CN104112650A - 板状物粘贴方法 - Google Patents

板状物粘贴方法 Download PDF

Info

Publication number
CN104112650A
CN104112650A CN201410151217.2A CN201410151217A CN104112650A CN 104112650 A CN104112650 A CN 104112650A CN 201410151217 A CN201410151217 A CN 201410151217A CN 104112650 A CN104112650 A CN 104112650A
Authority
CN
China
Prior art keywords
bonding agent
sheet material
plate object
wafer
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201410151217.2A
Other languages
English (en)
Chinese (zh)
Inventor
小野贵司
小野寺宽
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of CN104112650A publication Critical patent/CN104112650A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0007—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
    • B32B37/003—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality to avoid air inclusion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Quality & Reliability (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN201410151217.2A 2013-04-18 2014-04-14 板状物粘贴方法 Pending CN104112650A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013087145A JP6149223B2 (ja) 2013-04-18 2013-04-18 板状物の貼着方法
JP2013-087145 2013-04-18

Publications (1)

Publication Number Publication Date
CN104112650A true CN104112650A (zh) 2014-10-22

Family

ID=51709394

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410151217.2A Pending CN104112650A (zh) 2013-04-18 2014-04-14 板状物粘贴方法

Country Status (4)

Country Link
JP (1) JP6149223B2 (ko)
KR (1) KR102144137B1 (ko)
CN (1) CN104112650A (ko)
TW (1) TWI601643B (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7339768B2 (ja) * 2019-05-10 2023-09-06 株式会社ディスコ 保護部材形成装置
JP7339771B2 (ja) * 2019-05-17 2023-09-06 株式会社ディスコ 保護部材形成装置
JP7286250B2 (ja) * 2019-08-07 2023-06-05 株式会社ディスコ 保護部材形成装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011119578A (ja) * 2009-12-07 2011-06-16 Disco Abrasive Syst Ltd 貼着装置
CN102334182A (zh) * 2009-02-27 2012-01-25 索尼化学&信息部件株式会社 半导体装置的制造方法
EP2416633A1 (de) * 2010-08-04 2012-02-08 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Verfahren ur Festlegung und/oder Einbettung eines elektronischen Bauteils sowie Kleber zur Verwendung in einem derartigen Verfahren

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11307585A (ja) * 1998-04-22 1999-11-05 Sony Corp 半導体装置
JP2002203828A (ja) * 2000-12-28 2002-07-19 Lintec Corp ウエハの裏面研削方法
JP2004247611A (ja) * 2003-02-14 2004-09-02 Matsushita Electric Works Ltd 半導体素子実装基板、半導体素子実装基板の製造方法
JP5089370B2 (ja) 2007-12-21 2012-12-05 株式会社ディスコ 樹脂被覆方法および装置
JP2010062269A (ja) * 2008-09-02 2010-03-18 Three M Innovative Properties Co ウェーハ積層体の製造方法、ウェーハ積層体製造装置、ウェーハ積層体、支持層剥離方法、及びウェーハの製造方法
JP5324212B2 (ja) * 2008-12-26 2013-10-23 株式会社ディスコ 樹脂被覆方法および樹脂被覆装置
JP2011216763A (ja) * 2010-04-01 2011-10-27 Disco Corp ウェーハの加工方法
JP5524716B2 (ja) * 2010-05-28 2014-06-18 株式会社ディスコ ウェーハの平坦加工方法
JP5882577B2 (ja) * 2010-12-06 2016-03-09 スリーエム イノベイティブ プロパティズ カンパニー フィルム貼付方法、裏面研削方法、半導体チップ作製方法及びフィルム貼付装置
JP5670208B2 (ja) * 2011-01-13 2015-02-18 株式会社ディスコ 樹脂塗布装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102334182A (zh) * 2009-02-27 2012-01-25 索尼化学&信息部件株式会社 半导体装置的制造方法
JP2011119578A (ja) * 2009-12-07 2011-06-16 Disco Abrasive Syst Ltd 貼着装置
EP2416633A1 (de) * 2010-08-04 2012-02-08 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Verfahren ur Festlegung und/oder Einbettung eines elektronischen Bauteils sowie Kleber zur Verwendung in einem derartigen Verfahren

Also Published As

Publication number Publication date
KR102144137B1 (ko) 2020-08-12
KR20140125296A (ko) 2014-10-28
JP6149223B2 (ja) 2017-06-21
TWI601643B (zh) 2017-10-11
JP2014212188A (ja) 2014-11-13
TW201446532A (zh) 2014-12-16

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Application publication date: 20141022

RJ01 Rejection of invention patent application after publication