CN105097571A - 芯片封装方法及封装组件 - Google Patents
芯片封装方法及封装组件 Download PDFInfo
- Publication number
- CN105097571A CN105097571A CN201510317651.8A CN201510317651A CN105097571A CN 105097571 A CN105097571 A CN 105097571A CN 201510317651 A CN201510317651 A CN 201510317651A CN 105097571 A CN105097571 A CN 105097571A
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- Prior art keywords
- metallic conductor
- metal substrate
- chip
- groove
- plastic
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- 238000000034 method Methods 0.000 title claims abstract description 53
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 39
- 239000002184 metal Substances 0.000 claims abstract description 94
- 229910052751 metal Inorganic materials 0.000 claims abstract description 94
- 239000004020 conductor Substances 0.000 claims abstract description 62
- 239000000758 substrate Substances 0.000 claims abstract description 54
- 238000005530 etching Methods 0.000 claims abstract description 9
- 229910052729 chemical element Inorganic materials 0.000 claims description 15
- 238000005538 encapsulation Methods 0.000 claims description 14
- 229920002120 photoresistant polymer Polymers 0.000 claims description 13
- 230000015572 biosynthetic process Effects 0.000 claims description 12
- 238000007747 plating Methods 0.000 claims description 10
- 238000009713 electroplating Methods 0.000 claims description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 5
- 238000000059 patterning Methods 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical group [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 239000000463 material Substances 0.000 abstract description 4
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 239000005022 packaging material Substances 0.000 description 4
- 238000003486 chemical etching Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000012536 packaging technology Methods 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
Classifications
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- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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CN105845585A (zh) * | 2016-04-28 | 2016-08-10 | 合肥祖安投资合伙企业(有限合伙) | 一种芯片封装方法及芯片封装结构 |
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CN105489542A (zh) * | 2015-11-27 | 2016-04-13 | 矽力杰半导体技术(杭州)有限公司 | 芯片封装方法及芯片封装结构 |
CN105845585A (zh) * | 2016-04-28 | 2016-08-10 | 合肥祖安投资合伙企业(有限合伙) | 一种芯片封装方法及芯片封装结构 |
US10333019B2 (en) | 2016-05-27 | 2019-06-25 | Silergy Semiconductor Technology (Hangzhou) Ltd. | Package structure of light emitter and light sensor with light-blocking layer and method for manufacturing the same |
CN107946429A (zh) * | 2017-10-27 | 2018-04-20 | 佛山市国星光电股份有限公司 | 一种器件封装方法及相应的器件封装结构 |
CN107731998B (zh) * | 2017-10-27 | 2023-06-16 | 佛山市国星光电股份有限公司 | 一种器件封装方法及相应的器件封装结构 |
CN109037077A (zh) * | 2018-06-13 | 2018-12-18 | 南通通富微电子有限公司 | 一种半导体芯片封装方法 |
CN109065519A (zh) * | 2018-06-13 | 2018-12-21 | 南通通富微电子有限公司 | 一种半导体芯片封装器件 |
CN109065518A (zh) * | 2018-06-13 | 2018-12-21 | 南通通富微电子有限公司 | 一种半导体芯片封装阵列 |
CN113571434A (zh) * | 2021-06-07 | 2021-10-29 | 华宇华源电子科技(深圳)有限公司 | 一种新型的面板级封装方法及结构 |
CN113571434B (zh) * | 2021-06-07 | 2023-11-17 | 华宇华源电子科技(深圳)有限公司 | 一种新型的面板级封装方法及结构 |
CN114203567A (zh) * | 2021-11-24 | 2022-03-18 | 广东气派科技有限公司 | 一种控制半导体封装过程中粘接剂稳定性的工艺方法 |
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