TWI376753B - - Google Patents
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- Publication number
- TWI376753B TWI376753B TW097116617A TW97116617A TWI376753B TW I376753 B TWI376753 B TW I376753B TW 097116617 A TW097116617 A TW 097116617A TW 97116617 A TW97116617 A TW 97116617A TW I376753 B TWI376753 B TW I376753B
- Authority
- TW
- Taiwan
- Prior art keywords
- hole
- mold
- resin
- electronic component
- compression molding
- Prior art date
Links
- 239000011347 resin Substances 0.000 claims description 154
- 229920005989 resin Polymers 0.000 claims description 154
- 238000003825 pressing Methods 0.000 claims description 144
- 230000007246 mechanism Effects 0.000 claims description 103
- 238000000748 compression moulding Methods 0.000 claims description 72
- 239000000758 substrate Substances 0.000 claims description 62
- 239000000463 material Substances 0.000 claims description 39
- 230000006835 compression Effects 0.000 claims description 18
- 238000007906 compression Methods 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 17
- 238000007789 sealing Methods 0.000 claims description 15
- 238000009434 installation Methods 0.000 claims description 11
- 238000010438 heat treatment Methods 0.000 claims description 6
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 230000004888 barrier function Effects 0.000 claims description 2
- 238000007598 dipping method Methods 0.000 claims description 2
- 230000011218 segmentation Effects 0.000 claims 1
- 238000000465 moulding Methods 0.000 description 9
- 230000004048 modification Effects 0.000 description 7
- 238000012986 modification Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 238000005538 encapsulation Methods 0.000 description 5
- 239000004809 Teflon Substances 0.000 description 4
- 229920006362 Teflon® Polymers 0.000 description 4
- 239000000470 constituent Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000012530 fluid Substances 0.000 description 3
- 239000000565 sealant Substances 0.000 description 3
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- 241000282320 Panthera leo Species 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 1
- 210000003423 ankle Anatomy 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000002440 industrial waste Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 239000012756 surface treatment agent Substances 0.000 description 1
- ANRHNWWPFJCPAZ-UHFFFAOYSA-M thionine Chemical compound [Cl-].C1=CC(N)=CC2=[S+]C3=CC(N)=CC=C3N=C21 ANRHNWWPFJCPAZ-UHFFFAOYSA-M 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/34—Feeding the material to the mould or the compression means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
- B29C2043/181—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Description
九、發明說明：Nine, invention description:
發明領域 本發明係有關於一種電子零件之壓縮成形方法及該方 法所用之壓縮成形裝置，其係在壓縮成形用之孔内對已安 裝於基板之IC (Integrated Circuit:積體電路）進行壓縮成 形者。 C先前技術3 發明背景 以往是利用脫模膜之電子零件之壓縮成形裝置（例如 包含具上下兩模具之模具的裝置）而藉壓縮鑄模法，將已 安裝於基板之電子零件在壓縮成形用孔内加以壓縮成形來 進行樹脂填封。該方法係如下進行。 首先’於上下兩模具間架設脫模膜，並使下模具面及 上模具孔的内面吸著覆蓋脫模膜。接著，對覆蓋了脫模膜 之下模具孔内供給樹脂材料，同時對上模具之基板設置部 供給設置已安裝電子零件之基板。 此時，覆盖了脫模膜之下模具孔内的樹脂材料會被加 熱並融化。接著，將上下兩模具合模來將電子零件浸潰於 下模具孔内已融化之樹脂材料中，同時將已加熱融化之下 〜、孔内的柄·脂材料朝孔底面構件加壓，藉此對下模且孔 内之樹脂施加必要樹脂壓。 。經過硬化必要之預定時·，將上下兩模具開模，藉 下模具孔内，於其形狀已壓縮成形為與下模具孔之 形狀對應的樹脂成形體内，對已安裝於基板之電子零件進 行樹脂填封。由於該方法所用之模具是在僅設於下模具之 孔内壓縮成形，因此稱為「使用脫模模之單面鱗模」。記載 前述習知使用脫模膜之單面鑄模的先前文獻有例如特開 2002 —43345 號公報。 惟，使用前述脫模膜來壓縮成形時，使用完的脫模膜 會成為產業廢棄物而產生龐大的處理費用，因此產品原價 會提高。又，為了對模具供給脫模膜，需要模處理器或模 按壓用之中間板等。故，模具之販賣價格會提高，最後以 該模具生產之產品價格也會提高。為了控制前述產品之原 價提高’乃檢討不使用脫模膜之壓縮成形（請參考例如特 開2003- 127162號公報）。 以第10A圖說明前述不使用脫模膜之壓縮成形方法如 下。模具在合模時，首先，於設於未覆蓋脫模膜之下模具 101的壓縮成形用孔102内，將電子零件浸潰於已加熱融化 之樹脂材料中。在該狀態下，以孔底面構件1〇3加壓孔1〇2 内之樹脂，藉此將已安裝於基板之電子零件樹脂填封於經 壓縮成形之樹脂成形體内。 在前述不使用脫模膜之壓縮成形時，設於下模具1〇1 之孔（凹部）1 〇 1是由樹脂按壓用之孔底面構件103 '與以 包圍孔底面構件103周圍之狀態設置之孔周圍構件（前壓 塊）104構成。重複前述模具之壓縮成形後，通常，會因孔 底面構件10 3之滑動面或孔侧面構件丨〇 4之滑動面的磨損 等，使孔底面構件103與孔側面構件104兩者間（滑動部） 容易產生間隙105。 故，如㈣B圖所示，當下模具孔1〇2内沒有覆蓋脫模 膜時，孔底面構件103與孔周圍構件1〇4之間（滑動部）容 易產生間隙1G5°因此’經加熱融化之樹脂材料會滲入該間 隙105並硬化，而使該間隙（滑動部）容易形成樹脂潰等異 物 106。 即’形成於該間隙105 (滑動部）之異物1〇6會使孔底 面構件103產生滑動不良’因此無法以孔底面構件有效 地加壓下模具孔102内之樹脂。 換言之，習知所檢討之不使用脫模膜之磨縮成形方法 中’很難防止孔底面構件1〇埃關圍構件1G4間所形成之 間隙105形成異物’而有無法有效地以孔底面構件1〇3加麼 孔102内之樹脂的弊處。 又，如上所述，為除去形成於孔底面構件103與孔周圍 構件104之間隙105的異物1〇6，必須定期分解模具⑻來進 仃清潔’有生產產品之時間損失大而造成成品率降低 之問題。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a compression molding method for an electronic component and a compression molding apparatus for the same, which is used for compression molding of an IC (Integrated Circuit) mounted on a substrate in a hole for compression molding. By. C. Prior Art 3 Background of the Invention Conventionally, a compression molding apparatus for an electronic component of a release film (for example, a device including a mold having two upper and lower molds) is used, and a compression molding hole is used to compress an electronic component mounted on a substrate. The resin is sealed by compression molding. This method is carried out as follows. First, a release film is placed between the upper and lower molds, and the lower surface of the lower mold surface and the upper mold hole are covered with a release film. Next, the resin material is supplied into the mold hole covered by the release film, and the substrate on which the electronic component is mounted is supplied to the substrate installation portion of the upper mold. At this time, the resin material covering the inside of the die hole under the release film is heated and melted. Next, the upper and lower molds are clamped to impregnate the electronic component into the melted resin material in the lower mold hole, and at the same time, the handle and the grease material in the hole are heated and melted, and the bottom surface member is pressurized. This applies the necessary resin pressure to the lower mold and the resin in the hole. . When it is necessary to harden, the upper and lower molds are opened, and the inside of the mold hole is borrowed, and the shape is compressed and formed into a resin molded body corresponding to the shape of the lower mold hole, and the electronic parts mounted on the substrate are subjected to The resin is sealed. Since the mold used in this method is compression-molded in a hole provided only in the lower mold, it is called "a single-sided scale mold using a mold release mold". The prior art which is described in the above-mentioned conventional single-sided mold using a release film is disclosed in, for example, JP-A-2002-43345. However, when the release film is used for compression molding, the used release film becomes industrial waste and generates a large processing cost, so that the original product price is increased. Further, in order to supply the release film to the mold, a mold processor or an intermediate plate for press pressing is required. Therefore, the selling price of the mold will increase, and finally the price of the product produced by the mold will also increase. In order to control the increase in the original price of the above products, it is reviewed that compression molding without using a release film is reviewed (refer to Japanese Laid-Open Patent Publication No. 2003-127162, for example). The above-described compression molding method which does not use a release film will be described in Fig. 10A. When the mold is closed, first, the electronic component is immersed in the heated and melted resin material in the compression molding hole 102 provided in the mold 101 which is not covered with the release film. In this state, the resin in the hole 1〇2 is pressed by the hole bottom member 1〇3, whereby the electronic component resin mounted on the substrate is filled in the compression molded resin molded body. In the above-described compression molding without using the release film, the hole (concave portion) 1 〇 1 provided in the lower mold 1〇1 is provided by the hole bottom surface member 103' for resin pressing and the state surrounding the hole bottom surface member 103. A hole surrounding member (front block) 104 is formed. After the compression molding of the above-mentioned mold is repeated, the hole bottom surface member 103 and the hole side member 104 are usually separated by the sliding surface of the hole bottom surface member 103 or the sliding surface of the hole side member 丨〇4. ) It is easy to create a gap 105. Therefore, as shown in (4)B, when the mold release film is not covered in the lower mold hole 1〇2, the gap between the hole bottom surface member 103 and the hole surrounding member 1〇4 (sliding portion) is likely to generate a gap of 1G5°, so that it is heated and melted. The resin material penetrates into the gap 105 and hardens, and the gap (sliding portion) is likely to form foreign matter 106 such as resin collapse. In other words, the foreign matter 1〇6 formed in the gap 105 (sliding portion) causes the hole bottom member 103 to cause sliding failure. Therefore, the resin in the lower die hole 102 cannot be effectively pressurized by the hole bottom member. In other words, it is difficult to prevent the formation of the foreign matter in the gap 105 formed between the hole bottom member 1 and the surrounding member 1G4 in the grinding and shrinking method which is not known to use the release film, and it is impossible to effectively use the hole bottom member. 1〇3 plus the disadvantages of the resin in the hole 102. Further, as described above, in order to remove the foreign matter 1〇6 formed in the gap 105 between the hole bottom surface member 103 and the hole surrounding member 104, it is necessary to periodically decompose the mold (8) to clean and clean the product having a large loss of production time, resulting in a decrease in yield. The problem.
t發明内容J 發明概要 為解決上述習知之問題點，本發明之目的在於，抑制 孔底面構件與孔周圍構件之間隙内產生異物，藉此防止孔 底面構件之滑動不良’而以孔底面構件有效地加壓孔内之 樹脂。 又’本發明之目的在於，藉不使用脫模膜之構成、或 1376753 藉以孔底面構件有效地加壓孔内樹脂之構成來提高產品之 ' 成品率。 · 為達成上述目的，本發明之電子零件之壓縮成形方法 包含有：設置步驟，係將已安裝電子零件之基板，供給設 5置於壓縮成形用模具之基板設置部；供給步驟，係將樹脂 材料供給至模具之模具孔内；融化步驟，係將已供給至模 具孔内之樹脂材料加熱並使其融化；浸潰步驟，係將模具 合模，藉此將電子零件浸潰於模具孔内已融化之樹脂；及， 壓縮成形步驟，係在已將電子零件浸潰於已融化之樹脂的 · 10狀態下，利用形成模具孔之底面的孔底面構件來加壓模具 孔内之樹脂，而對模具孔内之樹脂施加必要樹脂壓，藉此 在模具孔内將電子零件封裝於與模具孔之形狀對應的樹脂 成形體内，構成模具孔之側面的構件係使用與孔底面構件 之各邊對應地分割之孔側面構件；壓縮成形步驟中，利用 15孔底面構件對模具孔内之樹脂施力口必要樹脂壓時係將經 分割之孔側面構件分別按壓至孔底面構件。本發明之特冑 · 在於’構成模具孔側φ之構件係使用對應孔底面構件之I Φ 邊而分割之孔侧面構件，於壓縮成形步驟中，以孔底面構 件對模具孔内之樹脂施加必要樹脂壓時，將經分割之孔㈣ · 20面構件分別按壓至孔底面構件。 - ^月/、中开^態，係利用設於經分割之孔側面構件 的各内部或外部之按屋裝置，將孔側面構件按壓至前述孔 底面構件。 又’本發明之較佳實施形態中’經分割之孔側面構件 8 分別具有設置成可拆裝之小片構件，且該小片構件至少包 含與孔底面構件間之滑動面’又’利用孔底面構件對模具 孔内之樹脂施加必要樹脂壓時’係將小片構件之滑動面按 壓至孔底面構件。 本發明於利用底面構件對模具孔内之樹脂施加 必要樹脂壓時’可對小片構件壓送壓縮空氣，藉此將小片 構件按壓至前述孔底面構件。 本發明之電子零件之壓縮成形裝置包含有：上模具； 下模具’係與上模具相對向地配置；基板設置部，係設於 上模具，並供給已安裝電子零件之基板者；模具孔，係設 於下模具’而作為壓縮成形用者；孔底面構件，係形成模 具孔之底面者：孔侧面構件，係形成模具孔之側面，並分 別與孔底面構件之各邊對應地分割而設置者；及按壓裝 置’係將經分狀孔側面構件分独壓至孔底面構件者。 本發明其中一實施形態中，按壓裝置由設於經分割之 孔側面構件的内部或外部之按壓機構所構成。 又本發月中，可於經分割之孔側面構件分別以可拆 裝之方U至少包含與孔底面構件間之滑動面的小片構 件，且按！裝置包含—將小片構件按壓至孔底面構件之裝 置。 " 本發明之較佳實施形態中，經分割之孔側面構件分別 具有.孔側面構件本體，係使小片構件滑動者；壓送路徑， 係設於孔侧面構件本體，並具#用崎孔側面構件本體與 小片構件間形成之間隙壓送壓縮空氣關口部；及密封 構件，係包圍開口部且使間隙呈外氣阻隔狀態者；又，按 壓裝置包含空氣壓送機構，該空氣壓送機構係透過壓送路 徑對間隙内之密封構件所包圍之空間部壓送空氣者。 藉具有上述步驟或構成之本發明，可防止因孔底面構 件與經分割之孔侧面構件間之間隙所產生之異物而造成孔 底面構件之滑動不良，藉此有效地以孔底面構件加壓孔内 之樹脂。 又，藉本發明，可在不使用脫模膜之情形下，有效地 以孔底面構件加壓孔内之樹脂，而可提高產品之成品率。 本發明之上述及其它目的、特徵、局面與優點應可由 附加圖式及與本發明相關之以下詳細說明可清楚理解。 圖式簡單說明 第1A圖及第m圖係概略顯示本發明第一實施形態之 電子零件之壓縮成形《具（電子零件之樹脂填封成形用 模具）的概略縱剖面圖，第1A圖係本發明第—實施形態之 電子零件之壓縮成形用模具的開模狀態之概略縱剖面圖， 第1B圖係同模具之合模狀態的概略縱剖面圖，第圖: 略顯不第1A圖所示之下模具模面的概略平面圖。' 第2A圖係擴大地概略顯示第1A圖所示之模具要立 擴大概略剖面圖’顯示以孔底面構件加 妝能，笛m 心樹难前的 弟2B圖係擴大地概略顯示第1B圖所示之模具 擴大概略剖面圖顯示以孔底面構件加壓了的 壯能。 <樹脂的 第3八圖、 第3B圖係擴大地概略顯示本發明第— 貫施形 態其中-變關之電子零件之壓縮成形用模具要部的擴大 概略剖關，第3A®顯和孔底面構件加壓孔内之樹^前 的狀態，而第3B圖則顯示以孔底面構件加壓了孔内之士匕 的狀態。 之祕脂 第4A圖、第4B圖係擴大地概略顯示本發明第一實㈣ 態另-變形例之電子零件之㈣成形關具要部的擴大概 略剖面圖，第4A圖顯示以孔底面構件加壓孔内 的 狀態，而第4B圖則顯示以孔底面構件加壓了孔内之樹脂的 狀態。 第5A圖係概略顯示本發明第二實施形態之電子零件之 壓縮成形用模具的開模狀態之概略縱剖面圖，第5β圖係概 略顯示第5A圖所示之下模具模面的概略平面圖，而第 則係擴大地概略顯*帛5Affi射之模具要部的擴大概略縱 剖面圖。 第6A圖係概略顯示本發明第三實施形態之電子零件之 壓縮成形用模具的開模狀態之概略縱剖面圖，第6B圖及第 6C圖係擴大地概略顯示第6八圖所示之模具要部的擴大概 略縱剖面圖，第6B圖顯示以孔底面構件加壓孔内之樹脂前 的狀態，而第6C圖則顯示以孔底面構件加壓了孔内之樹脂 的狀態。 第7A圖係擴大地概略顯示本發明第四實施形態之電子 零件之壓縮成形用模具要部的擴大概略縱剖面圖，第73圖 係擴大地概略顯示第7A圖所示之模具要部的擴大概略縱剖 面圖，而第7C圖則係擴大地概略顯示本發明第四實施形態 1376753 其中一變形例的電子零件之壓縮成形用模具要部的擴大概 略縱剖面圖。 第8A圖係概略顯示本發明第五實施形態之電子零件之 壓縮成形用模具（電子零件之樹脂填封成形用模具）的開 5模狀態之概略縱剖面圖，第8B係概略顯示第8A圖所示之下 模具模面的概略平面圖。 第9A圖係擴大地概略顯示第8A圖所示之模具要部的 擴大概略縱剖面圖，顯示孔底面構件之位置，第9B圖係擴 大地概略顯示與第9A圖所示之模具對應之模具要部的擴大 10概略縱剖面圖’顯示以孔底面構件對孔内之樹脂加壓之狀 態。 第10A圖係概略顯示習知電子零件之壓縮成形用模具 (上下兩模具）中，包含下模具孔之下模具面的概略平面 圖’第10B圖係擴大地概略顯示第1〇A圖所示之下模具要部 15的擴大概略縱剖面圖，顯示下模具孔内之孔底面構件的滑 動不良狀態。 C實施方式】 較佳實施形態之說明 本發明實施形態之電子零件之壓縮成形用模具設有固 20定之上模具、可動之下模具、設於上模具之電子零件並供 給已安裝電子零件之基板的基板設置部、設於下模具而具 有矩形孔開口部的壓縮成形用之孔、構成該孔側面之孔周 圍構件及形成孔底面之孔底面構件。 又’孔周圍構件由分別與孔開口部（或孔底面）之各 12 1376753 邊對應地分割之孔側面構件構成。而，以孔周圍構件與孔 底面構件形成孔部，並構造成孔底面構件可於設於孔周圍 構件之滑動孔滑動。經分割之孔側面構件的數量是由孔開 口部（或孔底面）在俯視時之形狀來決定，當孔開口部（或 5孔底面）在俯視時為矩形時，便對應該矩形之四邊，將孔 周圍構件分割為四個孔側面構件。 又，為有效地防止孔側面構件與孔底面構件間之滑動SUMMARY OF THE INVENTION SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, an object of the present invention is to suppress generation of foreign matter in a gap between a hole bottom member and a member around a hole, thereby preventing a sliding failure of a hole bottom member. The resin in the ground pressure hole. Further, the object of the present invention is to improve the yield of a product by using a structure in which a release film is not used or a structure in which a hole bottom member is used to effectively press a resin in a hole. In order to achieve the above object, a compression molding method for an electronic component according to the present invention includes a mounting step of placing a substrate on which an electronic component is mounted, a supply device 5 in a substrate mounting portion of a compression molding die, and a supply step of supplying a resin The material is supplied into the mold hole of the mold; the melting step heats and melts the resin material that has been supplied into the hole of the mold; and the dipping step clamps the mold to thereby immerse the electronic part in the hole of the mold The melted resin; and the compression molding step, in which the electronic component is immersed in the melted resin, the resin in the die hole is pressed by the hole bottom member forming the bottom surface of the die hole, and Applying a necessary resin pressure to the resin in the die hole, thereby enclosing the electronic component in the resin molded body corresponding to the shape of the die hole in the die hole, and the components constituting the side faces of the die hole are used for each side of the hole bottom member Correspondingly dividing the side member of the hole; in the compression forming step, when the resin is applied to the resin in the hole of the mold by the 15-hole bottom member, the resin pressure is required to be divided. The hole in the side member are pressed to the bottom of the hole member. The feature of the present invention is that the member constituting the die hole side φ is a hole side member which is divided by the I Φ edge of the hole bottom member, and in the compression molding step, the hole bottom member is required to apply the resin in the die hole. When the resin is pressed, the divided holes (4) and 20 face members are respectively pressed to the hole bottom member. - ^ month/, middle opening mode, pressing the side member of the hole to the bottom member by means of a press device provided inside or outside the divided side member of the hole. Further, in the preferred embodiment of the present invention, the divided hole side members 8 each have a detachable small piece member, and the small piece member includes at least a sliding surface between the bottom surface member and the hole bottom member. When a necessary resin pressure is applied to the resin in the die hole, the sliding surface of the die member is pressed to the hole bottom member. In the present invention, when a necessary resin pressure is applied to the resin in the die hole by the bottom member, compressed air can be pressure-fed to the die member, whereby the die member is pressed against the hole bottom member. The compression molding apparatus for an electronic component of the present invention includes: an upper mold; the lower mold is disposed opposite to the upper mold; and the substrate installation portion is provided on the upper mold and supplied to the substrate on which the electronic component is mounted; The bottom mold member is provided as a compression molding; the bottom surface member is formed on the bottom surface of the mold hole: the side surface member of the hole is formed on the side surface of the mold hole, and is respectively divided and arranged corresponding to each side of the hole bottom member. And the pressing device' is to press the side member of the split hole separately to the bottom member of the hole. In one embodiment of the present invention, the pressing device is constituted by a pressing mechanism provided inside or outside the divided hole side member. In the present month, the divided side members of the divided holes may each include a small piece member having at least a sliding surface with the bottom surface member of the hole, and press! The device includes means for pressing the die member to the bottom member of the hole. In a preferred embodiment of the present invention, the divided side members have a hole side member body for sliding the small piece member; the pressure feeding path is provided on the hole side member body, and has a sagging hole a gap formed between the side member body and the small piece member is pressed to the compressed air closing portion; and the sealing member surrounds the opening portion and the gap is in an external air blocking state; and the pressing device includes an air pressure feeding mechanism, and the air pressure feeding mechanism The air is supplied to the space surrounded by the sealing member in the gap through the pressure feed path. According to the present invention having the above steps or configurations, it is possible to prevent the sliding of the hole bottom member due to the foreign matter generated by the gap between the hole bottom member and the divided hole side member, thereby effectively pressing the hole bottom member pressing hole Resin inside. Further, according to the present invention, the resin in the hole can be effectively pressed by the hole bottom member without using the release film, and the yield of the product can be improved. The above and other objects, features, aspects and advantages of the present invention will be apparent from BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1A is a schematic longitudinal cross-sectional view showing a compression molding of an electronic component according to a first embodiment of the present invention (a mold for resin encapsulation molding of an electronic component), and FIG. 1A is a schematic view. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1B is a schematic longitudinal cross-sectional view showing a mold-opening state of a mold for compression molding of an electronic component, and FIG. 1B is a schematic longitudinal cross-sectional view showing a mold clamping state of the same mold, and a drawing is omitted: FIG. A schematic plan view of the mold face below. '2A is an enlarged view showing the enlarged outline of the mold shown in Fig. 1A', showing the makeup of the bottom member of the hole, and the 2B diagram of the younger brother of the flute m. The enlarged schematic cross-sectional view of the mold shown shows the strength of the pressurized bottom member. <3rd and 3rd drawings of the resin show an enlarged outline of the main part of the mold for compression molding of the electronic component in the first embodiment of the present invention, and the 3A® display hole The bottom member pressurizes the state in front of the tree, and the third panel shows the state in which the girder in the hole is pressurized by the bottom member of the hole. 4A and 4B are an enlarged schematic cross-sectional view showing the main part of the (4) forming and closing part of the electronic component of the first embodiment of the present invention, and FIG. 4A shows the bottom member of the hole. The state inside the pressure hole, and Fig. 4B shows the state in which the resin in the hole is pressurized by the hole bottom member. 5A is a schematic longitudinal cross-sectional view showing a mold opening state of a mold for compression molding of an electronic component according to a second embodiment of the present invention, and a fifth plan view schematically showing a schematic plan view of a mold surface shown in FIG. 5A. The ninth is an enlarged schematic longitudinal section of the main part of the mold of the 5Affi shot. 6A is a schematic longitudinal cross-sectional view showing a mold opening state of a mold for compression molding of an electronic component according to a third embodiment of the present invention, and FIGS. 6B and 6C are enlarged views schematically showing a mold shown in FIG. In the enlarged longitudinal cross-sectional view of the main portion, FIG. 6B shows a state before the resin in the hole is pressed by the hole bottom member, and FIG. 6C shows a state in which the resin in the hole is pressed by the hole bottom member. 7A is an enlarged schematic longitudinal cross-sectional view showing a main part of a mold for compression molding of an electronic component according to a fourth embodiment of the present invention, and an enlarged view of the enlarged main part of the mold shown in FIG. 7A. FIG. 7C is an enlarged schematic longitudinal cross-sectional view showing a main portion of a mold for compression molding of an electronic component according to a modification of the fourth embodiment of the present invention. 8A is a schematic longitudinal cross-sectional view showing a mold-opening mold for a compression molding of an electronic component according to a fifth embodiment of the present invention (a mold for resin encapsulation molding of an electronic component), and FIG. 8B is a schematic view showing an eighth embodiment. A schematic plan view of the mold face below is shown. Fig. 9A is an enlarged schematic longitudinal sectional view showing the main part of the mold shown in Fig. 8A, showing the position of the bottom surface member of the hole, and Fig. 9B is an enlarged view showing the mold corresponding to the mold shown in Fig. 9A. The enlarged longitudinal section of the main part 10 shows a state in which the resin in the hole is pressurized by the bottom member of the hole. Fig. 10A is a schematic plan view showing a mold for compression molding of a conventional electronic component (upper and lower molds), including a mold surface below the lower die hole. Fig. 10B is an enlarged view showing the first FIG. An enlarged schematic longitudinal cross-sectional view of the lower mold main portion 15 shows a sliding failure state of the hole bottom member in the lower mold hole. C. EMBODIMENT OF THE PREFERRED EMBODIMENT The mold for compression molding of an electronic component according to an embodiment of the present invention is provided with a mold for fixing a fixed mold, a movable mold, an electronic component provided in the upper mold, and a substrate on which an electronic component is mounted. The substrate installation portion, the hole for compression molding having a rectangular hole opening portion provided in the lower mold, the hole surrounding member constituting the side surface of the hole, and the hole bottom surface member forming the bottom surface of the hole. Further, the member around the hole is constituted by a hole side member which is divided correspondingly to the side of each of the hole opening portions (or the bottom surface of the hole) 12 1376753. Further, the hole surrounding member and the hole bottom member are formed into a hole portion, and the hole bottom member is configured to be slidable in the sliding hole provided in the member around the hole. The number of divided side members of the hole is determined by the shape of the hole opening portion (or the bottom surface of the hole) in a plan view. When the hole opening portion (or the bottom surface of the hole 5) is rectangular in plan view, the four sides of the rectangle are corresponding. The member around the hole is divided into four hole side members. Moreover, in order to effectively prevent the sliding between the side member of the hole and the member of the bottom surface of the hole
部產生間隙，以必要㈣力將孔側面構件之滑動部按壓至 孔底面構件之滑動部的觀機構，係設於孔側面構件之内 10 4或外。P (W參考第—實施形態所示之内部按壓機構，第 二、三實⑽態料之外部按壓機構及第五實麵雄之空 氣壓送機構）。 〜 便用上述構成之電子零件之㈣成形用模且時首 =將已安裝電子零件之基板供給設置於上模具之基板設 】》，對τ模具之孔内供給樹脂材料，並將A gap is formed in the portion, and the sliding portion of the hole side member is pressed to the sliding portion of the hole bottom member by the necessary (four) force, and is disposed inside the hole side member 10 or outside. P (W refers to the internal pressing mechanism shown in the first embodiment, the external pressing mechanism of the second and third solid (10) materials, and the air pressure transmitting mechanism of the fifth solid surface). - (4) forming the mold for the electronic component of the above-described configuration, and firstly supplying the substrate on which the electronic component is mounted to the substrate of the upper mold, and supplying the resin material to the hole of the τ mold, and
合模，藉此可將電子零件浸潰於下模具孔内已 加熱融化之樹脂中。 接著，使孔底面構件朝上方移動必要之移動距離，藉 此可對下拉具孔内之樹脂施加必要樹脂壓 2 件朝上方移動。而，別“心 便孔底面構 按壓方向係例如互相=構件之移動方向與按屋機構之 經過硬化必要之時間後，將上下兩模具開模’藉此可 13 1376753 在下模具孔闪將電子零件壓縮成形（樹脂填封成形）於與 孔形狀對應之樹脂成形體（產品）内。 如上所述，藉本發明，由於可使用上述按麗機構，在 以必要按壓力將經分割之孔側面構件的滑動面按壓至孔底 5面構件之滑動面的狀態下，使孔底面構件朝上方移動，因 此可有效地防止孔底面構件與孔側面構件間產生間隙。 故，可防止孔底面構件與設孔側面構件間之間隙產生 異物，因此可防止孔底面構件之滑動不良，有效地以孔底 面構件加壓孔内之樹脂。 10 再者，藉本發明，可利用不使用脫模膜之構成、或以 孔底面構件有效地加壓孔内樹脂之構成來有效地提高產品 之生產性。 而，經分割之各孔側面構件可採用設置小片構件之構 成’該小片構件至少包含與孔底面構件之滑動面。此時， 15藉設於各孔側面構件之按壓機構，可以必要按壓力來將小 片構件按壓至孔底面構件。 以下，根據圖式說明本發明之具體實施形態。 〔第一實施形態〕 首先，詳細說明本發明之第一實施形態。第1八圖、第 20 1B圖及第1C圖顯示第一實施形態之電子零件之壓縮成形 用模具（電子零件之樹脂填封成形用模具），第2A圖及第2B 圖顯示該模具要部之第一内部按壓機構。又，第3A圖、第 3B圖顯示第二内部按壓機構，第4八圖、第4B圖顯示第三内 部按壓機構。 14 (關於第一實施形態之電子零件之壓縮成形用模具的 構成） 如第1、第1B®及第1C®所示，電子零件之壓縮成 ，用杈具6又有固定之上模具i與與該上模具(相對向配置之 可動下模具2。上模具1之模面設有基板設置部5，基板設置 部5係在使電子零件3朝下之狀態下，供給設置已安展電子 零件3之基板者。 又’下模具2設有壓縮成形用之孔6，並設有對該孔6 内供給樹脂材料7 (例如顆粒狀樹脂材料 )之樹脂材料供給 機構8。該供給機構8構造成可由朝孔6上方開口之孔開口部 9對孔6内供給樹脂材料。在本實施形態中，如第1(：圖所示， 孔6在平面觀視下為具有4個邊之矩形，當然亦可為矩形以 外之形狀。 又’雖未圖示，模具（上下模具）1、2設有將模具！、 2加熱至必要模具溫度的加熱機構，以及將模具丨、2以必要 合模壓力合模之合模機構。又，下模具2之孔6設有夠成該 孔6之底面的孔底面構件1〇，以及構成該孔6之成為底面外 周圍之側面的孔周圍構件（前壓塊）。 再者’如第1C圖所示，孔周圍構件在平面觀視下，舉 例吕之’在分別對應孔底面構件1 〇之矩形底面的四個邊（或 矩形之孔開口部9的四個邊）的情形下，分割為4個孔側面 構件11。又，孔底面構件10固設有基台12，分割為4個之孔 側面構件11與基台12間，分別設有壓縮彈簧等彈性構件13。 而，經分割之孔側面構件11的滑動面與孔底面構件1〇 10的/骨動面間會形成滑動部14。 —本實施形態中，如第關、第1B圖所示，首先，將已 安裝電子讀3之基板4供給設置於上模具丨之基板設置部 5 ’在該狀態下，將樹脂材料7供給至下模具孔6内，並加熱 使其融化。接著，職具丨、2合模，藉此使經分割之孔側 立面構件（前壓塊）U之各前端面分別與上模具丨之基板設置 部5所設置之基板4表面抵接。在該狀態下，使孔底面構件 10朝上方移動’藉此可對在下模具孔6内加熱融化之樹脂材 料施加必要樹脂壓。 經過樹脂材料硬化必要之時間後，將模具i、2開模， 藉此可形成填封於與下模具孔6形狀對應之樹脂成形體15 内的電子零件3。 (關於设置在分割孔側面構件内部之内部按壓機構） 又’本實施形態之壓縮成形模具中，如第2A圖、第2B 圖所示’第一内部按壓機構21設於經分割之各孔側面構件 11。藉該第一内部按壓機構21，可針對孔底面構件10，由 内部以必要按壓力按壓經分割之孔側面構件丨丨。該第一内 部按壓機構21設於經分割之孔側面構件11的各内部之必要 處所形成之收容空間22内。 具體而言，第一内部按壓機構21係構成如下。設有位 於收容空間22之孔底面構件10側的壁面且上下方向較長的 長孔23，該長孔23插通有前端側固設於孔底面構件10之棒 材24»插通該棒材24而設有彈性按壓用之壓縮彈簧（彈性 構件）25，棒材24之底端侧固設有一固設且可卡止壓縮彈 1376753 簧24之-端侧的棒材卡止部26 (例如平板狀 容空間η 之孔底面構件10側的長孔23周圍設有卡止壓縮彈簧24之另 一端側的收容空間卡止部（壁面）27。 ” 如此’設於收容空間22内之壓縮彈箸25是在卡止於棒 5材卡止部26與收容空間卡止部27間之狀態下設置該壓縮 彈箦25可彈性按壓棒材卡止部26與收容空間卡止部27，藉 此相對孔底面構件1 〇之滑動面來彈性按壓經分割之孔側面 構件11的滑動面。 故，沿孔側面構件11使孔底面構件10移動來加壓孔6内 1〇之樹脂時，可以必要按壓力來將經分割之孔側面構件⑽ 滑動面按壓至孔底面構件1〇之滑動面，因此可有效地防止 孔側面構件11之滑動面與孔底面構件1〇之滑動面間（滑動 部14)產生間隙。 而，孔底面構件10、棒材24及棒材卡止部26係相對孔 15側面構件11只朝上方移動必要距離。孔底面構件10之移動 方向與孔側面構件11之按壓方向係例如相互垂直。 (電子零件之壓縮成形方法） 首先，如第1圖所示，將已安裝電子零件3之基板4供給 設置於上模具1之基板設置部5,並以樹脂材料之供給機構8 2〇 將樹脂材料7 (例如顆粒狀樹脂材料）供給至下模具孔6内， 再加熱使其融化。 接著，將上下兩模具1、2合模，藉此將分割孔側面構 件11之前端面與供給設置於上模具1之基板4表面接合，並 將已安裝於基板4之電子零件3浸漬於已在下模具孔6内加 17 1376753 熱融化之樹脂。 接著，將孔底面構件1〇朝上方移動，藉此加壓孔6内之 樹脂。該孔底面構件10之加壓步驟中，以第一内部按壓機 構21將經分割之孔侧面構件丨丨分別按壓至孔底面構件1〇。 5藉此，可有效防止孔側面構件π之滑動面與相對向之孔底 面構件10之滑動面間形成之滑動部14產生間隙。 故，以孔底面構件10加壓時，在以第一内部按壓機構 21用必要按壓縣經分割之孔側面構件丨丨分別按壓至孔底 面構件10的狀態下，使孔底面構件1〇朝上方僅移動必要之 10移動距離A，藉此可對下模孔6内之樹脂施加必要樹脂壓。 經過硬化所需之必要時間後，將上下兩模具丨、2開模， 藉此可形成填封於與下模具孔6形狀對應之樹脂成形體15 内的電子零件3。 如上所述，藉本實施形態，可在以第一内部按壓機構 15 21用必要按壓利將經分割t孔側面構件时別按壓至孔底 面構件10的狀態下’以孔底面構件1〇對孔6内之樹脂施加必 要樹脂壓。 故’根據第-實施形態’由於可防止孔底面構件職 分割孔側面構件⑽所形成之間隙（滑動部⑷產生異物， 結果，可防止該間隙（滑動部14)形成異物，因此可有效 地以孔底面構件10加塵孔6内之樹脂。 又’第一實施形態中，如上所述，由於可防止孔底面 構件10與分割孔側面構件⑽之間隙（滑動部⑷形成異 物，因此可減少定期分解並清洗模具之情事，並可使產品 18 1376753 (樹脂成形體15)之成品率提高，同時降低生產產品時之 時間損失。 故’根據第一實施形態，可防止孔底面構件1〇與分割 孔侧面構件11之間隙（滑動部14)形成異物，因此可使產 5品（樹脂成形體15)之成品率提高，且’由於可降低生產 產品時之時間損失，因此可使產品之生產性提高。 又，苐一實施形態中，可防止孔底面構件1 〇與分割孔 側面構件11之間隙（滑動部14)產生異物，藉此防止孔底The mold is closed so that the electronic component can be immersed in the resin that has been heated and melted in the lower mold hole. Next, the hole bottom member is moved upward by a necessary moving distance, whereby the necessary resin pressure is applied to the resin in the pull-down hole to move upward. However, if the direction of the bottom surface of the core hole is, for example, the direction of movement of the member = the movement of the member and the hardening of the pressing mechanism, the upper and lower molds are opened, thereby enabling the electronic parts to be flashed in the lower mold hole 13 13376753 Compression molding (resin sealing molding) in a resin molded body (product) corresponding to the shape of the hole. As described above, according to the present invention, since the above-described pressing mechanism can be used, the divided side member is divided by the necessary pressing force. In a state where the sliding surface is pressed against the sliding surface of the five-surface member of the hole bottom, the hole bottom surface member is moved upward, so that a gap can be effectively prevented from occurring between the hole bottom surface member and the hole side surface member. Since a foreign matter is generated in the gap between the side members of the hole, the sliding of the bottom surface member can be prevented, and the resin in the hole can be effectively pressed by the bottom surface member. Further, according to the present invention, the configuration without using the release film can be utilized. Or effectively compressing the resin in the hole by the bottom member of the hole to effectively improve the productivity of the product. The configuration of the small piece member 'The small piece member includes at least the sliding surface with the bottom surface member of the hole. At this time, 15 by the pressing mechanism of the side surface member of each hole, it is necessary to press the small piece member to the bottom surface member of the hole by pressure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS [First Embodiment] First, a first embodiment of the present invention will be described in detail. Figs. 1-8, 20B and 1C show electronic components of the first embodiment. The mold for compression molding (the mold for resin encapsulation molding of electronic parts), the first internal pressing mechanism for the main part of the mold is shown in Figs. 2A and 2B. Further, the third internal pressing mechanism is shown in Figs. 3A and 3B. 4th and 4th, the third internal pressing mechanism is shown. 14 (Configuration of the compression molding die for the electronic component according to the first embodiment) As shown in the first, first, and first, the electronic components. In the compression, the cookware 6 has a fixed upper mold i and the upper mold (the movable lower mold 2 is disposed opposite to each other. The mold surface of the upper mold 1 is provided with the substrate installation portion 5, and the substrate installation portion 5 is attached thereto. Electricity The substrate 3 is provided with a substrate on which the electronic component 3 is mounted in a state where the component 3 is facing downward. Further, the lower mold 2 is provided with a hole 6 for compression molding, and is provided with a resin material 7 (for example, granular) in the hole 6. A resin material supply mechanism 8 of a resin material. The supply mechanism 8 is configured to supply a resin material into the hole 6 by a hole opening portion 9 that opens upward in the hole 6. In the present embodiment, as shown in the first figure (: The hole 6 has a rectangular shape having four sides in plan view, and may of course be a shape other than a rectangle. Further, although not shown, the molds (upper and lower molds) 1 and 2 are provided with heating of the molds! a heating mechanism for the temperature, and a clamping mechanism for clamping the molds 2 and 2 at a necessary clamping pressure. Further, the hole 6 of the lower mold 2 is provided with a hole bottom member 1〇 which is formed as a bottom surface of the hole 6, and The hole 6 becomes a member around the hole (front block) on the side of the outer periphery of the bottom surface. Furthermore, as shown in Fig. 1C, the members around the hole are viewed in plan view, and the four sides of the rectangular bottom surface corresponding to the bottom surface member 1 of the hole bottom member 1 (or the four sides of the rectangular opening portion 9 of the rectangular hole) are exemplified. In the case of the case, it is divided into four hole side members 11. Further, the hole bottom member 10 is fixed to the base 12, and is divided into four holes. The side member 11 and the base 12 are respectively provided with elastic members 13 such as compression springs. On the other hand, the sliding portion 14 is formed between the sliding surface of the divided hole side member 11 and the perforating surface of the hole bottom member 1〇10. In the present embodiment, as shown in FIG. 1 and FIG. 1B, first, the substrate 4 on which the electronic read 3 is mounted is supplied to the substrate installation portion 5' provided in the upper mold '. In this state, the resin material 7 is supplied to The lower mold hole 6 is heated and melted. Then, the front end faces of the divided hole side surface members (front press blocks) U are brought into contact with the surfaces of the substrate 4 provided in the substrate mounting portion 5 of the upper mold set, respectively. In this state, the hole bottom member 10 is moved upward. Thus, the necessary resin pressure can be applied to the resin material which is heated and melted in the lower die hole 6. After the resin material is hardened for a period of time, the molds i and 2 are opened, whereby the electronic component 3 sealed in the resin molded body 15 corresponding to the shape of the lower mold hole 6 can be formed. (The internal pressing mechanism provided in the inside of the side member of the dividing hole) In the compression molding die of the present embodiment, as shown in Figs. 2A and 2B, the first internal pressing mechanism 21 is provided on the side of each of the divided holes. Member 11. By the first inner pressing mechanism 21, the divided hole side member 可 can be pressed by the inside with the necessary pressing force for the hole bottom surface member 10. The first inner pressing mechanism 21 is provided in the accommodating space 22 formed at the necessary position inside each of the divided hole side members 11. Specifically, the first internal pressing mechanism 21 is configured as follows. An elongated hole 23 is formed in the wall surface on the side of the hole bottom member 10 of the accommodating space 22 and is long in the vertical direction. The long hole 23 is inserted through the bar 24 of the front end side of the hole bottom member 10 and is inserted into the bar. 24 is provided with a compression spring (elastic member) 25 for elastic pressing, and the bottom end side of the bar 24 is fixed with a bar locking portion 26 which is fixed and can lock the end side of the compression spring 1374753 spring 24 (for example The accommodating space locking portion (wall surface) 27 on the other end side of the locking compression spring 24 is provided around the long hole 23 on the side of the hole bottom surface member 10 of the flat-shaped housing space η. The compression bomb provided in the accommodating space 22 In the state where the hook 25 is locked between the rod 5 locking portion 26 and the accommodating space locking portion 27, the compression magazine 25 can elastically press the bar locking portion 26 and the accommodating space locking portion 27, thereby The sliding surface of the divided hole side member 11 is elastically pressed against the sliding surface of the hole bottom surface member 1 . Therefore, when the hole bottom surface member 10 is moved along the hole side member 11 to press the resin in the hole 6 , it is necessary to Pressing the divided hole side member (10) sliding surface to the hole bottom member 1 by pressure Since the sliding surface of the crucible is formed, it is possible to effectively prevent a gap between the sliding surface of the hole side member 11 and the sliding surface of the hole bottom member 1 (sliding portion 14). However, the hole bottom member 10, the rod 24, and the rod are locked. The portion 26 is moved upward by the distance of the side member 11 with respect to the hole 15. The moving direction of the hole bottom member 10 and the pressing direction of the hole side member 11 are, for example, perpendicular to each other. (Compression molding method of electronic parts) First, as shown in Fig. 1. As shown, the substrate 4 on which the electronic component 3 has been mounted is supplied to the substrate setting portion 5 provided in the upper mold 1, and the resin material 7 (for example, a granular resin material) is supplied to the lower mold hole by the supply mechanism 8 2 of the resin material. Then, the upper and lower molds 1 and 2 are clamped, whereby the front end surface of the split-pore side member 11 is joined to the surface of the substrate 4 which is supplied to the upper mold 1, and is mounted on the substrate. The electronic component 3 of 4 is immersed in a resin which has been heated and melted in the lower die hole 6 by 17 1376753. Next, the hole bottom member 1〇 is moved upward, thereby pressurizing the resin in the hole 6. The hole bottom member 10 is added. Pressure In the first step, the divided hole side member 丨丨 is pressed to the hole bottom member 1〇 by the first internal pressing mechanism 21. 5 Thereby, the sliding side surface π sliding surface and the opposite hole bottom surface member 10 can be effectively prevented. The sliding portion 14 formed between the sliding surfaces generates a gap. Therefore, when the hole bottom member 10 is pressurized, the first inner pressing mechanism 21 presses the hole side member 分割 which is divided by the necessary pressing state to the hole bottom member 10, respectively. In this state, the hole bottom surface member 1 is moved upward only by the necessary 10 movement distance A, whereby the necessary resin pressure can be applied to the resin in the lower mold hole 6. After the necessary time required for hardening, the upper and lower molds are applied. The mold 2 and the mold are opened, whereby the electronic component 3 sealed in the resin molded body 15 corresponding to the shape of the lower mold hole 6 can be formed. As described above, according to the present embodiment, the hole bottom surface member 1 can be aligned with the hole bottom surface member 10 when the first inner pressing mechanism 15 21 is required to press the divided t hole side surface member. The resin in 6 is applied with the necessary resin pressure. Therefore, according to the first embodiment, it is possible to prevent the gap formed by the hole bottom surface member from dividing the hole side member (10) (the sliding portion (4) generates foreign matter, and as a result, the gap (sliding portion 14) can be prevented from forming foreign matter, so that it can be effectively In the first embodiment, as described above, since the gap between the hole bottom surface member 10 and the split hole side surface member (10) can be prevented (the sliding portion (4) forms a foreign matter, the periodicity can be reduced. Decomposing and cleaning the mold, and improving the yield of the product 18 1376753 (resin molded body 15), and reducing the time loss when the product is produced. Therefore, according to the first embodiment, the hole bottom member can be prevented from being separated and divided. The gap (sliding portion 14) of the hole side member 11 forms a foreign matter, so that the yield of the product 5 (resin molded body 15) can be improved, and the productivity of the product can be improved because the time loss in the production of the product can be reduced. Further, in the first embodiment, it is possible to prevent foreign matter from occurring in the gap (sliding portion 14) between the hole bottom surface member 1 and the split hole side member 11, thereby preventing the bottom of the hole
面構件10之滑動不良，因此可有效地以孔底面構件1〇加壓 10 孔内6之樹脂。 故，藉第一實施形態，在不使用脫模膜之構成中，可 防止孔底面構件10之滑動不良，並以孔底面構件1〇有效地 加壓孔内6之樹脂，因此可使產品之生產性提高。 (使用第二内部按壓機構之變形例） 15 接著，以第3A圖及第3B圖說明以第二内部按壓機構28 來代替第一實施形態之第一内部按壓機構21之變形例。 而，由於設有第3A圖及第3B圖所示之第二内部按壓機構28 的電子零件之壓縮成形用模具的構成構件與第1A圖、第1B 圖、第1C圖、第2A圖及第2B圖所示之模具構成構件相同， 20 因此賦予相同標號。 又，第二内部按壓機構28採用作為彈性構件之圓形彈 簧29來代替第一内部按壓機構21之壓縮彈簧25。· 第二内部按壓機構28也與第一内部按壓機構21相同， 設於經分割之孔側面構件11之必要處，將孔底面構件1〇按 19 1376753 壓至孔底面構件10。該第二内部按壓機構28設於孔側面構 件11内部之必要處所形成的收容空間22内。 具體而言，第二内部按壓機構28構成如下。設有位於 收容空間22之孔底面構件1〇側的壁面而上下方向較長之長 5孔23。該長孔23插通有前端側固設於孔底面構件10之棒材 24。插通該棒材24而設有彈性按壓用之圓形彈簧29，棒材 · 24之底端側固設有一固設且可卡止圓形彈簧29之一端側的 棒材卡止部26 (例如平板狀）。收容空間22之孔底面構件1〇 - 側的長孔23周圍設有卡止壓縮彈簧24之另一端側的收容空 鲁 10間卡止部（壁面）27。 如此，設於收容空間22内之圓形彈簧29是在卡止於棒 材卡止部26與收容空間卡止部27間之狀態下設置。又，藉 該圓形彈簣29，可按壓棒材卡止部26與收容空間卡止部^ 來以必要按壓力將經分割之孔侧面構件i i的滑動面按壓至 15 孔底面構件10之滑動面。 故，相對孔側面構件11使孔底面構件1〇朝上方移動來 加壓孔6内之樹脂時，可將經分割之孔側面構件u的滑動 · 面按壓至孔底面構件10之滑動面。結果，可有效地防止孔 側面構件11之滑動面與孔底面構件丨〇之滑動面間產生間 - 20 隙。 . 又，使用第二内部按壓機構28之構成與使用第一内部 按壓機構21之構成相同地，可防止礼底面構件1〇與孔側面 構件11之間隙產生異物，藉此可防止孔底面構件1〇之滑動 不良。結果，可利用孔底面構件1 〇有效地加壓孔6内之樹 20 1376753 脂。 • 又，採用不使用脫模模之模具時，或是利用孔底面構 件10有效地加壓孔6内之樹脂的構成中，可有效地使產品 (樹脂成形體15)之生產性提高。 5 而，孔底面構件1〇、棒材24、棒材卡止部26可相對經 分割之孔側面構件11朝上方只移動必要之移動距離B。 • (使用第三内部按壓機構之變形例） . 接著，以第4A圖及第4B圖說明以第三内部按壓機構31 春 來代替第一實施形態之第一内部按壓機構21 '或第二内部 10按壓機構28之變形例。而，由於設有第4A圖及第4B圖所示 之第三内部按壓機構31的電子零件之壓縮成形用模具的構 成構件與第1A圖、第1B圖、第ic圖、第2A圖及第2B圖所 示之模具構成構件相同，因此賦予相同標號。 第三内部按壓機構31使用圓形彈簧29作為彈性構件， 15這點與第二内部按壓機構28相同。第三内部按壓機構 中，一個孔底面構件10係藉二個孔側面構件丨丨由兩側包 • 夾。具體而言，第三内部按壓機構31是將一對孔側面構件 11相對向地配置，並將與第二内部按壓機構28之棒材24對 * 應的棒材33插通於孔底面構件1〇所設之貫通孔32，將相對 - 20 向之一對第三内部按壓機構31結合而成。 接著’以由一個孔底面構件10 '以及設於其周圍之四 個孔側面構件11構成的下模具2為例，說明第三内部按壓機 構31 ’孔底面構件10係形成平面形狀具有四邊之矩形的下 模具孔6。 21 5 第三内部按壓機構31中 孔32，且該貫通孔32之兩端 件1 〇包失於其間相對向配置 之開口位置（長孔23)—致 ，一個孔底面構件10設有貫通 的開口位置與將—個孔底面構 之孔侧面構件π的收容空間22 以'舌嵌狀態插入貫通孔32 ’該棒材33之!3 端設有棒材卡止㈣，轉材卡止獅與收容 則配置有作為彈性構件之圓形彈菁29。換言 三内部按壓機構31，利用1相對向之孔側面構件⑼ 個孔底面構件_其_“要減力加以按壓。 10 15Since the sliding of the surface member 10 is poor, it is possible to effectively press the resin of the inside of the hole 6 with the hole bottom member 1〇. Therefore, according to the first embodiment, in the configuration in which the release film is not used, the sliding failure of the hole bottom member 10 can be prevented, and the resin in the hole 6 can be effectively pressurized by the hole bottom member 1 Productive improvement. (Modification Example Using Second Internal Pressing Mechanism) Next, a modification example in which the second internal pressing mechanism 28 is used in place of the first internal pressing mechanism 21 of the first embodiment will be described with reference to FIGS. 3A and 3B. Further, the constituent members of the compression molding die for the electronic component of the second internal pressing mechanism 28 shown in FIGS. 3A and 3B are provided with the first A diagram, the first B diagram, the first C diagram, the second A diagram, and the The mold constituent members shown in Fig. 2B are the same, and thus the same reference numerals are given. Further, the second inner pressing mechanism 28 uses a circular spring 29 as an elastic member instead of the compression spring 25 of the first inner pressing mechanism 21. The second inner pressing mechanism 28 is also provided in the same manner as the first inner pressing mechanism 21, and is provided at the position of the divided hole side member 11, and the hole bottom surface member 1 is pressed to the hole bottom member 10 at 19 1376753. The second inner pressing mechanism 28 is provided in the accommodating space 22 formed at a necessary position inside the hole side member 11. Specifically, the second internal pressing mechanism 28 is configured as follows. A wall 5 having a wall surface on the side of the hole bottom member 1 of the accommodating space 22 is provided, and a long hole 5 is formed in the vertical direction. The long hole 23 is inserted into the bar 24 which is fixed to the hole bottom member 10 at the front end side. The rod 24 is inserted and a circular spring 29 for elastic pressing is provided. The bottom end side of the bar 24 is fixed with a bar locking portion 26 which is fixed and can lock one end side of the circular spring 29. For example, a flat shape). In the periphery of the long hole 23 on the side of the hole bottom surface member 1A of the accommodating space 22, the other end side of the locking compression spring 24 is accommodated in the vacant portion 10 (wall surface) 27. In this way, the circular spring 29 provided in the accommodating space 22 is provided in a state of being locked between the bar locking portion 26 and the accommodating space locking portion 27. Further, by the circular magazine 29, the bar locking portion 26 and the accommodating space locking portion can be pressed to press the sliding surface of the divided hole side member ii to the sliding of the 15-hole bottom member 10 with necessary pressing force. surface. Therefore, when the hole bottom surface member 11 moves the hole bottom surface member 1A upward to press the resin in the hole 6, the sliding surface of the divided hole side member u can be pressed against the sliding surface of the hole bottom member 10. As a result, it is possible to effectively prevent the occurrence of a gap between the sliding surface of the hole side member 11 and the sliding surface of the hole bottom member. Further, the configuration using the second inner pressing mechanism 28 is the same as the configuration using the first inner pressing mechanism 21, and it is possible to prevent foreign matter from occurring in the gap between the sole member 1 and the hole side member 11, thereby preventing the hole bottom member 1 from being formed. Bad sliding. As a result, the hole bottom member 1 can be used to effectively press the tree 20 1376753 in the hole 6. In addition, when the mold which does not use the mold release mold is used, or the resin in the hole 6 is effectively pressed by the hole bottom member 10, the productivity of the product (resin molded body 15) can be effectively improved. 5, the hole bottom member 1A, the bar member 24, and the bar locking portion 26 are movable only upward by the necessary moving distance B with respect to the divided hole side member 11. • (Modification using the third internal pressing mechanism). Next, the first internal pressing mechanism 21' or the second internal portion of the first embodiment will be replaced by the third internal pressing mechanism 31 in the fourth and fourth embodiments. 10 Modification of the pressing mechanism 28. In addition, the constituent members of the compression molding die for the electronic component of the third internal pressing mechanism 31 shown in FIGS. 4A and 4B and the first A, the first, the second, the second, and the second The mold constituent members shown in Fig. 2B are the same, and therefore the same reference numerals are given. The third inner pressing mechanism 31 uses the circular spring 29 as the elastic member, and this point is the same as the second inner pressing mechanism 28. In the third internal pressing mechanism, one hole bottom member 10 is sandwiched by two side members. Specifically, the third inner pressing mechanism 31 is disposed such that the pair of hole side members 11 are opposed to each other, and the bar 33 corresponding to the bar 24 of the second inner pressing mechanism 28 is inserted into the hole bottom member 1 The through hole 32 provided in the crucible is formed by combining one of the pair 20 directions with the third inner pressing mechanism 31. Next, the lower inner mold 2 composed of one hole bottom surface member 10' and the four hole side members 11 provided around it will be described as an example, and the third inner pressing mechanism 31' hole bottom member 10 is formed into a planar shape having a rectangular shape of four sides. Lower mold hole 6. 21 5 The third inner pressing mechanism 31 has a hole 32, and the two end members 1 of the through hole 32 are lost in the oppositely disposed opening positions (long holes 23), and one hole bottom member 10 is provided with a through hole. The opening position and the accommodating space 22 of the hole side member π which is formed by the bottom surface of the hole are inserted into the through hole 32 in a 'tongue-inserted state'. The bar 33 is provided with a bar stopper (four), and the material is inserted into the lion and the lion The housing is provided with a circular elastic cyanine 29 as an elastic member. In other words, the internal pressing mechanism 31 uses a relative hole side member (9) hole bottom member _ "to reduce the force and press it. 10 15
故，由於可防纽底面構制之滑動面與孔側 11之滑動面間（滑動部14)產生間隙，因此可獲得與^ 内部按壓機構21或第三内部按壓機構28相同之作用效果 即，利用第三内部按壓機構31來防止孔底面構件ι〇之滑 不良而提高生產性。 β ’ 〔第二實施形態〕Therefore, since a gap is formed between the sliding surface which can prevent the bottom surface from being formed and the sliding surface of the hole side 11 (sliding portion 14), the same effect as that of the internal pressing mechanism 21 or the third internal pressing mechanism 28 can be obtained. The third internal pressing mechanism 31 prevents slippage of the hole bottom member ι and improves productivity. β ' [second embodiment]
接著，詳細說明第二實施形態。第5八圖及第5Β圖顯示 第二實施形態之電子零件之壓縮成形用模具，第5c圖顯示 作為模具要部之第一外部按壓機構。而，第二實施形雖7^ 示之模具的基本構成與第一實施形態所示之模具的基本 20 成相同，因此省略其說明。 (關於第二實施形態之電子零件之壓縮成形用模具的 構成） ' 第5A圖及第5B圖所示之第二實施形態之模具中，設有 固定之上模具1、可動之下模具2、用以供給已安裳 电—零 22 件3之基板4的上換ι之基板設置部5、設於下模具2之廢縮 成形用孔6與其孔開口部9。下模具2設有構成孔^孔底面 構件10及孔周圍構件（前壓塊）。 又如第5B圖所"F，孔周圍構件設有孔側面構件U , 該孔侧面構件11由平面觀之，係對應例如矩形之孔6的底面 (或矩形之孔開〇部9)之四邊分割為四個。 又，孔底面構件10固設於基台12，經分割之孔側面構 心1設置成可透顧縮彈簧（彈性構件）13而相對基台12 彈性上下動。經分割之各孔側面構件丨丨固接有設成可相對 基台12滑動之導5丨棒38，且該導引棒38插通有彈性構件13。 藉具有上述構造之第二實施形態，將上下兩模具1、2 合拉’藉此’首先使經分割之孔側面構件u的各前端面與 供給設置於上模具1之基板4的表面接觸。之後，將已安裝 於基板4之電子零件3浸潰於已加熱融化之孔6的樹脂材料 ()接著，使孔底面構件10向上動，藉此可對孔6内之樹 脂施加必要樹脂壓。 (關於第一外部按壓機構） 又，如圖所示，第二實施形態之模具丨、2分別於各孔 側面構件11設有第一外部按壓機構36，第一外部按壓機構 36可相對孔底面構件10以必要按壓力將孔侧面構件i 1由其 兩側加以按壓。 又’第一按壓機構36於經分割之孔側面構件丨丨外部側 的必要部位，設有外部加壓構件37及球狀柱塞4〇，外部加 壓構件37係以直立設置之狀態形成於基台12，球狀柱塞4〇 1376753 係設於外部加壓構件37之必要部位而以必要按壓力按璧各 孔側面構件lb 該球狀柱塞40設有按壓用球構件（例如硬球）、作為按 壓球構件41之彈性構件的壓縮彈簧42、收容球構件41與彈 5簧42之收容空間43、以及具有收容空間43之球狀柱塞本體 44。又，球狀柱塞本體44藉設於其外周圍之螺絲部46，可 相對外部加壓構件37螺設成可自由拆裝，並可調整其螺設 . 位置。 . 又’球狀柱塞本體44之收容空間43的按壓前端側形成 鲁 10有卡止球構件41之罩斜面部45。球構件41通常（例如螺設 於外部加壓構件37前）是以設於球狀柱塞本體44前端側之 開口部47突出些許之狀態來設置。 藉上述構成，可利用螺設於外部加壓構件37之球狀柱 塞40將分割孔側面構件11對孔底面構件10進行按壓。故， 15藉第二實施形態之第一外部按壓機構36，可有效地防止分 割孔側面構件11之滑動面與孔底面構件1〇之滑動面間（滑 動部14)產生間隙。 · 而，第5C圖所示構成之例中，球構件41係存在於收容 空間43，呈透過球構件41以彈簧42按壓孔側面構件丨丨之狀 - 20 態。 — (關於第一實施形態的電子零件之壓縮成形方法及其 作用效果） 第二實施形態中，與第一實施形態相同地，將上下兩 模具1、2合模來以孔底面構件1〇對孔6内之樹脂施加必要樹 24 1376753 脂壓，藉此將已安裝於基板4之電子零件3壓縮成形於樹脂 成形體15内。 故，第二實施形態中，藉包含球形柱塞等的第一外部 按壓機構，對孔底面構件10以必要按壓力按壓各經分割之 5孔侧面構件11，藉此有效地防止孔側面構件11與孔底面構 件10間（滑動面14 )產生間隙。 換吕之，藉第二實施形態，由於可防止孔底面構件1〇 與分割孔側面構件11間形成之滑動部14產生間隙或異物， 因此可藉扎底面構件10有效地加壓孔6内之樹脂。 10 又，藉第二貫施形態，在不使用脫模膜之情形下，亦 可防止孔底面構件10之滑動不良’有效地提高產品之生產 性。 接著’詳細說明本發明之第三實施形態。第6A圖顯示 第三實施形態的電子零件之壓縮成形用模具，第6B圖及第 6C圖擴大顯不s亥模具要部之第二外部按壓機構。而，第三 實施形態所示之模具的基本構成與第一及第二實施形態所 示之模具的基本構成相同，因此省略說明β (關於第三實施形態的電子零件之壓縮成形用模具構 成） 20 第6Α圖所示之第三實施形態的模具3，與第一實施形態 才目同地，設有固定之上模具1、可動之下模具2、用以供給 已安裝電子零件3之基板4的上模具丨之基板設置部5、設於 下模具2之壓縮成形用孔6與孔開口部9。下模具2設有構成 孔6之孔底面構件1〇及孔側面構件11。 25 1376753 又，第三實施形態中，雖未圖示，但與第二實施形態 (參考第5B圖）相同地’由平面觀之，孔周圍構件設有孔 側面構件11，該孔側面構件11係對應例如矩形孔6之底面 (或矩形孔開口部）之四邊而分割。 5 藉具有上述構成之第二貫施形態，與第一、第-實施 形態相同地，將上下兩模具1、2合模，藉此，首先使各孔 側面構件11的各前端面與供給設置於上模具i之基板4的表 面接觸，並將已安裝於基板4之電子零件3浸潰於已加熱融 化之孔6的樹脂材料（7) ’接著，使孔底面構件1〇向上動， 10 藉此可對礼6内之樹脂施加必要樹脂愿。 (關於第二外部按壓機構） 又，如圖式之構造例，第三實施形態之模具設有第二 外部按壓機構50，第一外部按壓機構％可對孔底面構件 將經分割之各孔側面構件11由其外部加以按壓。第二外部 15按壓機構50分別設有立設於基台12之外部按壓構件51、以 及將外部按壓構件51卡止於基台12之卡止插銷52。 再者，第二貫施形態之模具設有嵌合用凸部及溝部 (凹部）54，嵌合用凸部53設於外部按壓構件51之前端側 的孔側面構件11侧，溝部54設於孔側面構件丨丨而呈可對應 20 凸部53嵌合滑動之狀態。 藉該構成，可藉外部按壓構件51之凸部53按壓孔側面 構件11之溝部54而滑動。故，藉以凸部53按壓溝部54，可 用必要按壓力對孔底面構件1〇按壓孔側面構件n。 而’孔側面構件11之前端面接觸設置於上模具1之基板 26 1376753 4表面後，接著將孔底面構件10朝上方移動藉此以卡止 #銷湖設之外部按壓機構5〇的凸部53會按壓3孔侧面構件 11之溝部54而滑動。 C關於第三實施形態的電子零件之壓縮成形方法與作 5 用效果） 帛三實施形態中’與第-、第二實施形態相同地，將 上下兩核具1、2合模來以孔底面構件10對孔6内之樹脂施加 必要樹脂壓，藉此可將已安裝於基板4之電子零件3壓縮成 # 形於樹脂成形體15内。 10 故，第三實施形態中，藉第二外部按壓機構50 (凸部） 對孔底面構件10按壓孔側面構件11，藉此可有效地防止孔 側面構件11與孔底面構件10間形成之滑動部14產生間隙或 形成異物’因此可利用孔底面構件10有效地加壓孔6内之樹 脂。又’藉第三實施形態，在不使用脫模膜之情形下，亦 15可防止孔底面構件1〇之滑動不良，有效地提高產品之生產 性。 •〔第四實施形態〕 接著’詳細說明本發明第四實施形態。第7A圖顯示第 • 四實施形態的電子零件之壓縮成形用模具’第7B圖顯示該 . 20模具要部之片按壓機構。而，第四實施形態所示之模具的 基本構成與第一〜三實施形態所示之模具的基本構成相 同’因此省略說明。 (關於第四實施形態的電子零件之壓縮成形用模具構 成） 27 1376753 第7A圖所示之第四實施形態的模具，與第--三實施 形態相同地，設有固定之上模具1、可動之下模具2、用以 供給已安裝電子零件3之基板4的上模具1之基板設置部5、 設於下模具2之瘦縮成形用孔6與其孔開口部9。下模具2設 5 有構成孔6之孔底面構件10及孔周圍構件11。 又，第四實施形態中’雖未圖示，但與第二實施形態 (參考第5B圖）相同地，由平面觀之，孔周圍構件設有孔 側面構件11，該孔侧面構件11係對應例如矩形孔6之底面 (或矩形孔開口部）之四邊而分割。孔側面構件u分別設 鲁 ίο有可相對孔側面構件11自由拆裝之分割型小片構件61，該 刀割型小片構件61係對應孔6之側面與孔側面構件η的滑 動面。又，經分割之孔側面構件丨丨分別設有將小片構件61 朝孔方向按壓之片按壓機構62。 藉具有上述構成之第四實施形態，首先，將上下兩模 I5具1、2合模’藉此使孔側面構件u之各小片構件61的各前 端面與供給設置於上模具之基板的表面接觸。在此狀態 下’將已安裝於基板之電子零件浸漬於已加熱融化之孔6的 · 樹脂材料7，接著’使礼底面構件10向上動，藉此可對孔6 内之樹脂施加必要樹脂壓。而，小片構件61只要是至少& * 2〇含孔側面構件u之滑動面的構成即可。 (關於片按壓機構） 第四實施形態中，如第7B圖所示，以必要按壓力將小 片構件61朝孔底面構件1〇按壓之片按壓機構62，係配置於 刀J孔側面構件U之必要處所形成的收容空間幻 28 1376753 按壓機構62設有片按壓構件64、彈性構件65及卡止彈性構 件65之卡止部66 ’片按壓構件64透過設於收容空間63之前 端側的開口部69來按壓小片構件61，而彈性構件65則是按 壓按壓構件64之壓縮彈簧等。故，藉片按壓構件64 (彈性 5 構件65)，可透過小片構件61來按壓孔底面構件1〇。 (關於第四實施形態的電子零件之壓縮成形方法與作 用效果）Next, the second embodiment will be described in detail. Fig. 5 and Fig. 5 are views showing a mold for compression molding of an electronic component according to the second embodiment, and Fig. 5c shows a first external pressing mechanism as a main part of the mold. Incidentally, the basic configuration of the mold of the second embodiment is the same as that of the mold shown in the first embodiment, and therefore the description thereof will be omitted. (Configuration of the mold for compression molding of the electronic component according to the second embodiment) 'In the mold of the second embodiment shown in Figs. 5A and 5B, the upper mold 1 and the movable mold 2 are fixed. The substrate mounting portion 5 for supplying the substrate 4 of the substrate 4 and the substrate 4 is provided, and the hole for shrinking molding 6 provided in the lower mold 2 and the hole opening portion 9 thereof. The lower mold 2 is provided with a hole bottom member 10 and a hole surrounding member (front block). Further, as shown in FIG. 5B, the member around the hole is provided with a hole side member U which is planarly viewed to correspond to, for example, the bottom surface of the rectangular hole 6 (or the rectangular hole opening portion 9). The four sides are divided into four. Further, the hole bottom member 10 is fixed to the base 12, and the divided hole side surface center 1 is provided so as to be elastically movable up and down with respect to the base 12 via the contraction spring (elastic member) 13. The divided side member of the hole is fixedly connected with a guide 5 bar 38 which is slidable relative to the base 12, and the guide bar 38 is inserted with the elastic member 13. According to the second embodiment having the above configuration, the upper and lower dies 1 and 2 are pulled together, whereby the front end faces of the divided hole side members u are first brought into contact with the surface of the substrate 4 provided on the upper mold 1. Thereafter, the electronic component 3 mounted on the substrate 4 is immersed in the resin material of the heated melted hole 6 (), and then the hole bottom member 10 is moved upward, whereby the necessary resin pressure can be applied to the resin in the hole 6. (First External Pressing Mechanism) Further, as shown in the drawing, the mold cymbal 2 of the second embodiment is provided with a first external pressing mechanism 36 on each of the hole side members 11, and the first external pressing mechanism 36 is opposite to the bottom surface of the hole. The member 10 presses the hole side member i 1 from both sides thereof with a necessary pressing force. Further, the first pressing mechanism 36 is provided with an external pressing member 37 and a spherical plunger 4〇 at a necessary portion on the outer side of the divided hole side member, and the external pressing member 37 is formed in an upright state. The base 12, the spherical plunger 4〇1376753 is provided at a necessary portion of the external pressing member 37, and presses each of the side surface members lb with a necessary pressing force. The spherical plunger 40 is provided with a pressing ball member (for example, a hard ball). The compression spring 42 that presses the elastic member of the ball member 41, the accommodation space 43 that houses the ball member 41 and the spring 5 spring 42, and the spherical plunger body 44 that has the accommodation space 43. Further, the ball plunger body 44 is screwed to the outer peripheral portion of the screw portion 46 so as to be detachable from the outer pressing member 37, and the screwing position thereof can be adjusted. Further, the pressing front end side of the accommodating space 43 of the spherical plunger main body 44 forms a cover inclined surface portion 45 having the locking ball member 41. The ball member 41 is normally provided (for example, before the external pressing member 37 is screwed) in a state in which the opening 47 provided on the front end side of the spherical plunger main body 44 is slightly protruded. According to the above configuration, the split hole side surface member 11 can be pressed against the hole bottom surface member 10 by the spherical plug 40 provided on the external pressing member 37. Therefore, by the first external pressing mechanism 36 of the second embodiment, it is possible to effectively prevent a gap between the sliding surface of the dividing hole side member 11 and the sliding surface of the hole bottom member 1 (sliding portion 14). In the example shown in Fig. 5C, the ball member 41 is present in the accommodating space 43, and is in a state in which the ball member 41 presses the hole side member 丨丨 through the ball member 41. (Reseal molding method of electronic component according to the first embodiment and its operation and effect) In the second embodiment, as in the first embodiment, the upper and lower molds 1 and 2 are clamped to each other by the hole bottom member 1 The resin in the hole 6 is subjected to a grease pressure of the necessary tree 24 1376753, whereby the electronic component 3 mounted on the substrate 4 is compression-molded into the resin molded body 15. Therefore, in the second embodiment, the first outer pressing mechanism including the spherical plunger or the like is used to press the divided five-hole side members 11 with the necessary pressing force on the hole bottom member 10, thereby effectively preventing the hole side member 11 A gap is formed between the hole bottom member 10 (the sliding surface 14). In the second embodiment, since the gap or the foreign matter is prevented from being generated in the sliding portion 14 formed between the hole bottom member 1〇 and the split hole side member 11, the bottom member 10 can be effectively pressed to press the hole 6 therein. Resin. Further, in the second embodiment, it is possible to prevent the sliding failure of the hole bottom member 10 without using the release film, thereby effectively improving the productivity of the product. Next, a third embodiment of the present invention will be described in detail. Fig. 6A is a view showing a mold for compression molding of an electronic component according to a third embodiment, and Figs. 6B and 6C show a second external pressing mechanism for expanding the main part of the mold. The basic configuration of the mold shown in the third embodiment is the same as the basic configuration of the molds shown in the first and second embodiments. Therefore, the description of the mold (the mold for compression molding of the electronic component according to the third embodiment) is omitted. The mold 3 of the third embodiment shown in FIG. 6 is similar to the first embodiment, and is provided with a fixed upper mold 1, a movable lower mold 2, and a substrate 4 for supplying the mounted electronic component 3. The substrate mounting portion 5 of the upper mold 、 is provided in the compression molding hole 6 and the hole opening portion 9 of the lower mold 2 . The lower mold 2 is provided with a hole bottom member 1A and a hole side member 11 which constitute the hole 6. Further, in the third embodiment, although not shown, in the same manner as the second embodiment (refer to FIG. 5B), the hole surrounding member is provided with a hole side member 11 in plan view, and the hole side member 11 is provided. The division is performed corresponding to, for example, four sides of the bottom surface (or the rectangular hole opening portion) of the rectangular hole 6. In the second embodiment having the above-described configuration, the upper and lower molds 1 and 2 are clamped in the same manner as in the first and the first embodiment, whereby the front end faces of the respective hole side members 11 and the supply are first set. Contacting the surface of the substrate 4 of the upper mold i, and immersing the electronic component 3 mounted on the substrate 4 in the resin material (7) of the heated melted hole 6. Next, the hole bottom member 1〇 is moved upward, 10 Thereby, the necessary resin can be applied to the resin in the ceremony 6. (Second External Pressing Mechanism) Further, in the structural example of the embodiment, the mold of the third embodiment is provided with a second external pressing mechanism 50, and the first external pressing mechanism % can be used to divide the side faces of the holes to the bottom surface member The member 11 is pressed by the outside thereof. The second outer 15 pressing mechanism 50 is provided with an outer pressing member 51 that is erected on the base 12, and a locking pin 52 that locks the outer pressing member 51 to the base 12. Further, the mold of the second embodiment is provided with a fitting convex portion and a groove portion (concave portion) 54, and the fitting convex portion 53 is provided on the side of the hole side member 11 on the front end side of the outer pressing member 51, and the groove portion 54 is provided on the side of the hole. The member is configured to be in a state in which the 20 convex portions 53 are fitted and slid. With this configuration, the convex portion 53 of the outer pressing member 51 can be pressed to press the groove portion 54 of the hole side member 11. Therefore, by pressing the groove portion 54 by the convex portion 53, the hole side surface member 1 can be pressed against the hole bottom surface member 1 by the necessary pressing force. On the other hand, after the front end surface of the hole side member 11 is in contact with the surface of the substrate 26 1376753 4 of the upper mold 1, the hole bottom surface member 10 is moved upward to thereby lock the convex portion 53 of the external pressing mechanism 5 of the pin lake. The groove portion 54 of the three-hole side member 11 is pressed and slid. C. The compression molding method for the electronic component according to the third embodiment and the effect of the fifth embodiment. In the third embodiment, the upper and lower cores 1 and 2 are clamped to the bottom surface of the hole in the same manner as in the first embodiment and the second embodiment. The member 10 applies a necessary resin pressure to the resin in the hole 6, whereby the electronic component 3 mounted on the substrate 4 can be compressed into a shape of the resin molded body 15. Therefore, in the third embodiment, the hole side surface member 11 is pressed against the hole bottom member 10 by the second outer pressing mechanism 50 (protrusion), whereby the sliding between the hole side member 11 and the hole bottom member 10 can be effectively prevented. The portion 14 creates a gap or forms a foreign matter. Therefore, the resin in the hole 6 can be effectively pressurized by the hole bottom member 10. Further, according to the third embodiment, in the case where the release film is not used, the sliding failure of the hole bottom member 1 can be prevented, and the productivity of the product can be effectively improved. [Fourth embodiment] Next, a fourth embodiment of the present invention will be described in detail. Fig. 7A is a view showing a mold for compression molding of an electronic component according to a fourth embodiment, and Fig. 7B is a view showing a sheet pressing mechanism of the main part of the mold. The basic configuration of the mold shown in the fourth embodiment is the same as the basic configuration of the mold shown in the first to third embodiments. Therefore, the description thereof is omitted. (Molded by a die for compression molding of an electronic component according to the fourth embodiment) 27 1376753 A mold according to a fourth embodiment shown in Fig. 7A is provided with a fixed upper mold 1 and movable as in the third embodiment. The lower mold 2 includes a substrate mounting portion 5 for supplying the upper mold 1 of the substrate 4 on which the electronic component 3 is mounted, and a thinning forming hole 6 provided in the lower mold 2 and the hole opening portion 9. The lower mold 2 is provided with a hole bottom member 10 and a hole surrounding member 11 which constitute the hole 6. Further, in the fourth embodiment, although not shown, similarly to the second embodiment (refer to FIG. 5B), the hole surrounding member is provided with a hole side member 11 in plan view, and the hole side member 11 corresponds to For example, the bottom surface of the rectangular hole 6 (or the rectangular hole opening portion) is divided into four sides. The hole side members u are respectively provided with a divided small piece member 61 which is detachably attachable to the hole side member 11, and the knife cut type small piece member 61 corresponds to the sliding surface of the side surface of the hole 6 and the hole side member η. Further, the divided hole side member 丨丨 is provided with a sheet pressing mechanism 62 that presses the small piece member 61 in the hole direction. According to the fourth embodiment having the above configuration, first, the upper and lower molds I5 are clamped 1 and 2, whereby the front end faces of the small pieces 61 of the hole side member u are supplied to the surface of the substrate provided on the upper mold. contact. In this state, the electronic component mounted on the substrate is immersed in the resin material 7 of the heated melted hole 6, and then the bottom member 10 is moved upward, whereby the necessary resin pressure can be applied to the resin in the hole 6. . Further, the small piece member 61 may be configured to have at least a sliding surface of the hole-containing side member u. (Regarding the sheet pressing mechanism) In the fourth embodiment, as shown in Fig. 7B, the sheet pressing mechanism 62 that presses the small piece member 61 toward the hole bottom surface member 1A with a required pressing force is disposed in the side surface member U of the blade J. The accommodating space formed by the necessary space 28 1376753 The pressing mechanism 62 is provided with the sheet pressing member 64, the elastic member 65, and the locking portion 66 of the locking elastic member 65. The sheet pressing member 64 transmits the opening portion provided on the front end side of the accommodating space 63. The small member 61 is pressed by 69, and the elastic member 65 is a compression spring or the like that presses the pressing member 64. Therefore, by the sheet pressing member 64 (elastic 5 member 65), the hole bottom member 1〇 can be pressed through the small piece member 61. (The compression molding method and effect of the electronic component of the fourth embodiment)
10 使用第四實施形態之模具，藉片按壓機構62，可對孔 底面構件10以必要按壓力來按壓構成各經分割之孔側面構 件11的小片構件61，藉此有效地防止小片構件61與孔底面 構件10間（滑動部14 )產生間隙或形成異物，因此可利用 孔底面構件10有效地加壓下模具孔6内之樹脂。又，藉第四 實施形態，在不使用脫模膜之情形下，亦可防止孔底面構 件10之滑動不良，有效地提高產品之生產性。 15 又’如第7A圖所示，小片構件61之滑動面構造成由孔 側面構件11之滑動面只突出距離C。再者，小片構件61之滑 動面設有可提高脫模性之脫模處理層67、或可提高滑動性 之滑動處理層67。此時，脫模處理層67或滑動處理層67可 形成例如鐵氟龍（登錄商標）等氣系表面處理劑。藉設置 20 該脫模處理層67或滑動處理層67，可有效地防止小片構件 61與孔底面構件1〇間形成之間隙（滑動部14)形成異物β 又，如第7C圖所示，可於孔底面構件10之滑動面的必 要處，設置例如使用鐵氟龍（登錄商標）等氟系密封劑等 之密封構件68。藉設置上述密封構件68，可有效地防止小 29 片構件61與孔底面構件_產生_。 而’脫模處理層67 r十上 構件68。 s月動處理層67)亦可併用密棄 〔第五實施形態〕 U細說明本發明第五實施形態 圖m實㈣態的電 ⑽ p,. ^Qt> f零件之壓縮成形用模具，第9/ 圖及第9B圖顯示該糢具要 ^ 邛之小片構件按壓機構。 (關於第五實施形離的雨工 成） 〜、的屯子令件之壓縮成形用模具掮By using the mold of the fourth embodiment, the sheet pressing mechanism 62 can press the small-diameter member 61 constituting each of the divided hole side members 11 with the necessary pressing force on the hole bottom member 10, thereby effectively preventing the small-piece member 61 from being Since the gap between the hole bottom members 10 (the sliding portion 14) or foreign matter is formed, the hole bottom member 10 can be used to effectively pressurize the resin in the lower mold hole 6. Further, according to the fourth embodiment, in the case where the release film is not used, the sliding failure of the hole bottom member 10 can be prevented, and the productivity of the product can be effectively improved. Further, as shown in Fig. 7A, the sliding surface of the small piece member 61 is constructed such that the sliding surface of the hole side member 11 protrudes only by the distance C. Further, the sliding surface of the small piece member 61 is provided with a release treatment layer 67 which can improve mold release property or a slide treatment layer 67 which can improve slidability. At this time, the release treatment layer 67 or the sliding treatment layer 67 can form a gas-based surface treatment agent such as Teflon (registered trademark). By providing the release treatment layer 67 or the sliding treatment layer 67, it is possible to effectively prevent the gap (sliding portion 14) formed between the small-piece member 61 and the hole bottom member 1 from forming the foreign matter β, as shown in Fig. 7C. A sealing member 68 such as a fluorine-based sealant such as Teflon (registered trademark) is used as necessary for the sliding surface of the hole bottom member 10. By providing the above-described sealing member 68, it is possible to effectively prevent the small-piece member 61 and the hole bottom member _ from being generated. And the 'release-treatment layer 67r' is on the member 68. The s monthly processing layer 67) may be used in combination. [Fifth Embodiment] The fifth embodiment of the present invention will be described with respect to the electric (10) p, . ^Qt> f-part compression molding die of the fifth embodiment of the present invention. 9/Fig. and Fig. 9B show the small piece member pressing mechanism of the mold. (About the fifth embodiment of the rain-making process) ~, the mold for compression molding of the 屯 令 掮
1〇如第8八圖及第纽圖所示，第五實施形態的電子零件之 壓縮成形賴具設有固定之上模具丨、以及與該上模具相對 向配置之可動下模具2。上模具i之模面設有基板設置的， 基板設置部5係用以在使電子零件3朝下方之狀態下，供給 設置已安裝電子零件3之基板4者。 15 又，下模具2設有壓縮成形用孔6，並設有對該孔6内供As shown in Fig. 8 and FIG. 10, the compression molding of the electronic component according to the fifth embodiment is provided with a fixed upper mold 丨 and a movable lower mold 2 disposed opposite to the upper mold. The mold surface of the upper mold i is provided with a substrate, and the substrate installation portion 5 is for supplying the substrate 4 on which the electronic component 3 is mounted with the electronic component 3 facing downward. Further, the lower mold 2 is provided with a hole for compression molding 6, and is provided for the hole 6
給樹脂材料（7)(例如顆粒狀樹脂材料）之樹脂材料供給 機構8，而可由朝孔6上方開口之孔開口部9 (圖式之實施形 態中，為平面具有4邊之矩形）對孔6内供給樹脂材料（7)。 又，雖未圖示，模具（上下兩模具）1、2設有可將模 2〇 具1、2加熱至必要模具溫度的加熱機構、以及以必要合模 壓力將模具1、2合模之合模機構。 又，下模具孔6設有構成該孔6之底面的孔底面構件 10、以及構成該孔6之底面外周圍的側面的孔側面構件（前 壓塊）。 30 再者’本實施形態中，如第8B圖所示，由平面觀之， 孔周圍構件係對應例如孔底面構件1〇之矩形孔6的底面（或 矩形孔開口部9的4個邊）之四邊而分割，藉此形成4個分割 之孔側面構件11 (外周箝位器）。 5 又，扎底面構件10構造成固設於基台12，並於4個分割The resin material supply mechanism 8 of the resin material (7) (for example, a particulate resin material) is provided by the hole opening portion 9 which is opened toward the upper side of the hole 6 (in the embodiment of the drawing, the plane has a rectangular shape of 4 sides) 6 is supplied with a resin material (7). Further, although not shown, the mold (upper and lower molds) 1 and 2 are provided with a heating mechanism capable of heating the molds 2 and 2 to a necessary mold temperature, and clamping the molds 1 and 2 at a necessary mold clamping pressure. Clamping mechanism. Further, the lower die hole 6 is provided with a hole bottom surface member 10 constituting the bottom surface of the hole 6, and a hole side surface member (front pressing block) constituting a side surface of the outer periphery of the bottom surface of the hole 6. Further, in the present embodiment, as shown in Fig. 8B, the peri-hole member corresponds to, for example, the bottom surface of the rectangular hole 6 of the hole bottom surface member 1 (or four sides of the rectangular hole opening portion 9). The four sides are divided to form four divided hole side members 11 (outer circumference clamps). 5, the bottom member 10 is configured to be fixed to the base 12 and divided into four
孔侧面構件11與基台12間分別設置壓縮彈簧等彈性構件 13。而，分割孔側面構件u之滑動面與孔底面構件⑺之滑 動面間會形成滑動部14。An elastic member 13 such as a compression spring is provided between the hole side member 11 and the base 12, respectively. On the other hand, the sliding portion 14 is formed between the sliding surface of the split hole side member u and the sliding surface of the hole bottom member (7).
本實施形態中，藉具有上述構成，首先，如第8A圖所 10不，於上模具1之基板設置部5供給設置已安裝電子零件3之 基板4,並於該狀態下，對下模具孔6内供給樹脂材料7並將 以加熱融化。接著，將模具丨、2合模，藉此使孔側面構件 (刖壓塊）11之各前端面與供給設置於上模具丨之基板設置 部5的基板4表面接觸❶在該狀態下，使孔底面構件1〇向上 Μ方移動’藉此可對在下模具孔6内已加熱融化之樹脂施加必 要樹脂壓。故，在經過硬化所需之必要時間後，可將已安 裝於基板4之電子零件3填封成形於與下模具孔6之形狀對 應的樹脂成形體15内。 (關於孔侧面構件） 20 又，經分割之孔側面構件11設有可以必要按壓力將孔 側面構件11朝孔底面構件1〇按壓之按壓機構（後述之空氣 壓送機構）。 二； 具體而言，如第9A圖及第9B圖所示，經分割之孔側面 構件11 (本體lla)設有按壓孔底面構件10小片構件71，而 31 1376753 該小片構件71係相對孔側面構件本體丨13呈可自由拆裝。 且，設有可將該小片構件71朝孔6側之方向按壓的小片構件 按麼機構（後述之空氣壓送機構72)。 又，小片構件71設有將小片構件71朝按壓方向（孔6 5側之方向）引導的引導部71a ’且可相對分割孔侧面構件之 本體11a以引導部71a將小片構件71朝按壓方向按壓而僅滑 動些許。藉該構成，可利用小片構件按壓機構72以必要按 壓力將分割孔側面構件11之滑動面（具有引導部71a之小片 - 構件71的滑動面）朝孔底面構件1〇之滑動面按壓。 · 10 故，相對經分割之孔側面構件11使孔底面構件1〇朝上 方移動來加壓孔6内之樹脂時，可用必要按壓力將分割孔側 面構件11之小片構件71的滑動面朝孔底面構件1〇之滑動面 按壓。結果，可防止孔側面構件u (小片構件71)之滑動 面與孔底面構件10之滑動面間（滑動部14)產生間隙。 15 而，孔底面構件10之移動方向與分割孔侧面構件丨丨之 按壓方向係例如互相垂直。 (關於小片構件按壓機構） g 又，如第9A圖及第9B圖所示，孔侧面構件叹本體旧 與小片構件71間以必要之間隔形成微小之間隙乃。又，▲& 20間隙73，係在經常與孔側面構件U之本體lla與小片構件^ 接觸的狀態下，或在經常被失持的狀態下，配設有〇環=71 . 隔外氣用之密封構件74。藉該構造，間隙乃可藉密Y 74在將間隙73之内部以密封構件74包圍之狀態下在封構件 氣阻隔用空間部（空氣按壓用空間部75)。 形成外 32 1376753 又刀割孔側面構件11之本體lla於複數處設有壓縮空 . 龄流_㈣流體之壓送路徑76。該槪路徑76之-端 側連通連接於設在密封構件74所形成之外氣阻隔空間部75 側之壓縮空氣壓送用的開口部，同時另一端側連通連接於 5剎用空氣等流體之壓力的空氣泵等流體麼送機構72，且該 流體壓送機構72係成為小片構件按壓機構。 本實施形態令’舉例言之，於間隙73以分割孔側面構 件之本體11a與小片構件71經常失持環狀密封構件74，形成 • 外氣阻隔空間部75。環狀密封構件74係以包圍必要數量之 ⑴壓送路徑76的開口部之狀態設置。藉該構造，以空氣壓送 機構72透過壓送路徑76來將壓縮空氣朝空氣按壓用空間部 75壓送，藉此可產生必要空壓力，並藉該空壓力產生之必 要按壓力，將小片構件71以必要按壓力朝孔6側之方向對孔 底面構件10按壓。 15 故，藉本實施形態，可以必要按壓力將小片構件71之 _ 滑動面朝孔底面構件1〇之滑動面按壓，而可有效地防止經 分割之孔侧面構件11 (小片構件71 )與孔底面構件10間（滑 動部14)形成間隙。 (關於將樹脂成形體脫模後移動孔底面構件） 2〇 本實施形態中，進一步將已安裝於基板4之電子零件3 壓縮成形於樹脂成形體15内，將模具（上下兩模具1、2) 開模’並由下模具孔6將樹脂成形體15脫模後，使孔底面構 件10朝下方移動來回到原先之位置。 舉例言之，朝孔底面構件10之上下方向移動時，一般 33 1376753 在採用按壓孔底面構件10之按壓機構的情形下，由於是在 以分割孔側面構件11 (小片構件71)來按壓孔底面構件1〇 的狀態下使孔底面構件10朝下方移動，因此孔底面構件10 有時會產生滑動不良。又，此時，無法有效地防止孔底面 5構件10與孔側面構件11 (小片構件71)之滑動面14所產生 的磨耗。 惟，本實施形態t，可解除因空氣壓送機構72所產生 的對小片構件71 (經分割之孔側面構件丨丨）之按壓。故， 可解除因空氣壓送機構72所產生的小月構件71 (孔側面構 10件U)對孔底面構件1〇之按壓，並在不按壓孔底面構件1〇 之狀態下，使礼底面構件1〇朝下方移動，因此可有效地防 止孔底面構件10產生的滑動不良。 又’使孔底面構件10朝上方移動時，以分割孔側面構 件11 (小片構件71)按壓孔底面構件10，並使孔底面構件 15 10朝下方移動時，由於可採用不以分割孔側面構件11按壓 孔底面構件10之構成’因此可有效地防止孔底面構件10產 生的磨耗。 故，本實施形態中，加壓下模具孔6内之樹脂時，可壓 送空氣來按壓小片構件71 (經分割之孔側面構件11 )，藉此 20在以必要按壓力利用小片構件按壓孔底面構件10之狀態 下，使孔底面構件10朝上方移動，且，在由下模具孔6内將 樹脂成形體脫模後，解除壓縮空氣之壓送，而在不以小片 構件71 (經分割之孔側面構件u)按壓扎底面構件1〇之狀 態下，使孔底面構件10朝下方移動。 34 1376753 (電子零件之壓縮成形方法） 本實施形態的電子零件之壓縮成形方法中，首先，如 第8A圖所示，將已安裝電子零件3之基板4供給設置於上模 具1之基板設置部5 ’並以樹脂材料之供給機構8將樹脂材料 5 7 (例如顆粒狀樹脂材料）供給至下模具孔6内，再加熱使 其融化。接著，將上下兩模具1、2合模，藉此將經分割之 孔側面構件11之前端面與供給設置於上模具丨之基板4表面 接合。在該狀態下，將已安裝於基板4之電子零件3浸潰於 • 已在下模具孔6内加熱融化之樹脂。 10 接著，將孔底面構件10朝上方移動，藉此將模具孔6 内之樹脂加壓。該利用孔底面構件10進行之樹脂加壓步驟 中，係藉空氣壓送機構72將空氣透過壓送路徑76壓送至間 隙73所形成之空間部75。藉此，可用必要空氣壓力產生的 必要按壓力而利用經分割之孔側面構件u (小片構件71) 15 來按壓孔底面構件10。 如此一來，藉第五實施形態之按壓機構，可在用必要 籲 按壓力而利用經分割之孔底面構件1〇 (小片構件川之滑 動面來按壓孔底面構件10之滑動面的狀態下，使孔底面構 • 件1G朝上方移動，對下模具孔6内之樹脂施加必要樹脂壓。 20 & ’可有效地防止經分割之孔側面構件11的滑動面與孔底 面構件ίο之滑動面間形成的滑動部14產生間隙。 經過樹脂材料硬化必要之時間後，將模具丨、2開模， 藉此可形成填封於與下模具孔6形狀對應之樹脂成形體^ 内的電子零件3。 35 1376753 如前所述，本實施形態中，以孔底面構件1〇加壓時， 在用空氣壓送機構72將經分割之孔側面構件j j分別以必要 按壓力按壓孔底面構件10時，可藉孔底面構件1〇對孔6内之 樹脂施加必要樹脂壓。故，藉本實施形態，可有效地防止 5孔底面構件10與孔側面構件11間所形成之滑動部14產生間 隙。 故，可有效地防止該間隙（滑動部14)形成異物，因 此可有效地用孔底面構件10加壓孔6内之樹脂。 又，本實施形態令，如前所述，由於可有效地防止孔 10底面構件10與分割孔側面構件11之間隙（滑動部14)形成 異物，因此可減少定期分解清掃模具之情事。故，可有效 地提向產品（樹脂成形體15)之成品率，且可降低產品生 產之時間損失，因此可有效地提高產品之生產性。 又，本實施形態中，可藉防止孔底面構件1〇與分割孔 15側面構件11之間隙（滑動部14 )產生異物來防止孔底面構 件10之滑動不良，結果，可有效地用孔底面構件10加壓孔6 内之樹脂》 又，藉第五實施形態，由於是不使用脫模膜，且可有 效地防止孔底面構件10之滑動不良的構成，因此可用孔底 20 面構件10有效地加壓孔6内之樹脂，因此可有效地使產品之 生產性提高。 而，小片構件71之滑動面設有可提高脫模性之脫模處 理層或可提高滑動性之滑動處理層。此時，脫模處理層或 滑動處理層可形成例如鐵氟龍（登錄商標）等氟系表面處 36 1376753 理劑。藉該構造’可有效地防止小片構件71與孔底面構件 10間形成之間隙（滑動部14)形成異物。 又’可於孔底面構件10之滑動面的必要處設置密封構 件68，例如鐵氟龍（登錄商標）等氣系密封劑。藉設置上 5述密封劑，可有效地防止小片構件71與孔底面構件1〇間產 生間隙。而，脫模處理層（或滑動處理層）亦可併用密封 構件。 王此匕評細說明本發明In the present embodiment, the above configuration is adopted. First, as shown in FIG. 8A, the substrate 4 on which the electronic component 3 is mounted is supplied to the substrate mounting portion 5 of the upper mold 1, and in this state, the lower mold hole is placed. The resin material 7 is supplied in 6 and will be melted by heating. Next, the molds 丨 and 2 are clamped, whereby the front end faces of the hole side members (squeezing blocks) 11 are brought into contact with the surface of the substrate 4 supplied to the substrate installation portion 5 of the upper mold ❶ in this state. The hole bottom member 1〇 moves upwards in the meandering direction, whereby the necessary resin pressure can be applied to the resin which has been heated and melted in the lower die hole 6. Therefore, after the necessary time required for the hardening, the electronic component 3 mounted on the substrate 4 can be filled and formed in the resin molded body 15 corresponding to the shape of the lower die hole 6. Further, the divided side surface member 11 is provided with a pressing mechanism (an air pressure feeding mechanism to be described later) that can press the hole side surface member 11 toward the hole bottom surface member 1A by pressure. Specifically, as shown in FIGS. 9A and 9B, the divided hole side member 11 (body 11a) is provided with a pressing hole bottom member 10 small piece member 71, and 31 1376753 is a small piece member 71 opposite to the side of the hole The component body 丨 13 is freely detachable. Further, a small member member (air pressure feeding mechanism 72 to be described later) which can press the small piece member 71 in the direction of the hole 6 side is provided. Further, the small piece member 71 is provided with a guide portion 71a' that guides the small piece member 71 in the pressing direction (the direction of the hole 65 side) and can press the small piece member 71 toward the pressing direction with the guide portion 71a with respect to the body 11a of the divided hole side member. Just slide a little. With this configuration, the small-plate member pressing mechanism 72 can press the sliding surface (the sliding surface of the small piece-member 71 having the guide portion 71a) of the split-hole side member 11 against the sliding surface of the hole bottom member 1A by the pressure. When the hole bottom surface member 11 is moved upward to press the resin in the hole 6 with respect to the divided hole side member 11, the sliding surface of the small piece member 71 of the divided hole side member 11 can be directed toward the hole by the necessary pressing force. The sliding surface of the bottom member 1 is pressed. As a result, it is possible to prevent a gap between the sliding surface of the hole side member u (the small piece member 71) and the sliding surface of the hole bottom member 10 (the sliding portion 14). Further, the moving direction of the hole bottom member 10 and the pressing direction of the split hole side member 系 are, for example, perpendicular to each other. (Regarding the small-piece member pressing mechanism) g Further, as shown in Figs. 9A and 9B, a slight gap is formed between the hole side member and the small-piece member 71 at necessary intervals. Further, the ▲ & 20 gap 73 is often in a state in which the body 11a of the hole side member U is in contact with the small piece member, or in a state in which it is often lost, an ankle ring = 71 is provided. The sealing member 74 is used. With this configuration, the gap can be in the sealing member air-shielding space portion (air pressing space portion 75) in a state in which the inside of the gap 73 is surrounded by the sealing member 74. Forming the outer 32 1376753 and the body 11a of the knife-cut side member 11 is provided with a compressed air at a plurality of places. The end side of the meandering path 76 is connected to the opening for the compressed air pressure feeding provided on the side of the air blocking space portion 75 formed by the sealing member 74, and the other end side is connected to the fluid such as the five brake air. A fluid feed mechanism 72 such as a pressure air pump is provided, and the fluid pressure feed mechanism 72 is a small piece member pressing mechanism. In the present embodiment, the main body 11a and the small-piece member 71, which are divided into the side members of the slit, are often deviated from the annular seal member 74 in the gap 73 to form the outer air barrier space portion 75. The annular seal member 74 is provided in a state of surrounding the necessary number of (1) opening portions of the pressure feed path 76. With this configuration, the air pressure feed mechanism 72 transmits the compressed air to the air pressing space portion 75 through the pressure feed path 76, whereby the necessary air pressure can be generated, and the necessary pressing force generated by the air pressure is used to make the small piece. The member 71 presses the hole bottom member 10 in a direction in which the pressing force is necessary toward the hole 6 side. Therefore, according to the present embodiment, it is necessary to press the sliding surface of the small-piece member 71 against the sliding surface of the hole bottom member 1〇 by pressure, and the divided hole side member 11 (small piece member 71) and the hole can be effectively prevented. A gap is formed between the bottom members 10 (sliding portions 14). (Removing the bottom surface member of the hole after demolding the resin molded body) In the present embodiment, the electronic component 3 mounted on the substrate 4 is further compression-molded into the resin molded body 15 to mold the upper and lower molds 1, 2 After the mold is opened and the resin molded body 15 is released from the lower mold hole 6, the hole bottom member 10 is moved downward to return to the original position. For example, when moving toward the upper and lower directions of the hole bottom member 10, generally 33 1376753, in the case of using the pressing mechanism of the pressing hole bottom member 10, the bottom surface of the hole is pressed by the split hole side member 11 (small piece member 71). In the state in which the member 1 is turned, the hole bottom member 10 is moved downward, and thus the hole bottom member 10 may have a sliding failure. Further, at this time, the wear of the sliding surface 14 of the hole bottom surface member 10 and the hole side surface member 11 (small piece member 71) cannot be effectively prevented. However, in the t-th embodiment, the pressing of the small-piece member 71 (the divided hole side member 产生) by the air pressure feeding mechanism 72 can be released. Therefore, the small moon member 71 (the hole side member 10 member U) generated by the air pressure feeding mechanism 72 can be released from pressing against the hole bottom surface member 1〇, and the bottom surface can be made without pressing the hole bottom member 1〇. Since the member 1 is moved downward, the sliding failure of the hole bottom member 10 can be effectively prevented. Further, when the hole bottom surface member 10 is moved upward, when the hole bottom surface member 11 (small piece member 71) presses the hole bottom surface member 10 and the hole bottom surface member 15 10 is moved downward, the side member which does not divide the hole can be used. 11 The structure of the hole bottom surface member 10 is pressed. Therefore, the wear of the hole bottom surface member 10 can be effectively prevented. Therefore, in the present embodiment, when the resin in the lower die hole 6 is pressed, air can be pressed to press the small piece member 71 (the divided hole side member 11), whereby the pressing member is pressed by the small member at a necessary pressing force. In the state of the bottom member 10, the hole bottom member 10 is moved upward, and after the resin molded body is released from the lower die hole 6, the compressed air is released, and the small piece member 71 is not divided. The hole side surface member u) presses the bottom surface member 1 in a state where the bottom surface member 10 is pressed downward, and moves the hole bottom surface member 10 downward. 34 1376753 (Compression molding method of electronic component) In the compression molding method of the electronic component of the present embodiment, first, as shown in FIG. 8A, the substrate 4 on which the electronic component 3 is mounted is supplied to the substrate installation portion of the upper mold 1. 5', a resin material 57 (for example, a particulate resin material) is supplied into the lower mold hole 6 by a supply mechanism 8 of a resin material, and heated to be melted. Next, the upper and lower dies 1 and 2 are clamped, whereby the front end surface of the divided hole side member 11 is joined to the surface of the substrate 4 supplied to the upper mold 。. In this state, the electronic component 3 already mounted on the substrate 4 is immersed in the resin which has been heated and melted in the lower die hole 6. 10 Next, the hole bottom member 10 is moved upward, thereby pressurizing the resin in the die hole 6. In the resin pressurizing step by the hole bottom member 10, the air is supplied to the space portion 75 formed by the gap 73 by the air pressure feed mechanism 72. Thereby, the hole bottom member 10 can be pressed by the divided hole side member u (small piece member 71) 15 by the necessary pressing force generated by the necessary air pressure. According to the pressing mechanism of the fifth embodiment, the divided hole bottom surface member 1〇 (the sliding surface of the small piece member is pressed to press the sliding surface of the hole bottom member 10 by the required pressing force, The hole bottom member 1G is moved upward to apply a necessary resin pressure to the resin in the lower die hole 6. 20 & 'The sliding surface of the divided hole side member 11 and the bottom surface member ίο can be effectively prevented. The sliding portion 14 formed therebetween generates a gap. After the resin material is hardened for a period of time, the molds 丨, 2 are opened, whereby the electronic component 3 filled in the resin molded body corresponding to the shape of the lower mold hole 6 can be formed. 35 1376753 As described above, in the present embodiment, when the hole bottom surface member 1 is pressurized, when the hole bottom surface member 10 is pressed by the air pressure feed mechanism 72 with the necessary pressing force, The necessary resin pressure can be applied to the resin in the hole 6 by the hole bottom member 1〇. Therefore, according to the embodiment, it is possible to effectively prevent the sliding portion 14 formed between the 5-hole bottom member 10 and the hole side member 11 from generating a gap. Therefore, it is possible to effectively prevent the gap (sliding portion 14) from forming foreign matter, so that the resin in the hole 6 can be effectively pressed by the hole bottom member 10. Further, the present embodiment is effective as described above. The gap between the bottom member 10 of the hole 10 and the side surface of the split hole side member 11 (sliding portion 14) is prevented from being formed into a foreign matter, so that the cleaning of the mold can be reduced periodically, so that the yield of the product (resin molded body 15) can be effectively improved. Further, in the present embodiment, the productivity of the product can be effectively improved. Further, in the present embodiment, foreign matter can be generated by preventing the gap between the hole bottom surface member 1A and the side member 11 of the dividing hole 15 (sliding portion 14). The sliding prevention of the hole bottom member 10 is prevented, and as a result, the resin in the hole 6 can be effectively pressed by the hole bottom member 10. Further, in the fifth embodiment, the release film is not used, and the hole can be effectively prevented. Since the bottom member 10 has a poor sliding structure, the resin in the hole 6 can be effectively pressed by the hole bottom member 10, so that the productivity of the product can be effectively improved. A release treatment layer which can improve mold release property or a slide treatment layer which can improve slidability is provided on the surface. At this time, the release treatment layer or the sliding treatment layer can form a fluorine-based surface such as Teflon (registered trademark). 1376753 The agent can effectively prevent the gap formed between the small piece member 71 and the hole bottom member 10 (the sliding portion 14) from forming a foreign matter. Further, the sealing member 68 can be provided at the necessary position of the sliding surface of the hole bottom member 10. For example, a gas sealant such as Teflon (registered trademark) can effectively prevent a gap between the small piece member 71 and the hole bottom surface member 1 by providing the sealant described above, and the release treatment layer (or sliding treatment) The layer may also be used in combination with a sealing member.
10 1510 15
20 马舉例說明，並未構成 限定，相信應可清楚理解發明之範圍應由申請專利範圍限 定。 【圖式簡單說明】 第1A圖及第1B圖係概略顯示本發明第一實施形態之 電子零件之壓縮成糊模具（電子零件之樹脂填封成形用 模具）的概略縱剖面圖，第1A圖係本發明第—實施形態之 電子零件之壓縮成形用模具的開模狀態之概略縱剖面圖， 第圖係同模具之合模狀態的概略縱剖面圖，第1C圖係概 略顯示第1續所示之下模具模面的概略平面圖。 圖係擴大地概略顯示第1A圖所示之模具要部的 擴=概^面圖’顯示以孔底面構件加壓孔内之樹脂前的 =槪购係擴大地概略顯示第1B圖所示之模具要部的 ::概略剖面圖，顯示以孔底面構件加壓了孔内之樹脂的 狀態。 雜立、第3B圖係擴大地概略顯示本發明第一實施形 …、之電子零件之壓縮成形用模具要部的擴大 37 概略剖面圖，第3A圖顯示以孔底面構件加壓孔内之樹脂前 的狀態，而第3B圖則顯示以孔底面構件加麼了孔内之樹脂 的狀態。 第4A圖、第4B圖係擴大地概略顯示本發明第一實施形 態另-變形例之電子零件之壓縮成形用模具要部的擴大概 略剖面圖，第4A圖顯示以孔底面構件加壓孔内之樹脂前的 狀態，而第4B圖則顯示以孔底面構件加壓了孔内之樹脂的 狀態。 曰 第5A圖係概略顯示本發明第二實施形態之電子零件之 壓縮成形用模具的開模狀態之概略縱剖面圖，第5β圖係概 略顯示第5A圖所示之下模具模面的概略平面圖，而第5匸圖 則係擴大地概略顯示第5A圖所示之模具要部的擴大概略縱 剖面圖。The example of 20 horses does not constitute a limitation. It is believed that it should be clearly understood that the scope of the invention should be limited by the scope of the patent application. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1A and FIG. 1B are schematic longitudinal cross-sectional views showing a compression-molding mold (a mold for resin encapsulation molding of an electronic component) of an electronic component according to a first embodiment of the present invention, and FIG. A schematic longitudinal cross-sectional view showing a mold-opening state of a mold for compression molding of an electronic component according to a first embodiment of the present invention, and a first longitudinal cross-sectional view of a mold clamping state of the same mold, and a first continuous view of the first embodiment A schematic plan view of the mold face below is shown. The enlargement of the figure shows that the enlargement of the main part of the mold shown in Fig. 1A is shown in Fig. 1B in the enlarged view of the resin in the pressure hole in the hole bottom member. The main part of the mold: a schematic sectional view showing the state in which the resin in the hole is pressurized by the bottom member of the hole. In the first embodiment, the first embodiment of the present invention is an enlarged sectional view of the main part of the compression molding mold for the electronic component according to the first embodiment of the present invention, and the third embodiment shows the resin in the pressure hole of the hole bottom member. The former state, and the 3B figure shows the state in which the resin in the hole is added by the hole bottom member. 4A and 4B are enlarged schematic cross-sectional views showing the main part of the mold for compression molding of the electronic component according to the first modification of the first embodiment of the present invention, and FIG. 4A shows the inside of the pressure hole in the bottom member of the hole. The state before the resin, and Fig. 4B shows the state in which the resin in the hole is pressurized by the hole bottom member. Fig. 5A is a schematic longitudinal cross-sectional view showing a mold opening state of a mold for compression molding of an electronic component according to a second embodiment of the present invention, and a fifth plan view schematically showing a schematic plan view of a mold surface shown in Fig. 5A. Further, the fifth plan is an enlarged schematic longitudinal sectional view showing the main part of the mold shown in Fig. 5A in an enlarged manner.
1S 第6A圖係概略顯示本發明第三實施形態之電子零件之 壓縮成形用模具的開模狀態之概略縱剖面圖，第6B圖及第 6C圖係擴大地概略顯示第6A圖所示之模具要部的擴大概 略縱剖面圖，第6B圖顯示以孔底面構件加壓孔内之樹n 的狀態，而第6C圖則顯示以孔底面構件加壓了孔内之樹月匕 的狀態。 曰 201S FIG. 6A is a schematic longitudinal cross-sectional view showing a mold opening state of a mold for compression molding of an electronic component according to a third embodiment of the present invention, and FIGS. 6B and 6C are enlarged views schematically showing a mold shown in FIG. 6A. An enlarged schematic longitudinal cross-sectional view of the main portion, Fig. 6B shows a state in which the tree n in the hole is pressed by the hole bottom member, and a 6Cth view shows a state in which the hole bottom member pressurizes the tree in the hole.曰 20
第7A圖係擴大地概略顯不本發明第四實施形熊 ^ 電子 零件之壓縮成形用模具要部的擴大概略縱剖面圖，第 係擴大地概略顯示第7A圖所示之模具要部的擴大概略縱剖 面圖，而第7C圖則係擴大地概略顯示本發明第四實施升， 其中一變形例的電子零件之壓縮成形用模具要部的擴=: 38 1376753 略縱剖面圖。 第8A圖係概略顯示本發明第五實施形態之電子零件之 壓縮成形用模具（電子零件之樹脂填封成形用模具）的開 模狀態之概略縱剖面圖，第8B係概略顯示第8A圖所示之下 5模具模面的概略平面圖。 • 第9A圖係擴大地概略顯示第8A圖所示之模具要部的 - 敍概略㈣面®，顯示孔底面構件之位置，第9B圖係擴 # 大地概略顯示與第9A圖所示之模具對應之模具要部的擴大 概略縱剖面圖，顯示以孔底面構件對孔内之樹脂加壓之狀 !〇態。 第10A圖係概略顯示習知電子零件之壓縮成形用模具 (上下兩模具）中’包含下模具孔之下模具面的概略平面 圖，第10B圖係擴大地概略顯示第10A圖所示之下模具要部 的擴大概略縱剖面圖，顯示下模具孔内之孔底面構件的滑 15 動不良狀態。 _ 【主要元件符號説明】 1…上模具 ···樹脂材料之供給機構 2...下模具 9...孔開口部 3...電子零件 1〇·.·孔底面構件 4…基板 11. ·.孑1»側面構件 5...基板設置部 12· ·.基台 6…孔 13..，彈性構件 7...樹脂材料 14-·.滑動部 39 1376753 15.. .樹脂成形體 21…第一按壓麟 22…收容空間 23···長孔 24…棒材 25.. .壓縮彈簧 26.. .棒材卡止部 27.. .收容空間卡止部 28…第二内部按壓機構 29.·.圓形彈簧（彈性構件) 31···第三内部按屋機構 32.. .貫通孔 33."棒材 36.. .第一外部按壓機構 37·"加壓構件 38.. .導引棒 40…球狀柱塞 41…賴件 42.. .壓縮彈簧 43.. .收容空間 44…球狀柱塞本體 45…箱體斜面部 46.. .螺絲部 47.. .開口部 50…第二外部按壓機構 51.. .外部按壓才冓件 52…卡止插銷 53…凸部 54".溝部 61.. .小片構件 62.. .片按壓機構 63.. .收容空間 64.. .片按壓機構 65.. .壓縮彈簧 66.. .卡止部 67.. .脫模處理層 68.. .密封構件 69.. .開口部7A is an enlarged schematic longitudinal cross-sectional view of the main part of the compression molding die for the electronic component of the fourth embodiment of the present invention, and the expansion of the main part of the mold shown in FIG. 7A is schematically enlarged. The seventh aspect of the present invention is an enlarged view of the fourth embodiment of the present invention. The expansion of the main part of the mold for compression molding of an electronic component according to a modification is: 38 1376753. 8A is a schematic longitudinal cross-sectional view showing a mold opening state of a mold for compression molding of an electronic component according to a fifth embodiment of the present invention (a mold for resin encapsulation molding of an electronic component), and FIG. 8B schematically shows a state of FIG. 8A. A schematic plan view of the lower 5 mold faces is shown. • Fig. 9A is an enlarged view showing the outline of the main part of the mold shown in Fig. 8A, showing the position of the bottom member of the hole, and Fig. 9B is a schematic view showing the mold shown in Fig. 9A. An enlarged schematic longitudinal cross-sectional view of the corresponding main part of the mold shows the state in which the resin in the hole is pressurized by the bottom member of the hole! Fig. 10A is a schematic plan view showing the mold surface under the lower die hole in the mold for compression molding (upper and lower molds) of the conventional electronic component, and Fig. 10B is an enlarged schematic view showing the mold shown in Fig. 10A. The enlarged schematic longitudinal section of the main part shows the slippery state of the bottom member of the hole in the lower die hole. _ [Description of main component symbols] 1... Upper mold · Supply mechanism of resin material 2... Lower mold 9... Hole opening part 3... Electronic part 1〇··· hole bottom part 4... Substrate 11孑1»Side member 5...Substrate setting portion 12··.Abutment 6... hole 13:., elastic member 7...resin material 14-·.sliding portion 39 1376753 15.. Resin molding Body 21...first pressing collar 22... accommodating space 23···long hole 24...bar material 25... compression spring 26.. bar locking portion 27.. accommodating space locking portion 28...second interior Pressing mechanism 29.·.round spring (elastic member) 31···the third internal pressing mechanism 32..through hole 33."bar 36...first external pressing mechanism 37·"pressurizing Member 38.. Guide rod 40...Spherical plunger 41...Retraction member 42.. Compression spring 43.. Containment space 44...Spherical plunger body 45...Box slope portion 46.. Screw portion 47 . . . opening portion 50... second external pressing mechanism 51.. external pressing member 52... locking pin 53... convex portion 54" groove portion 61.. small piece member 62.. sheet pressing mechanism 63.. . Containment space 64.. sheet pressing mechanism 65.. Compression spring 66 .. The locking portion 67 ... .. 68 releasably treated layer The sealing member 69 .. The opening
4040
Claims (1)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007141640A JP2008296382A (en) | 2007-05-29 | 2007-05-29 | Compression-molding method for electronic component and metal mold |
| JP2008038892A JP5128309B2 (en) | 2008-02-20 | 2008-02-20 | Electronic component compression molding method and mold |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200901341A TW200901341A (en) | 2009-01-01 |
| TWI376753B true TWI376753B (en) | 2012-11-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| TW097116617A TW200901341A (en) | 2007-05-29 | 2008-05-06 | Compression molding method and device for electronic component |
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| KR (1) | KR20080104966A (en) |
| TW (1) | TW200901341A (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5944866B2 (en) * | 2013-06-20 | 2016-07-05 | Ｔｏｗａ株式会社 | Compressed resin sealing method and compressed resin sealing device for electronic parts |
| JP6491508B2 (en) * | 2015-03-23 | 2019-03-27 | Ｔｏｗａ株式会社 | Resin sealing device and method of manufacturing resin molded product |
| CN115738897A (en) * | 2022-11-03 | 2023-03-07 | 巨玻固能(苏州)薄膜材料有限公司 | Granulating equipment |
-
2008
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| KR20080104966A (en) | 2008-12-03 |
| TW200901341A (en) | 2009-01-01 |
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