CN103184022A - 用于硅片制备中的暂时性粘合用粘合剂组合物 - Google Patents
用于硅片制备中的暂时性粘合用粘合剂组合物 Download PDFInfo
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- CN103184022A CN103184022A CN2011104595224A CN201110459522A CN103184022A CN 103184022 A CN103184022 A CN 103184022A CN 2011104595224 A CN2011104595224 A CN 2011104595224A CN 201110459522 A CN201110459522 A CN 201110459522A CN 103184022 A CN103184022 A CN 103184022A
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- binder composition
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4064—Curing agents not provided for by the groups C08G59/42 - C08G59/66 sulfur containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/66—Mercaptans
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
Abstract
Description
Claims (25)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110459522.4A CN103184022B (zh) | 2011-12-30 | 2011-12-30 | 用于硅片制备中的暂时性粘合用粘合剂组合物 |
PCT/CN2012/087801 WO2013097761A1 (en) | 2011-12-30 | 2012-12-28 | Adhesive composition for temporarily bonding use in wafer manufacturing |
EP12862543.1A EP2798028A4 (en) | 2011-12-30 | 2012-12-28 | ADHESIVE COMPOSITION FOR TEMPORARY CONNECTION USE IN WASHER MANUFACTURE |
JP2014549343A JP6099157B2 (ja) | 2011-12-30 | 2012-12-28 | ウエハーの製造における一時的結合に使用される接着剤組成物 |
CA2862440A CA2862440A1 (en) | 2011-12-30 | 2012-12-28 | Adhesive composition for temporarily bonding use in wafer manufacturing |
US14/309,915 US9714317B2 (en) | 2011-12-30 | 2014-06-20 | Adhesive composition for temporarily bonding use in wafer manufacturing |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110459522.4A CN103184022B (zh) | 2011-12-30 | 2011-12-30 | 用于硅片制备中的暂时性粘合用粘合剂组合物 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103184022A true CN103184022A (zh) | 2013-07-03 |
CN103184022B CN103184022B (zh) | 2017-09-19 |
Family
ID=48675473
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201110459522.4A Expired - Fee Related CN103184022B (zh) | 2011-12-30 | 2011-12-30 | 用于硅片制备中的暂时性粘合用粘合剂组合物 |
Country Status (6)
Country | Link |
---|---|
US (1) | US9714317B2 (zh) |
EP (1) | EP2798028A4 (zh) |
JP (1) | JP6099157B2 (zh) |
CN (1) | CN103184022B (zh) |
CA (1) | CA2862440A1 (zh) |
WO (1) | WO2013097761A1 (zh) |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103448153A (zh) * | 2013-08-23 | 2013-12-18 | 蓝思科技股份有限公司 | 一种蓝宝石晶棒的切割工艺及其加工治具 |
CN104312508A (zh) * | 2014-10-29 | 2015-01-28 | 苏州市胶粘剂厂有限公司 | 一种环氧树脂胶黏剂及其制备方法 |
WO2015021585A1 (en) * | 2013-08-12 | 2015-02-19 | Henkel (China) Company Limited | Mechano-responsive composition |
CN105473634A (zh) * | 2013-10-25 | 2016-04-06 | 味之素株式会社 | 柔性环氧树脂组合物 |
CN108624268A (zh) * | 2018-04-16 | 2018-10-09 | 杭州电子科技大学 | 一种太阳能硅片制造用复合材料 |
CN108676532A (zh) * | 2018-04-16 | 2018-10-19 | 杭州电子科技大学 | 一种环氧树脂粘结材料 |
CN109321185A (zh) * | 2018-10-12 | 2019-02-12 | 南宁珀源能源材料有限公司 | 可水煮脱胶的粘棒胶及其制备方法 |
CN109435079A (zh) * | 2018-09-17 | 2019-03-08 | 无锡斯贝尔磁性材料有限公司 | 一种金刚石线切割方法 |
CN110437779A (zh) * | 2019-07-31 | 2019-11-12 | 南宁珀源能源材料有限公司 | 用于薄片细线化硅切片的粘棒胶及其制备方法 |
CN111873200A (zh) * | 2020-07-15 | 2020-11-03 | 中锗科技有限公司 | 一种提高锗/硅红外晶体套圆合格率的方法 |
CN112752783A (zh) * | 2019-08-21 | 2021-05-04 | 纳美仕有限公司 | 环氧树脂组合物 |
CN112823177A (zh) * | 2018-10-17 | 2021-05-18 | 纳美仕有限公司 | 树脂组合物 |
CN112852367A (zh) * | 2021-03-08 | 2021-05-28 | 南宁珀源能源材料有限公司 | 一种双组份硅棒拼接胶及其制备方法 |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015060440A1 (ja) * | 2013-10-25 | 2015-04-30 | 味の素株式会社 | 耐熱性エポキシ樹脂組成物 |
CN104559852B (zh) * | 2014-12-31 | 2018-02-27 | 深圳市化讯半导体材料有限公司 | 一种用于薄晶圆加工的临时键合胶及其制备方法 |
EP3288998A4 (en) | 2015-04-29 | 2018-09-12 | 3M Innovative Properties Company | Method of making a polymer network from a polythiol and a polyepoxide |
EP3535332A1 (en) | 2016-11-03 | 2019-09-11 | 3M Innovative Properties Company | Method of applying a sealant to an aircraft component |
CA3042861A1 (en) | 2016-11-03 | 2018-05-11 | 3M Innovative Properties Company | Compositions including a photolatent amine, camphorquinone, and a coumarin and related methods |
JP7148848B2 (ja) * | 2019-03-28 | 2022-10-06 | 味の素株式会社 | 一液型樹脂組成物 |
CN114207023A (zh) * | 2019-11-11 | 2022-03-18 | 东丽精细化工株式会社 | 环氧树脂组合物 |
US20230407153A1 (en) | 2020-09-30 | 2023-12-21 | Basf Se | De-bondable polyurethane adhesives based on thermally expandable microspheres |
CN113956444B (zh) * | 2021-11-10 | 2023-09-22 | 广州飞思合成材料有限公司 | 一种环氧固化剂及其制备方法 |
US11951682B2 (en) * | 2021-11-18 | 2024-04-09 | The Regents Of The University Of California | Thermoresponsive suspension composites for 3D printing |
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CN1861730A (zh) * | 2006-03-29 | 2006-11-15 | 湖南神力实业有限公司 | 棒状单包装环氧胶粘剂及制备方法 |
US20070293603A1 (en) * | 2006-06-19 | 2007-12-20 | Ashland Licensing And Intellectual Property Llc | Epoxy adhesive composition and use thereof |
CN102120918A (zh) * | 2010-01-09 | 2011-07-13 | 爱克工业株式会社 | 粘着剂组成物 |
CN102925088A (zh) * | 2011-08-10 | 2013-02-13 | 烟台德邦科技有限公司 | 一种太阳能晶硅切片临时粘接胶及其制备方法 |
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GB705098A (en) * | 1950-09-30 | 1954-03-10 | Bataafsche Petroleum | Compositions containing glycidyl ethers of dihydric phenols with epichlorhydrin or dichlorhydrin |
US3567677A (en) * | 1968-04-16 | 1971-03-02 | Nasa | Flexible,repairable,pottable material for electrical connectors |
US3929717A (en) * | 1974-06-28 | 1975-12-30 | Us Army | Alcohol sensitive repairable epoxy embedding material |
US4092293A (en) * | 1976-06-24 | 1978-05-30 | Diamond Shamrock Corporation | Polymercaptans for curing epoxy resins and method of preparation thereof |
US4284574A (en) * | 1979-06-15 | 1981-08-18 | Ciba-Geigy Corporation | Diglycidyl ethers of di-secondary alcohols, their preparation, and curable compositions containing them |
DE3229657A1 (de) * | 1982-08-09 | 1984-02-09 | Henkel KGaA, 4000 Düsseldorf | Pastoese, vorgelierbare, waermehaertbare epoxidharz-klebstoffe |
US4897141A (en) | 1984-12-06 | 1990-01-30 | Valtech Corporation | Method for preparing semiconductor wafers |
US5128424A (en) * | 1991-07-18 | 1992-07-07 | Japan Synthetic Rubber Co., Ltd. | Epoxy resin, mercato curing agent and polysulfide adduct |
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2011
- 2011-12-30 CN CN201110459522.4A patent/CN103184022B/zh not_active Expired - Fee Related
-
2012
- 2012-12-28 EP EP12862543.1A patent/EP2798028A4/en not_active Withdrawn
- 2012-12-28 WO PCT/CN2012/087801 patent/WO2013097761A1/en active Application Filing
- 2012-12-28 JP JP2014549343A patent/JP6099157B2/ja not_active Expired - Fee Related
- 2012-12-28 CA CA2862440A patent/CA2862440A1/en not_active Abandoned
-
2014
- 2014-06-20 US US14/309,915 patent/US9714317B2/en not_active Expired - Fee Related
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Cited By (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015021585A1 (en) * | 2013-08-12 | 2015-02-19 | Henkel (China) Company Limited | Mechano-responsive composition |
CN105849186A (zh) * | 2013-08-12 | 2016-08-10 | 汉高股份有限及两合公司 | 机械响应组合物 |
US9868812B2 (en) | 2013-08-12 | 2018-01-16 | Henkel Ag & Co. Kgaa | Mechano-responsive composition |
CN105849186B (zh) * | 2013-08-12 | 2018-02-09 | 汉高股份有限及两合公司 | 机械响应组合物 |
CN103448153A (zh) * | 2013-08-23 | 2013-12-18 | 蓝思科技股份有限公司 | 一种蓝宝石晶棒的切割工艺及其加工治具 |
CN103448153B (zh) * | 2013-08-23 | 2016-02-03 | 蓝思科技股份有限公司 | 一种蓝宝石晶棒的切割工艺及其加工治具 |
CN105473634A (zh) * | 2013-10-25 | 2016-04-06 | 味之素株式会社 | 柔性环氧树脂组合物 |
CN105473634B (zh) * | 2013-10-25 | 2017-08-04 | 味之素株式会社 | 柔性环氧树脂组合物 |
CN104312508A (zh) * | 2014-10-29 | 2015-01-28 | 苏州市胶粘剂厂有限公司 | 一种环氧树脂胶黏剂及其制备方法 |
CN108676532A (zh) * | 2018-04-16 | 2018-10-19 | 杭州电子科技大学 | 一种环氧树脂粘结材料 |
CN108624268A (zh) * | 2018-04-16 | 2018-10-09 | 杭州电子科技大学 | 一种太阳能硅片制造用复合材料 |
CN109435079A (zh) * | 2018-09-17 | 2019-03-08 | 无锡斯贝尔磁性材料有限公司 | 一种金刚石线切割方法 |
CN109321185A (zh) * | 2018-10-12 | 2019-02-12 | 南宁珀源能源材料有限公司 | 可水煮脱胶的粘棒胶及其制备方法 |
CN112823177A (zh) * | 2018-10-17 | 2021-05-18 | 纳美仕有限公司 | 树脂组合物 |
CN112823177B (zh) * | 2018-10-17 | 2023-08-15 | 纳美仕有限公司 | 树脂组合物 |
TWI814922B (zh) * | 2018-10-17 | 2023-09-11 | 日商納美仕股份有限公司 | 樹脂組成物 |
CN110437779A (zh) * | 2019-07-31 | 2019-11-12 | 南宁珀源能源材料有限公司 | 用于薄片细线化硅切片的粘棒胶及其制备方法 |
CN112752783A (zh) * | 2019-08-21 | 2021-05-04 | 纳美仕有限公司 | 环氧树脂组合物 |
CN112752783B (zh) * | 2019-08-21 | 2022-08-02 | 纳美仕有限公司 | 环氧树脂组合物 |
CN111873200A (zh) * | 2020-07-15 | 2020-11-03 | 中锗科技有限公司 | 一种提高锗/硅红外晶体套圆合格率的方法 |
CN111873200B (zh) * | 2020-07-15 | 2022-04-22 | 中锗科技有限公司 | 一种提高锗/硅红外晶体套圆合格率的方法 |
CN112852367A (zh) * | 2021-03-08 | 2021-05-28 | 南宁珀源能源材料有限公司 | 一种双组份硅棒拼接胶及其制备方法 |
Also Published As
Publication number | Publication date |
---|---|
JP6099157B2 (ja) | 2017-03-22 |
CN103184022B (zh) | 2017-09-19 |
EP2798028A4 (en) | 2015-09-02 |
EP2798028A1 (en) | 2014-11-05 |
US9714317B2 (en) | 2017-07-25 |
US20140303286A1 (en) | 2014-10-09 |
CA2862440A1 (en) | 2013-07-04 |
WO2013097761A1 (en) | 2013-07-04 |
JP2015507674A (ja) | 2015-03-12 |
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