CN104102059B - Tft阵列基板及其制造方法 - Google Patents

Tft阵列基板及其制造方法 Download PDF

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Publication number
CN104102059B
CN104102059B CN201410131136.6A CN201410131136A CN104102059B CN 104102059 B CN104102059 B CN 104102059B CN 201410131136 A CN201410131136 A CN 201410131136A CN 104102059 B CN104102059 B CN 104102059B
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electrode
film
contact hole
insulating film
wiring
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Chinese (zh)
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CN104102059A (zh
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小田耕治
井上和式
石贺展昭
宫川修
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/441—Interconnections, e.g. scanning lines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices

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  • Liquid Crystal (AREA)
  • Thin Film Transistor (AREA)
CN201410131136.6A 2013-04-03 2014-04-02 Tft阵列基板及其制造方法 Active CN104102059B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013077357A JP6230253B2 (ja) 2013-04-03 2013-04-03 Ｔｆｔアレイ基板およびその製造方法
JP2013-077357 2013-04-03

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CN104102059A CN104102059A (zh) 2014-10-15
CN104102059B true CN104102059B (zh) 2017-06-13

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US (1) US9640557B2 (enExample)
JP (1) JP6230253B2 (enExample)
CN (1) CN104102059B (enExample)

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JP6286453B2 (ja) * 2014-02-10 2018-02-28 シャープ株式会社 半導体装置およびその製造方法
US20170184893A1 (en) * 2014-07-11 2017-06-29 Sharp Kabushiki Kaisha Semiconductor apparatus, method of manufacturing same, and liquid crystal display apparatus
KR102322014B1 (ko) * 2014-10-24 2021-11-05 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조방법
KR101712246B1 (ko) * 2014-12-05 2017-03-06 엘지디스플레이 주식회사 자기 정전용량식 터치 센서 일체형 표시장치
CN104536222A (zh) * 2014-12-22 2015-04-22 深圳市华星光电技术有限公司 Ffs阵列基板及液晶显示面板
US20160178978A1 (en) * 2014-12-22 2016-06-23 Shenzhen China Star Optoelectronics Technology Co., Ltd. FFS Mode Array Substrate and LCD Panel
JP6671155B2 (ja) * 2015-11-26 2020-03-25 三菱電機株式会社 薄膜トランジスタ基板
KR102454383B1 (ko) * 2015-12-28 2022-10-17 엘지디스플레이 주식회사 프린지 필드 스위칭 방식의 액정 표시장치
CN109478718B (zh) * 2016-07-28 2021-01-15 夏普株式会社 扫描天线
US11189914B2 (en) * 2016-09-26 2021-11-30 Sharp Kabushiki Kaisha Liquid crystal cell and scanning antenna
JP6779109B2 (ja) * 2016-11-21 2020-11-04 三菱電機株式会社 薄膜トランジスタ基板及びその製造方法、並びに、表示装置
CN110462841B (zh) * 2017-04-07 2023-06-02 夏普株式会社 Tft基板、具备tft基板的扫描天线以及tft基板的制造方法
US11171161B2 (en) * 2017-04-07 2021-11-09 Sharp Kabushiki Kaisha TFT substrate, scanning antenna provided with TFT substrate, and method for producing TFT substrate
CN106941093B (zh) * 2017-05-12 2019-10-11 京东方科技集团股份有限公司 显示装置、阵列基板及其制造方法
WO2019135147A1 (ja) * 2018-01-05 2019-07-11 株式会社半導体エネルギー研究所 表示装置、表示モジュール、及び電子機器
JP2019128541A (ja) * 2018-01-26 2019-08-01 シャープ株式会社 液晶セル、及び走査アンテナ
US11036322B2 (en) * 2019-06-24 2021-06-15 Wuhan China Star Optoelectronics Technology Co., Ltd Array substrate and method of manufacturing same
CN110703515A (zh) * 2019-09-29 2020-01-17 深圳市华星光电半导体显示技术有限公司 显示面板及其制作方法
JP7391736B2 (ja) * 2020-03-18 2023-12-05 株式会社ジャパンディスプレイ 表示装置及び半導体基板
JP2024003354A (ja) * 2022-06-27 2024-01-15 セイコーエプソン株式会社 半導体装置の製造方法

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US6678017B1 (en) * 1998-06-08 2004-01-13 Casio Computer Co., Ltd. Display panel and method of fabricating the same
CN1651998A (zh) * 2004-02-05 2005-08-10 夏普株式会社 电子元件、显示元件及其制造方法
CN101424853A (zh) * 2007-11-01 2009-05-06 株式会社日立显示器 液晶显示装置
CN101919043A (zh) * 2008-01-21 2010-12-15 日本电气株式会社 显示装置

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JP4278834B2 (ja) * 2000-06-02 2009-06-17 株式会社日立製作所 液晶表示装置とその製造方法
JP4522660B2 (ja) * 2003-03-14 2010-08-11 シャープ株式会社 薄膜トランジスタ基板の製造方法
JP4605438B2 (ja) * 2004-04-09 2011-01-05 ソニー株式会社 液晶表示装置およびその製造方法
JP4586573B2 (ja) * 2005-02-28 2010-11-24 エプソンイメージングデバイス株式会社 電気光学装置及びその製造方法、薄膜トランジスタ、電子機器
JP2006330418A (ja) * 2005-05-27 2006-12-07 Seiko Epson Corp 画素電極とその形成方法、電気光学装置、及び電子機器
KR101216171B1 (ko) 2005-09-12 2012-12-28 엘지디스플레이 주식회사 표시장치와 그 제조방법
JP2007093686A (ja) * 2005-09-27 2007-04-12 Mitsubishi Electric Corp 液晶表示装置及びその製造方法
JP2007226175A (ja) 2006-01-26 2007-09-06 Epson Imaging Devices Corp 液晶装置及び電子機器
JP2007242895A (ja) * 2006-03-08 2007-09-20 Mitsubishi Electric Corp 薄膜トランジスタ装置及びその製造方法
JP4905136B2 (ja) 2007-01-05 2012-03-28 ソニー株式会社 液晶装置
JP4487318B2 (ja) 2007-07-26 2010-06-23 エプソンイメージングデバイス株式会社 液晶表示装置及びその製造方法
JP2009036947A (ja) 2007-08-01 2009-02-19 Seiko Epson Corp 液晶装置の製造方法、および液晶装置
JP4442684B2 (ja) 2007-11-29 2010-03-31 エプソンイメージングデバイス株式会社 液晶表示装置及びその製造方法
JP2010079075A (ja) * 2008-09-26 2010-04-08 Hitachi Displays Ltd 透過型液晶表示装置
CN102822734B (zh) * 2010-04-16 2015-01-21 夏普株式会社 电子基板的制造方法、液晶显示装置的制造方法、电子基板以及液晶显示装置
TWI521612B (zh) * 2011-03-11 2016-02-11 半導體能源研究所股份有限公司 半導體裝置的製造方法
TWI792087B (zh) * 2011-05-05 2023-02-11 日商半導體能源研究所股份有限公司 半導體裝置及其製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6678017B1 (en) * 1998-06-08 2004-01-13 Casio Computer Co., Ltd. Display panel and method of fabricating the same
CN1651998A (zh) * 2004-02-05 2005-08-10 夏普株式会社 电子元件、显示元件及其制造方法
CN101424853A (zh) * 2007-11-01 2009-05-06 株式会社日立显示器 液晶显示装置
CN101919043A (zh) * 2008-01-21 2010-12-15 日本电气株式会社 显示装置

Also Published As

Publication number Publication date
JP2014202838A (ja) 2014-10-27
US20140299881A1 (en) 2014-10-09
CN104102059A (zh) 2014-10-15
JP6230253B2 (ja) 2017-11-15
US9640557B2 (en) 2017-05-02

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