CN105008795A - 使用光致发光波长转换组件的固态灯 - Google Patents
使用光致发光波长转换组件的固态灯 Download PDFInfo
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- CN105008795A CN105008795A CN201380072490.XA CN201380072490A CN105008795A CN 105008795 A CN105008795 A CN 105008795A CN 201380072490 A CN201380072490 A CN 201380072490A CN 105008795 A CN105008795 A CN 105008795A
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- assembly
- light
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- led
- photoluminescence wavelength
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
- F21K9/64—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/233—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating a spot light distribution, e.g. for substitution of reflector lamps
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0096—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the lights guides being of the hollow type
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/506—Cooling arrangements characterised by the adaptation for cooling of specific components of globes, bowls or cover glasses
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/02—Globes; Bowls; Cover glasses characterised by the shape
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/04—Optical design
- F21V7/048—Optical design with facets structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
本发明揭示经改善光致发光波长转换组件及并有此类组件的灯。所述光致发光波长转换组件包括空心圆柱形管,所述空心圆柱形管具有给定直径的孔及轴向长度。所述组件的相对尺寸及形状可影响所述组件的径向发射模式,且所述组件经配置以赋予所需发射模式(通常全向)。在所述组件的制造期间,光致发光材料可均质地分布遍及所述组件的体积。可使用挤压方法形成所述经改善光致发光波长转换组件。还可使用射出模制或铸造形成所述组件。另一可能方法是通过形成柔性片材以包含磷光体及/或量子点且随后将所述片材辊轧成用于所述组件的所要形状及尺寸而制造所述组件。所述经改善波长转换组件及并有这些组件的灯提供改善的发射特性,同时允许具有相对成本效益的制造成本。组件的进一步优势是其光发射类似于常规白炽光灯泡的灯丝。
Description
技术领域
本发明涉及使用光致发光波长转换组件的固态灯。特定地说,但非排它性地,诸实施例涉及用于具有全向发射模式的固态灯(灯泡)的光致发光波长转换组件。此外,本发明提供制造光致发光波长转换组件的方法。
背景技术
产生白光的LED(“白色LED”)是相对新近的创新且为具能量效益的全新一代照明系统的出现提供可能。可预测,白色LED归因于其长操作寿命(可能许多100,000小时)及依低功耗而言的其高效率而可替换灯丝(白炽)光源、荧光光源及紧凑型荧光光源。直到开发出在电磁光谱的蓝/紫外线部分中发光的LED,开发基于LED的白色光源才变得实际。如例如在US 5,998,925中所教示,白色LED包含一或多种磷光体材料(其是光致发光材料),磷光体材料吸收由LED发射的辐射的部分且重新发射不同颜色(波长)的辐射。通常,LED裸片产生蓝色光,且磷光体吸收某一百分比的蓝色光且发射黄色光或绿色光与红色光的组合、绿色光与黄色光的组合或黄色光与红色光的组合。由LED产生的蓝色光的未被磷光体吸收的部分与由磷光体发射的光组合以提供在人眼看来颜色接近白色的光。
归因于白色LED操作预期寿命(>50,000小时)及高发光性能(每瓦特70流明或更高),高亮度白色LED正逐渐用于替换常规荧光光源、紧凑型荧光光源及白炽光源。
通常,在白色LED中,磷光体材料与光透射材料(例如,硅氧烷或环氧树脂材料)混合且混合物施加到LED裸片的光发射表面。还已知提供磷光体材料作为定位于远离LED裸片处(通常物理空间上与LED裸片隔开)的光学组件(光致发光波长转换组件)上的层或将磷光体材料并入光学组件内。此类布置称为“远程磷光体”布置。远程定位磷光体波长转换组件的优势是磷光体材料热降级的可能性降低及所产生光的更一致颜色。
传统白炽灯泡无效率且有寿命问题。基于LED的技术使用更有效且更长寿命照明解决方案逐渐替换传统灯泡及甚至CFL(紧凑型荧光灯)。然而,已知基于LED的灯归因于LED的固有高导向光发射特性而难以匹配白炽灯泡的全向(在所有方向中均匀)发射特性。
图1展示使用光致发光波长转换组件的已知基于LED的灯(灯泡)10的示意性部分截面视图。灯10包括大致上圆锥形导热主体12及安装到主体12的截断顶点的连接器帽14。主体12进一步包括从主体12的基底延伸的圆锥形基座16及经安装而与基座16的截断顶点热连通的一或多个发蓝光LED 18。为了产生白色光,灯10进一步包括光致发光波长转换组件20,其安装到基座且经配置以围封LED 18。如图1中所指示,波长转换组件20包括球形空心壳,且包含一或多种磷光体材料以提供由LED产生的蓝色光的光致发光波长转换。为了赋予漫射光发射且出于美学考虑,灯10进一步包括光透射封套22,其围封波长转换组件20。
虽然图1的灯10具有改善的发射特性,但是由于其于轴24上发射过多光,因此此灯的发射特性未能符合所需工业标准。此类灯的另一问题是通常通过射出模制制造的光致发光波长转换组件的相对高制造成本。所述高制造成本起因于所述组件的开口小于所述组件的最大内部大小,其需要使用可折叠线圈架以能够从射出模制成形机移除所述组件。本发明的实施例至少部分解决已知基于LED的灯的限制。
发明内容
本发明的实施例涉及经改善光致发光波长转换组件及并有此类组件的灯。本发明的实施例的经改善灯及波长转换组件提供改善的发射特性,同时允许具有相对成本效益的制造成本。
根据一些实施例,所述光致发光波长转换组件包括空心圆柱形管,所述空心圆柱形管具有直径的孔及轴向长度L。在一个示范性实施例中,所述组件的长度是所述组件的孔直径的大约四倍,且所述组件在轴向方向上的纵横比(长度与孔直径的比)是大约4:1。所述组件的相对尺寸及形状可影响所述组件的径向发射模式,且所述组件经配置以赋予所需发射模式(通常全向)。对于A-19灯泡,所述组件的孔介于约1mm与10mm之间。在所述组件的制造期间,所述光致发光材料可均质地分布遍及所述组件的体积。所述光致发光材料的壁厚度通常介于200μm与2mm之间。
由于所述组件具有恒定截面,所以其可容易地使用挤压方法制造。所述组件可使用光透射热塑性(热软化)材料(例如,聚碳酸酯、丙烯酸或使用热挤压工艺的低温玻璃)形成。替代地,所述组件可包括热固性材料或UV可固化材料(例如,硅氧烷或环氧树脂材料)且使用冷挤压方法形成。挤压的益处是其为相对廉价的制造方法。
在替代实施例中,所述组件可通过射出模制形成。由于所述组件具有恒定截面,所以其可在不需使用昂贵可折叠线圈架的情况下使用射出模制形成。在其它实施例中,所述组件可通过铸造形成。
另一可能方法是通过形成柔性片材以包含磷光体及/或量子点且随后将所述片材辊轧成用于所述组件的所需形状及尺寸而制造所述组件。所述磷光体可作为层施加到所述片材上(例如,通过涂布、印刷或其它合适的沉积方法)。替代地,所述磷光体可并入到所述柔性片材内。
根据本发明的实施例的光致发光组件的益处是除改善发射分布模式外,其还可改善总体光发射效率。所描述的空心管状波长转换组件可赋予大于已知波长转换组件的总光发射。发射效率的增大可起因于具有高纵横比的组件降低通过放置于所述组件开口的LED重新吸收光的可能性。
根据本发明的光致发光波长转换组件的另一优势是其光发射类似于常规白炽灯泡的灯丝。
在一些实施例中,光致发光材料包括磷光体。然而,本发明适用于任何类型的光致发光材料(例如,磷光体材料、量子点或其组合)。
在一个实施例中,灯包括大致上圆锥形导热主体,其中所述主体的外表面大致上类似于圆锥体的截头体。如果所述灯旨在替换常规白炽A-19灯泡,那么所述灯的尺寸经选择以确保装置将适合于常规照明器具。在所述灯内提供一或多个固态光发射器,例如,使用可操作以产生具有455nm到465nm的主导波长的蓝色光的基于氮化镓的发蓝光LED。所述固态光发射器可经配置以使得其主发射轴平行于所述灯的轴。所述灯进一步包括光致发光波长转换组件,其包含一或多种光致发光材料。所述光致发光波长转换组件包括具有恒定截面的细长组件及在在LED远端的组件端上的反射器。所述反射器经操作以降低或消除来自所述组件端的光发射。通过降低或消除来自所述组件端的光发射降低沿着所述灯轴的总体发射强度。
替代实施例包括使用根据本发明的光致发光波长转换组件的LED烛光形灯泡。在此实施例中,所述光致发光波长转换组件包括细长管状组件,其中光致发光材料并入到包括所述组件的材料中且均质地分布遍及所述组件材料的体积中。
另一实施例涉及包括管状组件的光致发光波长转换组件,其中光致发光材料并入到包括所述组件的材料中,且其中所述组件安装到空心光透射管且所述组件具有一定长度使得其只覆盖在LED远端的管端部分。在一些实施例中,所述组件可包括半柔性材料,且所述组件在所述管上方滑动。在某些设计中,所述管的未被磷光体覆盖的部分(即,所述管的接近LED的部分)可包含光反射表面以防止从所述管的此部分的光发射。
在另一实施例中,提供在所述灯内部处、所述灯内部内及/或与所述灯内部连通的多个开口以使得气流通过所述灯。在一种方法中,所述灯内的一或多个通道与在所述灯体上的鳍片之间的多个开口流体连通。在操作中,由所述LED产生的热在通道内加热空气,通过所述通道,对流过程导致空气被汲取到灯泡中且通过灯泡,借此提供所述LED的被动冷却。
虽然某些实施例涉及包括空心组件的光致发光组件(即,中心区域或孔不包含光透射介质),但是在其它实施例中,所述组件可包括具有实心光透射芯体的组件。具有光透射芯体的组件可通过显著消除所述波长转换组件与所述LED之间的任何空气界面而进一步增大光发射。对于在所述组件的壁之间以径向方向行进的光尤其如此。
本发明的一个实施例涉及包括由圆柱形光透射芯体及外部同轴磷光体层构成的实心圆柱形组件的光致发光波长转换组件。此组件可通过所述芯体及所述磷光体层的共挤压形成。替代地,所述组件可通过制作所述组件且随后将光透射圆柱形杆(例如,玻璃杆)插入到所述组件的孔中而制造。在其它实施例中,所述组件可通过涂布磷光体材料于光透射杆(例如,玻璃杆或聚碳酸酯杆)的外表面上而制作。在一些实施例中,所述组件由弹性可变形(半柔性)光透射材料(例如,硅氧烷材料)制作。使用弹性可变形材料的益处是此可辅助插入所述杆。
在所述光致发光波长转换组件包括实心组件的情况下,所述反射器可包括直接施加到所述组件的端面的涂层(例如,光反射涂料或金属化层)。
在替代实施例中,所述光致发光波长转换组件包括圆柱形光透射组件,其具有在纬度方向上延伸的磷光体区域(条带),例如,其中存在均等周向隔开的四个磷光体区域,然而,应了解,在本发明的范围内,所述磷光体区域的数目、形状及配置可改变。
虽然本发明寻找关于灯泡的特定应用,但是本发明的光致发光波长转换组件可使用于其它光发射装置及照明布置中。本发明的实施例可应用于制造LED反射器灯(例如,MR16灯)。在此实施例中,所述光致发光波长转换组件包括磷光体层覆盖在LED远端的端部分的空心芯体或实心芯体。任选地,所述芯体的未被磷光体覆盖的部分(即,所述管的接近LED的部分)可包含光反射表面以防止从所述芯体的此部分的光发射。
实施例还可应用于使用根据本发明的多个光致发光波长转换组件的LED下照灯的制造。在此实施例中,一些或所有所述光致发光波长转换组件包括细长空心(或实心)管状组件,其中光致发光材料并入到构成所述组件的材料中且均质分布遍及组件材料的体积中。
在一些实施例中,光致发光波长转换组件包括用于接收光的第一近端及在远端上的反射器。在替代实施例中,所述光致发光波长转换组件经配置使得所述组件的每一端经配置以接收光,借此消除对反射器的需求。
在一些实施例中,所述组件经配置以具有位于两端处的LED。在此实施例中,所述光致发光波长转换组件包括细长空心(或实心)管状组件,其中光致发光材料并入到包括所述组件的材料中且均质地分布遍及组件材料的体积中。第一LED位于所述组件的第一端处,且第二LED位于所述组件的相对端处。在替代实施例中,所述组件包括管状组件,其各端回绕而使得两端共享共同平面。
又另一实施例涉及使用多个光致发光波长转换组件的LED线状灯。在此实施例中,每一光致发光波长转换组件包括细长管状组件,其中光致发光材料并入到包括所述组件的材料中且均质地分布遍及组件材料的体积中。
本发明的方面、目标及优势的进一步细节在下文详细描述、图式及权利要求书中描述。前述一般描述及下列详细描述两者均是示范性的及说明性的且不旨在限制本发明的范围。
附图说明
为了更好地理解本发明,现将参考附图描述(只举例)根据本发明的实施例的LED灯及光致发光波长转换组件,在所述附图中:
图1是如先前描述的已知LED灯泡的部分截面视图;
图2是根据本发明的实施例的使用空心光致发光波长转换组件的LED灯泡的示意性部分截面视图;
图3是图2的空心光致发光波长转换组件的示意性分解透视图;
图4是根据本发明的实施例的使用空心光致发光波长转换组件的LED烛光形灯泡的示意性部分截面视图;
图5是根据本发明的实施例的使用空心光致发光波长转换组件的LED灯泡的示意性部分截面视图;
图6是根据本发明的实施例的使用空心光致发光波长转换组件的LED灯泡的示意性部分截面视图;
图7是根据本发明的实施例的实心光致发光波长转换组件的示意性分解透视图;
图8A及8B分别是展示根据本发明的实施例的实心光致发光波长转换组件的示意性端视图及透视图;
图9是根据本发明的实施例的使用实心光致发光波长转换组件的LED灯泡的示意性部分截面视图;
图10是根据本发明的实施例的使用实心光致发光波长转换组件的LED反射器灯的示意性部分截面视图;
图11是根据本发明的实施例的使用多个空心光致发光波长转换组件的LED下照灯的示意性部分截面视图;
图12是根据本发明的实施例的使用空心光致发光波长转换组件的LED灯泡的示意性部分截面视图;
图13是根据本发明的实施例的使用实心光致发光波长转换组件的LED灯泡的示意性部分截面视图;
图14是根据本发明的实施例的使用空心光致发光波长转换组件的一ED灯泡的示意性部分截面视图;及
图15是根据本发明的实施例的使用多个空心光致发光波长转换组件的LED线状灯的示意性部分截面视图。
具体实施方式
灯(灯泡)可以多种形式可用且经常通过字母与数字的组合来标准地参考。灯的字母名称通常是指所述灯的特定形状类型,例如一般用途(A,蘑菇形)、高瓦特一般用途(PS-梨形)、装饰(B-烛光形、CA-扭曲烛光形、BA-弯曲尖头烛光形、F-火焰形、P-花式圆形、G-球形)、反射器(R)、抛物面形铝制反射器(PAR)及多面反射器(MR)。数字命名是指灯的大小,经常通过以八分之一英寸为单位指示灯的直径。因此,A-19型灯是指一般用途灯(灯泡),其形状通过字母“A”指代且具有二又八分之三英寸的最大直径。到申请此专利文件时为止,最普遍使用的家用“灯泡”是具有A-19封套的灯,此灯在美国普遍与E26螺旋灯座一起销售。
存在提供精确规格以定义准则的各种标准化及监管机构,制造者根据准则使用此类标准参考命名法来命名照明产品。关于灯的物理尺寸,ANSI提供概述所需大小及形状的规格(ANSI C78.20-2003),依所述规格,法规遵循将授予制造权利以获准标记所述灯为A-19型灯。除灯的物理尺寸外,还可存在涉及灯的性能及功能的额外规格及标准。例如,在美国,依据美国环境保护署(EPA)与美国能源部(DOE)联合公布的性能规格,灯可指定为“ENERGY STAR(能源之星)”合规产品,例如,识别功率使用量需求、最小光输出需求、发光强度分布需求、发光性能需求及预期寿命。
问题是不同规格及标准的相异需求产生通常相互对立的设计约束。例如,A-19灯与极特定物理大小及尺寸需求关联,其需确保在市场中销售的A-19型灯将适合于普遍家用照明器具。然而,为通过ENERGY STAR使基于LED的替换灯取得作为A-19替换的资格,其须证明当限于A-19光灯的外观尺寸及大小时使用固态照明产品难以实现的某些相关性能准则。
例如,关于在ENERGY STAR规格中的发光强度分布准则,为通过ENERGY STAR使基于LED的替换灯取得作为A-19替换的资格,其须证明具有270°以上的均匀(+/-20%)发光发射强度且最小5%总光发射高于270°。问题是LED替换灯需电子驱动电路及充足散热区域;为了使此类组件适合于A-19外观尺寸,用作为散热器且装载将AC电转换为由所述LED使用的低电压DC电所需的驱动电路的导热外壳来替换所述灯的底部分(封套)。由LED灯的外壳产生的问题是其阻断需遵从ENERGY STAR的朝向灯座方向的光发射。因此,许多LED灯失去传统灯泡的低光发射区域且成为导向光源,将大部分光发射出圆顶(180°模式),且由于光被散热器(体)阻断而实际上无光朝下,其破坏所述灯遵守ENERGY STAR规格中的发光强度分布准则的能力。
当前LED替换灯被认为对于一般消费者市场而言过于昂贵。通常,A-1960W替换LED灯成本为白炽灯泡或紧凑型荧光灯的成本的许多倍。高成本是归因于此类灯中使用的复杂及昂贵的构造及组件。
现参考图2(其展示灯的示意性部分截面视图)描述根据本发明的实施例的基于LED的灯100。在一些实施例中,灯100经配置以与110V(r.m.s.)AC(60Hz)主电力供应器(如在北美发现且旨在用作用于A-19白炽灯泡的遵从ENERGY STAR的替换)一起操作。
灯100包括大致上圆锥形导热主体110。主体110的外表面大致上类似于圆锥体的截头体;即,顶点被平行于灯座的平面截断(即,实质上截头圆锥形)的圆锥体。主体110由具有高导热性(通常≥150Wm-1K-1,优选地≥200Wm-1K-1)的材料组成,例如,例如铝(约250Wm-1K-1)、铝合金、镁合金、金属负载塑料材料(例如,聚合物(例如环氧树脂))。方便地,主体110当其包括金属合金时可为压铸件,或(例如)当主体110包括金属负载聚合物时通过射出模制予以模制。
多个在纬度方向上径向延伸的热辐射鳍片(翼片)120围绕主体110的外弯曲表面周向隔开。由于所述灯旨在替换常规白炽A-19灯泡,所以灯的尺寸经选择以确保装置将适合于常规照明器具。主体110进一步包括圆锥形基座部分130,其从主体110的灯座延伸。主体110可进一步包括同轴圆柱形腔(未展示),其从用于收纳整流器的主体的截断顶点或用于操作所述灯的其它驱动器电路延伸到所述主体内。
灯100进一步包括E26连接器帽(Edison螺旋灯座)140,其使得所述灯直接连接到使用标准电照明螺旋插座的主电力供应器。应了解,取决于预期应用,其它连接器帽可用作例如如在英国、爱尔兰、澳大利亚、新西兰及英联邦的多个成员国中普遍使用的双接触卡口连接器(即,B22d或BC)或如在欧洲使用的E27螺旋灯座(Edison螺旋灯座)。连接器帽140安装到主体110的截断顶点。
一或多个固态光发射器150安装到圆形衬底160上。在一些实施例中,衬底160包括圆形MCPCB(金属芯体印刷电路板)。已知MCPCB包括分层结构,其由金属芯体灯座(通常为铝)、导热/电绝缘介电层及用于电连接在所要电路配置中的电组件的铜电路层构成。MCPCB 160的金属芯体基底安装成凭借导热化合物(例如,例如含有包括氧化铍或氮化铝的标准散热化合物的材料)而与圆锥形基座130的上表面热连通。
每一固态光发射器150可包括基于氮化镓的发蓝光LED,其可操作以产生具有455nm到465nm的主导波长的蓝色光。如图3中指示,LED 150可配置为圆形阵列且经定向而使得其主发射轴平行于所述灯的轴170,且在远离连接器帽140的方向发射光。可提供覆盖MCPCB的光反射罩,所述罩包含对应于每一LED的孔隙以最大化来自所述灯的光发射。
灯100进一步包括光致发光波长转换组件180,其包含一或多种光致发光材料。光致发光波长转换组件180包括具有恒定截面的细长组件190及组件190的在LED 150远端的端上的反射器200。反射器200具有对应于组件190的外形的形状(在此实例中是圆形),借此降低或消除来自所述组件端的光发射。通过降低或消除来自所述组件端的光发射降低沿着所述灯的轴170的总体发射强度。
在一些实施例中,光致发光材料包括磷光体。只为说明的目的,下列描述参考具体体现为磷光体材料的光致发光材料。然而,本发明适用于任何类型的光致发光材料(例如,磷光体材料或量子点)。量子点是物质(例如,半导体)的部分,所述物质的激子受局限于可通过辐射能量激发以发射特定波长或波长范围的光的所有三维空间中。
一或多种磷光体材料可包含无机或有机磷光体(例如,例如一般组合物A3Si(O,D)5或A2Si(O,D)4的硅酸盐基磷光体,其中Si是硅,O是氧,A包含锶(Sr)、钡(Ba)、镁(Mg)或钙(Ca)且D包含氯(Cl)、氟(F)、氮(N)或硫(S)。硅酸盐基磷光体的实例揭示于美国专利US 7,575,697 B2“硅酸盐基绿色磷光体(Silicate-based green phosphors)”、US 7,601,276B2“两相硅酸盐基黄色磷光体(Two phase silicate-based yellow phosphors)”、US 7,655,156B2“硅酸盐基橙色磷光体(Silicate-based orange phosphors)”及US 7,311,858 B2“硅酸盐基黄绿色磷光体(Silicate-based yellow-green phosphors)”中。磷光体还可包含铝酸盐基材料(例如如同在申请中的专利申请案US2006/0158090 A1“新颖铝酸盐基绿色磷光体(Novel aluminate-based green phosphors)”及专利US 7,390,437 B2“铝酸盐基蓝色磷光体(Aluminate-based blue phosphors)”中所教示)、铝硅酸盐磷光体(如同在申请中的申请案US2008/0111472 A1“铝硅酸盐基橙红色磷光体(Aluminum-silicate orange-red phosphor)”中所教示)或基于氮化物的红磷光体材料(如同在申请中的美国专利申请案US2009/0283721 A1“基于氮化物的红磷光体(Nitride-based red phosphors)”及国际专利申请案WO2010/074963 A1“RGB(红-绿-蓝)发光系统中基于氮化物的红光发射(Nitride-based red-emitting in RGB(red-green-blue)lighting systems)”中所教示)。应了解,磷光体材料不限于所描述的实例且可包含任何磷光体材料,包含氮化物及/或硫酸盐磷光体材料、氮氧化物及含氧硫酸盐磷光体或石榴石材料(YAG)。
量子点可包括不同材料,例如硒化镉(CdSe)。通过与量子点的纳米晶体结构关联的量子限制效果实现由量子点产生的光的颜色。每一量子点的能量级直接相关于所述量子点的大小。例如,较大量子点(例如,红色量子点)可吸收及发射具有相对较低能量(即,相对较长波长)的光子。另一方面,橙色量子点(其具有较小大小)可吸收及发射具有相对较高能量(较短波长)的光子。此外,为了避免量子点中的镉的毒性,预想日光面板使用无镉量子点及稀土元素(RE)掺杂氧化物胶状磷光体纳米粒子。
合适量子点的实例包含:CdZnSeS(硫化镉锌硒)、CdxZn1-xSe(硒化镉锌)、CdSexS1-x(硫化镉硒)、CdTe(碲化镉)、CdTexS1-x(硫化镉碲)、InP(磷化铟)、InxGa1-xP(磷化铟镓)、InAs(砷化铟)、CuInS2(硫化铜铟)、CuInSe2(硒化铜铟)、CuInSxSe2-x(硒化铜铟硫)、CuInxGa1-xS2(硫化铜铟镓)、CuInxGa1-xSe2(硒化铜铟镓)、CuInxAl1-xSe2(硒化铜铟铝)、CuGaS2(硫化铜镓)及CuInS2xZnS1-x(硒化铜铟硒锌)。
所述量子点材料可包括在洋葱状结构中含有不同材料的芯体/壳纳米晶体。例如,上文描述的示范性材料可用作用于所述芯体/壳纳米晶体的芯体材料。
一种材料中的芯体纳米晶体的光学性质可通过生长另一材料的外延型壳而改变。取决于需求,所述芯体/壳纳米晶体可具有单个壳或多个壳。可基于能隙工程设计来选择壳材料。例如,所述壳材料可具有大于芯体材料的能隙,使得所述纳米晶体的壳可将光学活性芯体的表面与其周围介质分开。
在镉基量子点的情况中(例如,CdSe量子点),可使用化学式CdSe/ZnS、CdSe/CdS、CdSe/ZnSe、CdSe/CdS/ZnS或CdSe/ZnSe/ZnS合成所述芯体/壳量子点。类似地,对于CuInS2量子点可使用化学式CuInS2/ZnS、CuInS2/CdS、CuInS2/CuGaS2、CuInS2/CuGaS2/ZnS等合成所述芯体/壳量子点。
如图2中所示,光致发光波长转换组件150安装于基座130顶部上的LED上方且完全围封所述LED 150。灯100可进一步包括光扩散封套或盖210,其安装到所述主体的灯座且围封组件180。盖210可包括玻璃或并有或具有光扩散(散射)材料的层的光透射聚合物,例如聚碳酸酯、丙烯酸、PET或PVC。光扩散材料的实例包含氧化锌(ZnO)、二氧化钛(TiO2)、硫酸钡(BaSO4)、氧化镁(MgO)、二氧化硅(SiO2)或三氧化二铝(Al2O3)的粒子。
图3展示光致发光波长转换组件180的示意性分解透视图。如图3中所示,组件190可包括空心圆柱形管,所述空心圆柱形管具有直径的孔及轴向长度L。在示范性实施例中展示所述组件的长度是所述组件的孔直径的大约四倍,且所述组件180在轴向方向中的纵横比(长度与孔直径的比)是大约4:1。所述组件的相对尺寸及形状可影响所述组件的径向发射模式,且所述组件经配置以赋予所需发射模式(通常全向)。对于A-19灯泡,所述组件的孔介于约1mm与10mm之间。在所述组件190的制造期间,所述光致发光材料可均质地分布遍及组件190的体积。所述光致发光材料的壁厚度通常介于200μm与2mm之间。
反射器200可包括光反射圆形盘,其安装到所述组件的末端以覆盖所述组件的端面。方便地,反射器200可包括射出模制部分,其由光反射塑料材料构成。替代地,所述反射器可包括金属性组件或具有金属化表面的组件。
由于所述组件具有恒定截面,所以其可容易地使用挤压方法制造。可使用光透射热塑性(热软化)材料(例如,聚碳酸酯、丙烯酸或使用热挤压工艺的低温玻璃)形成所述组件。替代地,所述组件可包括热固性材料或UV可固化材料(例如,硅氧烷或环氧树脂材料)且使用冷挤压方法形成。挤压的益处为其是相对廉价的制造方法。
替代地,可通过射出模制形成所述组件,然而此方法趋向于比挤压更昂贵。由于所述组件具有恒定截面,所以可使用射出模制形成所述组件,而不需使用昂贵的可折叠线圈架。在其它实施例中,可通过铸造形成所述组件。
另一可能方法是通过形成柔性片材以包含磷光体及/或量子点且随后将所述片材辊轧成用于所述组件的所需形状及尺寸来制造所述组件。所述磷光体可作为层施加到所述片材上(例如,通过涂布、印刷或其它合适的沉积方法)。替代地,所述磷光体可并入到所述柔性片材内。
在操作中,LED 150产生蓝色激发光,此激发光的部分在波长转换组件180内激发光致发光材料,此波长转换组件180作为响应而通过光致发光的过程产生另一波长(颜色)(通常黄色、黄色/绿色、橙色、红色或其组合)的光。蓝色LED产生的光的部分与所述光致发光材料产生的光组合以赋予所述灯白色发射产物。
根据本发明的实施例的光致发光组件的特定益处是除改善发射分布模式外,其还可改善总光发射效率。例如,初级测试指示所描述的空心管状波长转换组件可赋予大于已知波长转换组件的总体光发射。相信发射效率的增大起因于具有高纵横比的组件,相信其降低放置于所述组件开口的LED重新吸收光的可能性。
根据本发明的实施例的光致发光波长转换组件的进一步优势是其光发射类似于常规白炽灯泡的灯丝。
图4是根据本发明的使用光致发光波长转换组件的LED烛光形灯泡的示意性部分截面视图。在此实施例中,光致发光波长转换组件180包括细长管状组件,其中光致发光材料并入到包括所述组件的材料中且均质地分布遍及组件材料的体积中。
图5是根据本发明的使用光致发光波长转换组件的LED灯泡的示意性部分截面视图。在此实施例中,光致发光波长转换组件180包括管状组件,其中光致发光材料并入到包括所述组件的材料中。组件180安装到空心光透射管220,且所述组件具有一定长度使得其只覆盖管220在LED 150远端的端部分。组件180可包括半柔性材料,且所述组件(其包括套筒)在管220上方滑动。任选地,如通过粗实线230指示,管220的未被磷光体覆盖的部分(即,所述管的接近LED的部分)可包含光反射表面以防止从所述管的此部分的光发射。
图6是根据本发明的实施例的使用光致发光波长转换组件的LED灯泡的示意性部分截面视图。在此实施例中,光致发光波长转换组件180包括管状组件,其中光致发光材料并入到包括所述组件的材料中。多个LED 150安装到配置为圆形阵列的环形MCPCB 160上。导热光反射管状通道240同轴安装于所述组件内且与基座130及主体110热连通。光反射通道240通过反射器200,此反射器200是环形的且具有通向周围环境的圆形开口250。鳍片110之间的多个开口与光反射通道240的内部形成流体连通,使得气流通过所述通道。在操作中,由所述LED产生的热在通道内加热空气,通过所述通道,对流过程导致空气被汲取到灯泡中并通过灯泡,借此提供所述LED的被动冷却。通过粗实线箭头260指示由于热对流的空气移动。
虽然前述光致发光组件包括空心组件(即,中心区域或孔不包含光透射介质),但是在其它实施例中,所述组件可包括具有实心光透射芯体的组件。具有光透射芯体的组件可通过显著消除所述波长转换组件180与所述LED 150之间的任何空气界面进一步增大光发射。对于在所述组件的壁之间以径向方向行进的光尤其如此。
图7展示根据本发明的实施例的具有实心芯体的光致发光波长转换组件的透视分解图。在此实施例中,所述组件包括实心圆柱形组件,其由圆柱形光透射芯体270及外同轴磷光体层190构成。
此组件可通过芯体270与磷光体层190的共挤压而形成。替代地,可通过制作图3的组件且随后将光透射圆柱形杆(例如,玻璃杆)插入于所述组件的芯体中而制造所述组件。在其它实施例中,可通过涂布磷光体材料于光透射杆(例如,玻璃杆或聚碳酸酯杆)的外表面上而制作所述组件。在一些实施例中,由弹性可变形(半柔性)光透射材料(例如,硅氧烷材料)制作所述组件。使用弹性可变形材料的益处是此可辅助插入所述杆。
在所述组件包括实心组件的情况下,反射器200可包括直接施加到所述组件的端面的涂层(例如,光反射涂料或金属化层)。
图8A及8B展示根据本发明的实施例的光致发光波长转换组件的示意性透视及端视图。如图8A到8B中图解说明的实施例中所见,所述组件包括圆柱形光透射组件270,其具有在纬度方向上延伸的磷光体区域(条带)190。图8A及8B展示均等周向隔开的四个磷光体区域190,然而,应了解,在本发明的范围内,所述磷光体区域的数目、形状及配置可改变。
图9是根据本发明的实施例的使用实心光致发光波长转换组件的LED灯泡的示意性部分截面视图。在此实施例中,光致发光波长转换组件180包括实心芯体270,其中磷光体层190覆盖在LED 150远端的端部分。磷光体层190可包括半柔性材料,其在芯体270上方滑动。任选地,如通过粗实线230指示,芯体270的未被磷光体覆盖的部分(即,所述管的接近LED的部分)可包含光反射表面以防止从所述芯体的此部分的光发射。
虽然本发明是关于灯泡而作出且寻找用于灯泡的特定应用,但是本发明的光致发光波长转换组件可用于其它光发射装置及照明布置(例如,例如线状灯)中。
图10是LED反射器灯的示意性部分截面视图(例如,MR16灯)。在此实施例中,光致发光波长转换组件180具有实心芯体270,其中磷光体层190覆盖在LED 150远端的端部分。任选地,如通过粗实线230指示,芯体270未被磷光体覆盖的部分(即,所述管接近LED的部分)可包含光反射表面以防止从所述芯体的此部分的光发射。所述组件的光发射部分定位于多面反射器280的焦点处或附近。
图11是根据本发明的实施例的使用多个空心光致发光波长转换组件的LED下照灯的示意性部分截面视图。在此实施例中,一些或所有光致发光波长转换组件180包括细长空心管状组件,其中光致发光材料并入到包括所述组件的材料中且均质地分布遍及组件材料的体积中。
在前述实施例中的每一者中,所述组件包括用于接收光的第一近端及在远端上的反射器。预想在进一步实施例中,所述组件的每一端经配置以接收光,借此消除对反射器的需求。图12是使用具有定位于两端处的LED的空心光致发光波长转换组件的LED灯泡的示意性部分截面视图。在此实施例中,光致发光波长转换组件180包括细长空心管状组件,其中光致发光材料并入到包括所述组件的材料中且均质地分布遍及组件材料的体积中。第一LED位于所述组件的第一端处,且第二LED位于所述组件的相对端处。
图13是使用具有定位于两端处的LED的实心光致发光波长转换组件180的LED灯泡的示意性部分截面视图。在此实施例中,组件180可包括图7的实心组件。
图14是使用具有定位于两端处的LED的空心光致发光波长转换组件180的LED灯泡的示意性部分截面视图。在此实施例中,组件180包括管状组件,其各端回绕而使得两端共享共同平面。
图15是根据本发明的实施例的使用多个空心光致发光波长转换组件的LED线状灯的示意性部分截面视图。在此实施例中,每一光致发光波长转换组件180包括细长空心管状组件,其中光致发光材料并入到包括所述组件的材料中且均质地分布遍及组件材料的体积中。
应了解,本发明不限于示范性实施例,且可在本发明的范围内做出改变。例如,虽然在所描述的实施例中光致发光波长转换组件具有圆形截面,但是所述组件可具有其它截面(例如,椭圆形、三角形、正方形、五边形、六边形)。
Claims (26)
1.一种光致发光波长转换组件,其包括:
光透射组件,其具有第一及第二端以及实质上恒定截面,其中所述第一端用于接收光;
光反射表面,其提供于所述第二端的至少部分上方;及
至少一种光致发光材料。
2.根据权利要求1所述的组件,其中所述组件是细长的。
3.根据权利要求2所述的组件,其中所述组件的长度与宽度的比是至少二比一。
4.根据权利要求2所述的组件,其中所述组件的所述长度与宽度的所述比是至少四比一。
5.根据任一前述权利要求所述的组件,其中所述组件具有实质上圆形截面。
6.根据任一前述权利要求所述的组件,其中所述光透射组件包括空心组件。
7.根据权利要求1到5中任一权利要求所述的组件,其中所述光透射组件包括具有光透射芯体的实心组件。
8.根据任一前述权利要求所述的组件,其中所述至少一种光致发光材料并入到所述组件中且均质地分布遍及所述组件的体积。
9.根据权利要求1到7中任一权利要求所述的组件,其中所述至少一种光致发光材料提供为所述组件的外表面的至少部分上的层。
10.根据任一前述权利要求所述的组件,其中所述组件是使用选自由挤压、射出模制及铸造组成的群组的工艺而制造。
11.一种灯,其包括:
至少一个固态光源,其可操作以产生激发光;及
光致发光波长转换组件,其包括:
光透射组件,其具有第一及第二端以及实质上恒定截面;
光反射表面,其提供于所述组件的所述第二端的至少部分上方;及
至少一种光致发光材料;
其中所述至少一个光源经配置以将激发光发射到所述组件的第一端中。
12.根据权利要求11所述的灯,其中所述组件是细长的。
13.根据权利要求12所述的灯,其中所述组件的长度与宽度的比是至少二比一。
14.根据权利要求11到13中任一权利要求所述的灯,其中所述组件具有实质上圆形截面。
15.根据权利要求11到14中任一权利要求所述的灯,其中所述光透射组件包括空心组件。
16.根据权利要求11到14中任一权利要求所述的灯,其中所述光透射组件包括具有光透射芯体的实心组件。
17.根据权利要求11到16中任一权利要求所述的灯,其中所述至少一种光致发光材料并入到所述组件中且均质地分布遍及所述组件的体积。
18.根据权利要求11到16中任一权利要求所述的灯,其中所述至少一种光致发光材料提供为所述组件的外表面的至少部分上的层。
19.一种灯,其包括:
光致发光波长转换组件,其包括光透射组件,所述光透射组件具有第一及第二端以及实质上恒定截面;及
至少一种光致发光材料;
可操作以产生激发光且经配置以将激发光发射到所述组件的所述第一端中的至少一个固态光源;及
可操作以产生激发光且经配置以将激发光发射到所述组件的所述第二端中的至少一个固态光源。
20.根据权利要求19所述的灯,其中所述组件是细长的。
21.根据权利要求20所述的灯,其中所述组件的长度与宽度的比是至少二比一。
22.根据权利要求19到21中任一权利要求所述的灯,其中所述组件具有实质上圆形截面。
23.根据权利要求19到22中任一权利要求所述的灯,其中所述光透射组件包括空心组件。
24.根据权利要求19到22中任一权利要求所述的灯,其中所述光透射组件包括具有光透射芯体的实心组件。
25.根据权利要求19到24中任一权利要求所述的灯,其中所述至少一种光致发光材料并入到所述组件中且均质地分布遍及所述组件的体积。
26.根据权利要求19到24中任一权利要求所述的灯,其中所述至少一种光致发光材料提供为所述组件的外表面的至少部分上的层。
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TW201428215A (zh) | 2014-07-16 |
US20140185269A1 (en) | 2014-07-03 |
EP2938921A1 (en) | 2015-11-04 |
WO2014105812A1 (en) | 2014-07-03 |
CN105008795B (zh) | 2019-07-26 |
US10557594B2 (en) | 2020-02-11 |
US20180328548A1 (en) | 2018-11-15 |
EP2938921B1 (en) | 2019-04-10 |
TWI679375B (zh) | 2019-12-11 |
EP2938921A4 (en) | 2016-10-19 |
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