008-02-20 2008-02-20 Electronic component compression molding method and mold

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI573199B (en) * 2013-06-20 2017-03-01 Towa Corp Electronic component compression resin sealing method and compression resin sealing device
TWI645520B (en) * 2015-03-23 2018-12-21 日商Ｔｏｗａ股份有限公司 Resin sealing apparatus and resin sealing method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI573199B (en) * 2013-06-20 2017-03-01 Towa Corp Electronic component compression resin sealing method and compression resin sealing device
TWI645520B (en) * 2015-03-23 2018-12-21 日商Ｔｏｗａ股份有限公司 Resin sealing apparatus and resin sealing method
US10170346B2 (en) 2015-03-23 2019-01-01 Towa Corporation Resin sealing apparatus and resin sealing method

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