CN1048821C - 形成半导体器件隔离的方法 - Google Patents

形成半导体器件隔离的方法 Download PDF

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Publication number
CN1048821C
CN1048821C CN96101498A CN96101498A CN1048821C CN 1048821 C CN1048821 C CN 1048821C CN 96101498 A CN96101498 A CN 96101498A CN 96101498 A CN96101498 A CN 96101498A CN 1048821 C CN1048821 C CN 1048821C
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CN
China
Prior art keywords
substrate
insulating barrier
transition metal
metal pad
groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN96101498A
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English (en)
Chinese (zh)
Other versions
CN1134038A (zh
Inventor
朴相勋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SK Hynix Inc
Original Assignee
Hyundai Electronics Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hyundai Electronics Industries Co Ltd filed Critical Hyundai Electronics Industries Co Ltd
Publication of CN1134038A publication Critical patent/CN1134038A/zh
Application granted granted Critical
Publication of CN1048821C publication Critical patent/CN1048821C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/76294—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using selective deposition of single crystal silicon, i.e. SEG techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/76224—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials
    • H01L21/76237—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials introducing impurities in trench side or bottom walls, e.g. for forming channel stoppers or alter isolation behavior

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Element Separation (AREA)
  • Local Oxidation Of Silicon (AREA)
CN96101498A 1995-02-24 1996-02-24 形成半导体器件隔离的方法 Expired - Fee Related CN1048821C (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR3727/95 1995-02-24
KR3727/1995 1995-02-24
KR1019950003727A KR100190367B1 (ko) 1995-02-24 1995-02-24 소자분리막형성방법

Publications (2)

Publication Number Publication Date
CN1134038A CN1134038A (zh) 1996-10-23
CN1048821C true CN1048821C (zh) 2000-01-26

Family

ID=19408771

Family Applications (1)

Application Number Title Priority Date Filing Date
CN96101498A Expired - Fee Related CN1048821C (zh) 1995-02-24 1996-02-24 形成半导体器件隔离的方法

Country Status (5)

Country Link
US (1) US5668043A (enExample)
JP (1) JP2788889B2 (enExample)
KR (1) KR100190367B1 (enExample)
CN (1) CN1048821C (enExample)
TW (1) TW301022B (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW365047B (en) * 1996-10-04 1999-07-21 Winbond Electronics Corp Manufacturing method for simultaneously forming trenches of different depths
US6686283B1 (en) * 1999-02-05 2004-02-03 Texas Instruments Incorporated Shallow trench isolation planarization using self aligned isotropic etch
US6306723B1 (en) 2000-03-13 2001-10-23 Chartered Semiconductor Manufacturing Ltd. Method to form shallow trench isolations without a chemical mechanical polish
CN110223916B (zh) * 2019-05-06 2022-03-08 瑞声科技(新加坡)有限公司 一种硅晶片的加工方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5256591A (en) * 1991-01-07 1993-10-26 Gold Star Electron Co., Ltd. Method for forming isolation region in semiconductor device using trench

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5766627A (en) * 1980-10-13 1982-04-22 Toshiba Corp Manufacture of semiconductor device
JPS5893220A (ja) * 1981-11-30 1983-06-02 Toshiba Corp 半導体単結晶膜の製造方法
JPH01321629A (ja) * 1988-06-23 1989-12-27 Nec Corp 薄膜形成方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5256591A (en) * 1991-01-07 1993-10-26 Gold Star Electron Co., Ltd. Method for forming isolation region in semiconductor device using trench

Also Published As

Publication number Publication date
CN1134038A (zh) 1996-10-23
JP2788889B2 (ja) 1998-08-20
KR960032673A (ko) 1996-09-17
US5668043A (en) 1997-09-16
KR100190367B1 (ko) 1999-06-01
JPH08264634A (ja) 1996-10-11
TW301022B (enExample) 1997-03-21

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C06 Publication
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C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C56 Change in the name or address of the patentee

Owner name: HYNIX SEMICONDUCTOR INC.

Free format text: FORMER NAME OR ADDRESS: HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.

CP01 Change in the name or title of a patent holder

Address after: Gyeonggi Do, South Korea

Patentee after: Hairyoksa Semiconductor Co., Ltd.

Address before: Gyeonggi Do, South Korea

Patentee before: Hyundai Electronics Industries Co., Ltd.

C19 Lapse of patent right due to non-payment of the annual fee
CF01 Termination of patent right due to non-payment of annual fee