CN104216222A - 感光性树脂组合物和电子装置 - Google Patents

感光性树脂组合物和电子装置 Download PDF

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Publication number
CN104216222A
CN104216222A CN201410230856.8A CN201410230856A CN104216222A CN 104216222 A CN104216222 A CN 104216222A CN 201410230856 A CN201410230856 A CN 201410230856A CN 104216222 A CN104216222 A CN 104216222A
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CN
China
Prior art keywords
formula
photosensitive polymer
polymer combination
polymkeric substance
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201410230856.8A
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English (en)
Chinese (zh)
Inventor
池田阳雄
大西治
今村裕治
田头宣雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Publication of CN104216222A publication Critical patent/CN104216222A/zh
Pending legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D241/00—Heterocyclic compounds containing 1,4-diazine or hydrogenated 1,4-diazine rings
    • C07D241/36—Heterocyclic compounds containing 1,4-diazine or hydrogenated 1,4-diazine rings condensed with carbocyclic rings or ring systems
    • C07D241/38—Heterocyclic compounds containing 1,4-diazine or hydrogenated 1,4-diazine rings condensed with carbocyclic rings or ring systems with only hydrogen or carbon atoms directly attached to the ring nitrogen atoms
    • C07D241/40—Benzopyrazines
    • C07D241/42—Benzopyrazines with only hydrogen atoms, hydrocarbon or substituted hydrocarbon radicals, directly attached to carbon atoms of the hetero ring
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/0226—Quinonediazides characterised by the non-macromolecular additives
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials For Photolithography (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
CN201410230856.8A 2013-05-29 2014-05-28 感光性树脂组合物和电子装置 Pending CN104216222A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013-113411 2013-05-29
JP2013113411A JP6065750B2 (ja) 2013-05-29 2013-05-29 感光性樹脂組成物および電子装置

Publications (1)

Publication Number Publication Date
CN104216222A true CN104216222A (zh) 2014-12-17

Family

ID=52097871

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410230856.8A Pending CN104216222A (zh) 2013-05-29 2014-05-28 感光性树脂组合物和电子装置

Country Status (4)

Country Link
JP (1) JP6065750B2 (ko)
KR (1) KR102262620B1 (ko)
CN (1) CN104216222A (ko)
TW (1) TWI597571B (ko)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106103512A (zh) * 2014-03-20 2016-11-09 住友电木株式会社 聚合物、感光性树脂组合物和电子装置
CN107531824A (zh) * 2015-04-30 2018-01-02 住友电木株式会社 聚合物的制造方法、感光性树脂组合物和电子装置
CN107922708A (zh) * 2015-08-21 2018-04-17 住友电木株式会社 树脂组合物、感光性树脂组合物、树脂膜和电子装置
CN110178085A (zh) * 2017-01-10 2019-08-27 住友电木株式会社 负型感光性树脂组合物、树脂膜和电子装置
CN113840849A (zh) * 2019-06-28 2021-12-24 日本瑞翁株式会社 树脂组合物、电子部件及树脂膜的制造方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10254648B2 (en) * 2013-08-27 2019-04-09 Zeon Corportion Radiation-sensitive resin composition, resin film, and electronic device
JP6710903B2 (ja) * 2015-06-25 2020-06-17 住友ベークライト株式会社 感光性樹脂組成物
JP2019095581A (ja) * 2017-11-22 2019-06-20 住友ベークライト株式会社 感光性樹脂組成物、感光性樹脂組成物溶液および電子装置

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JP2000089463A (ja) * 1998-09-11 2000-03-31 Fuji Photo Film Co Ltd ポジ型レジスト組成物
US20040224525A1 (en) * 2003-05-09 2004-11-11 Matsushita Electric Industrial Co., Ltd. Pattern formation method
JP2005017332A (ja) * 2003-06-23 2005-01-20 Matsushita Electric Ind Co Ltd パターン形成方法
JP2008256735A (ja) * 2007-03-30 2008-10-23 Fujifilm Corp 感光性組成物、感光性転写材料、表示装置用遮光膜及びその形成方法、遮光膜付基板、表示装置、並びにパターン欠け防止方法
JP2008275912A (ja) * 2007-04-27 2008-11-13 Fujifilm Corp 着色光重合性組成物並びにそれを用いたカラーフィルタ及びカラーフィルタの製造方法
JP2010224533A (ja) * 2009-02-26 2010-10-07 Nippon Zeon Co Ltd 感放射線性樹脂組成物、樹脂膜及び電子部品

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JP3822160B2 (ja) * 1997-08-05 2006-09-13 株式会社ルネサステクノロジ 半導体装置の製造方法
KR100557608B1 (ko) * 1999-02-10 2006-03-10 주식회사 하이닉스반도체 신규의 포토레지스트 가교제 및 이를 이용한 포토레지스트 조성물
WO2003029898A1 (fr) * 2001-09-27 2003-04-10 Clariant International Ltd. Composition de resine photosensible
JP2004190008A (ja) * 2002-11-08 2004-07-08 Toray Ind Inc 樹脂組成物とそれを用いた絶縁膜、半導体装置及び有機電界発光素子
JP4084710B2 (ja) * 2003-06-12 2008-04-30 松下電器産業株式会社 パターン形成方法
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KR101378692B1 (ko) * 2006-08-29 2014-03-27 제이에스알 가부시끼가이샤 감광성 절연 수지 조성물 및 그의 경화물 및 이를 구비하는회로 기판
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US7759048B2 (en) * 2007-07-09 2010-07-20 Tokyo Ohka Kogyo Co., Ltd. Photosensitive resin composition and microlens formed with use thereof
JP2011064869A (ja) * 2009-09-16 2011-03-31 Fujifilm Corp 感光性樹脂組成物、硬化膜の形成方法、硬化膜、有機ｅｌ表示装置、及び、液晶表示装置
JP5526693B2 (ja) * 2009-10-09 2014-06-18 日油株式会社 感光性樹脂組成物およびその用途
JP5425031B2 (ja) * 2009-10-16 2014-02-26 富士フイルム株式会社 感光性樹脂組成物、硬化膜の形成方法、硬化膜、有機ｅｌ表示装置、及び、液晶表示装置
JP5333581B2 (ja) * 2010-02-25 2013-11-06 日立化成株式会社 ネガ型感光性樹脂組成物、層間絶縁膜及びその形成方法
WO2011129182A1 (ja) * 2010-04-13 2011-10-20 昭和電工株式会社 付加共重合体、感光性樹脂組成物及びカラーフィルター

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000089463A (ja) * 1998-09-11 2000-03-31 Fuji Photo Film Co Ltd ポジ型レジスト組成物
US20040224525A1 (en) * 2003-05-09 2004-11-11 Matsushita Electric Industrial Co., Ltd. Pattern formation method
JP2005017332A (ja) * 2003-06-23 2005-01-20 Matsushita Electric Ind Co Ltd パターン形成方法
JP2008256735A (ja) * 2007-03-30 2008-10-23 Fujifilm Corp 感光性組成物、感光性転写材料、表示装置用遮光膜及びその形成方法、遮光膜付基板、表示装置、並びにパターン欠け防止方法
JP2008275912A (ja) * 2007-04-27 2008-11-13 Fujifilm Corp 着色光重合性組成物並びにそれを用いたカラーフィルタ及びカラーフィルタの製造方法
JP2010224533A (ja) * 2009-02-26 2010-10-07 Nippon Zeon Co Ltd 感放射線性樹脂組成物、樹脂膜及び電子部品

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106103512A (zh) * 2014-03-20 2016-11-09 住友电木株式会社 聚合物、感光性树脂组合物和电子装置
CN107531824A (zh) * 2015-04-30 2018-01-02 住友电木株式会社 聚合物的制造方法、感光性树脂组合物和电子装置
CN107531824B (zh) * 2015-04-30 2020-11-17 住友电木株式会社 聚合物的制造方法、感光性树脂组合物和电子装置
CN107922708A (zh) * 2015-08-21 2018-04-17 住友电木株式会社 树脂组合物、感光性树脂组合物、树脂膜和电子装置
CN110178085A (zh) * 2017-01-10 2019-08-27 住友电木株式会社 负型感光性树脂组合物、树脂膜和电子装置
CN110178085B (zh) * 2017-01-10 2022-10-21 住友电木株式会社 负型感光性树脂组合物、树脂膜和电子装置
CN113840849A (zh) * 2019-06-28 2021-12-24 日本瑞翁株式会社 树脂组合物、电子部件及树脂膜的制造方法
CN113840849B (zh) * 2019-06-28 2023-03-28 日本瑞翁株式会社 树脂组合物、电子部件及树脂膜的制造方法

Also Published As

Publication number Publication date
JP2014232233A (ja) 2014-12-11
TWI597571B (zh) 2017-09-01
KR102262620B1 (ko) 2021-06-08
KR20140140488A (ko) 2014-12-09
JP6065750B2 (ja) 2017-01-25
TW201510642A (zh) 2015-03-16

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