CN104254911B - 芯片分类装置和芯片分类方法 - Google Patents

芯片分类装置和芯片分类方法 Download PDF

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Publication number
CN104254911B
CN104254911B CN201380021965.2A CN201380021965A CN104254911B CN 104254911 B CN104254911 B CN 104254911B CN 201380021965 A CN201380021965 A CN 201380021965A CN 104254911 B CN104254911 B CN 104254911B
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CN
China
Prior art keywords
classification
grade
chip
sheet
chips
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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CN201380021965.2A
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English (en)
Chinese (zh)
Other versions
CN104254911A (zh
Inventor
佐藤刚
内田练
五十殿宏二
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Sharp Corp
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Sharp Corp
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Publication of CN104254911A publication Critical patent/CN104254911A/zh
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Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN201380021965.2A 2012-04-27 2013-03-18 芯片分类装置和芯片分类方法 Expired - Fee Related CN104254911B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012103500 2012-04-27
JP2012-103500 2012-04-27
PCT/JP2013/001844 WO2013161173A1 (ja) 2012-04-27 2013-03-18 チップソーティング装置およびチップソーティング方法、制御プログラム、可読記憶媒体

Publications (2)

Publication Number Publication Date
CN104254911A CN104254911A (zh) 2014-12-31
CN104254911B true CN104254911B (zh) 2016-07-06

Family

ID=49482531

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201380021965.2A Expired - Fee Related CN104254911B (zh) 2012-04-27 2013-03-18 芯片分类装置和芯片分类方法

Country Status (4)

Country Link
JP (1) JP5941982B2 (ja)
CN (1) CN104254911B (ja)
TW (1) TWI601224B (ja)
WO (1) WO2013161173A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018163389A1 (ja) * 2017-03-09 2018-09-13 株式会社Ｆｕｊｉ ウエハ供給装置
CN110366772B (zh) * 2017-03-09 2023-06-23 株式会社富士 元件安装机
CN109830447B (zh) * 2019-01-17 2020-11-27 深圳赛意法微电子有限公司 半导体晶圆芯片分选方法、半导体产品的封装方法及系统
CN112612660B (zh) * 2020-12-16 2024-02-13 海光信息技术股份有限公司 规格信息数据库创建方法、芯片挑选方法及装置和系统
CN113387167B (zh) * 2021-06-18 2023-04-28 上海金东唐科技有限公司 激光芯片的处理方法、装置及电子设备

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01172536A (ja) * 1987-12-25 1989-07-07 Daihatsu Motor Co Ltd 断熱、耐熱性セラミックス多孔体複合金属材料
JPH04343485A (ja) * 1991-05-21 1992-11-30 Dowa Mining Co Ltd 半導体ペレット選別装置
JPH0936203A (ja) * 1995-07-20 1997-02-07 Canon Inc 移動体装置及びその制御方法
JPH10144741A (ja) * 1996-11-07 1998-05-29 Rohm Co Ltd Ｉｃチップの性能分類方法および装置
JP3605009B2 (ja) * 2000-08-03 2004-12-22 三洋電機株式会社 半導体装置の製造方法
AT6405U1 (de) * 2002-06-05 2003-10-27 Card Casinos Austria Res & Dev Chipsortiervorrichtung
TW200848722A (en) * 2007-06-15 2008-12-16 King Yuan Electronics Co Ltd Automatic optical inspection device
JP4931710B2 (ja) * 2007-06-29 2012-05-16 株式会社リコー ウエハにおける良品チップ分類方法、それを用いたチップ品質判定方法、ならびにチップ分類プログラム、チップ品質判定プログラム、マーキング機構及び半導体装置の製造方法

Also Published As

Publication number Publication date
WO2013161173A1 (ja) 2013-10-31
CN104254911A (zh) 2014-12-31
JPWO2013161173A1 (ja) 2015-12-21
JP5941982B2 (ja) 2016-06-29
TWI601224B (zh) 2017-10-01
TW201351539A (zh) 2013-12-16

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Granted publication date: 20160706

Termination date: 20210318

CF01 Termination of patent right due to non-payment of annual fee