CN104662198B - 导电性材料及其制造方法 - Google Patents

导电性材料及其制造方法 Download PDF

Info

Publication number
CN104662198B
CN104662198B CN201380049266.9A CN201380049266A CN104662198B CN 104662198 B CN104662198 B CN 104662198B CN 201380049266 A CN201380049266 A CN 201380049266A CN 104662198 B CN104662198 B CN 104662198B
Authority
CN
China
Prior art keywords
conductive layer
copper
base material
film
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201380049266.9A
Other languages
English (en)
Chinese (zh)
Other versions
CN104662198A (zh
Inventor
深泽宪正
梶井智代
佐野义之
关根信博
清冈隆
清冈隆一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DIC Corp
Original Assignee
Dainippon Ink and Chemicals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Ink and Chemicals Co Ltd filed Critical Dainippon Ink and Chemicals Co Ltd
Publication of CN104662198A publication Critical patent/CN104662198A/zh
Application granted granted Critical
Publication of CN104662198B publication Critical patent/CN104662198B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2026—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by radiant energy
    • C23C18/2033—Heat
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)
CN201380049266.9A 2012-09-20 2013-09-11 导电性材料及其制造方法 Active CN104662198B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012206999 2012-09-20
JP2012-206999 2012-09-20
PCT/JP2013/074550 WO2014045972A1 (ja) 2012-09-20 2013-09-11 導電性材料及びその製造方法

Publications (2)

Publication Number Publication Date
CN104662198A CN104662198A (zh) 2015-05-27
CN104662198B true CN104662198B (zh) 2017-06-13

Family

ID=50341286

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201380049266.9A Active CN104662198B (zh) 2012-09-20 2013-09-11 导电性材料及其制造方法

Country Status (5)

Country Link
JP (1) JP5594449B2 (ja)
KR (1) KR102027193B1 (ja)
CN (1) CN104662198B (ja)
TW (1) TWI577556B (ja)
WO (1) WO2014045972A1 (ja)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6327442B2 (ja) * 2013-03-07 2018-05-23 Dic株式会社 導電性材料の製造方法及び導電性材料
JP6327443B2 (ja) * 2013-03-19 2018-05-23 Dic株式会社 導電性材料の製造方法及び導電性材料
JP6432761B2 (ja) * 2014-06-25 2018-12-05 Dic株式会社 積層体、導電性パターン、電子回路及び積層体の製造方法
JP6460383B2 (ja) * 2014-12-11 2019-01-30 Dic株式会社 導電性積層体及びその製造方法
JP6400503B2 (ja) * 2015-02-19 2018-10-03 住友電工プリントサーキット株式会社 プリント配線板用基材及びプリント配線板
WO2016208006A1 (ja) 2015-06-24 2016-12-29 株式会社メイコー 立体配線基板の製造方法、立体配線基板、立体配線基板用基材
CN106544655B (zh) * 2016-10-13 2019-10-08 上海交通大学 一种聚酰亚胺表面图形化导电银薄膜的制备方法
WO2018207628A1 (ja) * 2017-05-08 2018-11-15 日本化学工業株式会社 被覆粒子及びその製造方法
JP2019014188A (ja) * 2017-07-10 2019-01-31 Dic株式会社 積層体、それを用いたプリント配線板、フレキシブルプリント配線板及び成形品
JP7000269B2 (ja) * 2017-07-27 2022-02-10 Tdk株式会社 シート材、メタルメッシュ、及びそれらの製造方法
JP2019075457A (ja) * 2017-10-16 2019-05-16 住友電気工業株式会社 プリント配線板用基材及びプリント配線板
CN108624907A (zh) * 2018-04-26 2018-10-09 复旦大学 非金属基体高效催化电极及其制备方法
KR20210023828A (ko) 2018-06-26 2021-03-04 디아이씨 가부시끼가이샤 프린트 배선판의 제조 방법
KR20210022548A (ko) 2018-06-26 2021-03-03 디아이씨 가부시끼가이샤 프린트 배선판의 제조 방법
US11311934B2 (en) * 2018-07-10 2022-04-26 Nippon Chemical Industrial Co., Ltd. Covered particle
KR102530672B1 (ko) * 2018-07-20 2023-05-08 엘지디스플레이 주식회사 스트레쳐블 표시 장치
TW202035793A (zh) * 2018-12-21 2020-10-01 日商Ｄｉｃ股份有限公司 印刷配線板之製造方法
CN111254423B (zh) * 2020-03-26 2021-12-07 上海大学 一种芳香族聚酰胺纤维电镀银的方法及应用
WO2022019069A1 (ja) * 2020-07-20 2022-01-27 株式会社クラレ 金属粒子組成物、金属粒子組成物の製造方法、及び、ペースト
CN114773989A (zh) * 2022-03-14 2022-07-22 苏州瑞港环保科技有限公司 一种防银胶扩散剂、其制备方法及应用

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1786268A (zh) * 2005-12-15 2006-06-14 复旦大学 一种非金属材料表面自组装化学镀银方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6468478A (en) 1987-09-07 1989-03-14 Agency Ind Science Techn Metal plating method using silver hydrosol
JPH0953196A (ja) * 1995-08-15 1997-02-25 Nikkoshi Prod Kk 電極材料と、その製造方法
JP3570802B2 (ja) 1995-11-14 2004-09-29 三井化学株式会社 銅薄膜基板及びプリント配線板
JPH1030188A (ja) 1996-07-16 1998-02-03 Okuno Chem Ind Co Ltd 無電解めっき用触媒液
JP4684632B2 (ja) 2003-11-27 2011-05-18 富士フイルム株式会社 金属パターン形成方法、金属パターン及びプリント配線板
JP2006305914A (ja) 2005-04-28 2006-11-09 Asahi Kasei Corp 積層基板の製造方法
JP2006342380A (ja) * 2005-06-07 2006-12-21 Morimura Chemicals Ltd 複合金属コロイド粒子、複合金属コロイド粒子被覆体、混合金属コロイド粒子分散液、導電膜の形成方法
WO2010029635A1 (ja) * 2008-09-11 2010-03-18 パイオニア株式会社 金属配線の形成方法、及び金属配線を備えた電子部品
JP2010196137A (ja) * 2009-02-26 2010-09-09 Osaka Prefecture Univ ポリイミド樹脂基材の無電解めっき方法、その方法で無電解めっきされたポリイミド樹脂基材、分散液および分散液の製造方法
JP2010272837A (ja) 2009-04-24 2010-12-02 Sumitomo Electric Ind Ltd プリント配線板用基板、プリント配線板、及びプリント配線板用基板の製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1786268A (zh) * 2005-12-15 2006-06-14 复旦大学 一种非金属材料表面自组装化学镀银方法

Also Published As

Publication number Publication date
TWI577556B (zh) 2017-04-11
JPWO2014045972A1 (ja) 2016-08-18
CN104662198A (zh) 2015-05-27
KR20150058097A (ko) 2015-05-28
WO2014045972A1 (ja) 2014-03-27
TW201420350A (zh) 2014-06-01
JP5594449B2 (ja) 2014-09-24
KR102027193B1 (ko) 2019-10-01

Similar Documents

Publication Publication Date Title
CN104662198B (zh) 导电性材料及其制造方法
CN102066024B (zh) 含银粉末及其制法、使用其的导电性糊剂和塑料基板
CN109790409B (zh) 铜油墨和由其制成的导电可焊接铜迹线
KR20160055891A (ko) 깊은 공융 용매에 의한 그래파이트의 박리
JP6327442B2 (ja) 導電性材料の製造方法及び導電性材料
JP6327443B2 (ja) 導電性材料の製造方法及び導電性材料
JP6204348B2 (ja) 分子インク由来の金属合金
CN106688314B (zh) 印刷线路板用基材、印刷线路板以及印刷线路板用基材的制造方法
KR20170094178A (ko) 은 페이스트 및 이것을 사용하여 얻어지는 도전성 성형 가공물
CN106488821A (zh) 金属微粒分散液和金属覆膜
JP5077728B1 (ja) 有機化合物と銀コア銅シェルナノ粒子との複合体及びその製造方法
CN105986253A (zh) 密合性优异的镀敷物及其制造方法
JP7241734B2 (ja) 銅インク
JP5521536B2 (ja) 金属製膜基板の製造方法及びフレキシブルプラスチック基板
KR102681330B1 (ko) 고전도성 미세한 인쇄를 위한 구리 잉크
WO2023171691A1 (ja) 導電性組成物及びその製造方法、導電性画像の記録方法、並びに導電性画像
JP2007301461A (ja) 金属コロイド溶液の製造方法及び金属コロイド溶液
JP2023133162A (ja) 導電性組成物及びその製造方法、導電性画像の記録方法、並びに導電性画像
TW201934681A (zh) 用於高傳導性精細印刷之銅油墨
CN118165579A (zh) 一种可梯度烧结的多金属前驱体无颗粒导电墨水、其制法与导电薄膜
JP2016027202A (ja) 繊維状銅微粒子分散液の製造方法
CN104350550A (zh) 含银组合物及形成银成分的基材

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
EXSB Decision made by sipo to initiate substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant