CN104112650A - Adhesion method of plate-like objects - Google Patents
Adhesion method of plate-like objects Download PDFInfo
- Publication number
- CN104112650A CN104112650A CN201410151217.2A CN201410151217A CN104112650A CN 104112650 A CN104112650 A CN 104112650A CN 201410151217 A CN201410151217 A CN 201410151217A CN 104112650 A CN104112650 A CN 104112650A
- Authority
- CN
- China
- Prior art keywords
- bonding agent
- sheet material
- plate object
- wafer
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/0007—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
- B32B37/003—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality to avoid air inclusion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Quality & Reliability (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides an adhesion method of plate-like objects which prevents generation of bubbles between an adhesive and a plate-like object. The adhesion method of plate-like objects makes the plate-like object adhere to a sheet and comprises an adhesive supply step in which the adhesive is supplied to one point of the sheet to form an adhesive peak and a bonding step in which the plate-like object is made to move relative to the sheet on the condition that the bonded face of the plate-like object is opposite to the sheet after the adhesive supply step, and thus, the adhesive peak is spread through the plate-like object from the tiptop of the adhesive peak and the plate-like object adheres to the sheet across the adhesive.
Description
Technical field
The present invention relates to the plate objects such as wafer to stick on the plate object method of attaching on sheet material.
Background technology
About being formed with a large amount of devices such as IC, LSI on surface and being divided into the semiconductor wafer of each device by cutting apart preset lines (spacing track), the back side being carried out by grinding attachment after grinding is processed as the thickness of regulation, cut and be divided into each device cutting apart preset lines by topping machanism (cutter sweep), the device after cutting apart is extensively used in the various electric equipments such as portable phone, PC.
(following to semiconductor wafer, sometimes referred to as wafer) the back side grinding attachment that carries out grinding have keep wafer chuck table, be equipped with the grinding unit of Grinding wheel in the mode that can rotate, this Grinding wheel has the grinding stone that the wafer to remaining on this chuck table carries out grinding, the thickness that this grinding attachment can become to expect by grinding wafer accurately.
In the time that grinding is carried out in the back side of semiconductor wafer; owing to must utilizing chuck table to carry out attracting holding to the face side of the wafer that is formed with multiple devices; therefore for protection device, be pasted with the boundary belt that arranges the adhesive linkage of propylene system on a surface of the base materials such as polyethylene, vinyl chloride, polyolefin and form on the surface of semiconductor wafer.
In the grinding of the back side of wafer; the maintenance that utilizes chuck table is carried out attracting holding in the face of the boundary belt side that is pasted with this boundary belt on surface; the back side of wafer is carried out grinding and made wafer thinning is uniform thickness; but because the thickness of the adhesive linkage of boundary belt exists deviation, be therefore not easy grinding wafer to become uniform thickness.Particularly, the bore of wafer is larger, and the thickness deviation producing on the adhesive linkage of boundary belt is larger, is therefore difficult to grinding wafer to become uniform thickness.
On the other hand, the wafer that uses scroll saw etc. to cut out from blank (ingot) has warpage and fluctuating.This wafer is carried out making by grinding to the processing of its planarization.Disclose following method and apparatus: in the time of the grinding of this wafer, application of resin on a surface, by making hardening of resin make this face side become tabular surface, keep afterwards this tabular surface side, make grinding stone and another Surface Contact and carry out grinding, remove thus fluctuating and the warpage (with reference to TOHKEMY 2009-148866 communique) of wafer.
In the resin-coated device of recording at the disclosure communique, on supporting station, arrange thin slice, so that the ultraviolet hardening resin playing a role as bonding agent is not bonding with the supporting station of supporting ultraviolet hardening resin, on a surface of thin slice and wafer application of resin and make its sclerosis, make a face side become tabular surface.
This utilization is pressed (press) etc. the face side of wafer is pressed to and replaces boundary belt and be coated on the aqueous resin on sheet material and make aqueous resin become the method that makes its sclerosis after uniform thickness; the protected location that the surface of the wafer using during as back side grinding to wafer is protected is effective; if particularly the bore of wafer increases, its value increases.
Patent documentation 1: TOHKEMY 2009-148866 communique
In the disclosed resin-coated method of patent documentation 1, while stickup on wafer being pressed into the sheet material of upper surface supply bonding agent, when sneak into bubble between bonding agent and wafer time, sneak into alveolate part and cannot support by bonding agent partly, therefore exist and in following process, cause dysgenic problem.
Particularly, for example, owing to sneaking into bubble, in the time of grinding, cannot carry out attracting holding fully fixing to wafer, sometimes be created in grinding wafer and the problem such as peel off from bonding agent.
Summary of the invention
The present invention completes in view of the above-mentioned problems, and its object is, the plate object method of attaching that is difficult to sneak into bubble between bonding agent and plate object is provided.
According to the present invention, provide a kind of plate object is sticked on to the plate object method of attaching on sheet material, this plate object method of attaching is characterised in that, comprising: bonding agent supplying step, to the some supply bonding agent on sheet material, forms the peak of bonding agent; And stickup step, after implementing this bonding agent supplying step, under the face that is stuck that the makes plate object state relative with this sheet material, plate object is relatively moved for this sheet material, by plate object, the peak of this bonding agent is spread out from the vertex at the peak of this bonding agent, on this sheet material, paste plate object across this bonding agent.
Preferably, the viscosity of bonding agent is set to, and bonding agent forms the peak of hemispheric bonding agent while being supplied on sheet material in bonding agent supplying step.Preferably, bonding agent is made up of the ultraviolet hardening resin hardening by irradiation ultraviolet radiation, sheet material transmitting UV, and plate object method of attaching of the present invention also comprises following cure step: after implementing to paste step, to bonding agent irradiation ultraviolet radiation, make adhesive hardens across sheet material.
According to plate object method of attaching of the present invention, some supply bonding agent on sheet material is formed to the peak of bonding agent, then, plate object relatively moved for sheet material and by plate object, the peak of bonding agent is spread out from the vertex at the peak of bonding agent, thereby on sheet material, pasting plate object across bonding agent.
At plate object roughly to put after the mode of contact contacts with bonding agent, bonding agent is spread out and plate object is sticked on sheet material by plate object, therefore owing to preventing that air from entering between bonding agent and plate object, thereby be difficult to sneak into bubble between bonding agent and plate object.
Brief description of the drawings
Fig. 1 is the end view that bonding agent supplying step is shown.
Fig. 2 is the face side stereogram of semiconductor wafer.
Fig. 3 illustrates the partial cut away side views of pasting step.
Fig. 4 is the partial cut away side views that adhesive hardens step is shown.
Label declaration
10: sheet material; 11: semiconductor wafer; 16: supporting station; 18: bonding agent; 20: press device; 22: keep platform; 24: attracting holding portion; 28: attraction source; 30: ultra-violet lamp.
Embodiment
Below, with reference to accompanying drawing, embodiments of the present invention are elaborated.With reference to Fig. 1, the end view that represents bonding agent supplying step is shown.First, on the bearing-surface 16a of the supporting station 16 being formed by transparent components such as glass, load sheet material 10, on sheet material 10 a bit, be preferably sheet material 10 core a bit supply with bonding agent 18, on sheet material 10, form the peak of bonding agent 18.Preferably the peak of bonding agent 18 bulges into hemispherical.
Like this, in order to form the hemispheric peak of bonding agent 18, preferably the viscosity of bonding agent 18, for more than to a certain degree, is suitably set viscosity according to the kind of bonding agent 18.For example, in the situation that to adopt epoxy be resin as bonding agent 18, preferably its viscosity is more than 15Pas.
Here, in order suitably to form the peak of bonding agent 18, sheet material 10 is key factors for the wetability of bonding agent 18, and preferably the surface of sheet material 10 has the low character of degree to flicking bonding agent 18 of wetability.
For example, in the time forming sheet material 10 by polystyrene, can give this character to the surface of sheet material 10.Or, in the time being become sheet material 10 by resin-shaped such as polyethylene, vinyl chloride, polyolefin and the surface of sheet material 10 is implemented fluor resin coating or implemented Corona discharge Treatment, can give wetability the low character of degree to flicking bonding agent 18 to the surface of sheet material 10.Preferably bonding agent 18 is made up of the ultraviolet hardening resin hardening by irradiation ultraviolet radiation, and preferably sheet material 10 is transparent for ultraviolet ray.
With reference to Fig. 2, the face side stereogram as a kind of semiconductor wafer (following, sometimes referred to as wafer) 11 of the plate object of stickup sheet material 10 is shown.At the surperficial 11a of semiconductor wafer 11, be clathrate and be formed with multiple preset lines (spacing track) 13 of cutting apart, and be formed with the device such as IC, LSI 15 by cutting apart on each region that preset lines 13 is divided.Semiconductor wafer 11 is for example made up of silicon wafer, and its thickness is approximately 700 μ m left and right.11b is the back side of wafer 11.
Then,, with reference to Fig. 3 and Fig. 4, the method for pasting the protection sheet material 32 being made up of the bond layer 18a hardening and sheet material 10 on the surperficial 11a of wafer 11 is described.With reference to Fig. 3 (A), press device 20 has the platform 22 of maintenance, and this maintenance platform 22 has the attracting holding portion 24 being formed by porous ceramic etc., and attracting holding portion 24 is optionally connected with attraction source 28 by electromagnetic switching valve 26.
As shown in Fig. 3 (A), utilize the maintenance platform 22 of press device 20 to carry out attracting holding to the back side 11b side of wafer 11, make to keep platform 22 to decline to arrow A direction, thereby as shown in Fig. 3 (B), the surperficial 11a of wafer 11 is contacted with 18 of hemispheric bonding agents.
From this state, while bonding agent 18 being pressed on sheet material 10 when making to keep the further slow decreasing of platform 22, bonding agent 18 extends equably in arrow B direction, and sheet material 10 sticks on the surperficial 11a upper (stickup step) of wafer 11 across the bonding agent 18 extending equably.
Under this state, as shown in Figure 4, light the ultra-violet lamp 30 of the below that is configured in the supporting station 16 being formed by transparent materials such as glass, through supporting station 16 with there is the sheet material 10 of the character of transmitting UV, to bonding agent 18 irradiation ultraviolet radiations that extend equably, bonding agent 18 is hardened, become the bond layer 18a with cementability.In the time making the maintenance platform 22 of press device 20 increase, can paste the protection sheet material 32 being formed by sheet material 10 and bond layer 18a at the surperficial 11a of wafer 11.
In the method for attaching of above-mentioned wafer, in bonding agent supplying step, some supply bonding agent 18 on sheet material 10 is formed to the peak of bonding agent, in stickup step, under the face that is stuck that makes wafer 11 state relative with sheet material 10, wafer 11 is relatively moved for sheet material 10, by wafer 11, the peak of bonding agent 18 is spread out from the vertex at the peak of bonding agent 18, on sheet material 10, paste bonding agent 18.
Thus, paste at the surperficial 11a of wafer 11 the protection sheet material 32 being formed by the bond layer 18a of sheet material 10 and sclerosis.Therefore, owing to preventing that air from entering between bonding agent 18 and wafer 11, is therefore suppressed between bonding agent 18 and wafer 11 and sneaks into bubble.
In the above-described embodiment, the example of the surperficial 11a at wafer 11 being pasted to sheet material 10 across bonding agent 18 is illustrated, and the plate object of still pasting sheet material 10 is not limited to wafer 11, comprises general tabular machined object (plate object).
Claims (3)
1. plate object is sticked on to the plate object method of attaching on sheet material, this plate object method of attaching is characterised in that, comprising:
Bonding agent supplying step, to the some supply bonding agent on sheet material, forms the peak of bonding agent; And
Paste step, after implementing this bonding agent supplying step, under the face that is stuck that the makes plate object state relative with this sheet material, plate object is relatively moved for this sheet material, by plate object, the peak of this bonding agent is spread out from the vertex at the peak of this bonding agent, on this sheet material, paste plate object across this bonding agent.
2. plate object method of attaching according to claim 1, is characterized in that,
The viscosity of described bonding agent is set to, and described bonding agent forms the peak of hemispheric described bonding agent while being supplied on described sheet material in described bonding agent supplying step.
3. plate object method of attaching according to claim 1 and 2, is characterized in that,
Described bonding agent is made up of the ultraviolet hardening resin hardening by irradiation ultraviolet radiation,
Described sheet material transmitting UV,
Described plate object method of attaching also comprises following cure step: after implementing described stickup step, to this bonding agent irradiation ultraviolet radiation, make this adhesive hardens across this sheet material.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013087145A JP6149223B2 (en) | 2013-04-18 | 2013-04-18 | How to stick a plate |
| JP2013-087145 | 2013-04-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104112650A true CN104112650A (en) | 2014-10-22 |
Family
ID=51709394
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410151217.2A Pending CN104112650A (en) | 2013-04-18 | 2014-04-14 | Adhesion method of plate-like objects |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6149223B2 (en) |
| KR (1) | KR102144137B1 (en) |
| CN (1) | CN104112650A (en) |
| TW (1) | TWI601643B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7339768B2 (en) * | 2019-05-10 | 2023-09-06 | 株式会社ディスコ | Protective member forming device |
| JP7339771B2 (en) * | 2019-05-17 | 2023-09-06 | 株式会社ディスコ | Protective member forming device |
| JP7286250B2 (en) * | 2019-08-07 | 2023-06-05 | 株式会社ディスコ | Protective member forming device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011119578A (en) * | 2009-12-07 | 2011-06-16 | Disco Abrasive Syst Ltd | Sticking apparatus |
| CN102334182A (en) * | 2009-02-27 | 2012-01-25 | 索尼化学&信息部件株式会社 | Method of producing semiconductor device |
| EP2416633A1 (en) * | 2010-08-04 | 2012-02-08 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Method for fixing and/or embedding an electronic component and adhesive for use in such a method |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11307585A (en) * | 1998-04-22 | 1999-11-05 | Sony Corp | Semiconductor device |
| JP2002203828A (en) * | 2000-12-28 | 2002-07-19 | Lintec Corp | Method for grinding back side of wafer |
| JP2004247611A (en) * | 2003-02-14 | 2004-09-02 | Matsushita Electric Works Ltd | Semiconductor device mounted board and manufacturing method of same |
| JP5089370B2 (en) | 2007-12-21 | 2012-12-05 | 株式会社ディスコ | Resin coating method and apparatus |
| JP2010062269A (en) * | 2008-09-02 | 2010-03-18 | Three M Innovative Properties Co | Method and apparatus for manufacturing wafer laminate, wafer laminate manufacturing method, method for exfoliating support layer, and method for manufacturing wafer |
| JP5324212B2 (en) * | 2008-12-26 | 2013-10-23 | 株式会社ディスコ | Resin coating method and resin coating apparatus |
| JP2011216763A (en) * | 2010-04-01 | 2011-10-27 | Disco Corp | Method of processing wafer |
| JP5524716B2 (en) * | 2010-05-28 | 2014-06-18 | 株式会社ディスコ | Wafer flat processing method |
| JP5882577B2 (en) * | 2010-12-06 | 2016-03-09 | スリーエム イノベイティブ プロパティズ カンパニー | Film sticking method, back grinding method, semiconductor chip manufacturing method, and film sticking apparatus |
| JP5670208B2 (en) * | 2011-01-13 | 2015-02-18 | 株式会社ディスコ | Resin coating device |
-
2013
- 2013-04-18 JP JP2013087145A patent/JP6149223B2/en active Active
-
2014
- 2014-03-12 TW TW103108732A patent/TWI601643B/en active
- 2014-04-04 KR KR1020140040366A patent/KR102144137B1/en active IP Right Grant
- 2014-04-14 CN CN201410151217.2A patent/CN104112650A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102334182A (en) * | 2009-02-27 | 2012-01-25 | 索尼化学&信息部件株式会社 | Method of producing semiconductor device |
| JP2011119578A (en) * | 2009-12-07 | 2011-06-16 | Disco Abrasive Syst Ltd | Sticking apparatus |
| EP2416633A1 (en) * | 2010-08-04 | 2012-02-08 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Method for fixing and/or embedding an electronic component and adhesive for use in such a method |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201446532A (en) | 2014-12-16 |
| KR102144137B1 (en) | 2020-08-12 |
| JP6149223B2 (en) | 2017-06-21 |
| TWI601643B (en) | 2017-10-11 |
| JP2014212188A (en) | 2014-11-13 |
| KR20140125296A (en) | 2014-10-28 |
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| C06 | Publication | ||
| PB01 | Publication | ||
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20141022 |
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| RJ01 | Rejection of invention patent application after publication |