JP6146707B2 - セラミックス−金属の接合体およびその製造方法 - Google Patents
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
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- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
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- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
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- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
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- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/32—Selection of soldering or welding materials proper with the principal constituent melting at more than 1550 degrees C
- B23K35/325—Ti as the principal constituent
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- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
- C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
- C04B37/026—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of metals or metal salts
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/02—Iron or ferrous alloys
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/18—Dissimilar materials
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/52—Ceramics
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
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- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
- C04B2237/12—Metallic interlayers
- C04B2237/122—Metallic interlayers based on refractory metals
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- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
- C04B2237/12—Metallic interlayers
- C04B2237/123—Metallic interlayers based on iron group metals, e.g. steel
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- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
- C04B2237/12—Metallic interlayers
- C04B2237/124—Metallic interlayers based on copper
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- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
- C04B2237/12—Metallic interlayers
- C04B2237/125—Metallic interlayers based on noble metals, e.g. silver
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- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/32—Ceramic
- C04B2237/34—Oxidic
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- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/32—Ceramic
- C04B2237/34—Oxidic
- C04B2237/341—Silica or silicates
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- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/32—Ceramic
- C04B2237/34—Oxidic
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- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/40—Metallic
- C04B2237/405—Iron metal group, e.g. Co or Ni
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- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/55—Pre-treatments of a coated or not coated substrate other than oxidation treatment in order to form an active joining layer
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Ceramic Products (AREA)
Description
1aa 表面
2 金属部材
2b 接合端部
3 接着層
3a ペースト材
4 ろう材
4a 金属材
4a1 金属間化合物
10 セラミックス−金属の接合体
Claims (8)
- セラミックス部材と板状の金属部材とを、ろう材により接合した電磁継電器の外囲器用のセラミックス−金属の接合体であって、
前記セラミックス部材は、酸化物系セラミックよりなり、前記金属部材は、Niを含有し主としてFeよりなり、前記セラミックス部材は、前記酸化物系セラミックと反応可能な活性金属を含み前記セラミックス部材と前記ろう材との接着を行う接着層を前記セラミックス部材の表面に1.5μm以下の厚さで有しており、前記ろう材は、前記接着層および前記金属部材の接合端部に接しており、
前記接合端部は、断面視において、前記セラミックス部材側に突出する凸形状であり、外方に向かって膨らむ曲面状であり、前記ろう材中に前記活性金属と前記Niとの金属間化合物を前記接合端部の外周に沿って有することを特徴とするセラミックス−金属の接合体。 - 前記金属部材は、Niの含有率が30重量%以下のFe合金であることを特徴とする請求項1に記載のセラミックス−金属の接合体。
- 酸化物系セラミックよりなるセラミックス部材と、Niを含有し主としてFeよりなり、断面視において、前記セラミックス部材側に突出する凸形状であり、外方に向かって膨らむ曲面状の接合端部を有する板状の金属部材とを、ろう材により接合する電磁継電器の外囲器用のセラミックス−金属の接合体の製造方法であって、
前記酸化物系セラミックと反応可能な活性金属を含有するペースト材を前記セラミックス部材に塗布する塗布工程と、
前記セラミックス部材に塗布された前記ペースト材上にAgを含む金属材を介して前記金属部材の前記接合端部を前記セラミックス側に配置する配置工程と、
配置工程の後、減圧雰囲気中で加熱処理することにより、前記ペースト材の前記活性金属を前記酸化物系セラミック中に拡散させ前記セラミックス部材上に前記セラミックス部材と前記ろう材との接着を行う接着層を形成するとともに前記金属材を溶融させて、前記セラミックス部材上の前記接着層と前記金属部材の前記接合端部とをろう付けするろう付け工程とを有することを特徴とするセラミックス−金属の接合体の製造方法。 - 前記ペースト材は、前記活性金属を含み平均粒子径が10μm以下の粉末を有しており、前記塗布工程において、前記ペースト材を20μm以下の膜厚で前記セラミックス部材に塗布することを特徴とする請求項3に記載のセラミックス−金属の接合体の製造方法。
- 前記活性金属は、Ti、Zr、Hfのいずれか1種であることを特徴とする請求項3または請求項4に記載のセラミックス−金属の接合体の製造方法。
- 前記ペースト材は、前記ペースト材中に25重量%から35重量%のTiH2を有することを特徴とする請求項3または請求項4に記載のセラミックス−金属の接合体の製造方法。
- 前記ろう付け工程において、減圧雰囲気は、10−1Pa以下であり、前記ペースト材と前記金属材とを800℃から850℃の温度範囲内で加熱処理することを特徴とする請求項3ないし請求項6のいずれか1項に記載のセラミックス−金属の接合体の製造方法。
- 前記ろう付け工程において、前記ろう材中に、前記活性金属と前記金属部材のNiとの金属間化合物を介して、前記セラミックス部材側と前記金属部材とをろう付けすることを特徴とする請求項3ないし請求項7のいずれか1項に記載のセラミックス−金属の接合体の製造方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
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JP2013067098A JP6146707B2 (ja) | 2013-03-27 | 2013-03-27 | セラミックス−金属の接合体およびその製造方法 |
CN201480018140.XA CN105073685A (zh) | 2013-03-27 | 2014-03-20 | 陶瓷-金属接合结构体以及用于制造它的方法 |
DE112014002069.9T DE112014002069T5 (de) | 2013-03-27 | 2014-03-20 | Keramik-Metall-Bondstruktur und Verfahren zu deren Herstellung |
US14/780,517 US20160039031A1 (en) | 2013-03-27 | 2014-03-20 | Ceramic-metal bonding structure and process for producing same |
PCT/JP2014/001624 WO2014156093A1 (ja) | 2013-03-27 | 2014-03-20 | セラミックス-金属の接合体およびその製造方法 |
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JP2013067098A JP6146707B2 (ja) | 2013-03-27 | 2013-03-27 | セラミックス−金属の接合体およびその製造方法 |
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JP6146707B2 true JP6146707B2 (ja) | 2017-06-14 |
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JP (1) | JP6146707B2 (ja) |
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CN105070590A (zh) * | 2015-07-29 | 2015-11-18 | 常熟市银洋陶瓷器件有限公司 | 大容量直流继电器用金属化陶瓷管壳 |
SK288500B6 (sk) * | 2016-04-28 | 2017-10-03 | Slovenská Technická Univerzita V Bratislave | Mäkká aktívna spájka a jej použitie |
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EP0286335B2 (en) * | 1987-04-02 | 2001-10-17 | Kabushiki Kaisha Toshiba | Air-tight ceramic container |
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US5186380A (en) * | 1991-08-15 | 1993-02-16 | Handy & Harman | Titanium hydride coated brazing product |
KR100255027B1 (ko) * | 1995-05-17 | 2000-05-01 | 니시무로 타이죠 | 세라믹 금속접합재 및 이를 사용한 세라믹 금속접합체 제조방법 및 이를 이용하여 제작한 진공기밀용기 |
JP3892965B2 (ja) * | 1998-03-27 | 2007-03-14 | 日本碍子株式会社 | 接合体の製造方法および接合体 |
JP4021575B2 (ja) * | 1999-01-28 | 2007-12-12 | 日本碍子株式会社 | セラミックス部材と金属部材との接合体およびその製造方法 |
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2014
- 2014-03-20 WO PCT/JP2014/001624 patent/WO2014156093A1/ja active Application Filing
- 2014-03-20 CN CN201480018140.XA patent/CN105073685A/zh active Pending
- 2014-03-20 US US14/780,517 patent/US20160039031A1/en not_active Abandoned
- 2014-03-20 DE DE112014002069.9T patent/DE112014002069T5/de not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
CN105073685A (zh) | 2015-11-18 |
DE112014002069T5 (de) | 2015-12-31 |
US20160039031A1 (en) | 2016-02-11 |
WO2014156093A1 (ja) | 2014-10-02 |
JP2014189450A (ja) | 2014-10-06 |
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