M392320 五、新型說明： 【新型所屬之技術領域】 本創作「照日月結構」’係指一種將發光二極體的 裸晶片與螢光粉間以非接觸之方式，製成一照明結 構體的設計。 【先前技術】 按’發光二極體（led ) &應用已十分廣泛且 逐漸地應用更為多元化，目冑應用於照㈣LED基 本結構，如第3圖所示’為第一種習用結構，主要 係在一圍起的外封體（outerpackage)内設有一晶 片，該晶片表面再封設有—螢光混合膠，該螢光混 。膠内包含有：基礎膠體（一般為矽膠）、螢光粉、 活化劑等，該螢光混合膠封設於該外封體的上方， 並與晶片直接或間接接觸，因此當晶片發光時，該 光線穿過保護透鏡，並與保護透鏡内的螢光粉產生 作用而形成不同的色澤。 請參看第4圖所示，係為第二種習用結構，和 上—種的不同處’係先將螢光粉覆在晶片處，再加 上螢光混合膝，使螢光粉更接近晶片；再請參看第 5圖所示，為第三種習用結構，主要是將螢光粉設 於螢光混合膠的上層，使晶片射出之光經過螢光粉 而發出白光。 3 M392320 帳由於高功率的LED (例如：照明用LED)， 發出的熱量極高’因此由晶片發出的熱，會直接傳 導至螢光混合膠，使得該基礎膠體（一般為矽膠）、 螢光粉、活化劑長時間被燒烤於高熱之下，使得螢 光粉容易@ LED產生之高溫而劣化變質，同時產生 光衰之現象，而螢光混合膠長時間則容易發生脆裂 情形，是習用LED最常見的缺點。 其次，為了減緩上述高功率[ED的高熱對螢光 混合膠及螢光粉的影響，必需研發及使用耐高溫的 螢光粉及膠體，使得LED的成本一直居高不下，是 習用另一缺點。 又由於LED在裝設晶片後，係以含有螢光粉的 混合膠體塗佈封設於晶片並結合為一體，但由於螢 光粉在螢光混合膠内的分佈不易均勻，且容易在凝 固時產生飄移的現象，故LED在塗佈螢光粉後，需 再進行光學測試，—旦光飽和度有偏差或色澤失 真，則將連同優良的外封體及晶片一併捨棄，使得 良率一直無法提昇，成本無法有效控制，是習用又 一缺點。 【新型内容】 "本創作之主要目的，係在燈座散熱模組内設發 光一極體晶片，該發光二極體晶片係為不具螢光粉 或封厣的裸晶片，而在燈座散熱模組的發光二極體 4 M392320 晶片上方則罩封一燈罩，該燈罩的内壁係均勻塗佈 有螢光塗層’使該發光晶片與螢光塗層之間留有— 空間’且該螢光塗層係吸收發光二極體晶片所發出 光線的照射而發出照明白光；藉此使發光二極體晶 片所產生的高熱無法直接傳導至螢光粉而具有更佳 的哥命’並提高良率而節省成本。 為達上述之目的’本創作可以下列的方式來達 成的： 設一燈座散熱模組，於一端設有電路板，同時 該電路板上至少設有一高功率發光二極體晶片，且 該發光二極體晶片係為裸晶片； 再設一燈罩，係罩設於燈座散熱模組之發光二 極體晶片上方，且在燈罩的内壁係均勻塗佈有螢光 塗層，使該發光一極體晶片與勞光塗層之間留有一 充足的空間，且該螢光塗層係吸收發光晶片的光線 而發出高功率的照明白光。 藉此’使晶片所發出的高熱，不會直接接觸傳 導到螢光粉及封膠，而是先被一空間阻隔，再以輻 射的方式至達燈罩，因此具有降低螢光粉受高熱而 損壞；同時即使是螢光塗層的測試為不良品，則可 直接更換燈罩，更為方便，且選用的螢光粉原料不 需耐高溫而節省成本，為本創作之諸項優點。 因此，本創作是一種利用發光二極體的照明設 計’能得到集燈泡與日光燈優點於一身的創作，又 5 M392320 月b減化知發光二極體傳統燈泡的製程，提高良 率，誠為一十分新穎且實用的設計。 【實施方式】 為使貴審查委員能清楚了解本創作之内容，僅 以下列說明搭配圖式，說明如后：M392320 V. New description: [New technical field] The creation of "Sunshine structure" refers to a kind of illumination structure in which non-contact between bare wafer and phosphor powder of a light-emitting diode is made. the design of. [Prior Art] According to the 'light-emitting diode (LED) & application has been widely and gradually applied more diversified, the purpose is to apply to the (four) LED basic structure, as shown in Figure 3 'as the first conventional structure The main body is provided with a wafer in a surrounding outer package, and the surface of the wafer is further sealed with a fluorescent mixed glue, and the fluorescent mixture is mixed. The glue comprises: a base colloid (generally silicone), a phosphor powder, an activator, etc., the fluorescent hybrid glue is sealed above the outer seal body and directly or indirectly contacted with the wafer, so when the wafer emits light, The light passes through the protective lens and acts to form a different color with the phosphor in the protective lens. Please refer to Figure 4, which is the second conventional structure. The difference between the above and the other is to first coat the phosphor powder on the wafer, and add the fluorescent mixing knee to make the phosphor powder closer to the wafer. Please refer to Fig. 5 again. For the third conventional structure, the phosphor powder is mainly placed on the upper layer of the fluorescent hybrid glue, so that the light emitted from the wafer passes through the phosphor powder to emit white light. 3 M392320 accounts for high heat output LEDs (eg LEDs for illumination), so the heat emitted by the wafer is directly transmitted to the fluorescent hybrid, making the base colloid (usually silicone), fluorescent The powder and activator are grilled under high heat for a long time, which makes the fluorescent powder easy to deteriorate due to the high temperature generated by the LED, and at the same time, the phenomenon of light decay occurs, and the fluorescent mixed rubber is prone to brittleness for a long time, which is a conventional use. The most common drawback of LEDs. Secondly, in order to alleviate the above-mentioned high-power [ED high heat on the fluorescent hybrid and fluorescent powder, it is necessary to develop and use high-temperature fluorescent powder and colloid, so that the cost of LED has always been high, which is another disadvantage of the conventional use. . Moreover, since the LED is packaged on the wafer and integrated by the mixed colloid containing the phosphor powder after the wafer is mounted, the distribution of the phosphor powder in the fluorescent hybrid rubber is not uniform, and it is easy to be solidified. The drift phenomenon occurs, so after the LED is coated with the fluorescent powder, it needs to be optically tested again. If the light saturation is deviated or the color is distorted, it will be discarded together with the excellent outer sealing body and the wafer, so that the yield is always Can not be upgraded, the cost can not be effectively controlled, is another shortcoming of the use. [New content] " The main purpose of this creation is to provide a light-emitting one-pole wafer in the lamp holder heat-dissipating module. The light-emitting diode chip is a bare wafer without fluorescent powder or sealing, and the lamp holder is in the lamp holder. The light-emitting diode 4 of the heat-dissipating module is covered with a lamp cover, and the inner wall of the lamp cover is evenly coated with a fluorescent coating 'to leave space between the light-emitting chip and the fluorescent coating' and The fluorescent coating absorbs the light emitted by the light emitting diode chip to emit white light; thereby, the high heat generated by the light emitting diode chip cannot be directly transmitted to the fluorescent powder, thereby having a better life and improving Yield and cost savings. In order to achieve the above objectives, the present invention can be achieved in the following manner: a lamp socket heat dissipation module is provided with a circuit board at one end, and at least one high power light emitting diode chip is disposed on the circuit board, and the light is emitted. The diode chip is a bare chip; a lamp cover is disposed on the light-emitting diode chip of the lamp socket heat-dissipating module, and the inner wall of the lamp cover is uniformly coated with a fluorescent coating to make the light-emitting layer A sufficient space is left between the polar body wafer and the glare coating, and the luminescent coating absorbs light from the illuminating wafer to emit high power illuminating white light. Therefore, the high heat generated by the wafer is not directly contacted to the phosphor powder and the sealant, but is first blocked by a space and then radiated to the lampshade, thereby reducing the damage of the phosphor powder by high heat. At the same time, even if the test of the fluorescent coating is a defective product, the lampshade can be directly replaced, which is more convenient, and the selected fluorescent powder raw material does not need high temperature resistance and saves cost, which is an advantage of the creation. Therefore, this creation is a kind of lighting design using the light-emitting diodes, which can get the advantages of integrating the advantages of the light bulb and the fluorescent lamp, and the process of improving the yield of the traditional light bulb of the light-emitting diode by 5 M392320 month b, and improving the yield. A very novel and practical design. [Embodiment] In order for your review board to clearly understand the content of this creation, only the following description is used in conjunction with the schema, as explained below:
請參看第1、2圖所示，本創作至少包含有： 一燈座散熱模組（1 〇 )，於一端設有電路板（2 〇)’同時該電路板（20)上至少設有一高功率發 光二極體晶片（3 0 )，且該發光二極體晶片（3 ◦) 係具有二種實施方式，第一種係為單純散發有色光 的發光二極體（LED)裸晶片，即不具有螢光粉、保護 封膠（Lens)的裸晶片，故可為藍光、红光、綠光 2其中一種；該發光二極體晶片（3〇)的第二種 實施例係為能發出高功率紫外線（uv)的裸晶片。 上述的燈座散熱模組（i 〇 )可為一體成型， 亦可由單純的燈座再附加散熱模組所取代，並不奢 響本創作之特色。 燈座政熱模組（1 〇)，是用來吸收並傳導誃 發光二極體晶“ 3 〇 )所產生之熱，並予導弓丨 一燈罩（40)，係罩設於燈座散熱模組（ι 〇 之發光二極趙晶“ 3 〇 )上方，該燈罩（4 〇 ) 可為任意的燈泡型式，且在該燈罩（4 〇 )的内壁 6 M392320 係均勻塗佈有螢光塗層（50)，而因發光二極體晶 片（30)與螢光塗層（50)之間留有一充足的 ^間（4 1 )，使得螢光塗層（5 〇 )能避免直接被 高熱所燒烤；這和習知（如第3、4、5圖）直接 在發光二極體晶片上塗佈螢光粉是有明顯的差異 性’本創作之優點將於後段再予詳述。Please refer to Figures 1 and 2, the creation includes at least: a lamp holder cooling module (1 〇), with a circuit board (2 〇) at one end and at least one high on the circuit board (20) A power LED chip (30), and the LED chip (3 ◦) has two embodiments, the first one is a bare LED of a light emitting diode (LED) that simply emits colored light, that is, A bare wafer that does not have a phosphor powder or a protective sealant (Lens), so it can be one of blue light, red light, and green light 2; the second embodiment of the light-emitting diode chip (3 turns) is capable of emitting High power ultraviolet (uv) bare wafer. The above-mentioned lamp holder heat dissipation module (i 〇 ) can be integrally formed, or can be replaced by a simple lamp holder and an additional heat dissipation module, which does not excite the characteristics of the creation. The lampholder thermal module (1 〇) is used to absorb and conduct the heat generated by the 誃-emitting diode crystal “3 〇”, and to guide the bow to a lampshade (40), and the cover is disposed at the lamp holder for heat dissipation. Above the module (3 〇), the lampshade (4 〇) can be any bulb type, and the inner wall 6 M392320 of the lampshade (4 〇) is uniformly coated with fluorescent coating. Layer (50), because there is a sufficient space (4 1 ) between the LED chip (30) and the fluorescent coating (50), so that the fluorescent coating (5 〇) can avoid direct high heat This is a good difference between the conventional method (as shown in Figures 3, 4, and 5) for directly coating the phosphor powder on the LED wafer. The advantages of this creation will be described in detail later.
上述塗設於燈罩（40)内壁的螢光塗層（5 〇 )係配合發光二極體晶片（3 〇 )而設置，例如： 當發光二極體晶片（3 〇 )係發出藍光，則該螢光 塗層（5 〇 )係、為黃色螢光粉之封夥，即可配出有 效的照明白光；諸如此類，當發光二極體晶片（3 〇 )係發出綠光或红光或紫外線，則螢光塗層（5 0 )亦可相對設置；惟該發光二極體晶片（3 〇 ) 一 ^光塗層（5 〇 )(即：螢光粉）之間的材料配置， 皆可用目前現有之技藝來使用於本創作也證明本The phosphor coating (5 〇) coated on the inner wall of the lamp cover (40) is provided in combination with the LED chip (3 〇), for example: when the LED chip (3 〇) emits blue light, the Fluorescent coated (5 〇) system, which is a yellow fluorescent powder, can be equipped with effective illumination white light; and so on, when the LED chip (3 〇) emits green or red or ultraviolet light, The phosphor coating (50) can also be disposed oppositely; however, the material arrangement between the LED chip (3 〇) and the light coating (5 〇) (ie, phosphor powder) can be used at present. The existing skills to use in this creation also prove this
案的可實施性，故該材料的配置並非本創作案之特 徵，故不予贅述，合先陳明。 曰°月參看第1、2圖所示，t高功率的發光二極 片（3 0 )發出強烈的原色光時，能均勻的朝 燈罩（4 0 )内壁散出’這個空間（4丄）能避免 塗佈於燈罩（40)内壁的榮光塗層（5〇)被直 接燒烤，ϋ此壽命較長。 :述的燈罩（4〇)，其内部罩設發光二極體晶 )的空間（4 1 )内，可為抽真空狀或填 7 M392320 充有鈍氣，或其他稀薄的空氣， 證明本創作的使用十分廣泛。 至於燈罩（4 0 )除了可為 曰光燈管狀）亦可同理使用，仍係為本創作的特徵 内容所在。The feasibility of the case, so the configuration of the material is not a feature of this creation case, so it will not be described in detail.曰° month, as shown in Figures 1 and 2, when the high-powered light-emitting diode (30) emits strong primary light, it can evenly scatter the space (4丄) toward the inner wall of the lampshade (40). It is possible to prevent the glare coating (5〇) applied to the inner wall of the lampshade (40) from being directly grilled, and the life is longer. The space (4 1 ) of the lampshade (4〇), which is covered with a light-emitting diode crystal, can be vacuumed or filled with 7 M392320 with a blunt gas, or other thin air, which proves the creation. It is widely used. As for the lampshade (40), it can be used in the same way as the twilight tube. It is still the characteristic content of this creation.
另外，本創作係將高功率發光二極體晶片 〇 )及營光塗層（5 〇 )>開一定距離設置，不直 接接觸’除了上述的防止高溫損壞之外，該螢光塗 層（5 〇 )僅需適度選用適合溫度的原料，能節省 成本’為本創作之又一優點。 再則，本創作若是高功率發光二極體晶片（3 、或螢光塗層（5 0 )有任一損壞，係得分別予 以；太置，以節省材料，為本創作再一優點。 Φ 皆仍可有效使用， 本劍作圖式所揭示 的球形之外，其他如橢圓形、半球形或長管形（如 、Χ上所述者，僅為本創作之較佳實施例而已， ，非用以限定本創作實施之範圍，其他如附加各種 =矣既有的技術及元件，在不脫離本創作之精神與 ★圍下所作之等效取代與修飾，皆應涵蓋於本創作 之專利範圍内。 8 M392320 【圖式簡單說明】 第1圖 係本創作應用實施例之結構分解圖。 第2圖 係本創作應用實施例之組合剖視圖。 第3圖 係習用第1種照明結構内之LED結構圖。 第4圖 係習用第2種照明結構内之LED結構圖。 第5圖 係習用第3種照明結構内之LED結構圖。 2 0電路板 4 0燈罩 5 0螢光塗層 【主要元件符號說明】 1 0燈座散熱模組 3 0發光二極體晶片 4 1空間In addition, the creation of the high-power light-emitting diode chip 及) and the camping light coating (5 〇) > set a certain distance, not directly in contact with the above-mentioned to prevent high temperature damage, the fluorescent coating ( 5 〇) Only a moderate selection of materials suitable for temperature can save cost, which is another advantage of this creation. Furthermore, if the creation of high-power LED chips (3, or fluorescent coating (50) has any damage, it should be given separately; too, to save materials, another advantage of the creation. Φ They can still be used effectively. Other than the spherical shape disclosed by the sword, other such as elliptical, hemispherical or long tubular (as described above, only the preferred embodiment of the present invention, It is not intended to limit the scope of the implementation of this work. Others, such as the addition of various technologies and components, should be included in the patents of this creation without departing from the spirit of this creation and the equivalent substitutions and modifications. 8 M392320 [Simple description of the drawings] Fig. 1 is a structural exploded view of the application example of the present application. Fig. 2 is a sectional view of a combination of the embodiments of the present application. Fig. 3 is a view of the first illumination structure. LED structure diagram. Figure 4 is a diagram of the LED structure in the second illumination structure. Figure 5 is a diagram of the LED structure in the third illumination structure. 2 0 circuit board 4 0 lampshade 50 fluorescent coating Main component symbol description] 1 0 lamp holder cooling module 3 0 LED Diode Wafer 4 1 Space