JP4071191B2 - 電子部品パッケージ封止用の蓋体 - Google Patents
電子部品パッケージ封止用の蓋体 Download PDFInfo
- Publication number
- JP4071191B2 JP4071191B2 JP2003425489A JP2003425489A JP4071191B2 JP 4071191 B2 JP4071191 B2 JP 4071191B2 JP 2003425489 A JP2003425489 A JP 2003425489A JP 2003425489 A JP2003425489 A JP 2003425489A JP 4071191 B2 JP4071191 B2 JP 4071191B2
- Authority
- JP
- Japan
- Prior art keywords
- lid
- copper
- layer
- nickel
- silver
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 48
- 239000000463 material Substances 0.000 claims description 46
- 238000005219 brazing Methods 0.000 claims description 30
- 229910052759 nickel Inorganic materials 0.000 claims description 24
- 229910045601 alloy Inorganic materials 0.000 claims description 19
- 239000000956 alloy Substances 0.000 claims description 19
- 229910000570 Cupronickel Inorganic materials 0.000 claims description 17
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 claims description 17
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 9
- 229910052709 silver Inorganic materials 0.000 claims description 9
- 239000004332 silver Substances 0.000 claims description 9
- 229910000833 kovar Inorganic materials 0.000 claims description 8
- 238000007789 sealing Methods 0.000 claims description 8
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 4
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims description 3
- 229910001128 Sn alloy Inorganic materials 0.000 claims description 3
- 229910000846 In alloy Inorganic materials 0.000 claims description 2
- 229910001297 Zn alloy Inorganic materials 0.000 claims description 2
- NEIHULKJZQTQKJ-UHFFFAOYSA-N [Cu].[Ag] Chemical compound [Cu].[Ag] NEIHULKJZQTQKJ-UHFFFAOYSA-N 0.000 claims description 2
- PQIJHIWFHSVPMH-UHFFFAOYSA-N [Cu].[Ag].[Sn] Chemical compound [Cu].[Ag].[Sn] PQIJHIWFHSVPMH-UHFFFAOYSA-N 0.000 claims description 2
- NZWXMOTXTNDNLK-UHFFFAOYSA-N [Cu].[Zn].[Ag] Chemical compound [Cu].[Zn].[Ag] NZWXMOTXTNDNLK-UHFFFAOYSA-N 0.000 claims description 2
- DICWILYNZSJYMQ-UHFFFAOYSA-N [In].[Cu].[Ag] Chemical compound [In].[Cu].[Ag] DICWILYNZSJYMQ-UHFFFAOYSA-N 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 66
- 238000000034 method Methods 0.000 description 25
- 238000003466 welding Methods 0.000 description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 12
- 229910052802 copper Inorganic materials 0.000 description 12
- 239000010949 copper Substances 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 8
- 238000005304 joining Methods 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 229910000990 Ni alloy Inorganic materials 0.000 description 3
- 238000010894 electron beam technology Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 229910000531 Co alloy Inorganic materials 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- KGWWEXORQXHJJQ-UHFFFAOYSA-N [Fe].[Co].[Ni] Chemical compound [Fe].[Co].[Ni] KGWWEXORQXHJJQ-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000012611 container material Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- ORQBXQOJMQIAOY-UHFFFAOYSA-N nobelium Chemical compound [No] ORQBXQOJMQIAOY-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 230000002040 relaxant effect Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Images
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
Claims (3)
- コバール、鉄ニッケル合金からなる蓋体と、該蓋体のベースへの接合面に接合される銀系ろう材層とからなる電子部品パッケージ封止用の蓋体であって、
前記蓋体と銀系ろう材層との中間に、ニッケル濃度が30重量%の銅−ニッケル合金よりなり、厚さ1〜30μmの中間層を備える電子部品パッケージ封止用の蓋体。 - 前記銀系ろう材は、銀−銅合金、銀−銅−錫合金、銀−銅−インジウム合金、銀−銅−亜鉛合金である請求項1記載の電子部品パッケージ封止用の蓋体。
- 前記蓋体の表面にニッケル層を備える請求項1又は請求項2記載の電子部品パッケージ封止用の蓋体。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003425489A JP4071191B2 (ja) | 2003-12-22 | 2003-12-22 | 電子部品パッケージ封止用の蓋体 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003425489A JP4071191B2 (ja) | 2003-12-22 | 2003-12-22 | 電子部品パッケージ封止用の蓋体 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005183830A JP2005183830A (ja) | 2005-07-07 |
JP4071191B2 true JP4071191B2 (ja) | 2008-04-02 |
Family
ID=34785364
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003425489A Expired - Lifetime JP4071191B2 (ja) | 2003-12-22 | 2003-12-22 | 電子部品パッケージ封止用の蓋体 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4071191B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021066024A1 (ja) | 2019-09-30 | 2021-04-08 | 京セラ株式会社 | 蓋体、電子部品収容用パッケージ及び電子装置 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4969890B2 (ja) * | 2006-03-31 | 2012-07-04 | 日本電波工業株式会社 | 圧電デバイス |
WO2014073665A1 (ja) * | 2012-11-12 | 2014-05-15 | 株式会社Neomaxマテリアル | 気密封止用蓋材および電子部品収納用パッケージ |
JP2016139758A (ja) * | 2015-01-29 | 2016-08-04 | 株式会社日立金属ネオマテリアル | 気密封止用蓋材および電子部品収容パッケージ |
KR102117466B1 (ko) * | 2015-08-28 | 2020-06-01 | 삼성전기주식회사 | 전자부품 패키지 |
US11417575B2 (en) | 2018-06-28 | 2022-08-16 | Kyocera Corporation | Board and semiconductor apparatus |
-
2003
- 2003-12-22 JP JP2003425489A patent/JP4071191B2/ja not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021066024A1 (ja) | 2019-09-30 | 2021-04-08 | 京セラ株式会社 | 蓋体、電子部品収容用パッケージ及び電子装置 |
Also Published As
Publication number | Publication date |
---|---|
JP2005183830A (ja) | 2005-07-07 |
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