CN105190438B - 光固化性热固化性树脂组合物、固化物、及印刷电路板 - Google Patents

光固化性热固化性树脂组合物、固化物、及印刷电路板 Download PDF

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Publication number
CN105190438B
CN105190438B CN201480024944.0A CN201480024944A CN105190438B CN 105190438 B CN105190438 B CN 105190438B CN 201480024944 A CN201480024944 A CN 201480024944A CN 105190438 B CN105190438 B CN 105190438B
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resin
solidifying
softening point
methyl
resin composition
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Chinese (zh)
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CN105190438A (zh
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植田千穂
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Taiyo Holdings Co Ltd
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Taiyo Ink Mfg Co Ltd
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Priority to CN201910864518.2A priority Critical patent/CN110609446B/zh
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Epoxy Resins (AREA)
CN201480024944.0A 2013-06-04 2014-06-02 光固化性热固化性树脂组合物、固化物、及印刷电路板 Active CN105190438B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910864518.2A CN110609446B (zh) 2013-06-04 2014-06-02 光固化热固化性树脂组合物、固化物、及印刷电路板

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013-118148 2013-06-04
JP2013118148A JP5572737B1 (ja) 2013-06-04 2013-06-04 光硬化熱硬化性樹脂組成物、硬化物、及びプリント配線板
PCT/JP2014/064632 WO2014196502A1 (ja) 2013-06-04 2014-06-02 光硬化熱硬化性樹脂組成物、硬化物、及びプリント配線板

Related Child Applications (1)

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CN201910864518.2A Division CN110609446B (zh) 2013-06-04 2014-06-02 光固化热固化性树脂组合物、固化物、及印刷电路板

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CN105190438A CN105190438A (zh) 2015-12-23
CN105190438B true CN105190438B (zh) 2019-10-01

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CN201910864518.2A Active CN110609446B (zh) 2013-06-04 2014-06-02 光固化热固化性树脂组合物、固化物、及印刷电路板

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JP (1) JP5572737B1 (ja)
KR (1) KR102167483B1 (ja)
CN (2) CN105190438B (ja)
TW (1) TWI614577B (ja)
WO (1) WO2014196502A1 (ja)

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JP6525305B2 (ja) * 2014-09-19 2019-06-05 互応化学工業株式会社 硬化性組成物及び被覆配線板の製造方法
JP6668637B2 (ja) * 2015-08-24 2020-03-18 住友ベークライト株式会社 樹脂組成物、樹脂膜、回路基板および半導体装置
KR102674718B1 (ko) * 2016-01-18 2024-06-14 듀폰스페셜티머터리얼스코리아 유한회사 흑색 감광성 수지 조성물 및 이로부터 제조된 블랙 컬럼 스페이서
TWI721087B (zh) * 2016-01-27 2021-03-11 日商住友化學股份有限公司 著色硬化性樹脂組成物、彩色濾光片及含有該濾光片之顯示裝置
CN109073969B (zh) * 2016-03-31 2022-09-13 太阳油墨制造株式会社 固化性树脂组合物、干膜、固化物和印刷电路板
JPWO2019017418A1 (ja) * 2017-07-21 2020-05-28 株式会社Adeka 組成物、これを含む接着剤、組成物の硬化物およびその製造方法
JP7104397B2 (ja) * 2018-03-12 2022-07-21 互応化学工業株式会社 黒色感光性樹脂組成物、ドライフィルム及びプリント配線板
WO2019188629A1 (ja) * 2018-03-29 2019-10-03 株式会社カネカ 感光性樹脂組成物、ドライフィルム、硬化膜、プリント配線板およびその製造方法
WO2020045024A1 (ja) * 2018-08-27 2020-03-05 互応化学工業株式会社 感光性樹脂組成物、ドライフィルム、及びプリント配線板
JP7137241B2 (ja) * 2018-10-30 2022-09-14 互応化学工業株式会社 絶縁膜形成用の樹脂組成物、絶縁膜形成用の樹脂組成物の製造方法、ドライフィルム、プリント配線板、及びプリント配線板の製造方法
WO2023190454A1 (ja) * 2022-03-29 2023-10-05 太陽ホールディングス株式会社 感光性樹脂組成物およびプリント配線板の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
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CN101410757A (zh) * 2006-03-29 2009-04-15 太阳油墨制造株式会社 光固化性热固化性树脂组合物及其固化物以及使用其所得到的印刷电路板
CN102822747A (zh) * 2010-03-31 2012-12-12 太阳控股株式会社 光固化性热固化性树脂组合物
CN103034052A (zh) * 2011-09-30 2013-04-10 太阳油墨制造株式会社 感光性树脂组合物、其固化皮膜和印刷电路板

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JPS5319205B2 (ja) * 1973-03-27 1978-06-20
JP2963069B2 (ja) 1997-04-03 1999-10-12 日華化学株式会社 ソルダーフォトレジストインキ組成物
JP4033455B2 (ja) * 2002-11-07 2008-01-16 日本化薬株式会社 感光性樹脂組成物及びその硬化物
JP4745146B2 (ja) * 2006-06-22 2011-08-10 東京応化工業株式会社 着色感光性樹脂組成物
KR101106806B1 (ko) * 2007-11-07 2012-01-19 다이요 홀딩스 가부시키가이샤 광 경화성 수지 조성물 및 경화물 패턴, 및 인쇄 배선판
JP5201396B2 (ja) * 2008-04-25 2013-06-05 日立化成株式会社 感光性樹脂組成物及びそれを用いた感光性永久レジスト、感光性フィルム
JP5385663B2 (ja) * 2009-03-31 2014-01-08 太陽ホールディングス株式会社 硬化性樹脂組成物
JP5236587B2 (ja) 2009-07-15 2013-07-17 太陽ホールディングス株式会社 光硬化性樹脂組成物
JP5619443B2 (ja) * 2010-03-18 2014-11-05 太陽ホールディングス株式会社 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
JP5439256B2 (ja) * 2010-03-31 2014-03-12 太陽ホールディングス株式会社 光硬化性熱硬化性樹脂組成物
JP5814691B2 (ja) * 2011-08-11 2015-11-17 互応化学工業株式会社 レジスト用樹脂組成物
JP5583091B2 (ja) 2011-08-31 2014-09-03 株式会社タムラ製作所 黒色硬化性樹脂組成物

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CN101410757A (zh) * 2006-03-29 2009-04-15 太阳油墨制造株式会社 光固化性热固化性树脂组合物及其固化物以及使用其所得到的印刷电路板
CN102822747A (zh) * 2010-03-31 2012-12-12 太阳控股株式会社 光固化性热固化性树脂组合物
CN103034052A (zh) * 2011-09-30 2013-04-10 太阳油墨制造株式会社 感光性树脂组合物、其固化皮膜和印刷电路板

Also Published As

Publication number Publication date
CN105190438A (zh) 2015-12-23
TWI614577B (zh) 2018-02-11
JP2014235376A (ja) 2014-12-15
TW201523141A (zh) 2015-06-16
KR102167483B1 (ko) 2020-10-19
JP5572737B1 (ja) 2014-08-13
KR20160016817A (ko) 2016-02-15
CN110609446B (zh) 2023-07-04
WO2014196502A1 (ja) 2014-12-11
CN110609446A (zh) 2019-12-24

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Effective date of registration: 20230606

Address after: Saitama Prefecture, Japan

Patentee after: TAIYO HOLDINGS Co.,Ltd.

Address before: Saitama Prefecture, Japan

Patentee before: TAIYO INK MFG. Co.,Ltd.