CN103180257B - 减少银的电迁移的方法及由其制备的制品 - Google Patents
减少银的电迁移的方法及由其制备的制品 Download PDFInfo
- Publication number
- CN103180257B CN103180257B CN201180051725.8A CN201180051725A CN103180257B CN 103180257 B CN103180257 B CN 103180257B CN 201180051725 A CN201180051725 A CN 201180051725A CN 103180257 B CN103180257 B CN 103180257B
- Authority
- CN
- China
- Prior art keywords
- conductive member
- divalent group
- silver
- polysilazane
- glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
- C03C17/38—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal at least one coating being a coating of an organic material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ceramic Engineering (AREA)
- Laminated Bodies (AREA)
- Surface Treatment Of Glass (AREA)
- Position Input By Displaying (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US41468810P | 2010-11-17 | 2010-11-17 | |
| US61/414,688 | 2010-11-17 | ||
| PCT/US2011/058322 WO2012067789A2 (en) | 2010-11-17 | 2011-10-28 | Method of reducing electromigration of silver and article made thereby |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103180257A CN103180257A (zh) | 2013-06-26 |
| CN103180257B true CN103180257B (zh) | 2016-02-17 |
Family
ID=44947239
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201180051725.8A Expired - Fee Related CN103180257B (zh) | 2010-11-17 | 2011-10-28 | 减少银的电迁移的方法及由其制备的制品 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20130220682A1 (enExample) |
| EP (1) | EP2640572B1 (enExample) |
| JP (1) | JP6109074B2 (enExample) |
| CN (1) | CN103180257B (enExample) |
| WO (1) | WO2012067789A2 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103910885A (zh) * | 2012-12-31 | 2014-07-09 | 第一毛织株式会社 | 制备间隙填充剂的方法、用其制备的间隙填充剂和使用间隙填充剂制造半导体电容器的方法 |
| JP6475388B1 (ja) * | 2018-07-18 | 2019-02-27 | 信越化学工業株式会社 | ポリシラザン含有組成物 |
| DE102020134437A1 (de) * | 2020-12-21 | 2022-06-23 | Deutsches Zentrum für Luft- und Raumfahrt e.V. | Passiver Strahlungskühler |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020119675A1 (en) * | 2000-12-27 | 2002-08-29 | Samsung Electronics Co., Ltd. | Method of forming a spin-on-glass insulation layer |
| CN1386391A (zh) * | 2000-07-24 | 2002-12-18 | Tdk株式会社 | 发光元件 |
| US20040169005A1 (en) * | 2003-02-17 | 2004-09-02 | Hong-Gun Kim | Methods for forming a thin film on an integrated circuit including soft baking a silicon glass film |
| CN1694936A (zh) * | 2002-11-01 | 2005-11-09 | 克拉里安特国际有限公司 | 包含聚硅氮烷的涂覆溶液 |
| CN101080282B (zh) * | 2004-12-17 | 2010-05-12 | 国立大学法人德岛大学 | 基材表面的改性方法、具有改性表面的基材及其制造方法 |
| JP2010143802A (ja) * | 2008-12-19 | 2010-07-01 | Toda Kogyo Corp | 酸化ケイ素ゲル体膜、透明導電性膜および透明導電性膜積層基板並びにそれらの製造方法 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US3813519A (en) * | 1964-11-09 | 1974-05-28 | Saint Gobain | Electrically heated glass window |
| US3592726A (en) * | 1965-04-28 | 1971-07-13 | Corning Glass Works | Composite vehicle closure comprising an inner sheet of chemically strengthened glass |
| US4010311A (en) * | 1973-09-14 | 1977-03-01 | Ppg Industries, Inc. | Impact-resistant glass-polyesterurethane laminates |
| JPH02176923A (ja) * | 1988-12-28 | 1990-07-10 | Toray Ind Inc | 感圧入力タブレット |
| JPH08133792A (ja) * | 1994-10-31 | 1996-05-28 | Central Glass Co Ltd | 熱線反射紫外線吸収透明体 |
| JPH08160405A (ja) * | 1994-12-09 | 1996-06-21 | Seiko Instr Inc | 表示装置及びその製造方法 |
| JPH09142887A (ja) * | 1995-11-20 | 1997-06-03 | N E Chemcat Corp | 貴金属表面の保護膜 |
| FR2761978B1 (fr) * | 1997-04-11 | 1999-05-07 | Saint Gobain Vitrage | Composition de verre et substrat en verre trempe chimiquement |
| JPH11110133A (ja) * | 1997-10-01 | 1999-04-23 | Daicel Chem Ind Ltd | タッチセンサ用ガラス基板およびタッチパネル |
| JP3414236B2 (ja) * | 1998-01-05 | 2003-06-09 | 松下電器産業株式会社 | プラズマディスプレイパネル |
| JPH11236533A (ja) * | 1998-02-24 | 1999-08-31 | Hitachi Chem Co Ltd | シリカ系被膜形成用塗布液及びシリカ系被膜 |
| KR20010109321A (ko) * | 1999-03-24 | 2001-12-08 | 추후보정 | 유기 전광 소자 |
| US6305073B1 (en) * | 1999-12-29 | 2001-10-23 | Gm Nameplate, Inc. | One-sided electrode arrangement on an intermediate spacer for a touchscreen |
| DE60136703D1 (de) * | 2000-05-04 | 2009-01-08 | Schott Donnelly Llc | Verfahren zur Herstellung einer electrochromen Tafel |
| JP5291275B2 (ja) * | 2000-07-27 | 2013-09-18 | 有限会社コンタミネーション・コントロール・サービス | コーティング膜が施された部材及びコーティング膜の製造方法 |
| US6819316B2 (en) * | 2001-04-17 | 2004-11-16 | 3M Innovative Properties Company | Flexible capacitive touch sensor |
| US6652978B2 (en) * | 2001-05-07 | 2003-11-25 | Kion Corporation | Thermally stable, moisture curable polysilazanes and polysiloxazanes |
| US6961049B2 (en) | 2002-06-21 | 2005-11-01 | 3M Innovative Properties Company | Capacitive touch sensor architecture with unique sensor bar addressing |
| US6970160B2 (en) | 2002-12-19 | 2005-11-29 | 3M Innovative Properties Company | Lattice touch-sensing system |
| JP4370139B2 (ja) * | 2003-09-30 | 2009-11-25 | 三菱重工業株式会社 | 電波ステルス性および/または電磁波シールド性を有する窓の製造方法並びに電波ステルス性および/または電磁波シールド性を有する窓材 |
| US8068186B2 (en) * | 2003-10-15 | 2011-11-29 | 3M Innovative Properties Company | Patterned conductor touch screen having improved optics |
| JP2005220378A (ja) * | 2004-02-03 | 2005-08-18 | Pc Wave:Kk | 装飾品及び装飾品の表面処理方法 |
| DE102005003627A1 (de) * | 2005-01-26 | 2006-07-27 | Clariant International Limited | Verfahren zur Erzeugung einer permanenten Schutzschicht auf Edelmetalloberflächen durch Beschichten mit Lösungen auf Polysilazanbasis |
| DE102005008857A1 (de) * | 2005-02-26 | 2006-09-07 | Clariant International Limited | Verwendung von Polysilazanen als permanente Anit-Fingerprint-Beschichtung |
| JP4679272B2 (ja) * | 2005-07-04 | 2011-04-27 | セントラル硝子株式会社 | 入出力一体型表示装置及び保護ガラス板 |
| JP2007184445A (ja) * | 2006-01-10 | 2007-07-19 | Seiko Epson Corp | 配線形成方法、薄膜トランジスタの製造方法及びデバイス製造方法並びに電子機器 |
| KR20090019059A (ko) * | 2007-08-20 | 2009-02-25 | 전자부품연구원 | 표면에 글래스 보호층을 갖는 구조물 |
| JP2009047879A (ja) * | 2007-08-20 | 2009-03-05 | Seiko Epson Corp | 有機エレクトロルミネッセンス装置及びその製造方法、電子機器 |
| JP2010062241A (ja) * | 2008-09-02 | 2010-03-18 | Konica Minolta Holdings Inc | 有機薄膜トランジスタの製造方法、有機薄膜トランジスタ素子及び表示装置 |
| DE102009013903A1 (de) * | 2009-03-19 | 2010-09-23 | Clariant International Limited | Solarzellen mit einer Barriereschicht auf Basis von Polysilazan |
-
2011
- 2011-10-28 WO PCT/US2011/058322 patent/WO2012067789A2/en not_active Ceased
- 2011-10-28 JP JP2013539858A patent/JP6109074B2/ja not_active Expired - Fee Related
- 2011-10-28 EP EP11782322.9A patent/EP2640572B1/en not_active Not-in-force
- 2011-10-28 CN CN201180051725.8A patent/CN103180257B/zh not_active Expired - Fee Related
- 2011-10-28 US US13/881,571 patent/US20130220682A1/en not_active Abandoned
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1386391A (zh) * | 2000-07-24 | 2002-12-18 | Tdk株式会社 | 发光元件 |
| US20020119675A1 (en) * | 2000-12-27 | 2002-08-29 | Samsung Electronics Co., Ltd. | Method of forming a spin-on-glass insulation layer |
| CN1694936A (zh) * | 2002-11-01 | 2005-11-09 | 克拉里安特国际有限公司 | 包含聚硅氮烷的涂覆溶液 |
| US20040169005A1 (en) * | 2003-02-17 | 2004-09-02 | Hong-Gun Kim | Methods for forming a thin film on an integrated circuit including soft baking a silicon glass film |
| CN101080282B (zh) * | 2004-12-17 | 2010-05-12 | 国立大学法人德岛大学 | 基材表面的改性方法、具有改性表面的基材及其制造方法 |
| JP2010143802A (ja) * | 2008-12-19 | 2010-07-01 | Toda Kogyo Corp | 酸化ケイ素ゲル体膜、透明導電性膜および透明導電性膜積層基板並びにそれらの製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP2640572A2 (en) | 2013-09-25 |
| WO2012067789A2 (en) | 2012-05-24 |
| CN103180257A (zh) | 2013-06-26 |
| JP2013544222A (ja) | 2013-12-12 |
| JP6109074B2 (ja) | 2017-04-05 |
| US20130220682A1 (en) | 2013-08-29 |
| WO2012067789A3 (en) | 2012-07-26 |
| EP2640572B1 (en) | 2017-11-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160217 Termination date: 20191028 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |