CN103081077A - 半导体装置的制造方法及半导体装置 - Google Patents

半导体装置的制造方法及半导体装置 Download PDF

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Publication number
CN103081077A
CN103081077A CN2011800389423A CN201180038942A CN103081077A CN 103081077 A CN103081077 A CN 103081077A CN 2011800389423 A CN2011800389423 A CN 2011800389423A CN 201180038942 A CN201180038942 A CN 201180038942A CN 103081077 A CN103081077 A CN 103081077A
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mentioned
film
semiconductor device
semiconductor substrate
substrate
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大见忠弘
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Tohoku University NUC
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Tohoku University NUC
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76898—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics formed through a semiconductor substrate
    • H—ELECTRICITY
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures
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    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
    • H01L21/02167—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material being a silicon carbide not containing oxygen, e.g. SiC, SiC:H or silicon carbonitrides
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    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
    • H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
    • H01L21/02271—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
    • H01L21/02274—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition in the presence of a plasma [PECVD]
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    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3065—Plasma etching; Reactive-ion etching
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    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/308—Chemical or electrical treatment, e.g. electrolytic etching using masks
    • H01L21/3081—Chemical or electrical treatment, e.g. electrolytic etching using masks characterised by their composition, e.g. multilayer masks, materials
    • H—ELECTRICITY
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    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76841—Barrier, adhesion or liner layers
    • H01L21/76843—Barrier, adhesion or liner layers formed in openings in a dielectric
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    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
    • H01L21/0217—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material being a silicon nitride not containing oxygen, e.g. SixNy or SixByNz
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    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/02227—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process
    • H01L21/02247—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by nitridation, e.g. nitridation of the substrate
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    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/02227—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process
    • H01L21/02252—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by plasma treatment, e.g. plasma oxidation of the substrate
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    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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    • H01L25/065—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10D89/00
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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Formation Of Insulating Films (AREA)
CN2011800389423A 2010-08-10 2011-08-04 半导体装置的制造方法及半导体装置 Pending CN103081077A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010-179468 2010-08-10
JP2010179468A JP5419167B2 (ja) 2010-08-10 2010-08-10 半導体装置の製造方法および半導体装置
PCT/JP2011/067847 WO2012020689A1 (ja) 2010-08-10 2011-08-04 半導体装置の製造方法および半導体装置

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US (1) US20130140700A1 (enExample)
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WO (1) WO2012020689A1 (enExample)

Cited By (8)

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CN103426864A (zh) * 2013-08-26 2013-12-04 华进半导体封装先导技术研发中心有限公司 适用于转接板的tsv结构及其制备方法
CN105428311A (zh) * 2015-12-16 2016-03-23 华进半导体封装先导技术研发中心有限公司 Tsv背部露头的工艺方法
CN105990166A (zh) * 2015-02-27 2016-10-05 中芯国际集成电路制造(上海)有限公司 晶圆键合方法
CN106206509A (zh) * 2015-03-17 2016-12-07 矽品精密工业股份有限公司 电子封装件及其制法与基板结构
CN106935563A (zh) * 2015-12-31 2017-07-07 矽品精密工业股份有限公司 电子封装件及其制法与基板结构
CN107305840A (zh) * 2016-04-25 2017-10-31 中芯国际集成电路制造(上海)有限公司 一种半导体器件及其制造方法和电子装置
CN108735744A (zh) * 2017-04-21 2018-11-02 联华电子股份有限公司 半导体存储装置以及其制作方法
CN109994422A (zh) * 2017-12-29 2019-07-09 江苏长电科技股份有限公司 Tsv封装结构及其制备方法

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JP2921677B2 (ja) 1997-07-28 1999-07-19 矢崎総業株式会社 カード式電気錠装置
US8940637B2 (en) * 2012-07-05 2015-01-27 Globalfoundries Singapore Pte. Ltd. Method for forming through silicon via with wafer backside protection
US8963336B2 (en) 2012-08-03 2015-02-24 Samsung Electronics Co., Ltd. Semiconductor packages, methods of manufacturing the same, and semiconductor package structures including the same
US9034752B2 (en) * 2013-01-03 2015-05-19 Micron Technology, Inc. Methods of exposing conductive vias of semiconductor devices and associated structures
US9786605B1 (en) * 2016-05-27 2017-10-10 International Business Machines Corporation Advanced through substrate via metallization in three dimensional semiconductor integration
US10396012B2 (en) 2016-05-27 2019-08-27 International Business Machines Corporation Advanced through substrate via metallization in three dimensional semiconductor integration
US10312181B2 (en) 2016-05-27 2019-06-04 International Business Machines Corporation Advanced through substrate via metallization in three dimensional semiconductor integration
US9997452B1 (en) 2017-01-27 2018-06-12 Micron Technology, Inc. Forming conductive plugs for memory device
KR102757381B1 (ko) * 2020-10-13 2025-01-20 삼성전자주식회사 반도체 장치 제조 방법
CN115588619B (zh) * 2021-07-05 2025-07-18 长鑫存储技术有限公司 微凸块及其形成方法、芯片互连结构及方法
US20230352369A1 (en) * 2022-04-28 2023-11-02 Invensas Bonding Technologies, Inc. Through-substrate vias with metal plane layers and methods of manufacturing the same

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CN101794717A (zh) * 2009-01-13 2010-08-04 台湾积体电路制造股份有限公司 堆叠集成芯片及其制造方法

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JP4454242B2 (ja) * 2003-03-25 2010-04-21 株式会社ルネサステクノロジ 半導体装置およびその製造方法
JP4500961B2 (ja) * 2004-06-07 2010-07-14 国立大学法人九州工業大学 薄膜形成方法
JP4783906B2 (ja) * 2004-11-30 2011-09-28 国立大学法人九州工業大学 パッケージングされた積層型半導体装置及びその製造方法
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JP2005310817A (ja) * 2004-04-16 2005-11-04 Seiko Epson Corp 半導体装置の製造方法、回路基板、並びに電子機器
US20100038800A1 (en) * 2008-08-18 2010-02-18 Samsung Electronics Co., Ltd. Through-silicon via structures including conductive protective layers and methods of forming the same
CN101794717A (zh) * 2009-01-13 2010-08-04 台湾积体电路制造股份有限公司 堆叠集成芯片及其制造方法

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103426864A (zh) * 2013-08-26 2013-12-04 华进半导体封装先导技术研发中心有限公司 适用于转接板的tsv结构及其制备方法
CN105990166A (zh) * 2015-02-27 2016-10-05 中芯国际集成电路制造(上海)有限公司 晶圆键合方法
CN105990166B (zh) * 2015-02-27 2018-12-21 中芯国际集成电路制造(上海)有限公司 晶圆键合方法
CN106206509B (zh) * 2015-03-17 2019-12-03 矽品精密工业股份有限公司 电子封装件及其制法与基板结构
CN106206509A (zh) * 2015-03-17 2016-12-07 矽品精密工业股份有限公司 电子封装件及其制法与基板结构
CN105428311A (zh) * 2015-12-16 2016-03-23 华进半导体封装先导技术研发中心有限公司 Tsv背部露头的工艺方法
CN106935563A (zh) * 2015-12-31 2017-07-07 矽品精密工业股份有限公司 电子封装件及其制法与基板结构
CN106935563B (zh) * 2015-12-31 2019-06-18 矽品精密工业股份有限公司 电子封装件及其制法与基板结构
CN107305840A (zh) * 2016-04-25 2017-10-31 中芯国际集成电路制造(上海)有限公司 一种半导体器件及其制造方法和电子装置
CN107305840B (zh) * 2016-04-25 2020-05-12 中芯国际集成电路制造(上海)有限公司 一种半导体器件及其制造方法和电子装置
CN108735744A (zh) * 2017-04-21 2018-11-02 联华电子股份有限公司 半导体存储装置以及其制作方法
US10672864B2 (en) 2017-04-21 2020-06-02 United Microelectronics Corp. Manufacturing method of semiconductor memory device
CN108735744B (zh) * 2017-04-21 2021-02-02 联华电子股份有限公司 半导体存储装置以及其制作方法
CN109994422A (zh) * 2017-12-29 2019-07-09 江苏长电科技股份有限公司 Tsv封装结构及其制备方法
CN109994422B (zh) * 2017-12-29 2021-10-19 江苏长电科技股份有限公司 Tsv封装结构及其制备方法

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JP2012038996A (ja) 2012-02-23
WO2012020689A1 (ja) 2012-02-16
US20130140700A1 (en) 2013-06-06
JP5419167B2 (ja) 2014-02-19
TW201216411A (en) 2012-04-16

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