CN104781926A - 气密密封用盖材和电子部件收纳用封装件 - Google Patents
气密密封用盖材和电子部件收纳用封装件 Download PDFInfo
- Publication number
- CN104781926A CN104781926A CN201380058789.XA CN201380058789A CN104781926A CN 104781926 A CN104781926 A CN 104781926A CN 201380058789 A CN201380058789 A CN 201380058789A CN 104781926 A CN104781926 A CN 104781926A
- Authority
- CN
- China
- Prior art keywords
- alloy
- quality
- sealing cap
- hermetic sealing
- electronic unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D65/00—Wrappers or flexible covers; Packaging materials of special type or form
- B65D65/02—Wrappers or flexible covers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0077—Other packages not provided for in groups B81B7/0035 - B81B7/0074
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D25/00—Details of other kinds or types of rigid or semi-rigid containers
- B65D25/02—Internal fittings
- B65D25/10—Devices to locate articles in containers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D65/00—Wrappers or flexible covers; Packaging materials of special type or form
- B65D65/38—Packaging materials of special type or form
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
- B65D85/70—Containers, packaging elements or packages, specially adapted for particular articles or materials for materials not otherwise provided for
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/562—Protection against mechanical damage
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02086—Means for compensation or elimination of undesirable effects
- H03H9/02149—Means for compensation or elimination of undesirable effects of ageing changes of characteristics, e.g. electro-acousto-migration
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
- H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12896—Ag-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12903—Cu-base component
- Y10T428/1291—Next to Co-, Cu-, or Ni-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12931—Co-, Fe-, or Ni-base components, alternative to each other
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12944—Ni-base component
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Abstract
Description
Claims (18)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012-248261 | 2012-11-12 | ||
JP2012248261 | 2012-11-12 | ||
PCT/JP2013/080321 WO2014073665A1 (ja) | 2012-11-12 | 2013-11-08 | 気密封止用蓋材および電子部品収納用パッケージ |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104781926A true CN104781926A (zh) | 2015-07-15 |
CN104781926B CN104781926B (zh) | 2017-07-28 |
Family
ID=50684756
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201380058789.XA Active CN104781926B (zh) | 2012-11-12 | 2013-11-08 | 气密密封用盖材和电子部件收纳用封装件 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20150232244A1 (zh) |
EP (1) | EP2919263B1 (zh) |
JP (1) | JP5632563B2 (zh) |
KR (1) | KR101674333B1 (zh) |
CN (1) | CN104781926B (zh) |
TW (1) | TWI508234B (zh) |
WO (1) | WO2014073665A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108909085A (zh) * | 2018-07-13 | 2018-11-30 | 安徽晶赛科技股份有限公司 | 一种适用于激光焊接石英晶体封装的上盖及其制备方法 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6164538B2 (ja) * | 2014-10-30 | 2017-07-19 | 日立金属株式会社 | 気密封止用リッドおよびその製造方法、それを用いた電子部品収納パッケージ |
JP6387818B2 (ja) * | 2014-12-11 | 2018-09-12 | 日立金属株式会社 | 気密封止用蓋材の製造方法 |
JP6421595B2 (ja) * | 2014-12-26 | 2018-11-14 | 日立金属株式会社 | 気密封止用蓋材、気密封止用蓋材の製造方法および電子部品収納パッケージ |
JP2016139758A (ja) * | 2015-01-29 | 2016-08-04 | 株式会社日立金属ネオマテリアル | 気密封止用蓋材および電子部品収容パッケージ |
JP2017011237A (ja) * | 2015-06-26 | 2017-01-12 | セイコーエプソン株式会社 | 蓋体、パッケージ、電子デバイス、電子機器及び移動体 |
KR102117466B1 (ko) * | 2015-08-28 | 2020-06-01 | 삼성전기주식회사 | 전자부품 패키지 |
KR102414843B1 (ko) * | 2017-05-22 | 2022-06-30 | 삼성전기주식회사 | 음향파 디바이스 및 그 제조방법 |
DE102017125140B4 (de) * | 2017-10-26 | 2021-06-10 | Infineon Technologies Ag | Verfahren zum Herstellen eines hermetisch abgedichteten Gehäuses mit einem Halbleiterbauteil |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000236228A (ja) * | 1999-02-12 | 2000-08-29 | Daishinku Corp | 圧電振動子の気密封止構造 |
JP2002026679A (ja) * | 2000-07-04 | 2002-01-25 | Daishinku Corp | 圧電振動デバイス用パッケージ |
JP2002255167A (ja) * | 2001-02-26 | 2002-09-11 | Murata Mfg Co Ltd | 電子部品パッケージおよびその製造方法 |
CN1460292A (zh) * | 2001-03-27 | 2003-12-03 | 住友特殊金属株式会社 | 电子器件用封装体及其制造方法 |
WO2012108083A1 (ja) * | 2011-02-07 | 2012-08-16 | 株式会社Neomaxマテリアル | 気密封止用蓋材、電子部品収納用パッケージおよび気密封止用蓋材の製造方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
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US762431A (en) * | 1903-06-11 | 1904-06-14 | Patrick C Mcgrath | Suction apparatus for paper-machines. |
JP2883235B2 (ja) * | 1991-12-09 | 1999-04-19 | 京セラ株式会社 | 半導体素子収納用パッケージ |
JPH076231A (ja) * | 1993-04-07 | 1995-01-10 | Yuseisho Tsushin Sogo Kenkyusho | 画像間距離高速計算方式 |
JP2976763B2 (ja) * | 1993-08-20 | 1999-11-10 | 日本鋼管株式会社 | 低熱膨張合金の製造方法 |
NL1019373C2 (nl) * | 2001-11-15 | 2003-05-16 | Eurosort B V I O | Inrichting en transporthouder voor het transporteren en gecontroleerd afwerpen van een last. |
JP4071191B2 (ja) * | 2003-12-22 | 2008-04-02 | 田中貴金属工業株式会社 | 電子部品パッケージ封止用の蓋体 |
JP2006147875A (ja) * | 2004-11-19 | 2006-06-08 | Tokuriki Honten Co Ltd | 封止材料およびその製造方法 |
US20120132522A1 (en) * | 2007-07-19 | 2012-05-31 | Innovative Micro Technology | Deposition/bonding chamber for encapsulated microdevices and method of use |
JP2009232327A (ja) * | 2008-03-25 | 2009-10-08 | Citizen Holdings Co Ltd | 圧電振動子パッケージの製造方法 |
WO2009133717A1 (ja) * | 2008-05-02 | 2009-11-05 | 株式会社Neomaxマテリアル | 気密封止用キャップ |
JP2010104999A (ja) * | 2008-10-28 | 2010-05-13 | Hitachi Cable Ltd | ろう付け用複合材及びろう付け製品 |
JP5668392B2 (ja) * | 2010-09-28 | 2015-02-12 | セイコーエプソン株式会社 | 圧電振動素子、圧電振動子及び圧電発振器 |
US9398426B2 (en) * | 2011-02-07 | 2016-07-19 | Telefonaktiebolaget Lm Ericsson (Publ) | Method and apparatus for transmitting secure cell broadcast messages in a cellular communication network |
-
2013
- 2013-11-08 CN CN201380058789.XA patent/CN104781926B/zh active Active
- 2013-11-08 WO PCT/JP2013/080321 patent/WO2014073665A1/ja active Application Filing
- 2013-11-08 KR KR1020157007351A patent/KR101674333B1/ko active IP Right Grant
- 2013-11-08 JP JP2014511673A patent/JP5632563B2/ja active Active
- 2013-11-08 US US14/428,054 patent/US20150232244A1/en not_active Abandoned
- 2013-11-08 EP EP13852845.0A patent/EP2919263B1/en active Active
- 2013-11-12 TW TW102140996A patent/TWI508234B/zh active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000236228A (ja) * | 1999-02-12 | 2000-08-29 | Daishinku Corp | 圧電振動子の気密封止構造 |
JP2002026679A (ja) * | 2000-07-04 | 2002-01-25 | Daishinku Corp | 圧電振動デバイス用パッケージ |
JP2002255167A (ja) * | 2001-02-26 | 2002-09-11 | Murata Mfg Co Ltd | 電子部品パッケージおよびその製造方法 |
CN1460292A (zh) * | 2001-03-27 | 2003-12-03 | 住友特殊金属株式会社 | 电子器件用封装体及其制造方法 |
WO2012108083A1 (ja) * | 2011-02-07 | 2012-08-16 | 株式会社Neomaxマテリアル | 気密封止用蓋材、電子部品収納用パッケージおよび気密封止用蓋材の製造方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108909085A (zh) * | 2018-07-13 | 2018-11-30 | 安徽晶赛科技股份有限公司 | 一种适用于激光焊接石英晶体封装的上盖及其制备方法 |
Also Published As
Publication number | Publication date |
---|---|
US20150232244A1 (en) | 2015-08-20 |
CN104781926B (zh) | 2017-07-28 |
TW201431008A (zh) | 2014-08-01 |
WO2014073665A1 (ja) | 2014-05-15 |
EP2919263A4 (en) | 2016-06-22 |
KR101674333B1 (ko) | 2016-11-22 |
EP2919263B1 (en) | 2021-08-18 |
TWI508234B (zh) | 2015-11-11 |
KR20150064034A (ko) | 2015-06-10 |
JP5632563B2 (ja) | 2014-11-26 |
EP2919263A1 (en) | 2015-09-16 |
JPWO2014073665A1 (ja) | 2016-09-08 |
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C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20170110 Address after: Tokyo, Japan Applicant after: HITACHI METALS, Ltd. Address before: Osaka Japan Applicant before: NEOMAX MAT Co.,Ltd. Applicant before: Hitachi Metals, Ltd. Effective date of registration: 20170110 Address after: Osaka Japan Applicant after: NEOMAX MAT Co.,Ltd. Applicant after: HITACHI METALS, Ltd. Address before: Osaka Japan Applicant before: NEOMAX MATERIALS CO.,LTD. Applicant before: Hitachi Metals, Ltd. |
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