CN104254198A - 布线基板 - Google Patents
布线基板 Download PDFInfo
- Publication number
- CN104254198A CN104254198A CN201410294997.6A CN201410294997A CN104254198A CN 104254198 A CN104254198 A CN 104254198A CN 201410294997 A CN201410294997 A CN 201410294997A CN 104254198 A CN104254198 A CN 104254198A
- Authority
- CN
- China
- Prior art keywords
- layer
- film resistor
- circuit board
- resistor layer
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
- H05K1/113—Via provided in pad; Pad over filled via
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
- H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49822—Multilayer substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/13099—Material
- H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8119—Arrangement of the bump connectors prior to mounting
- H01L2224/81193—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0317—Thin film conductor layer; Thin film passive component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer, layered thin film adhesion layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Electromagnetism (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Claims (9)
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013-135844 | 2013-06-28 | ||
JP2013135843A JP2015012111A (ja) | 2013-06-28 | 2013-06-28 | 配線基板 |
JP2013135844A JP2015012112A (ja) | 2013-06-28 | 2013-06-28 | 配線基板 |
JP2013-135843 | 2013-06-28 | ||
JP2013-158706 | 2013-07-31 | ||
JP2013158706A JP2015032594A (ja) | 2013-07-31 | 2013-07-31 | 配線基板 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN104254198A true CN104254198A (zh) | 2014-12-31 |
Family
ID=52114498
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410294997.6A Pending CN104254198A (zh) | 2013-06-28 | 2014-06-26 | 布线基板 |
Country Status (4)
Country | Link |
---|---|
US (1) | US9295154B2 (zh) |
KR (1) | KR20150002492A (zh) |
CN (1) | CN104254198A (zh) |
TW (1) | TW201519715A (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104576587A (zh) * | 2015-01-22 | 2015-04-29 | 中国电子科技集团公司第四十三研究所 | 一种封装用凸点结构 |
CN112687653A (zh) * | 2020-12-01 | 2021-04-20 | 贵州振华风光半导体有限公司 | 一种用于集成电路封装的高速模数转换器有机基板 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9521752B2 (en) * | 2014-09-19 | 2016-12-13 | Harris Corporation | Method of making an electronic device having a thin film resistor formed on an LCP solder mask and related devices |
JP6462360B2 (ja) * | 2014-12-27 | 2019-01-30 | 京セラ株式会社 | 配線基板 |
US10483182B2 (en) | 2016-05-24 | 2019-11-19 | Noda Screen Co., Ltd. | Intermediate connector, semiconductor device including intermediate connector, and method of manufacturing intermediate connector |
US10276465B2 (en) | 2016-09-29 | 2019-04-30 | Mediatek Inc. | Semiconductor package assembly |
JP7097964B2 (ja) | 2018-06-26 | 2022-07-08 | 京セラ株式会社 | 配線基板 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5912507A (en) * | 1998-02-04 | 1999-06-15 | Motorola, Inc. | Solderable pad with integral series termination resistor |
JP2001168484A (ja) * | 1999-12-06 | 2001-06-22 | Nippon Telegr & Teleph Corp <Ntt> | 配線構体及びその形成法 |
CN1430272A (zh) * | 2001-12-26 | 2003-07-16 | 株式会社日立制作所 | 半导体装置及其制造方法 |
CN101668880A (zh) * | 2007-04-27 | 2010-03-10 | 日立化成工业株式会社 | 连接端子、使用了连接端子的半导体封装件及半导体封装件的制造方法 |
CN102111951A (zh) * | 2009-12-28 | 2011-06-29 | 日本特殊陶业株式会社 | 多层布线基板 |
JP2013045938A (ja) * | 2011-08-25 | 2013-03-04 | Kyocer Slc Technologies Corp | 配線基板 |
US20130075145A1 (en) * | 2011-09-27 | 2013-03-28 | Shinko Electric Industries Co., Ltd. | Wiring substrate and method of manufacturing the same |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003023250A (ja) * | 2001-07-06 | 2003-01-24 | Denso Corp | 多層基板のおよびその製造方法 |
-
2014
- 2014-06-25 KR KR20140077879A patent/KR20150002492A/ko not_active Application Discontinuation
- 2014-06-26 CN CN201410294997.6A patent/CN104254198A/zh active Pending
- 2014-06-27 TW TW103122225A patent/TW201519715A/zh unknown
- 2014-06-27 US US14/317,657 patent/US9295154B2/en not_active Expired - Fee Related
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5912507A (en) * | 1998-02-04 | 1999-06-15 | Motorola, Inc. | Solderable pad with integral series termination resistor |
JP2001168484A (ja) * | 1999-12-06 | 2001-06-22 | Nippon Telegr & Teleph Corp <Ntt> | 配線構体及びその形成法 |
CN1430272A (zh) * | 2001-12-26 | 2003-07-16 | 株式会社日立制作所 | 半导体装置及其制造方法 |
CN101668880A (zh) * | 2007-04-27 | 2010-03-10 | 日立化成工业株式会社 | 连接端子、使用了连接端子的半导体封装件及半导体封装件的制造方法 |
CN102111951A (zh) * | 2009-12-28 | 2011-06-29 | 日本特殊陶业株式会社 | 多层布线基板 |
JP2013045938A (ja) * | 2011-08-25 | 2013-03-04 | Kyocer Slc Technologies Corp | 配線基板 |
US20130075145A1 (en) * | 2011-09-27 | 2013-03-28 | Shinko Electric Industries Co., Ltd. | Wiring substrate and method of manufacturing the same |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104576587A (zh) * | 2015-01-22 | 2015-04-29 | 中国电子科技集团公司第四十三研究所 | 一种封装用凸点结构 |
CN112687653A (zh) * | 2020-12-01 | 2021-04-20 | 贵州振华风光半导体有限公司 | 一种用于集成电路封装的高速模数转换器有机基板 |
Also Published As
Publication number | Publication date |
---|---|
US9295154B2 (en) | 2016-03-22 |
TW201519715A (zh) | 2015-05-16 |
US20150000965A1 (en) | 2015-01-01 |
KR20150002492A (ko) | 2015-01-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
ASS | Succession or assignment of patent right |
Owner name: KYOCERA CIRCUIT SOLUTIONS, INC. Free format text: FORMER OWNER: KYOCERA SLC TECHNOLOGIES CORP. Effective date: 20150730 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20150730 Address after: Kyoto Prefecture Applicant after: Circuit science and technology Co., Ltd. of KYOCERA Address before: Shiga Applicant before: Kyocera SLC Technologies Corporation |
|
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20160601 Address after: Kyoto Japan Applicant after: KYOCERA Corporation Address before: Kyoto Prefecture Applicant before: Circuit science and technology Co., Ltd. of KYOCERA |
|
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20141231 |
|
WD01 | Invention patent application deemed withdrawn after publication |