CN105814676B - 单晶硅基板的缺陷浓度评价方法 - Google Patents

单晶硅基板的缺陷浓度评价方法 Download PDF

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CN105814676B
CN105814676B CN201480066875.XA CN201480066875A CN105814676B CN 105814676 B CN105814676 B CN 105814676B CN 201480066875 A CN201480066875 A CN 201480066875A CN 105814676 B CN105814676 B CN 105814676B
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silicon substrate
monocrystalline silicon
irradiation
concentration
particle beam
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CN105814676A (zh
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镰田洋之
星亮二
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Shin Etsu Handotai Co Ltd
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Shin Etsu Handotai Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N15/00—Investigating characteristics of particles; Investigating permeability, pore-volume or surface-area of porous materials
    • G01N15/06—Investigating concentration of particle suspensions
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
    • G01N27/041—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02367—Substrates
    • H01L21/0237—Materials
    • H01L21/02373—Group 14 semiconducting materials
    • H01L21/02381—Silicon, silicon germanium, germanium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/02587—Structure
    • H01L21/0259—Microstructure
    • H01L21/02598—Microstructure monocrystalline
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/28008—Making conductor-insulator-semiconductor electrodes
    • H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
    • H01L21/28158—Making the insulator
    • H01L21/28167—Making the insulator on single crystalline silicon, e.g. using a liquid, i.e. chemical oxidation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/24—Optical enhancement of defects or not directly visible states, e.g. selective electrolytic deposition, bubbles in liquids, light emission, colour change
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/8215—Bodies characterised by crystalline imperfections, e.g. dislocations; characterised by the distribution of dopants, e.g. delta-doping

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Biochemistry (AREA)
  • Analytical Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Electrochemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
CN201480066875.XA 2013-12-10 2014-11-12 单晶硅基板的缺陷浓度评价方法 Active CN105814676B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013-255250 2013-12-10
JP2013255250A JP6036670B2 (ja) 2013-12-10 2013-12-10 シリコン単結晶基板の欠陥濃度評価方法
PCT/JP2014/005680 WO2015087485A1 (ja) 2013-12-10 2014-11-12 シリコン単結晶基板の欠陥濃度評価方法

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CN105814676A CN105814676A (zh) 2016-07-27
CN105814676B true CN105814676B (zh) 2018-08-28

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US (1) US9773710B2 (enExample)
JP (1) JP6036670B2 (enExample)
KR (1) KR102029647B1 (enExample)
CN (1) CN105814676B (enExample)
DE (1) DE112014005230B4 (enExample)
WO (1) WO2015087485A1 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
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JP6036670B2 (ja) * 2013-12-10 2016-11-30 信越半導体株式会社 シリコン単結晶基板の欠陥濃度評価方法
CN107112370B (zh) * 2015-06-30 2020-08-28 富士电机株式会社 半导体装置及其制造方法
JP6531729B2 (ja) * 2016-07-19 2019-06-19 株式会社Sumco シリコン試料の炭素濃度評価方法、シリコンウェーハ製造工程の評価方法、シリコンウェーハの製造方法およびシリコン単結晶インゴットの製造方法
JP6805015B2 (ja) * 2017-02-10 2020-12-23 グローバルウェーハズ・ジャパン株式会社 検量線の作成方法、炭素濃度測定方法及びシリコンウェハの製造方法
JP6844561B2 (ja) * 2018-03-09 2021-03-17 信越半導体株式会社 酸素濃度評価方法
JP6852703B2 (ja) * 2018-03-16 2021-03-31 信越半導体株式会社 炭素濃度評価方法
JP7006517B2 (ja) * 2018-06-12 2022-01-24 信越半導体株式会社 シリコン単結晶基板中の欠陥密度の制御方法
JP7351266B2 (ja) * 2020-07-07 2023-09-27 信越半導体株式会社 半導体装置の製造方法
JP7322832B2 (ja) 2020-07-29 2023-08-08 信越半導体株式会社 量子コンピュータ用半導体装置の製造方法
CN112034008A (zh) * 2020-09-11 2020-12-04 电子科技大学 一种石墨烯晶体结构质量评价方法
CN119290973B (zh) * 2024-12-10 2025-05-30 江西联创光电超导应用有限公司 一种晶体缺陷检测分析方法及系统

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US20050042781A1 (en) * 2002-09-20 2005-02-24 Semiconductor Leading Edge Technologies, Inc. Method of observation by transmission electron microscopy
WO2006134662A1 (ja) * 2005-06-17 2006-12-21 Topcon Corporation 薄膜測定装置、薄膜測定方法および薄膜製造方法
CN101933130A (zh) * 2008-06-27 2010-12-29 日商英益达股份有限公司 硅晶圆的缺陷检查装置及其缺陷检查方法
JP2012199299A (ja) * 2011-03-18 2012-10-18 Shin Etsu Handotai Co Ltd ライフタイム値の測定方法及びこれを用いたウエーハの選別方法

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JPH0955415A (ja) * 1995-08-16 1997-02-25 Nippon Telegr & Teleph Corp <Ntt> 半導体中に発生した欠陥の評価方法
TWI231357B (en) * 2002-10-18 2005-04-21 Sumitomo Mitsubishi Silicon Method for measuring defect-distribution in silicon monocrystal ingot
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JP2008177296A (ja) * 2007-01-17 2008-07-31 Toyota Central R&D Labs Inc 半導体装置、ｐｎダイオード、ｉｇｂｔ、及びそれらの製造方法
US8771415B2 (en) * 2008-10-27 2014-07-08 Sumco Corporation Method of manufacturing silicon single crystal, silicon single crystal ingot, and silicon wafer
JP5515406B2 (ja) * 2009-05-15 2014-06-11 株式会社Ｓｕｍｃｏ シリコンウェーハおよびその製造方法
DE112010003035B4 (de) * 2009-07-23 2022-09-22 Sumitomo Electric Industries, Ltd. Verfahren und Vorrichtung zum Erzeugen eines Halbleiterkristalls
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JP6036670B2 (ja) 2013-12-10 2016-11-30 信越半導体株式会社 シリコン単結晶基板の欠陥濃度評価方法
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US20050042781A1 (en) * 2002-09-20 2005-02-24 Semiconductor Leading Edge Technologies, Inc. Method of observation by transmission electron microscopy
WO2006134662A1 (ja) * 2005-06-17 2006-12-21 Topcon Corporation 薄膜測定装置、薄膜測定方法および薄膜製造方法
CN101933130A (zh) * 2008-06-27 2010-12-29 日商英益达股份有限公司 硅晶圆的缺陷检查装置及其缺陷检查方法
JP2012199299A (ja) * 2011-03-18 2012-10-18 Shin Etsu Handotai Co Ltd ライフタイム値の測定方法及びこれを用いたウエーハの選別方法

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US20160300768A1 (en) 2016-10-13
KR102029647B1 (ko) 2019-10-08
DE112014005230B4 (de) 2025-04-30
CN105814676A (zh) 2016-07-27
US9773710B2 (en) 2017-09-26
JP2015115404A (ja) 2015-06-22
DE112014005230T5 (de) 2016-08-18
JP6036670B2 (ja) 2016-11-30
WO2015087485A1 (ja) 2015-06-18
KR20160097200A (ko) 2016-08-17

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