CN104282641B - 半导体装置 - Google Patents

半导体装置 Download PDF

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Publication number
CN104282641B
CN104282641B CN201410314663.0A CN201410314663A CN104282641B CN 104282641 B CN104282641 B CN 104282641B CN 201410314663 A CN201410314663 A CN 201410314663A CN 104282641 B CN104282641 B CN 104282641B
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CN
China
Prior art keywords
semiconductor element
insulating substrate
semiconductor device
metal pattern
metal
Prior art date
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Active
Application number
CN201410314663.0A
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English (en)
Chinese (zh)
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CN104282641A (zh
Inventor
新井规由
碓井修
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Publication of CN104282641A publication Critical patent/CN104282641A/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/778—Auxiliary members characterised by their shape in encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/20—Conductive package substrates serving as an interconnection, e.g. metal plates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H10W76/47—Solid or gel fillings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07651—Connecting or disconnecting of strap connectors characterised by changes in properties of the strap connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
CN201410314663.0A 2013-07-03 2014-07-03 半导体装置 Active CN104282641B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013139454A JP6120704B2 (ja) 2013-07-03 2013-07-03 半導体装置
JP2013-139454 2013-07-03

Publications (2)

Publication Number Publication Date
CN104282641A CN104282641A (zh) 2015-01-14
CN104282641B true CN104282641B (zh) 2018-03-16

Family

ID=52106507

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410314663.0A Active CN104282641B (zh) 2013-07-03 2014-07-03 半导体装置

Country Status (4)

Country Link
US (1) US9171773B2 (https=)
JP (1) JP6120704B2 (https=)
CN (1) CN104282641B (https=)
DE (1) DE102014212376B4 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107452688A (zh) * 2016-04-19 2017-12-08 三菱电机株式会社 半导体装置

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014147787A1 (ja) * 2013-03-21 2014-09-25 三菱電機株式会社 半導体装置
WO2016152258A1 (ja) * 2015-03-23 2016-09-29 株式会社日立製作所 半導体装置
CN107615463B (zh) * 2015-05-26 2020-05-05 三菱电机株式会社 半导体装置的制造方法
JP6493317B2 (ja) * 2016-06-23 2019-04-03 三菱電機株式会社 半導体装置
US9960098B2 (en) * 2016-06-27 2018-05-01 Psemi Corporation Systems and methods for thermal conduction using S-contacts
CN109643661B (zh) * 2016-08-05 2022-09-09 三菱电机株式会社 功率半导体装置
US11107756B2 (en) * 2017-04-06 2021-08-31 Mitsubishi Electric Corporation Semiconductor device and method for manufacturing the same, and power conversion device
CN107195623B (zh) * 2017-06-14 2023-10-27 扬州国扬电子有限公司 一种双面散热高可靠功率模块
JP6517442B1 (ja) * 2017-07-14 2019-05-22 新電元工業株式会社 電子モジュール
JP6858688B2 (ja) * 2017-10-24 2021-04-14 三菱電機株式会社 半導体装置
CN107946273A (zh) * 2017-12-22 2018-04-20 江苏宏微科技股份有限公司 一种插接功率模块封装装置
US10658386B2 (en) 2018-07-19 2020-05-19 Psemi Corporation Thermal extraction of single layer transfer integrated circuits
JP7038632B2 (ja) * 2018-09-12 2022-03-18 三菱電機株式会社 半導体装置、及び、半導体装置の製造方法
JP7516786B2 (ja) * 2019-06-21 2024-07-17 株式会社村田製作所 半導体装置及びその製造方法
JP7123271B2 (ja) * 2019-10-30 2022-08-22 三菱電機株式会社 気密封止型半導体装置
CN111211097B (zh) * 2020-02-17 2021-11-16 珠海格力电器股份有限公司 一种功率半导体器件的封装模块和封装方法
CN113496958B (zh) * 2020-03-20 2024-05-10 无锡华润微电子有限公司 基板及封装结构
JP7407684B2 (ja) * 2020-09-30 2024-01-04 三菱電機株式会社 半導体装置
DE112020007729T5 (de) * 2020-10-19 2023-08-10 Mitsubishi Electric Corporation Halbleitervorrichtung
US20240063073A1 (en) * 2021-03-25 2024-02-22 Mitsubishi Electric Corporation Semiconductor device and method of manufacturing semiconductor device
EP4362088A4 (en) * 2021-06-25 2024-09-25 Amosense Co.,Ltd POWER MODULE
US12218018B2 (en) * 2022-04-21 2025-02-04 Infineon Technologies Ag Semiconductor encapsulant strength enhancer
JP2026035927A (ja) * 2022-12-15 2026-03-05 ローム株式会社 半導体装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102810526A (zh) * 2011-05-31 2012-12-05 株式会社安川电机 功率变换装置、半导体装置及功率变换装置的制造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07161925A (ja) 1993-12-09 1995-06-23 Mitsubishi Electric Corp パワーモジュール
US6002171A (en) * 1997-09-22 1999-12-14 Lsi Logic Corporation Integrated heat spreader/stiffener assembly and method of assembly for semiconductor package
JP2000174180A (ja) 1998-12-02 2000-06-23 Shibafu Engineering Kk 半導体装置
US6219243B1 (en) * 1999-12-14 2001-04-17 Intel Corporation Heat spreader structures for enhanced heat removal from both sides of chip-on-flex packaged units
JP5048230B2 (ja) 2005-03-30 2012-10-17 オンセミコンダクター・トレーディング・リミテッド 半導体装置およびその製造方法
JP2007305962A (ja) * 2006-05-12 2007-11-22 Honda Motor Co Ltd パワー半導体モジュール
JP4973059B2 (ja) 2006-08-09 2012-07-11 日産自動車株式会社 半導体装置及び電力変換装置
JP5098392B2 (ja) * 2007-03-28 2012-12-12 株式会社豊田自動織機 半導体装置
US7944033B2 (en) * 2007-10-18 2011-05-17 Infineon Technologies Ag Power semiconductor module
JP4634497B2 (ja) * 2008-11-25 2011-02-16 三菱電機株式会社 電力用半導体モジュール
JPWO2011102561A1 (ja) 2010-02-22 2013-06-17 三洋電機株式会社 多層プリント配線基板およびその製造方法
DE102010046963A1 (de) 2010-09-29 2012-03-29 Infineon Technologies Ag Multi-Chip Package

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102810526A (zh) * 2011-05-31 2012-12-05 株式会社安川电机 功率变换装置、半导体装置及功率变换装置的制造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107452688A (zh) * 2016-04-19 2017-12-08 三菱电机株式会社 半导体装置

Also Published As

Publication number Publication date
DE102014212376B4 (de) 2019-03-07
US9171773B2 (en) 2015-10-27
US20150008570A1 (en) 2015-01-08
JP6120704B2 (ja) 2017-04-26
DE102014212376A1 (de) 2015-01-08
JP2015015270A (ja) 2015-01-22
CN104282641A (zh) 2015-01-14

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